TWM510419U - Illuminant device and lighting module thereof - Google Patents
Illuminant device and lighting module thereof Download PDFInfo
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- TWM510419U TWM510419U TW104208800U TW104208800U TWM510419U TW M510419 U TWM510419 U TW M510419U TW 104208800 U TW104208800 U TW 104208800U TW 104208800 U TW104208800 U TW 104208800U TW M510419 U TWM510419 U TW M510419U
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Abstract
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本新型是關於一種發光裝置及光源模組,且特別是有關於利用發光二極體作為光源的發光裝置及光源模組。The present invention relates to a light-emitting device and a light source module, and more particularly to a light-emitting device and a light source module using a light-emitting diode as a light source.
發光二極體(light emitting diode, LED)為一種半導體元件,主要透過半導體化合物將電能轉換為光能以達到發光效果,因此具有壽命長、穩定性高及耗電量小等優點,目前已被廣泛地應用於居家、辦公、室外與行動照明,以取代燈管、白熾燈泡及鹵素燈等傳統的非指向性發光源。A light emitting diode (LED) is a semiconductor component that mainly converts electrical energy into light energy through a semiconductor compound to achieve a luminous effect, thereby having the advantages of long life, high stability, and low power consumption. Widely used in home, office, outdoor and mobile lighting to replace traditional non-directional light sources such as lamps, incandescent bulbs and halogen lamps.
配合參閱第一圖,為習知之發光裝置之剖視圖。發光裝置1包含一殼體10、一光源模組12、一驅動模組14、一燈罩16及複數連接線18。殼體10定義有一容置空間100,驅動模組14設置於容置空間100中,用以驅動光源模組12發出光線。光源模組12設於殼體10的一側,並通過連接線18電性連接於驅動模組14。光源模組12包含一電路板120及複數發光二極體122,電路板120呈平板狀,並具有一板面121,所述板面121為電路板120具有較大面積的一平面。發光二極體122設置於電路板120的板面121上,並與電路板120形成電性連接,使發光二極體122朝著相反於殼體10的方向發出光線。燈罩16與殼體10結合,使光源模組12位於燈罩16及殼體10之間。Referring to the first figure, it is a cross-sectional view of a conventional light-emitting device. The light-emitting device 1 includes a casing 10, a light source module 12, a driving module 14, a lamp cover 16, and a plurality of connecting wires 18. The housing 10 defines an accommodating space 100. The driving module 14 is disposed in the accommodating space 100 for driving the light source module 12 to emit light. The light source module 12 is disposed on one side of the housing 10 and electrically connected to the driving module 14 through the connecting line 18 . The light source module 12 includes a circuit board 120 and a plurality of light emitting diodes 122. The circuit board 120 has a flat shape and has a board surface 121. The board surface 121 is a plane having a large area of the circuit board 120. The LEDs 122 are disposed on the board surface 121 of the circuit board 120 and electrically connected to the circuit board 120 such that the LEDs emit light in a direction opposite to the housing 10. The lamp cover 16 is coupled to the housing 10 such that the light source module 12 is located between the lamp cover 16 and the housing 10.
由於發光二極體122為指向性光源,因此由發光二極體122發出的光線只能朝向前方(即相反於殼體10的方向)發出光線,加上目前發光二極體122的發光角度約為120度,故發光裝置1的發光角度遠不及於傳統的鹵素燈泡所發出的非指向性光源的發光角度,因而無法達到鹵素燈泡等非指向性光源的出光需求,進而導致使用者降低使用利用發光二極體122作為發光源的發光裝置1的意願。Since the light-emitting diode 122 is a directional light source, the light emitted by the light-emitting diode 122 can only emit light toward the front (ie, opposite to the direction of the casing 10), and the light-emitting angle of the current light-emitting diode 122 is about Since the illumination angle of the light-emitting device 1 is far less than the illumination angle of the non-directional light source emitted by the conventional halogen bulb, the light-emitting requirement of the non-directional light source such as a halogen bulb cannot be achieved, and the user is reduced in use. The intention of the light-emitting device 1 of the light-emitting diode 122 as a light-emitting source.
其次,所述發光裝置1的光源模組12及驅動模組14是透過連接線18而形成電性連接,故在組裝發光裝置1時,必須分別對連接線18與光源模組12及驅動模組14的接點進行焊接動作,整體製作程序較為繁複,且當發光裝置1受外力衝擊時,連接線18可能由光源模組12或驅動模組14上脫落,致使發光裝置1無法達到發光效果。The light source module 12 and the driving module 14 of the light-emitting device 1 are electrically connected through the connecting line 18. Therefore, when assembling the light-emitting device 1, the connecting line 18 and the light source module 12 and the driving mode must be respectively connected. The joints of the group 14 are welded, and the overall manufacturing process is complicated. When the light-emitting device 1 is impacted by an external force, the connecting wire 18 may be detached from the light source module 12 or the driving module 14, so that the light-emitting device 1 cannot achieve the light-emitting effect. .
