TWM501533U - Light emitting diode - Google Patents

Light emitting diode Download PDF

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TWM501533U
TWM501533U TW102218786U TW102218786U TWM501533U TW M501533 U TWM501533 U TW M501533U TW 102218786 U TW102218786 U TW 102218786U TW 102218786 U TW102218786 U TW 102218786U TW M501533 U TWM501533 U TW M501533U
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Taiwan
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emitting diode
light
quantum dot
light emitting
type
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TW102218786U
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Chinese (zh)
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Chi-Min Ho
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Advanced Optoelectronic Tech
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Abstract

A light emitting diode comprises: a substrate with a circuit structure and a reflection cup, a light emitting diode chip and a packaging material. The light emitting diode chip is positioned in a bottom of the reflection cup and electrically connected with the circuit structure, the packaging material is received in the reflection cup and covers the light emitting diode chip. The light emitting diode chip is an ultraviolet light emitting diode chip. The light emitting diode also includes a quantum dot film arranged on the packaging material, the quantum dot film includes two transparent sheets, and a first quantum dot, a second quantum dot and a third quantum dot sandwiched between the two transparent sheets. The first quantum dot, the second quantum dot and the third quantum dot respectively emits red light, green light and blue light when excited by ultraviolet light.

Description

發光二極體Light-emitting diode

本新型涉及一種發光二極體,特別涉及各種色光的發光二極體。The invention relates to a light-emitting diode, in particular to a light-emitting diode of various color lights.

發光二極體作為一種新的光源,目前已廣泛應用於多種場合,對於不同色光的發光二極體的需求也在日益增加。習知的製造不同色光的發光二極體的過程是先利用磊晶方法製造出可以發出不同色光的發光二極體晶片,並將此發光二極體晶片固著於基板上,然後採用透明封裝將此不同色光的發光二極體封裝而成。例如,橙色發光二極體是將可以發出橙色光的GaAsP晶片固著於基板上,再利用透明封裝材料封裝而成的,以此類推,其他色光的發光二極體的製造方法類似。As a new kind of light source, the light-emitting diode has been widely used in various occasions, and the demand for light-emitting diodes of different color lights is also increasing. The conventional process for manufacturing light-emitting diodes of different color light is to first produce a light-emitting diode wafer capable of emitting different color lights by using an epitaxial method, and fix the light-emitting diode wafer on a substrate, and then adopt a transparent package. The light-emitting diodes of different color lights are encapsulated. For example, the orange light emitting diode is a GaAsP wafer that can emit orange light and is fixed on a substrate, and then encapsulated by a transparent packaging material, and so on, and the manufacturing method of other color light emitting diodes is similar.

然而,習知的方法製造不同色光的發光二極體需要選用可以發出不同色光的發光二極體晶片,這不僅增加了生產成本,同時不利於小批量客制化的生產模式。However, the conventional method of manufacturing a light-emitting diode of different color lights requires a light-emitting diode chip which can emit different color lights, which not only increases the production cost, but also is disadvantageous for a small-volume customized production mode.

本新型旨在提供一種發光二極體以克服上述缺陷。The present invention is directed to providing a light emitting diode to overcome the above drawbacks.

