TWM509223U - Electro-deposition equipment, holding device and spring type holding mechanism thereof - Google Patents

Description

Electrodeposition device, holding device and spring type holding mechanism thereof

The present invention relates to a machine component for holding a substrate, in particular to a spring-type holding mechanism for holding a workpiece to be processed in a coating process, a holding device having the spring-type holding mechanism, and electrodeposition using the same device.

As is well known, "electroplating" is a method of plating a film on an object by an electrolytic reduction reaction, and the process equipment used is different depending on the desired plating (such as nickel plating, silver plating, tin plating, etc.). Regardless of the type of process equipment used, no fixed device is required in each plating zone to fix the workpiece to be plated, so that the positioning position remains unchanged during the coating process. The surface of the plated workpiece is plated with a metal coating.

However, the conventional electroplating fixing device mainly uses a colloidal structure of different amounts to hold the workpiece to be electroplated, and in the high temperature environment, the workpiece to be electroplated may be bent and deformed due to the expansion coefficient, so that a part of the colloidal structure cannot be combined with The workpiece to be electroplated is effectively bonded, so that the workpiece to be electroplated is dropped; in a more serious case, the fragmentation may occur.

One of the objects of the present invention is to provide a novel spring-type holding mechanism and a holding device using the same, which can provide better holding flexibility, so that the object to be processed is not heated by high temperature. influences.

In order to achieve the goal, the present invention adopts the following technical solution: a spring-type holding mechanism for holding a workpiece to be processed, the spring-type holding mechanism comprises: a base, a supporting positioning member, an elastic member and a limit Component. The base has a first surface and a second surface opposite to the first surface; the support positioning member is disposed on the base, the support positioning member has a receiving portion and a extending portion of the receiving portion a shaft portion; the elastic member is disposed inside the base, the elastic member surrounds the shaft portion and maintains elastic contact with the receiving portion; the limiting assembly is coupled to the shaft portion for limiting the support positioning The location of the piece.

Based on the above-mentioned spring-type holding mechanism, the present invention further provides a holding device, which is suitable for fixing at least one object to be processed in a coating chamber, the holding device comprising: a carrying unit and a plurality of spring-type holding mechanisms. The spring-type retaining mechanism is disposed on the carrying unit, wherein the spring-type retaining mechanisms each include a base, a supporting positioning member, an elastic member and a limiting component; the base has a first surface And a second surface opposite to the first surface; the support positioning member is disposed on the base, the support positioning member has a receiving portion and a shaft portion formed by the extending portion, wherein the receiving portion is located Above the first surface, and a portion of the shaft portion protrudes from the second surface; the elastic member is disposed inside the base, the elastic member surrounds the shaft portion and maintains elastic contact with the receiving portion; The limiting component is coupled to the shaft portion for limiting the position of the support positioning member.

Based on the above holding device, the present invention further provides an electrodeposition apparatus comprising: a coating chamber, a holding device, and a plating device. The holding device is disposed in the coating chamber for holding at least one object to be processed, the holding device includes a carrying unit and a plurality of spring-type retaining mechanisms disposed on the carrying unit; wherein the spring-type retaining mechanism Each of the base includes a base, a support positioning member, an elastic member and a limiting component, the base has a first surface and a second surface opposite to the first surface, the support positioning member is disposed on the base The support positioning member has a receiving portion and a shaft portion formed by the extending portion, wherein the receiving portion is located above the first surface, and a part of the shaft portion protrudes from the second surface, elasticity The member is disposed inside the base, the elastic member surrounds the shaft portion and maintains elastic contact with the receiving portion, and the limiting assembly is coupled to the shaft portion for limiting the position of the supporting positioning member; It is provided corresponding to the holding device.

The present invention has at least the following technical effects: the holding device of the present invention is easy to manufacture, low in cost, and suitable for articles to be processed of different sizes, which greatly improves the practicality.