本新型揭示內容之一技術態樣在於提供一種光源模組及發光裝置。One technical aspect of the present disclosure is to provide a light source module and a light emitting device.
在本技術態樣其他實施方式中,提供一種光源模組,所述光源模組包含一主電路板、複數發光單元及一驅動單元。主電路板上形成有複數通孔。發光單元包含一透明基板、一電路層及一透明膠層;透明基板包含一第一板面及一相對於第一板面之第二板面,透明基板設於主電路板上,且透明基板之第一板面與主電路板夾一預定角度。電路層設置於第一板面;發光二極體晶粒設於第一板面並與電路層形成電性連接;透明膠層設於第一板面及第二板面,並包覆發光二極體晶粒及部分之電路層。驅動單元包含一驅動電路板及一驅動器;驅動電路板包含複數凸部,凸部對應插設於通孔中,使驅動電路板大致垂直於主電路板上,並與主電路板形成電性連接。驅動器設置於驅動電路板上並與驅動電路板形成電性連接。In other embodiments of the present disclosure, a light source module is provided. The light source module includes a main circuit board, a plurality of light emitting units, and a driving unit. A plurality of through holes are formed in the main circuit board. The light emitting unit comprises a transparent substrate, a circuit layer and a transparent adhesive layer; the transparent substrate comprises a first plate surface and a second plate surface opposite to the first plate surface, the transparent substrate is disposed on the main circuit board, and the transparent substrate The first board surface is clamped to the main circuit board by a predetermined angle. The circuit layer is disposed on the first board surface; the light emitting diode die is disposed on the first board surface and electrically connected to the circuit layer; the transparent glue layer is disposed on the first board surface and the second board surface, and is coated with the light emitting Polar body grains and part of the circuit layer. The driving unit comprises a driving circuit board and a driver; the driving circuit board comprises a plurality of convex portions, and the convex portions are correspondingly inserted in the through holes, so that the driving circuit board is substantially perpendicular to the main circuit board and electrically connected with the main circuit board . The driver is disposed on the driving circuit board and electrically connected to the driving circuit board.
根據本技術態樣之其他實施方式,主電路板上具有複數插槽,透明基板對應插設於插槽中。According to other embodiments of the present disclosure, the main circuit board has a plurality of slots, and the transparent substrate is correspondingly inserted into the slots.
根據本技術態樣之其他實施方式,預定角度為90度。According to other embodiments of the present technical aspect, the predetermined angle is 90 degrees.
根據本技術態樣之其他實施方式,光源模組更包含複數連接件,設置於主電路板及電路層之間,用以連接主電路板及發光單元,並電性連接主電路板及電路層。According to another embodiment of the present disclosure, the light source module further includes a plurality of connecting members disposed between the main circuit board and the circuit layer for connecting the main circuit board and the light emitting unit, and electrically connecting the main circuit board and the circuit layer. .
根據本技術態樣之其他實施方式,預定角度大於90度。According to other embodiments of the present technical aspect, the predetermined angle is greater than 90 degrees.
根據本技術態樣之其他實施方式,光源模組更包含複數連接端子,連接於驅動電路板。According to other embodiments of the present disclosure, the light source module further includes a plurality of connection terminals connected to the driving circuit board.
根據本技術態樣之其他實施方式,發光單元等角度地排列在主電路板上。According to other embodiments of the present technical aspect, the light emitting units are arranged equiangularly on the main circuit board.