一種發光二極體,包括一具有電路結構和反射杯的基板、發光二極體晶片和封裝材料,發光二極體晶片設置於基板的反射杯的底部且與基板的電路結構電連接,封裝材料設置在所述基板的反射杯內並包覆發光二極體晶片。所述發光二極體晶片為一紫外光發光二極體晶片,所述發光二極體還包括一設置於封裝材料之上的量子點薄膜,所述量子點薄膜包含兩個透明片材,以及設置在兩個透明片材之間的第一型量子點、第二型量子點和第三型量子點中的一種或多種的組合,所述第一型量子點受到紫外光激發時發出紅光,所述第二型量子點受到紫外光激發時發出綠光,所述第三型量子點受到紫外光激發時發出藍光。A light emitting diode comprising a substrate having a circuit structure and a reflective cup, a light emitting diode chip and a packaging material, wherein the light emitting diode chip is disposed at a bottom of the reflective cup of the substrate and electrically connected to the circuit structure of the substrate, the packaging material It is disposed in the reflective cup of the substrate and covers the light emitting diode wafer. The light emitting diode chip is an ultraviolet light emitting diode chip, and the light emitting diode further includes a quantum dot film disposed on the packaging material, the quantum dot film comprising two transparent sheets, and a combination of one or more of a first type of quantum dot, a second type of quantum dot, and a third type of quantum dot disposed between two transparent sheets, the first type of quantum dot emitting red light when excited by ultraviolet light The second type quantum dot emits green light when excited by ultraviolet light, and the third type quantum dot emits blue light when excited by ultraviolet light.

進一步地,所述封裝材料為透明封裝材料。所述封裝材料為環氧樹脂、矽膠或聚甲基丙烯酸甲酯。所述封裝材料中不包含螢光粉或量子點。Further, the encapsulating material is a transparent encapsulating material. The encapsulating material is epoxy resin, silicone rubber or polymethyl methacrylate. The encapsulating material does not contain phosphor powder or quantum dots.

所述量子點的平均粒徑小於15nm。所述第一型量子點為平均粒徑為9-11nm的CdSe量子點。所述第二型量子點為平均粒徑為4-6nm的CdSe量子點。所述第三型量子點為平均粒徑為1-3nm的CdSe量子點。The quantum dots have an average particle diameter of less than 15 nm. The first type of quantum dots are CdSe quantum dots having an average particle diameter of 9 to 11 nm. The second type of quantum dots are CdSe quantum dots having an average particle diameter of 4 to 6 nm. The third type of quantum dots are CdSe quantum dots having an average particle diameter of 1-3 nm.

本新型所提供的發光二極體,在基板的凹槽底部設置紫外光發光二極體晶片,以透明封裝材料封裝發光二極體晶片,然後在封裝材料之上設置包含第一型量子點、第二型量子點和第三型量子點的量子點薄膜。通過對量子點薄膜中的量子點的粒徑的選擇和不同粒徑的量子點的配比,就可以呈現出大自然所有的可見光色彩。本新型所提供的發光二極體不僅生產成本低,並且可以小批量客制化的生產模式。In the light emitting diode provided by the present invention, an ultraviolet light emitting diode chip is disposed at the bottom of the groove of the substrate, the light emitting diode chip is encapsulated in a transparent packaging material, and then the first type quantum dot is disposed on the packaging material, A quantum dot film of a second type of quantum dot and a third type of quantum dot. By selecting the particle size of the quantum dots in the quantum dot film and the ratio of the quantum dots of different particle sizes, it is possible to present all visible light colors of nature. The light-emitting diode provided by the present invention not only has a low production cost, but also can be customized in a small batch production mode.

11‧‧‧基板11‧‧‧Substrate

111‧‧‧電路結構111‧‧‧Circuit structure

112‧‧‧反射杯112‧‧‧Reflection Cup

12‧‧‧發光二極體晶片12‧‧‧Light Emitter Wafer

13‧‧‧封裝材料13‧‧‧Packaging materials

14‧‧‧量子點薄膜14‧‧‧Quantum dot film

141‧‧‧第一透明片材141‧‧‧First transparent sheet

142‧‧‧第二透明片材142‧‧‧Second transparent sheet

20‧‧‧量子點20‧‧ ‧ quantum dots

圖1為本新型提供的發光二極體的示意圖。FIG. 1 is a schematic view of a light emitting diode provided by the present invention.

下面將結合附圖,對本新型作進一步的詳細說明。The present invention will be further described in detail below with reference to the accompanying drawings.