Furthermore, the present invention passes through a plurality of spring-type holding mechanisms disposed on the carrying unit, wherein the supporting positioning member is disposed on the base, and the elastic member is disposed inside the base and maintains elastic contact with the supporting positioning member, and the limit group is used. The design to limit the position of the support locator provides better retention flexibility to prevent the object to be electroplated from falling due to high temperature heating.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and description, and are not intended to limit the creation.

E‧‧‧Electrodeposition equipment

100, 100’‧‧‧ holding device

1‧‧‧bearing unit

2, 2'‧‧ ‧ spring-type retaining mechanism

21‧‧‧Base

211‧‧‧ first side

212‧‧‧ second side

213‧‧‧Component configuration space

2131‧‧‧First accommodation cavity

2132‧‧‧Second accommodating chamber

D1, d2‧‧‧ inside diameter

22‧‧‧Support positioning parts

221‧‧‧Acceptance Department

2211‧‧‧Main areas

2212‧‧‧ surrounding area

2213‧‧‧Limited holes

222‧‧‧Axis

23‧‧‧Flexible parts

24‧‧‧Limited components

241‧‧‧ Limit gasket

242‧‧‧Locker

243‧‧‧Limited Column

2431‧‧‧Great Path Department

25‧‧‧Next layer

200‧‧‧ coating chamber

300‧‧‧Electroplating unit

C1, C2‧‧‧ center line

W‧‧‧Items to be processed

FIG. 1 is a schematic structural view of a holding device according to a first embodiment of the present invention.

2 is an exploded perspective view of the spring-type holding mechanism of the first embodiment of the present invention.

Fig. 3A is a view showing the use state (1) of the spring type holding mechanism of the first embodiment of the present invention.

Fig. 3B is a view showing the use state (2) of the spring type holding mechanism of the first embodiment of the present invention.

FIG. 4 is a schematic structural view of a holding device according to a second embodiment of the present invention.

Fig. 5 is an exploded perspective view showing the spring type holding mechanism of the second embodiment of the present invention.

Fig. 6A is a view showing a state of use of the spring type holding mechanism of the second embodiment of the present invention.

Fig. 6B is a view showing the use state (2) of the spring type holding mechanism of the second embodiment of the present invention.

Fig. 6C is a view (3) showing a state of use of the spring type holding mechanism of the second embodiment of the present invention.

FIG. 7 is a schematic structural view of the electrodeposition apparatus of the present invention.

The various embodiments and advantages of the present invention are described in detail below with reference to the accompanying drawings.

[First Embodiment]

FIG. 1 is a schematic structural view of a holding device according to a first embodiment of the present invention. As shown in the figure, the holding device 100 of the present embodiment mainly includes a carrying unit 1 and a plurality of spring-type holding mechanisms 2 disposed on the carrying unit 1. The carrying unit 1 can be a carrying platform, and the spring-type holding mechanisms 2 are disposed on the carrying unit 1 and are evenly distributed.

It should be noted that the holding device 100 provided by the first embodiment of the present invention is applicable to various processing chambers, for example, an electroplating chamber, an electrochemical polishing chamber, a chemical mechanical polishing chamber, and the like; and the holding device 100 mainly transmits through The plurality of spring-type holding mechanisms 2 are connected to a workpiece W to be processed to hold the larger-sized object to be processed W, wherein the object to be processed W can be, but not limited to, a substrate of a glass substrate or a semiconductor material.

In addition, although the number of the spring-type holding mechanisms 2 corresponding to one object W to be processed is four in the holding device 100 shown in FIG. 1, for the other embodiments of the present embodiment, one is to be treated. The number of spring-type holding mechanisms 2 of the processed article W may be four or more. That is to say, the number of the spring-type holding mechanism 2 shown in FIG. 1 is for illustrative purposes only, and the present invention is not limited thereto. The number of the spring-type holding mechanisms 2 can be determined according to the size of the workpiece W to be processed.