本技術態樣之另一實施方式提供一種發光裝置,所述發光裝置包含一殼體及一光源模組。殼體包含一環繞壁及一連接於環繞壁之底壁,環繞壁及底壁配合界定一容置空間及一連通於容置空間之開口,底壁上形成有複數穿孔。光源模組包含一主電路板、複數發光單元及一驅動單元;主電路板封閉開口,主電路板上形成有複數通孔。發光單元包含一透明基板、一電路層、複數發光二極體晶粒及一透明膠層;透明基板包含一第一板面及一相對於第一板面之第二板面,透明基板設於主電路板上,且透明基板之第一板面與主電路板夾一預定角度。電路層設置於第一板面;發光二極體晶粒設於第一板面並與電路層形成電性連接。透明膠層設於第一板面及第二板面,並包覆發光二極體晶粒及部分之電路層。驅動單元位於容置空間中,驅動單元包含一驅動電路板及一驅動器。驅動電路板包含複數凸部,凸部對應插設於通孔中,使驅動電路板大致垂直於主電路板上,並與主電路板形成電性連接。驅動器設置於驅動電路板上並與驅動電路板形成電性連接。Another embodiment of the present invention provides a light emitting device including a housing and a light source module. The housing comprises a surrounding wall and a bottom wall connected to the surrounding wall. The surrounding wall and the bottom wall cooperate to define an accommodating space and an opening communicating with the accommodating space, and the bottom wall is formed with a plurality of through holes. The light source module comprises a main circuit board, a plurality of light emitting units and a driving unit; the main circuit board closes the opening, and the plurality of through holes are formed on the main circuit board. The illuminating unit comprises a transparent substrate, a circuit layer, a plurality of illuminating diode dies and a transparent adhesive layer; the transparent substrate comprises a first plate surface and a second plate surface opposite to the first plate surface, and the transparent substrate is disposed on the transparent substrate On the main circuit board, the first board surface of the transparent substrate is clamped to the main circuit board by a predetermined angle. The circuit layer is disposed on the first board surface; the light emitting diode die is disposed on the first board surface and electrically connected to the circuit layer. The transparent adhesive layer is disposed on the first board surface and the second board surface, and covers the light emitting diode die and a part of the circuit layer. The driving unit is located in the accommodating space, and the driving unit comprises a driving circuit board and a driver. The driving circuit board includes a plurality of convex portions, and the convex portions are correspondingly inserted in the through holes, so that the driving circuit board is substantially perpendicular to the main circuit board and electrically connected to the main circuit board. The driver is disposed on the driving circuit board and electrically connected to the driving circuit board.
根據本技術態樣之其他實施方式,主電路板上具有複數插槽,透明基板對應插設於插槽中。According to other embodiments of the present disclosure, the main circuit board has a plurality of slots, and the transparent substrate is correspondingly inserted into the slots.
根據本技術態樣之其他實施方式,預定角度為90度。According to other embodiments of the present technical aspect, the predetermined angle is 90 degrees.
根據本技術態樣之其他實施方式,發光裝置更包含複數連接件,設置於主電路板及電路層之間,用以連接主電路板及發光單元,並電性連接主電路板及電路層。According to another embodiment of the present disclosure, the light emitting device further includes a plurality of connecting members disposed between the main circuit board and the circuit layer for connecting the main circuit board and the light emitting unit, and electrically connecting the main circuit board and the circuit layer.
根據本技術態樣之其他實施方式,預定角度大於90度。According to other embodiments of the present technical aspect, the predetermined angle is greater than 90 degrees.
根據本技術態樣之其他實施方式,發光單元等角度地排列在主電路板上。According to other embodiments of the present technical aspect, the light emitting units are arranged equiangularly on the main circuit board.
根據本技術態樣之其他實施方式,發光裝置更包含一燈罩,燈罩與殼體結合,使發光單元位於主電路板及燈罩之間。According to another embodiment of the present technical aspect, the light emitting device further includes a lamp cover, and the lamp cover is coupled to the housing such that the light emitting unit is located between the main circuit board and the lamp cover.
根據本技術態樣之其他實施方式,發光裝置更包含複數連接端子,連接於驅動電路板並穿伸於穿孔。According to other embodiments of the present disclosure, the light emitting device further includes a plurality of connection terminals connected to the driving circuit board and extending through the through holes.
根據本技術態樣之其他實施方式,燈罩包含一支撐部及複數固定部,支撐部連接於固定部,支撐部連接於殼體,使固定部具有一預定距離地撐立在主電路板上,固定部對應設置在發光單元上方。According to another embodiment of the present disclosure, the lamp cover includes a support portion and a plurality of fixing portions. The support portion is coupled to the fixing portion, and the support portion is coupled to the housing, so that the fixing portion has a predetermined distance to support the main circuit board. The fixing portion is correspondingly disposed above the light emitting unit.
請參考隨附圖示,本新型揭示內容之以上及額外目的、特徵及優點將透過本揭示內容之較佳實施例之以下闡釋性及非限制性詳細描敘予以更好地理解。The above and other objects, features, and advantages of the present invention will be better understood from the following description of the preferred embodiments.
配合參閱第二圖及第三圖,為本揭示內容第一實施方式之發光裝置之立體分解圖及組合圖。發光裝置3用以提供發光角度大於180度的光源。發光裝置3包含一殼體4、一光源模組5及一燈罩6。Referring to the second and third figures, an exploded perspective view and a combined view of a light-emitting device according to a first embodiment of the present disclosure are provided. The illuminating device 3 is for providing a light source having an illuminating angle greater than 180 degrees. The light-emitting device 3 includes a casing 4, a light source module 5 and a lamp cover 6.