請參閱圖1,本新型提供一種發光二極體,所述發光二極體包含一具有電路結構111和反射杯112的基板11、發光二極體晶片12、封裝材料13和量子點薄膜14。Referring to FIG. 1 , the present invention provides a light emitting diode comprising a substrate 11 having a circuit structure 111 and a reflective cup 112 , a light emitting diode chip 12 , a packaging material 13 , and a quantum dot film 14 .

所述發光二極體晶片12設置於基板11的反射杯112的底部,並且所述發光二極體晶片12與基板11的電路結構111電連接。所述發光二極體晶片12為紫外光發光二極體晶片12。The light emitting diode chip 12 is disposed at the bottom of the reflective cup 112 of the substrate 11 , and the light emitting diode wafer 12 is electrically connected to the circuit structure 111 of the substrate 11 . The light emitting diode chip 12 is an ultraviolet light emitting diode chip 12.

所述封裝材料13設置在基板11的反射杯112內,並且包覆所述發光二極體晶片12。所述封裝材料13為透明封裝材料。所述封裝材料13可選擇環氧樹脂、矽膠或聚甲基丙烯酸甲酯等材料。所述封裝材料13中不包含螢光粉或者量子點。The encapsulation material 13 is disposed in the reflective cup 112 of the substrate 11 and encapsulates the LED substrate 12 . The encapsulating material 13 is a transparent encapsulating material. The encapsulating material 13 may be selected from materials such as epoxy resin, silicone rubber or polymethyl methacrylate. The encapsulating material 13 does not contain phosphor powder or quantum dots.

所述量子點薄膜14設置於封裝材料13之上。所述量子點薄膜14包含第一透明片材141和第二透明片材142,在所述第一透明片材141和第二透明片材142之間均勻的設置有第一型、第二型和第三型量子點20的其中一種或多種的組合。所述第一透明片材141和第二透明片材142為硬質材料,可以理解的是,所述第一透明片材141和第二透明片材142亦可以為柔性材料。The quantum dot film 14 is disposed on the encapsulation material 13. The quantum dot film 14 includes a first transparent sheet 141 and a second transparent sheet 142, and a first type and a second type are uniformly disposed between the first transparent sheet 141 and the second transparent sheet 142. And a combination of one or more of the third type quantum dots 20. The first transparent sheet 141 and the second transparent sheet 142 are hard materials. It can be understood that the first transparent sheet 141 and the second transparent sheet 142 may also be flexible materials.

具體的,首先,提供一第一透明片材141,在所述第一透明片材141上均勻的設置量子點20,提供一第二透明片材142覆蓋於所述量子點20之上。然後,採用加熱的方法使得所述第一透明片材141和第二透明片材142貼合以得到量子點薄膜14,並且所述量子點20位於第一透明片材141和第二透明片材142之間。最後,將量子點薄膜14設置於封裝材料13之上。需要說明的是,本新型採用的封裝材料13具有熱固化性或紫外固化性,可以在所述封裝材料13固化之前將量子點薄膜14黏附於封裝材料13之上,待封裝材料13固化後,量子點薄膜14固著於封裝材料13之上。Specifically, first, a first transparent sheet 141 is provided, and quantum dots 20 are uniformly disposed on the first transparent sheet 141 to provide a second transparent sheet 142 overlying the quantum dots 20. Then, the first transparent sheet 141 and the second transparent sheet 142 are attached by heating to obtain a quantum dot film 14, and the quantum dots 20 are located on the first transparent sheet 141 and the second transparent sheet. Between 142. Finally, the quantum dot film 14 is placed on the encapsulation material 13. It should be noted that the encapsulating material 13 used in the present invention has thermal curability or ultraviolet curability, and the quantum dot film 14 can be adhered to the encapsulating material 13 before the encapsulating material 13 is cured. The quantum dot film 14 is fixed on the encapsulation material 13.