Please refer to FIG. 2, FIG. 3A and FIG. 3B together. FIG. 2 is an exploded perspective view of the spring-type holding mechanism according to the first embodiment of the present invention, and FIG. 3A and FIG. A state diagram of the use of a spring-type holding mechanism. In the holding device 100, the spring-type holding mechanism 2 functions to hold one side of the object to be processed W to restrain the workpiece W to be processed; each spring-type holding mechanism 2 includes a base 21 and a supporting positioning member. 22. An elastic member 23 and a limit assembly 24.

In this embodiment, the base 21 can be assembled by the remaining components, and the present invention does not limit its configuration; the support positioning member 22 is used to receive and hold the object to be processed W in a fixed position, and supports the positioning member 22. A part of the elastic member 23 is mounted on the base 21 and is in elastic contact with the support positioning member 22, so that the support positioning member 22 can be stretched and compressed by the elastic member 23. The stroke is to buffer the deformation of the workpiece W, and the limiting component 24 is in contact with the end of the supporting positioning member 22 for limiting the supporting positioning member 22 so as not to be separated from the base 21 by an external force.

Further, the pedestal 21 has a first surface 211 exposed to the outside and a second surface 212 opposite to the first surface 211, and the inner wall surface of the pedestal 21 defines a first accommodating cavity 2131 and a The second accommodating cavity 2132, the first and second accommodating cavities 2131, 2132 are vertically dislocated and communicate with each other, and the first and second accommodating cavities 2131, 2132 form a component arranging space 213 to provide a supporting locating member. The main part of 22 and the elastic member 23 are provided. The inner diameter d1 of the first accommodating cavity 2131 must be larger than the inner diameter d2 of the second accommodating cavity 2132 according to the size and positioning of the component.

In addition, the first surface 211 of the base 21 is provided with a first opening that communicates with the first accommodating cavity 2131 (not shown). The second surface 212 of the base 21 is provided with a second opening (not shown) that communicates with the second receiving cavity 2132.

The support locating member 22 can be made of metal. For example, the support locating member 22 can be an aluminum member. The support positioning member 22 has a receiving portion 221 and a shaft portion 222 formed by the extending portion 221. The structural portion is designed to have a circular circular plate shape and the shaft portion 222 has a cylindrical shape. The receiving portion 221 itself defines a main area 2211 and a peripheral area 2212 surrounding the main area 2211. The shaft portion 222 It is formed at the center of the main region 2211 and extends along the first surface 211 of the susceptor 21 in the direction of the second surface 222. When the support positioning member 22 is assembled, the receiving portion 221 is above the first surface 211, and the shaft portion 222 extends along the first surface 211 toward the second surface 212.

The elastic member 23 can be a compression spring. The elastic member 23 is sleeved on the shaft portion 222 of the support locating member 22. One end of the elastic member 23 is fixed to the bottom surface of the second accommodating chamber 2132, and the other end is elastic with the receiving portion 221 contact. The limiting component 24 is coupled to the shaft portion 222 of the supporting locating member 22. The limiting component 24 mainly includes a limiting spacer 241 and a locking member 242. When the mounting member is used, the limiting portion 241 can be used to abut the shaft portion. The end of 222 is then locked into the shaft portion 222 by the fastener 242 passing through the limit spacer 241, wherein the lock 242 can be a screw. Accordingly, the limit spacer 241 can be actuated together with the support positioning member 22 and the elastic member 23.

As described above, the constituent elements of the holding device 100 and the detailed features thereof have been described in detail, and the manner of use of the holding device 100 provided by the first embodiment of the present creation will be further explained.

Referring to FIG. 3A and FIG. 3B, first, the holding device 100 is placed in a processing chamber (such as a plating chamber), and the holding device 100 can be placed vertically or horizontally according to the process requirements; then, an appropriate size is selected. The object W is processed and combined with the holding device 100, and the bonding may be performed by first forming an adhesive layer 25 on the receiving portion 221 of all the supporting positioning members 22, and then passing through the adhesive layer 25 and the object to be processed. W is joined together. At the same time, as shown in FIG. 3A, the support positioning member 22 together with the limiting member 24 may be displaced downward due to the gravity of the object W to be processed, and the elastic member 23 is gradually compressed until the receiving portion 221 contacts the first portion. A cavity is placed on the bottom surface of the cavity 2131.