殼體4包含一環繞壁40及一底壁42。底壁42連接於環繞壁40的底緣,並與環繞壁40配合界定一容置空間44及一連通於容置空間44的開口46。環繞壁40在鄰近於開口46之一側形成有複數卡扣48。底壁42上形成有複數穿孔420;在本實施方式中,穿孔420的數量以兩個做為說明範例。The housing 4 includes a surrounding wall 40 and a bottom wall 42. The bottom wall 42 is connected to the bottom edge of the surrounding wall 40 and cooperates with the surrounding wall 40 to define an accommodating space 44 and an opening 46 communicating with the accommodating space 44. The surrounding wall 40 is formed with a plurality of snaps 48 on one side adjacent to the opening 46. A plurality of through holes 420 are formed in the bottom wall 42. In the present embodiment, the number of the through holes 420 is exemplified by two.
配合參閱第四圖、第五圖及第六圖。光源模組5包含一主電路板50、複數發光單元52、一驅動單元54及複數連接端子56。主電路板50密封開口46(如第一圖及第二圖所示),主電路板50上形成有複數插槽500及複數通孔502;在本實施方式中,插槽500及通孔502分別為貫穿主電路板50的槽孔結構,在實際實施時,插槽500也可以是不貫穿主電路板50的槽孔結構。主電路板50可例如(但不限定)為印刷電路板,且主電路板50的其中之一板面51上佈設有複數電路佈線504及焊墊506,所述焊墊506設置鄰近於所述插槽500及所述通孔502,且所述焊墊506與電路佈線504形成電性連接。在此要說明的是,當主電路板50的板面51及相反於板面51的另一板面(未標號)皆佈設有電路佈線504及焊墊506時,則插槽500及通孔502都可以是不貫穿主電路板50的槽孔結構。Refer to the fourth, fifth and sixth figures. The light source module 5 includes a main circuit board 50, a plurality of light emitting units 52, a driving unit 54, and a plurality of connecting terminals 56. The main circuit board 50 seals the opening 46 (as shown in the first figure and the second figure). The main circuit board 50 is formed with a plurality of slots 500 and a plurality of through holes 502. In the embodiment, the slot 500 and the through hole 502 are formed. The slots 500 are formed through the main circuit board 50. In actual implementation, the slots 500 may also be slot structures that do not extend through the main circuit board 50. The main circuit board 50 can be, for example, but not limited to, a printed circuit board, and one of the board faces 51 of the main circuit board 50 is provided with a plurality of circuit wirings 504 and pads 506 disposed adjacent to the The socket 500 and the through hole 502, and the pad 506 is electrically connected to the circuit wiring 504. It should be noted that when the board surface 51 of the main circuit board 50 and the other board surface (not labeled) opposite to the board surface 51 are provided with the circuit wiring 504 and the bonding pad 506, the slot 500 and the through hole are provided. 502 may be a slot structure that does not extend through the main circuit board 50.
發光單元52包含一透明基板520、一電路層522、複數發光二極體晶粒524及一透明膠層526。透明基板520可例如(但不限定)使用玻璃或石英製作而成,透明基板520包含一第一板面5200及一相對於第一板面5200之第二板面5202;在本實施方式中,第一板面5200及第二板面5202分別為透明基板520具有較大面積的平面。The light emitting unit 52 includes a transparent substrate 520, a circuit layer 522, a plurality of light emitting diode dies 524, and a transparent adhesive layer 526. The transparent substrate 520 can be made of, for example, but not limited to, glass or quartz. The transparent substrate 520 includes a first plate surface 5200 and a second plate surface 5202 with respect to the first plate surface 5200. In this embodiment, The first plate surface 5200 and the second plate surface 5202 are planes having a large area of the transparent substrate 520, respectively.
電路層522貼設在透明基板520的第一板面5200,電路層522是使用具有導電特性的材料(例如:銅)製作而成,用以作為電力的傳導路徑。The circuit layer 522 is attached to the first plate surface 5200 of the transparent substrate 520. The circuit layer 522 is made of a material having electrical conductivity (for example, copper) and serves as a conduction path for electric power.
發光二極體晶粒524設置於第一板面5200並與電路層522形成電性連接。在本實施方式中,發光二極體晶粒524呈線性排列,實際實施時則不以此為限。The LED die 524 is disposed on the first board surface 5200 and electrically connected to the circuit layer 522. In the present embodiment, the LED 524 is linearly arranged, and is not limited thereto.
