TWM502246U - Bearing seat for chip tester - Google Patents
Bearing seat for chip tester Download PDFInfo
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- TWM502246U TWM502246U TW103222304U TW103222304U TWM502246U TW M502246 U TWM502246 U TW M502246U TW 103222304 U TW103222304 U TW 103222304U TW 103222304 U TW103222304 U TW 103222304U TW M502246 U TWM502246 U TW M502246U
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- positioning block
- wafer
- carrier
- fixing piece
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
本創作係為一種用於晶片測試機的承載座,尤指一種可同時承載兩片晶片的承載座。The present invention is a carrier for a wafer testing machine, and more particularly a carrier that can carry two wafers at the same time.
矽晶圓是目前製作積體電路的主要材料,將經過精煉後的矽錠切片,研磨之後就成為厚薄一致、像鏡子一樣的晶圓,由晶圓形成各種不同種類的電子元件,如電晶體和二極體。矽 Wafer is the main material for making integrated circuits. After the refined bismuth ingot is sliced, it becomes a thick and uniform mirror-like wafer. Various kinds of electronic components, such as transistors, are formed from the wafer. And diodes.
晶圓是最常用的半導體材料,按其直徑分為4英寸、5英寸、6英寸、8英寸、……20英吋以上等規格,晶圓越大,同一圓片上可生產的IC就越多,成本即可大幅降低,但對生產技術的要求更高,若是均勻度不足,將導致不良品的產生,無論是何種規格的晶圓,在其切割後,皆需要進行檢驗,以避免不良品輸出導致後續生產問題。Wafers are the most commonly used semiconductor materials. They are divided into 4", 5", 6", 8", ... 20" and above. The larger the wafer, the more ICs can be produced on the same wafer. The cost can be greatly reduced, but the production technology is more demanding. If the uniformity is insufficient, it will lead to the production of defective products. No matter what kind of wafer, after cutting, it needs to be inspected to avoid Good product output leads to subsequent production problems.
請參閱第1圖所示,其為習知的單顆晶片測試機用於搭載晶片的承載座90,其上設置有用於對位的右對位片91與下對位片92,將晶片C的右邊緣與下邊緣分別靠扺於右對位片91與下對位片92,藉以使晶片C位於探針對應的位置,而可供探針進行檢測。Referring to FIG. 1 , it is a conventional single wafer tester for a carrier 90 on which a wafer is mounted, on which a right alignment sheet 91 and a lower alignment sheet 92 for alignment are disposed. The right edge and the lower edge respectively lie on the right aligning piece 91 and the lower aligning piece 92, so that the wafer C is located at a position corresponding to the probe, and can be detected by the probe.
然而,此種習知的承載座90,其一次僅能對一片晶片C進行 承載,其效率較差,再者,若為加速檢驗的數量,則唯一的方式即是增加檢驗的機台與承載座90,此將使成本大幅增加。However, such a conventional carrier 90 can only perform one wafer C at a time. The load is inefficient, and in addition, if the number of inspections is accelerated, the only way is to increase the inspection machine and the carrier 90, which will greatly increase the cost.
為克服習知技術的問題,本創作係提供一種承載座,其可供兩片待測試晶片置放,藉以減少裝載的工序,提升檢測的效率,克服習知技術的問題。In order to overcome the problems of the prior art, the present invention provides a carrier that can be placed on two wafers to be tested, thereby reducing the loading process, improving the efficiency of detection, and overcoming the problems of the prior art.
為達上述目的,本創作之一種用於晶片測試機之承載座,其可用以承載兩片待測試的晶片,其包括一座體、一下固定片、一右定位塊與一左定位塊。下固定片設置於該座體上。右定位塊設置於該座體之右側。左定位塊設置於該座體,並位於該右定位塊的相對側。其中,該右定位塊與該下固定片分別抵頂於一晶片的右側與下側;該左定位塊與該下固定片分別用以抵頂於一晶片的左側與下側。To achieve the above object, a carrier for a wafer testing machine of the present invention can be used to carry two wafers to be tested, including a body, a lower fixing piece, a right positioning block and a left positioning block. The lower fixing piece is disposed on the seat body. The right positioning block is disposed on the right side of the seat. The left positioning block is disposed on the seat body and is located on an opposite side of the right positioning block. The right positioning block and the lower fixing piece respectively abut on the right side and the lower side of a wafer; the left positioning block and the lower fixing piece are respectively used to abut the left side and the lower side of a wafer.
晶片可分別同時置放兩組,故可達到一次承載兩片晶片之效能,可配合兩組檢測用的探針,同時對此二組晶片進行檢測,達到可加速檢測之功效。The wafers can be placed in two sets at the same time, so that the performance of carrying two wafers at a time can be achieved, and the probes for two sets of detection can be matched, and the two sets of wafers can be detected at the same time, thereby achieving the effect of accelerating detection.
較佳者,其中該右定位塊係結合一位移微調機構,用以改變右定位塊與該座體的相對位置,藉以進行晶片與測試探針的位置調整。Preferably, the right positioning block is combined with a displacement fine adjustment mechanism for changing the relative position of the right positioning block and the base body, thereby performing position adjustment of the wafer and the test probe.
較佳者,其中該左定位塊係為一片體,藉以可抵頂晶片,供晶片作為對位之用。Preferably, the left positioning block is a piece of the body, so that the top wafer can be abutted for the wafer to be used for alignment.
較佳者,該右定位塊係為角柱體,其頂端係抵頂於晶片的左端,藉以便於對位的進行。Preferably, the right positioning block is a corner cylinder, the top end of which is abutted against the left end of the wafer, so as to facilitate the alignment.