所述量子點20的材質可選擇CdS、CdSe、CdTe、CdPo、ZnS、ZnSe、ZnTe、ZnTe、ZnPo、MgS、MgSe、MgTe、PbSe、PbS、PbTe、HgS、HgSe、HgTe、CdS1-x Sex 、BaTiO3 、PbZrO3 、PbZnx Ti1-x O3 、SrTiO3 、LaMnO3 、CaMnO3 和La1-x Cax MnO3 中的一種或者幾種的配合。所述量子點20的平均粒徑小於15nm。The material of the quantum dot 20 may be selected from CdS, CdSe, CdTe, CdPo, ZnS, ZnSe, ZnTe, ZnTe, ZnPo, MgS, MgSe, MgTe, PbSe, PbS, PbTe, HgS, HgSe, HgTe, CdS 1-x Se. x, BaTiO 3, PbZrO 3, PbZn x Ti 1-x O 3, SrTiO 3, LaMnO 3, one kind of 3 CaMnO 3 and La 1-x Ca x MnO or several mating. The quantum dots 20 have an average particle diameter of less than 15 nm.

所述量子點20在受到紫外光發光二極體晶片12發出的紫外光的激發下,能產生螢光,更重要的是,不同粒徑的量子點20在紫外光的激發可以產生不同波長的光線,也即量子點20發出光線的波長與量子點20的粒徑有關,所述第一型量子點20受到紫外光激發時發出紅光,所述第二型量子點20受到紫外光激發時發出綠光,所述第三型量子點20受到紫外光激發時發出藍光。舉例來說,第一型量子點20為平均粒徑為9-11nm的CdSe量子點20,受到紫外光激發時發出紅光,第二型量子點20為平均粒徑為4-6nm的CdSe量子點20,受到紫外光激發時發出綠光,第三型量子點20的平均粒徑為1-3nm的CdSe量子點20,受到紫外光激發時發出藍光。The quantum dots 20 can generate fluorescence under the excitation of ultraviolet light emitted from the ultraviolet light emitting diode chip 12. More importantly, the quantum dots 20 of different particle sizes can generate different wavelengths when excited by ultraviolet light. The light, that is, the wavelength at which the quantum dot 20 emits light is related to the particle diameter of the quantum dot 20, which emits red light when excited by ultraviolet light, and the second type quantum dot 20 is excited by ultraviolet light. The green light is emitted, and the third type quantum dot 20 emits blue light when excited by ultraviolet light. For example, the first type quantum dot 20 is a CdSe quantum dot 20 having an average particle diameter of 9-11 nm, and emits red light when excited by ultraviolet light, and the second type quantum dot 20 is a CdSe quantum having an average particle diameter of 4-6 nm. Point 20, which emits green light when excited by ultraviolet light, and CdSe quantum dot 20 of the third type quantum dot 20 having an average particle diameter of 1-3 nm emits blue light when excited by ultraviolet light.

優選的,第一型量子點20為平均粒徑為10nm的CdSe量子點20。第二型量子點20為平均粒徑為5nm的CdSe量子點20。第三型量子點20的平均粒徑為2nm的CdSe量子點20。Preferably, the first type quantum dots 20 are CdSe quantum dots 20 having an average particle diameter of 10 nm. The second type quantum dot 20 is a CdSe quantum dot 20 having an average particle diameter of 5 nm. The third type quantum dot 20 has a CdSe quantum dot 20 having an average particle diameter of 2 nm.

所述量子點薄膜14中的第一型、第二型和第三型量子點20的數量配比的具體實施方式如下:A specific embodiment of the number ratio of the first type, the second type, and the third type quantum dot 20 in the quantum dot film 14 is as follows:

第一實施例:量子點薄膜14中僅包含第一型量子點20,則配合紫外光發光二極體晶片12所製造的發光二極體發紅色光。First Embodiment: When only the first type quantum dot 20 is included in the quantum dot film 14, the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 emits red light.