透明膠層526佈設於第一板面5200及第二板面5202,並包覆發光二極體晶粒524及部分電路層522(意即有一部分的電路層522露出在透明膠層526之外)。透明膠層526可例如(但不限定)為環氧樹脂或矽樹脂,透明膠層526可以提供發光二極體晶粒524發出的光線一混光空間,使發光單元52發出之光線的均勻提升;同時,透明膠層526也用以避免發光二極體晶粒524受到水氣或外力衝擊而損壞。在此要說明的是,透明膠層526內也可以均勻混合有一波長轉換物質(圖未示),所述波長轉換物質可例如為螢光粉,且所述波長轉換物質用以與發光二極體晶粒524發出的部分光線發生波長轉換並產生一波長轉換光線。所述波長轉換光線與發光二極體晶粒524發出的其他部分光線混光後可供產生一需求光色的光線。The transparent adhesive layer 526 is disposed on the first board surface 5200 and the second board surface 5202, and covers the LED die 524 and a portion of the circuit layer 522 (ie, a portion of the circuit layer 522 is exposed outside the transparent adhesive layer 526). ). The transparent adhesive layer 526 can be, for example, but not limited to, an epoxy resin or a resin. The transparent adhesive layer 526 can provide a light-mixing space emitted by the light-emitting diode die 524 to uniformly increase the light emitted by the light-emitting unit 52. At the same time, the transparent adhesive layer 526 is also used to prevent the light-emitting diode die 524 from being damaged by moisture or external force. It should be noted that the transparent adhesive layer 526 may also be uniformly mixed with a wavelength converting substance (not shown), and the wavelength converting substance may be, for example, a fluorescent powder, and the wavelength converting substance is used for emitting light A portion of the light emitted by the bulk crystal grains 524 undergoes wavelength conversion and produces a wavelength converted light. The wavelength-converted light is mixed with other portions of the light emitted by the LED die 524 to produce a light of a desired color.
所述發光單元52分別插設於插槽500中,使透明基板520的第一板面5200與主電路板50的板面51夾一預定角度,且發光單元52的電路層522與主電路板50的焊墊506接觸。在此要說明的是,當發光單元52插設於插槽500中,沒有被透明膠層526包覆的電路層522之一端會容設在插槽500中,使電路層522與主電路板50的焊墊506接觸。在本實施方式中,透明基板520的第一板面5200與主電路板50間的預定角度為90度,且發光單元52等角度地排列在主電路板50上。其中,發光單元52也可以依據所需求的光型而不為等角度排列,然而,等角度排列的發光單元52可以增加發光裝置3的出光均勻度。在此要說明的是,電路層522及焊墊506間可以透過焊接製程設置焊錫53在其間(如第五圖所示),以增加電路層522及焊墊506間的連接強度及電性連接能力。如此一來,發光單元52就與主電路板50形成電性連接。The light emitting units 52 are respectively inserted into the slots 500, so that the first board surface 5200 of the transparent substrate 520 and the board surface 51 of the main circuit board 50 are at a predetermined angle, and the circuit layer 522 of the light emitting unit 52 and the main circuit board The pad 506 of 50 is in contact. It should be noted that when the light emitting unit 52 is inserted into the slot 500, one end of the circuit layer 522 not covered by the transparent adhesive layer 526 is accommodated in the slot 500, so that the circuit layer 522 and the main circuit board The pad 506 of 50 is in contact. In the present embodiment, the predetermined angle between the first board surface 5200 of the transparent substrate 520 and the main circuit board 50 is 90 degrees, and the light emitting units 52 are equiangularly arranged on the main circuit board 50. The light-emitting units 52 may also be arranged at equal angles according to the required light patterns. However, the light-emitting units 52 arranged at equal angles may increase the light-emitting uniformity of the light-emitting device 3. It should be noted that the solder layer 53 can be disposed between the circuit layer 522 and the pad 506 therebetween (as shown in FIG. 5) to increase the connection strength and electrical connection between the circuit layer 522 and the pad 506. ability. In this way, the light emitting unit 52 is electrically connected to the main circuit board 50.