Thereafter, although the object to be processed W is heated by the high temperature in the process to cause bending deformation, it is worth noting that, as shown in FIG. 3B, since the receiving portion 221 of the support positioning member 22 is in elastic contact with the elastic member 23, the support is supported. The positioning member 22 together with the limiting member 24 will have an upward position with the warpage generated by the object W to be processed. The object W to be processed is continuously restrained by the adhesive layer 241 and the stopper 241.

Further, in the high temperature environment, the object to be processed W may be bent inward or outward due to the relationship of the expansion coefficient; at the same time, the receiving portion 221 of the support positioning member 22 may be bent and deformed. Moving from a position close to the susceptor 21 to a position away from the susceptor 21, and in this way, preventing the object to be processed W from falling due to high temperature heating is particularly effective for a large-sized object to be processed W.

[Second embodiment]

FIG. 4 is a schematic structural view of a holding device according to a second embodiment of the present invention. The holding device 100' provided by the second embodiment of the present invention is applicable to various types of processing chambers, for example, an electroplating chamber, an electrochemical polishing chamber, a chemical mechanical polishing chamber, etc.; a difference from the previous embodiment is that The holding device 100' of the embodiment mainly holds the small-sized object to be processed W by means of "a spring-type holding mechanism 2' is connected to an object to be processed W".

Please refer to FIG. 5 , which is an exploded perspective view of the spring-type holding mechanism of the second embodiment of the present invention. In the spring-type holding mechanism 2 ′ of the embodiment, the limiting component 24 further includes a plurality of limiting posts 243 , and the peripheral region 2212 of the receiving portion 221 of the supporting positioning member 22 defines a plurality of matching with the limiting posts 243 . The limiting hole 2213 is fixed to the base 21 through the limiting holes 2213, wherein the limiting posts 243 are spaced apart from the inner edges of the corresponding limiting holes 2213. .

In addition, although the number of the limiting post 243 and the limiting hole 2213 is four in the spring-type holding mechanism 2' shown in FIG. 5, for other embodiments of the embodiment, the limiting post 243 and the limit The number of bit holes 2213 may be four or more. That is to say, the number of the limiting post 243 and the limiting hole 2213 shown in FIG. 5 is for illustrative purposes only, and the present invention is not limited thereto.

Referring to Figures 6A through 6C, the manner of use of the holding device 100' provided by the second embodiment of the present invention is further explained. First, as shown in Figs. 6A and 6B, the support positioning member 22 of each spring-type holding mechanism 2' can be used to place an object to be processed W, when When the object to be processed W is accurately placed, the center line C1 of the object to be processed W completely overlaps with the center line C2 of the support positioning member 22. Then, as shown in FIG. 6C, although the object to be processed W may be displaced due to being not accurately placed or subjected to an external force, when the support positioning member 22 generates a downward displacement, the object to be processed is to be processed. The W can still be stably supported on the limit post 243 such that the center line C1 of the object W to be processed is parallel to the center line C2 of the support positioning member 22 (i.e., the position of the object W to be processed is not offset).

As described in the above embodiments, the overall structural design and function of the holding device 100 of the present invention have been described in detail, and the application fields thereof will be briefly described next.

Please refer to FIG. 7 , which is a basic structural diagram of the electrodeposition apparatus of the present invention. As shown, the electrodeposition apparatus E mainly includes a coating chamber 200, at least one holding device 100, and at least one plating device 300. In this embodiment, the coating chamber 200 may be a vacuum chamber suitable for the coating process of the anti-reflection film (AR); the holding device 100 is used for fixing at least one object to be electroplated W in a coating chamber 200, wherein the coating is held therein The device 100 can be mounted horizontally or vertically on a bracket (not shown) and stood in the coating chamber 200 by the bracket; the plating device 300 is disposed corresponding to the holding device 100, and the constituent elements of the plating device 300 are not The focus of this creation is not to be repeated. It should be noted that the number of the plating apparatus 300 and the holding apparatus 100 also correspond, and those skilled in the art can increase or decrease the number of both according to the required production capacity.