為利 貴審查員瞭解本創作之技術特徵、內容與優點及其所能達成之功效,茲將本創作配合附圖,並以實施例之表達形式詳細說明如下,而其中所使用之圖式,其主旨僅為示意及輔助說明書之用,未必為本創作實施後之真實比例與精準配置,故不應就所附之圖式的比例與配置關係解讀、侷限本創作於實際實施上的權利範圍,合先敘明。In order to understand the technical characteristics, content and advantages of the creation and the effects that can be achieved by the examiner, the author will use the drawings in detail and explain the following in the form of the examples, and the drawings used therein The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the original creation. Therefore, the proportions and configuration relationships of the attached drawings should not be interpreted or limited in the actual implementation scope. First described.
C‧‧‧晶片C‧‧‧ wafer
10‧‧‧座體10‧‧‧ body
30‧‧‧下固定片30‧‧‧ lower fixed piece
40‧‧‧右定位塊40‧‧‧right positioning block
50‧‧‧左定位塊50‧‧‧Left positioning block
60‧‧‧位移微調機構60‧‧‧ Displacement fine-tuning mechanism
第1圖係為習知承載座之示意圖。Figure 1 is a schematic view of a conventional carrier.
第2圖係為本實施例之俯視示意圖。Figure 2 is a top plan view of the present embodiment.
第3圖係為本實施例之立體示意圖。Figure 3 is a perspective view of the present embodiment.
請參閱第2圖及第3圖所示,本實施例之用於晶片測試機之承載座,其可用以承載兩片待測試的晶片C,其包括一座體10、一下固定片30、一右定位塊40與一左定位塊50。Referring to FIG. 2 and FIG. 3, the carrier for the wafer testing machine of the embodiment can be used to carry two wafers C to be tested, including a body 10, a lower fixing piece 30, and a right. The positioning block 40 and a left positioning block 50 are located.
其中,座體10此為一般習知之技藝,且其種類繁雜,但於本領域的技術人員可直接無歧異得知,故於本實施例不加以贅述。The seat body 10 is generally known in the art, and the types thereof are complicated. However, those skilled in the art can directly and without any knowledge, and thus will not be described in detail in this embodiment.
下固定片30設置於該座體10上。The lower fixing piece 30 is disposed on the seat body 10.
右定位塊40設置於座體10之右側,並突伸入座體10內,左定位塊50設置於該右定位塊40的相對側。其中,該右定位塊40與該下固定片30排列分別抵頂於一晶片C的右側與下側,藉以達到固定晶片C位置之目 的。該左定位塊50與該下固定片30排列分別抵頂於另一晶片C的左側與下側。The right positioning block 40 is disposed on the right side of the base body 10 and protrudes into the seat body 10. The left positioning block 50 is disposed on the opposite side of the right positioning block 40. The right positioning block 40 and the lower fixing piece 30 are arranged to abut on the right side and the lower side of a wafer C, respectively, thereby achieving the purpose of fixing the position of the wafer C. of. The left positioning block 50 and the lower fixing piece 30 are arranged to abut against the left side and the lower side of the other wafer C, respectively.
由上述可得知,本實施例的設置可以分別對兩個晶片C進行擺放,以使進行晶片測試時,只要於初次的位置調整完畢後,即可以同時對兩組晶片進行測試,可加速檢測業的進行,克服習知技術僅能一次置放一個晶片的困擾。As can be seen from the above, the arrangement of the embodiment can separately place two wafers C, so that when the wafer test is performed, the two sets of wafers can be tested at the same time after the initial position adjustment is completed, which can be accelerated. The testing industry is carried out, overcoming the trouble that the prior art can only place one wafer at a time.
又,右定位塊40係可結合一位移微調機構60,用以改變右定位塊40與該座體10的相對位置。由於位移微調機構60為此領域技術人員可直接無歧異得知之機構、技術,故於此不加贅述其組成。Moreover, the right positioning block 40 can be combined with a displacement fine adjustment mechanism 60 for changing the relative position of the right positioning block 40 and the base 10. Since the displacement fine adjustment mechanism 60 can directly and unambiguously know the mechanism and technology for those skilled in the art, the composition thereof will not be described herein.
另,左定位塊50係可為一片體,其垂直突出於座體10的上表面。右定位塊40係為角柱體,利用其尖端抵頂於晶片C。In addition, the left positioning block 50 can be a piece that protrudes perpendicularly from the upper surface of the base 10. The right positioning block 40 is a corner cylinder with its tip abutting against the wafer C.
以上所述之實施例僅係為說明本創作之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本創作之內容並據以實施,當不能以之限定本創作之專利範圍,即大凡依本創作所揭示之精神所作之均等變化或修飾,仍應涵蓋在本創作之專利範圍內。The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.
C‧‧‧晶片C‧‧‧ wafer
10‧‧‧座體10‧‧‧ body
30‧‧‧下固定片30‧‧‧ lower fixed piece
40‧‧‧右定位塊40‧‧‧right positioning block
50‧‧‧左定位塊50‧‧‧Left positioning block
60‧‧‧位移微調機構60‧‧‧ Displacement fine-tuning mechanism
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TW103222304U TWM502246U (en) | 2014-12-16 | 2014-12-16 | Bearing seat for chip tester |
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TW103222304U TWM502246U (en) | 2014-12-16 | 2014-12-16 | Bearing seat for chip tester |
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TWM502246U true TWM502246U (en) | 2015-06-01 |
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2014
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