驅動單元54包含一驅動電路板540及一驅動器542。驅動電路板540可例如(但不限定)為印刷電路板,且其上預先佈設有銅箔線路5400。驅動電路板540的外型大致呈矩形,且驅動電路板540之一端部形成有複數凸部5402,所述銅箔線路5400同時也佈設在所述凸部5402上。所述凸部5402插設於所述通孔502中,使驅動電路板540大致垂直於主電路板50,且銅箔線路5400與設在主電路板50上的焊墊506接觸;較佳地,可以透過焊接製程使焊錫53設在銅箔線路5400及焊墊506間,以增加銅箔線路5400及焊墊506間的連接強度及電性連接能力。如此一來,驅動單元54就與主電路板50形成電性連接。The driving unit 54 includes a driving circuit board 540 and a driver 542. The driver circuit board 540 can be, for example, but not limited to, a printed circuit board with a copper foil line 5400 pre-wired thereon. The driving circuit board 540 has a substantially rectangular outer shape, and one end of the driving circuit board 540 is formed with a plurality of convex portions 5402, and the copper foil wiring 5400 is also disposed on the convex portion 5402. The protruding portion 5402 is inserted into the through hole 502 such that the driving circuit board 540 is substantially perpendicular to the main circuit board 50, and the copper foil line 5400 is in contact with the bonding pad 506 provided on the main circuit board 50; preferably The solder 53 can be disposed between the copper foil line 5400 and the pad 506 through a soldering process to increase the connection strength and electrical connection capability between the copper foil line 5400 and the pad 506. As a result, the driving unit 54 is electrically connected to the main circuit board 50.
驅動器542設置於驅動電路板540上,並與銅箔線路5400形成電性連接。驅動器542用以驅動發光單元52發出光線,驅動器542可例如包含交直流轉換電路。The driver 542 is disposed on the driving circuit board 540 and electrically connected to the copper foil line 5400. The driver 542 is used to drive the light emitting unit 52 to emit light, and the driver 542 can include, for example, an AC/DC converting circuit.
連接端子56連接於驅動電路板540,並與銅箔線路5400形成電性連接。在本實施方式中,發光單元5以包含兩個連接端子56作為說明範例,實際實施時,連接端子56的數量是對應於形成在底壁42上之穿孔420的數量。The connection terminal 56 is connected to the driving circuit board 540 and is electrically connected to the copper foil line 5400. In the present embodiment, the light-emitting unit 5 includes two connection terminals 56 as an illustrative example. In actual implementation, the number of connection terminals 56 corresponds to the number of the through holes 420 formed on the bottom wall 42.
復參閱第二圖及第三圖,實際在組裝發光裝置3時,驅動單元54是位在容置空間44內,所述連接端子56通過形成在底壁42上的穿孔420。露出於殼體4外的連接端子56供插接於外部燈座(未圖示)上,以擷取發光裝置3發光時所需的電力。Referring to the second and third figures, when the light-emitting device 3 is assembled, the driving unit 54 is located in the accommodating space 44, and the connecting terminal 56 passes through the through hole 420 formed in the bottom wall 42. The connection terminal 56 exposed outside the casing 4 is inserted into an external socket (not shown) to extract electric power required for the light-emitting device 3 to emit light.
燈罩6與殼體4結合,使發光單元52位於燈罩6及主電路板50之間。所述燈罩6包含一支撐部60及複數固定部62,固定部62連接於支撐部60,支撐部60用以將固定部62具有一預定距離的撐立在主電路板50上方。支撐部62的底緣形成有複數卡合孔600,所述卡合孔600與形成在環繞壁40的卡扣48對應接合,以將燈罩6固定在殼體4上。固定部62對應設於發光單元52上方,用以壓掣發光單元52,避免發光單元52受外力衝擊而扭轉。The lamp cover 6 is coupled to the housing 4 such that the lighting unit 52 is located between the lamp housing 6 and the main circuit board 50. The lamp cover 6 includes a supporting portion 60 and a plurality of fixing portions 62. The fixing portion 62 is connected to the supporting portion 60 for supporting the fixing portion 62 to a predetermined distance above the main circuit board 50. The bottom edge of the support portion 62 is formed with a plurality of engaging holes 600 that are correspondingly engaged with the buckles 48 formed around the surrounding wall 40 to fix the lamp cover 6 to the housing 4. The fixing portion 62 is correspondingly disposed above the light emitting unit 52 for pressing the light emitting unit 52 to prevent the light emitting unit 52 from being twisted by an external force.