In summary, the present invention has at least the following advantages over the conventional carrier to be electroplated: First of all, the holding device of the present invention is easy to manufacture, low in cost, and suitable for different sizes of objects to be processed, so that the practicality is greatly improved.

Secondly, the holding device of the present invention passes through a plurality of spring-type holding mechanisms disposed on the carrying unit, wherein the supporting positioning member is disposed on the base, and the elastic member is disposed inside the base and maintains elastic contact with the supporting positioning member, and the limit is The design of the group to limit the position of the support locator provides better retention flexibility to prevent the object to be electroplated from falling due to high temperature heating.

Furthermore, the spring-type holding mechanism of the present invention has a plurality of limiting holes formed on the supporting positioning member, and a plurality of limiting posts in the limiting component respectively pass through the limiting holes and are fixed on the base. The design can be firmly held on the limit post even if the workpiece is not accurately placed or displaced due to external force.

The above description is only an embodiment of the present invention, and is not intended to limit the scope of patent protection of the present invention. Anyone who is familiar with the art of the artist, within the spirit and scope of the creation, the equivalent of the changes and retouching, still fall within the scope of the patent protection of this creation.

100‧‧‧ holding device

1‧‧‧bearing unit

2‧‧‧Spring type retaining mechanism

21‧‧‧Base

W‧‧‧Items to be processed

Claims (21)