第二實施例:量子點薄膜14中包含的第一型量子點20與第二型量子點20的數量之比為75%:25%,配合紫外光發光二極體晶片12所製造的發光二極體發橙色光。The second embodiment: the ratio of the number of the first type quantum dots 20 to the second type quantum dots 20 included in the quantum dot film 14 is 75%: 25%, and the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 is used. The polar body glows orange.

第三實施例:量子點薄膜14中包含的第一型量子點20與第二型量子點20的數量之比為50%:50%,配合紫外光發光二極體晶片12所製造的發光二極體發黃色光。The third embodiment: the ratio of the number of the first type quantum dots 20 to the second type quantum dots 20 included in the quantum dot film 14 is 50%: 50%, and the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 is used. The polar body glows yellow.

第四實施例:量子點薄膜14中僅包含第二型量子點20,則配合紫外光發光二極體晶片12所製造的發光二極體發綠色光。Fourth Embodiment: When only the second type quantum dot 20 is included in the quantum dot film 14, the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 emits green light.

第五實施例:量子點薄膜14中僅包含第三型量子點20,則配合紫外光發光二極體晶片12所製造的發光二極體發藍色光。Fifth Embodiment: The quantum dot film 14 includes only the third type quantum dot 20, and the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 emits blue light.

第六實施例:量子點薄膜14中包含的第一型量子點20與第三型量子點20的數量之比為25%:75%,配合紫外光發光二極體晶片12所製造的發光二極體發藍紫色光。Sixth embodiment: the ratio of the number of the first type quantum dots 20 to the third type quantum dots 20 included in the quantum dot film 14 is 25%: 75%, and the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 is used. The polar body glows blue and purple.

第七實施例:量子點薄膜14中包含的第一型量子點20與第三型量子點20的數量之比為50%:50%,配合紫外光發光二極體晶片12所製造的發光二極體發紫色光。Seventh embodiment: the ratio of the number of the first type quantum dots 20 to the third type quantum dots 20 included in the quantum dot film 14 is 50%: 50%, and the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 is used. The polar body emits purple light.

第八實施例:量子點薄膜14中包含的第一型量子點20與第三型量子點20的數量之比為75%:25%,配合紫外光發光二極體晶片12所製造的發光二極體發紅紫色光。The eighth embodiment: the ratio of the number of the first type quantum dots 20 to the third type quantum dots 20 included in the quantum dot film 14 is 75%: 25%, and the light emitting diode manufactured by the ultraviolet light emitting diode chip 12 is used. The polar body glows red and purple.

第九實施例:量子點薄膜14中包含的第一型量子點20、第二型量子點20和第三型量子點20的數量之比為33%:33%:34%,配合紫外光發光二極體晶片12所製造的發光二極體發白光。Ninth Embodiment: The ratio of the number of the first type quantum dots 20, the second type quantum dots 20, and the third type quantum dots 20 included in the quantum dot film 14 is 33%: 33%: 34%, and is combined with ultraviolet light emission. The light-emitting diode manufactured by the diode wafer 12 emits white light.

需要說明的是,本新型所提供的發光二極體發出的不同色光並不拘泥於以上九種實施例。It should be noted that the different color lights emitted by the light-emitting diodes provided by the present invention are not limited to the above nine embodiments.

本新型提供了可以發出不同色光的發光二極體,通過改變量子點薄膜14中第一型、第二型和第三型量子點20的數量配比可以製造出能夠呈現大自然各種可見光色彩的發光二極體,並可以降低生產成本,符合小批量客制化的生產模式的要求。The present invention provides a light-emitting diode capable of emitting different color lights, and by changing the number ratio of the first type, the second type, and the third type quantum dot 20 in the quantum dot film 14, a variety of visible light colors can be produced. Light-emitting diodes can reduce production costs and meet the requirements of small-volume customized production models.