綜合以上所述,本揭示內容之光源模組5的發光單元52及驅動單元54分別插接於主電路板50上並與主電路板50形成電性連接,可以有效地降低光源模組5組裝難度,且發光單元52及驅動單元54間透過主電路板50形成電性連接,發光單元52、驅動單元54及主電路板50間的接合強度強,故可有效避免光源模組5受外力衝擊時,發光單元52、驅動單元54與主電路板50脫離而致使發光裝置3無法發光的問題。再者,將發光單元52插接使立在主電路板50上可以有效地提高發光裝置3的發光角度,使提供一出光角度及光型近似於鹵素燈泡的光源。In summary, the light-emitting unit 52 and the driving unit 54 of the light source module 5 of the present disclosure are respectively connected to the main circuit board 50 and electrically connected to the main circuit board 50, which can effectively reduce the assembly of the light source module 5. Difficulty, and the light-emitting unit 52 and the driving unit 54 are electrically connected through the main circuit board 50, and the bonding strength between the light-emitting unit 52, the driving unit 54 and the main circuit board 50 is strong, so that the light source module 5 can be effectively prevented from being impacted by external force. At this time, the light-emitting unit 52 and the driving unit 54 are separated from the main circuit board 50, causing the light-emitting device 3 to fail to emit light. Moreover, the light-emitting unit 52 is inserted and placed on the main circuit board 50 to effectively increase the light-emitting angle of the light-emitting device 3, so as to provide a light source and a light source similar to a halogen light source.
配合參閱第七圖及第八圖,為本揭示內容第二實施方式之光源模組之立體分解圖及組合圖。第七圖及第八圖所示之光源模組5A與第一實施方式的光源模組5類似,且相同的元件標示以相同的符號。值得注意的是,兩者的差異在於第七圖及第八圖所示的光源模組5A更包含複數連接件7。FIG. 7 is a perspective exploded view and a combined view of a light source module according to a second embodiment of the disclosure. The light source module 5A shown in the seventh and eighth embodiments is similar to the light source module 5 of the first embodiment, and the same elements are denoted by the same reference numerals. It should be noted that the difference between the two is that the light source module 5A shown in the seventh and eighth figures further includes a plurality of connectors 7.
所述連接件7連接在主電路板50的焊墊506及發光單元52的電路層522間,所述連接件7用以使發光單元52之透明基板520的第一板面5200與主電路板50間之預定角度大於90度,藉以擴大發光單元52發出之光線的分佈角度。當然,在實際實施時,發光單元52之透明基板520的第一板面5200與主電路板50間之預定角度也可以小於90度。其次,所述連接件7同時使主電路板50的焊墊506及發光單元52的電路層522形成電性連接,所述連接件7是使用具有導電特性的材料製作而成。光源模組5A的各元件的功用與相關說明,實際上與第一實施方式的光源模組5相同,在此不予贅述。光源模組5A至少可達到與光源模組5相同的功能。The connecting member 7 is connected between the pad 506 of the main circuit board 50 and the circuit layer 522 of the light emitting unit 52. The connecting member 7 is used to make the first board surface 5200 of the transparent substrate 520 of the light emitting unit 52 and the main circuit board. The predetermined angle of 50 is greater than 90 degrees, thereby expanding the distribution angle of the light emitted by the light-emitting unit 52. Of course, in actual implementation, the predetermined angle between the first board surface 5200 of the transparent substrate 520 of the light emitting unit 52 and the main circuit board 50 may also be less than 90 degrees. Next, the connecting member 7 simultaneously electrically connects the pad 506 of the main circuit board 50 and the circuit layer 522 of the light emitting unit 52, and the connecting member 7 is made of a material having conductive properties. The function and related description of each element of the light source module 5A are substantially the same as those of the light source module 5 of the first embodiment, and will not be described herein. The light source module 5A can at least achieve the same function as the light source module 5.
當然,光源模組5A也可以配合與第一實施方式所述的殼體4及燈罩6組成一發光裝置,且具有光源模組5A的發光裝置也可以達到與第一實施方式的發光裝置3相同的功能。Of course, the light source module 5A can also be combined with the housing 4 and the lamp cover 6 of the first embodiment to form a light-emitting device, and the light-emitting device having the light source module 5A can also be the same as the light-emitting device 3 of the first embodiment. The function.
雖然本新型已以實施方式揭露如上,然其並非用以限定本新型,任何熟習此技藝者,在不脫離本新型的精神和範圍內,當可作各種的更動與潤飾,因此本新型的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application.