The utility model relates to a spring-type holding mechanism, which is suitable for holding a workpiece to be processed. The spring-type holding mechanism comprises: a base having a first surface and a second surface opposite to the first surface; a support positioning member disposed on the The support positioning member has a receiving portion and a shaft portion formed by the extending portion, the receiving portion is located above the first surface, and the shaft portion is along the first surface toward the second surface a direction extending; an elastic member disposed on the base, the elastic member surrounding the shaft portion and maintaining elastic contact with the receiving portion; and a limiting component coupled to the shaft portion for limiting the support The position of the positioning piece. The spring-type holding mechanism of claim 1, wherein the base is provided with a first accommodating cavity and a second accommodating cavity, and the first accommodating cavity and the second accommodating cavity are vertically displaced The first accommodating cavity and the second accommodating cavity form a component arrangement space, and a main portion of the support locating member and the elastic component are installed in the component arrangement space. The spring-type holding mechanism of claim 2, wherein an inner diameter of the first receiving cavity is larger than an inner diameter of the second receiving cavity. The spring-type holding mechanism according to claim 1, wherein the receiving portion of the supporting positioning member has a main portion and a peripheral portion surrounding the main portion, the shaft portion of the supporting positioning member is located at the center of the main portion Formed along the first surface of the base extending in the direction of the second surface. The spring-type retaining mechanism of claim 4, wherein the limiting component further comprises a plurality of limiting posts, wherein the peripheral portion of the receiving portion defines a plurality of limiting holes that cooperate with the limiting posts, and The limiting posts are respectively fixed to the base through the limiting holes. The spring-type retaining mechanism of claim 5, wherein the limiting posts each have a large diameter portion, and the outer diameters of the large diameter portions are smaller than the corresponding apertures of the limiting holes. The spring-type holding mechanism of claim 1, wherein the limiting component comprises a limit a spacer and a locking member, the limiting spacer is in contact with the shaft portion of the supporting positioning member, and the locking member is locked into the shaft portion through the limiting spacer. A holding device is adapted to fix at least one object to be processed in a coating chamber, the holding device comprising: a carrying unit; and at least one spring-type holding mechanism disposed on the carrying unit, wherein the spring-type holding mechanism comprises a base having a first surface and a second surface opposite to the first surface; a support positioning member disposed on the base, the support positioning member having a receiving portion and an extension portion extending from the receiving portion a shaft portion, the receiving portion is located above the first surface, and the shaft portion extends along the first surface toward the second surface; an elastic member is disposed on the base, the elastic member is surrounded by The shaft portion is in elastic contact with the receiving portion; and a limiting assembly is coupled to the shaft portion for limiting the position of the supporting positioning member. The holding device of claim 8, wherein the base is provided with a first accommodating cavity and a second accommodating cavity, and the first accommodating cavity and the second accommodating cavity are vertically displaced and mutually The first accommodating cavity and the second accommodating cavity form a component arrangement space, and a main part of the support locating member and the elastic component are installed in the component arrangement space. The holding device of claim 9, wherein an inner diameter of the first accommodating cavity is larger than an inner diameter of the second accommodating cavity. The holding device of claim 8, wherein the receiving portion of the supporting positioning member has a main area and a peripheral area surrounding the main area, the shaft portion of the supporting positioning member is located at the center of the main area and along the The first surface of the base extends to extend in the direction of the second surface. The holding device of claim 11, wherein the limiting component further comprises a plurality of limiting posts, wherein the peripheral region of the receiving portion defines a plurality of limiting holes that cooperate with the limiting posts, and the The limit post is respectively fixed through the limit holes The pedestal. The holding device of claim 12, wherein the limiting posts each have a large diameter portion, and the outer diameters of the large diameter portions are smaller than the corresponding apertures of the limiting holes. The holding device of claim 8, wherein the limiting component comprises a limiting spacer and a locking member, the limiting spacer is in contact with the shaft portion of the supporting positioning member, and the locking member passes through the limit The spacer is locked into the shaft. An electrodeposition apparatus comprising: a coating chamber; a holding device disposed in the coating chamber for holding at least one object to be processed, the holding device comprising a carrying unit and at least one spring disposed on the carrying unit The retaining mechanism, wherein the spring retaining mechanism comprises: a base having a first surface and a second surface opposite to the first surface; a support positioning member disposed on the base, the support positioning member Having a receiving portion and a shaft portion formed by the extending portion, the receiving portion is located above the first surface, and the shaft portion extends along the first surface toward the second surface; an elastic member is disposed On the base, the elastic member surrounds the shaft portion and maintains elastic contact with the receiving portion; and a limiting assembly is coupled to the shaft portion for limiting the position of the supporting positioning member; and a plating device , corresponding to the holding device. The electrodeposition apparatus of claim 15, wherein the susceptor has a first accommodating cavity and a second accommodating cavity, wherein the first accommodating cavity and the second accommodating cavity are vertically dislocated and mutually The first accommodating cavity and the second accommodating cavity form a component arrangement space, and a main portion of the support locating member and the elastic component are installed in the component arrangement space. The electrodeposition apparatus of claim 16, wherein an inner diameter of the first accommodating cavity is larger than an inner diameter of the second accommodating cavity. The electrodeposition apparatus according to claim 15, wherein the receiving portion of the support positioning member The main portion and the peripheral portion surrounding the main portion are formed by the central portion of the main portion extending from the first surface of the main portion toward the second surface. The electrodeposition apparatus of claim 18, wherein the limiting component further comprises a plurality of limiting posts, wherein the peripheral region of the receiving portion defines a plurality of limiting holes that cooperate with the limiting posts, and the The limiting posts are respectively fixed to the base through the limiting holes. The electrodeposition apparatus of claim 19, wherein the plurality of limiting posts each have a large diameter portion, and the outer diameters of the large diameter portions are smaller than the corresponding apertures of the limiting holes. The electrodeposition apparatus of claim 15, wherein the limiting component comprises a limiting spacer and a locking member, the limiting spacer is in contact with the shaft portion of the supporting positioning member, and the locking member passes through the The limit pad is locked into the shaft.