本新型之技術內容及技術特點已揭示如上,然而熟悉本項技術之人士仍可能基於本新型之教示及揭示而作種種不背離本新型精神之替換及修飾。因此,本新型之保護範圍應不限於實施例所揭示者,而應包括各種不背離本新型之替換及修飾,並為以下之申請專利範圍所涵蓋。The technical content and technical features of the present invention have been disclosed as above, but those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should not be limited by the scope of the invention, but should be construed as being included in the appended claims.

11‧‧‧基板 11‧‧‧Substrate

111‧‧‧電路結構 111‧‧‧Circuit structure

112‧‧‧反射杯 112‧‧‧Reflection Cup

12‧‧‧發光二極體晶片 12‧‧‧Light Emitter Wafer

13‧‧‧封裝材料 13‧‧‧Packaging materials

14‧‧‧量子點薄膜 14‧‧‧Quantum dot film

141‧‧‧第一透明片材 141‧‧‧First transparent sheet

142‧‧‧第二透明片材 142‧‧‧Second transparent sheet

20‧‧‧量子點 20‧‧ ‧ quantum dots

Claims (6)

一種發光二極體,包括一具有電路結構和反射杯的基板、發光二極體晶片和封裝材料,發光二極體晶片設置於基板的反射杯的底部且與基板的電路結構電連接,封裝材料設置在所述基板的反射杯內並包覆發光二極體晶片,其改良在於:所述發光二極體晶片為一紫外光發光二極體晶片,所述發光二極體還包括一設置於封裝材料之上的量子點薄膜,所述量子點薄膜包含兩個透明片材,以及設置在兩個透明片材之間的第一型量子點、第二型量子點和第三型量子點中的一種或多種的組合,所述第一型量子點受到紫外光激發時發出紅光,所述第二型量子點受到紫外光激發時發出綠光,所述第三型量子點受到紫外光激發時發出藍光。A light emitting diode comprising a substrate having a circuit structure and a reflective cup, a light emitting diode chip and a packaging material, wherein the light emitting diode chip is disposed at a bottom of the reflective cup of the substrate and electrically connected to the circuit structure of the substrate, the packaging material The LED is disposed in the reflective cup of the substrate and encapsulates the LED chip. The improvement is that the LED is an ultraviolet light emitting diode chip, and the light emitting diode further includes a light emitting diode. a quantum dot film on the encapsulating material, the quantum dot film comprising two transparent sheets, and a first type of quantum dots, a second type of quantum dots, and a third type of quantum dots disposed between the two transparent sheets One or more combinations of the first type of quantum dots emitting red light when excited by ultraviolet light, the second type of quantum dots emitting green light when excited by ultraviolet light, and the third type of quantum dots being excited by ultraviolet light It emits blue light. 如申請專利範圍第1項所述之發光二極體,其中,所述封裝材料中不包含螢光粉或量子點。The luminescent diode of claim 1, wherein the encapsulating material does not contain phosphor powder or quantum dots. 如申請專利範圍第1項所述之發光二極體,其中,所述量子點的平均粒徑小於15nm。The light-emitting diode according to claim 1, wherein the quantum dots have an average particle diameter of less than 15 nm. 如申請專利範圍第3項所述之發光二極體,其中,所述第一型量子點為平均粒徑為9-11nm的CdSe量子點。The light-emitting diode according to claim 3, wherein the first type of quantum dots are CdSe quantum dots having an average particle diameter of 9 to 11 nm. 如申請專利範圍第3項所述之發光二極體,其中,所述第二型量子點為平均粒徑為4-6nm的CdSe量子點。The light-emitting diode according to claim 3, wherein the second-type quantum dots are CdSe quantum dots having an average particle diameter of 4-6 nm. 如申請專利範圍第3項所述之發光二極體,其中,所述第三型量子點為平均粒徑為1-3nm的CdSe量子點。
The light-emitting diode according to claim 3, wherein the third-type quantum dot is a CdSe quantum dot having an average particle diameter of 1-3 nm.
TW102218786U 2013-09-29 2013-10-08 Light emitting diode TWM501533U (en)

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