1、3‧‧‧發光裝置1, 3‧‧‧ illuminating devices
10、4‧‧‧殼體10, 4‧‧‧ shell
100、44‧‧‧容置空間100, 44‧‧‧ accommodating space
12、5、5A‧‧‧光源模組12, 5, 5A‧‧‧ light source module
120‧‧‧電路板120‧‧‧ boards
121‧‧‧板面121‧‧‧ board
122‧‧‧發光二極體122‧‧‧Lighting diode
14‧‧‧驅動模組14‧‧‧Drive Module
16、6‧‧‧燈罩16, 6‧‧‧ lampshade
18‧‧‧連接線18‧‧‧Connecting line
40‧‧‧環繞壁40‧‧‧ Surrounding wall
42‧‧‧底壁42‧‧‧ bottom wall
420‧‧‧穿孔420‧‧‧Perforation
46‧‧‧開口46‧‧‧ openings
48‧‧‧卡扣48‧‧‧ buckle
50‧‧‧主電路板50‧‧‧ main board
500‧‧‧插槽500‧‧‧ slots
502‧‧‧通孔502‧‧‧through hole
504‧‧‧電路佈線504‧‧‧Circuit wiring
506‧‧‧焊墊506‧‧‧ solder pads
51‧‧‧板面51‧‧‧ board
52‧‧‧發光單元52‧‧‧Lighting unit
520‧‧‧透明基板520‧‧‧Transparent substrate
5200‧‧‧第一板面5200‧‧‧ first board
5202‧‧‧第二板面5202‧‧‧ second board
522‧‧‧電路層522‧‧‧ circuit layer
524‧‧‧發光二極體晶粒524‧‧‧Light Emitting Diode Grains
526‧‧‧透明膠層526‧‧‧Transparent rubber layer
53‧‧‧焊錫53‧‧‧ Solder
54‧‧‧驅動單元54‧‧‧ drive unit
540‧‧‧驅動電路板540‧‧‧Drive circuit board
5400‧‧‧銅箔線路5400‧‧‧ copper foil line
5402‧‧‧凸部5402‧‧‧ convex
542‧‧‧驅動器542‧‧‧ drive
56‧‧‧連接端子56‧‧‧Connecting terminal
60‧‧‧支撐部60‧‧‧Support
600‧‧‧卡合孔600‧‧‧ snap hole
62‧‧‧固定部62‧‧‧ Fixed Department
7‧‧‧連接件7‧‧‧Connecting parts
第一圖為習知之發光裝置之剖視圖。The first figure is a cross-sectional view of a conventional illumination device.
第二圖為本揭示內容第一實施方式之發光裝置之立體分解圖。The second figure is an exploded perspective view of a light-emitting device according to a first embodiment of the present disclosure.
第三圖為本揭示內容第一實施方式之發光裝置之組合圖。The third figure is a combination diagram of a light-emitting device according to a first embodiment of the disclosure.
第四圖為本揭示內容第一實施方式之光源模組之立體分解圖。The fourth figure is an exploded perspective view of the light source module of the first embodiment of the disclosure.
第五圖為本揭示內容第一實施方式之光源模組之組合圖。The fifth figure is a combination diagram of the light source module of the first embodiment of the disclosure.
第六圖為本揭示內容第一實施方式之光源模組之另一視角之組合圖。The sixth figure is a combination view of another perspective of the light source module of the first embodiment of the disclosure.
第七圖為本揭示內容第二實施方式之光源模組之立體分解圖。FIG. 7 is an exploded perspective view of a light source module according to a second embodiment of the present disclosure.
第八圖為本揭示內容第二實施方式之光源模組之組合圖。The eighth figure is a combination diagram of the light source module of the second embodiment of the disclosure.
5‧‧‧光源模組 5‧‧‧Light source module
50‧‧‧主電路板 50‧‧‧ main board
500‧‧‧插槽 500‧‧‧ slots
502‧‧‧通孔 502‧‧‧through hole
504‧‧‧電路佈線 504‧‧‧Circuit wiring
506‧‧‧焊墊 506‧‧‧ solder pads
51‧‧‧板面 51‧‧‧ board
52‧‧‧發光單元 52‧‧‧Lighting unit
520‧‧‧透明基板 520‧‧‧Transparent substrate
5200‧‧‧第一板面 5200‧‧‧ first board
5202‧‧‧第二板面 5202‧‧‧ second board
522‧‧‧電路層 522‧‧‧ circuit layer
524‧‧‧發光二極體晶粒 524‧‧‧Light Emitting Diode Grains
526‧‧‧透明膠層 526‧‧‧Transparent rubber layer
54‧‧‧驅動單元 54‧‧‧ drive unit
540‧‧‧驅動電路板 540‧‧‧Drive circuit board
5400‧‧‧銅箔線路 5400‧‧‧ copper foil line
5402‧‧‧凸部 5402‧‧‧ convex
542‧‧‧驅動器 542‧‧‧ drive
56‧‧‧連接端子 56‧‧‧Connecting terminal
Claims (16)
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TW104208800U TWM510419U (en) | 2013-09-04 | 2013-09-04 | Illuminant device and lighting module thereof |
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TW104208800U TWM510419U (en) | 2013-09-04 | 2013-09-04 | Illuminant device and lighting module thereof |
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Publication Number | Publication Date |
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TWM510419U true TWM510419U (en) | 2015-10-11 |
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