TWM496778U - Display panel - Google Patents
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Abstract
Description
本新型創作是有關於一種顯示面板，且特別是一種具有晶片的顯示面板。The present invention relates to a display panel, and more particularly to a display panel having a wafer.
近年來，隨著科技的進步與半導體產業的日益發達，電子產品，例如筆記型電腦(notebook，NB)、智慧型手機(smart phone)與平板電腦(tablet)，等電子裝置的使用越來越普遍，並朝著便利、多功能且美觀的設計方向發展，以提供使用者更多元的選擇。當使用者對電子產品的需求日漸提升，在電子產品中扮演重要角色的顯示面板(display panel)亦成為設計者關注的焦點。In recent years, with the advancement of technology and the development of the semiconductor industry, electronic products, such as notebooks (notebooks, NB), smart phones and tablets, are increasingly used. It is universal and is moving in a convenient, versatile and aesthetically pleasing design to provide users with more choices. As users' demand for electronic products is increasing, display panels, which play an important role in electronic products, have also become the focus of designers.
電子產品可藉由顯示面板顯示影像，以將電子產品內的資訊以影像的型態輸出。顯示面板通常包括上下基板以及夾置在上下基板之間的顯示介質層，且顯示介質層藉由密封件密封在上下基板之間。如此，上下基板上配置的電子元件，例如主動元件或彩色濾光單元，可藉由驅動晶片驅動，而致使顯示面板顯示影像。上述的驅動晶片可藉由例如是覆晶玻璃(chip on glass，COG)技術或其他適用的技術而配置在基板上，並透過連接線連接至前 述的電子元件。然而，基板容易在配置晶片的過程中產生變形，而此變形結果可能透過基板傳遞至顯示面板內部。如此，顯示面板的顯示區容易產生漏光現象，導致顯示面板的顯示品質下降。The electronic product can display images through the display panel to output the information in the electronic product in the image type. The display panel generally includes upper and lower substrates and a display medium layer sandwiched between the upper and lower substrates, and the display medium layer is sealed between the upper and lower substrates by a sealing member. In this way, electronic components disposed on the upper and lower substrates, such as active components or color filter units, can be driven by the drive wafer to cause the display panel to display images. The above-mentioned driving wafer can be disposed on the substrate by, for example, chip on glass (COG) technology or other suitable technology, and connected to the front through a connecting wire. Electronic components as described. However, the substrate is liable to be deformed during the process of arranging the wafer, and the result of this deformation may be transmitted to the inside of the display panel through the substrate. As a result, the display area of the display panel is prone to light leakage, resulting in a decrease in display quality of the display panel.
本新型創作提供一種顯示面板，其具有良好的顯示品質。The novel creation provides a display panel with good display quality.
本新型創作的顯示面板包括一下基板、一上基板、一密封件、一顯示介質層、一晶片以及一接合件。下基板具有相鄰的一顯示區與一非顯示區。上基板配置在下基板的上方。密封件配置在上基板與下基板之間，並在上基板與下基板之間形成對應於顯示區的一密封空間。顯示介質層填充於密封空間內，並對應於顯示區。晶片配置在下基板上，並對應於非顯示區。接合件配置在上基板與下基板之間，以固定上基板與下基板，且接合件位在晶片與密封件之間。The display panel of the present invention comprises a lower substrate, an upper substrate, a sealing member, a display medium layer, a wafer and a bonding member. The lower substrate has an adjacent display area and a non-display area. The upper substrate is disposed above the lower substrate. The sealing member is disposed between the upper substrate and the lower substrate, and forms a sealed space corresponding to the display area between the upper substrate and the lower substrate. The display medium layer is filled in the sealed space and corresponds to the display area. The wafer is disposed on the lower substrate and corresponds to the non-display area. The bonding member is disposed between the upper substrate and the lower substrate to fix the upper substrate and the lower substrate, and the bonding member is located between the wafer and the sealing member.
在本新型創作的一實施例中，上述的上基板與下基板各自具有一內表面。上基板與下基板以內表面彼此相對，而接合件接觸上基板與下基板的內表面，以固定上基板與下基板。In an embodiment of the present invention, the upper substrate and the lower substrate each have an inner surface. The upper substrate and the lower substrate have inner surfaces facing each other, and the bonding members contact the inner surfaces of the upper substrate and the lower substrate to fix the upper substrate and the lower substrate.
在本新型創作的一實施例中，上述的上基板的邊緣具有一接合區域。接合件沿著上基板的邊緣配置在接合區域，並連接至下基板。In an embodiment of the present invention, the edge of the upper substrate has a joint area. The joint is disposed at the joint region along the edge of the upper substrate and is coupled to the lower substrate.
在本新型創作的一實施例中，上述的接合件沿著上基板的邊緣環繞上基板而呈現環形(ring-shaped)。In an embodiment of the present invention, the engaging member is ring-shaped around the upper substrate along the edge of the upper substrate.
在本新型創作的一實施例中，上述的接合件包括分離的多個區段，沿著上基板的邊緣排列。In an embodiment of the novel creation, the engaging member includes a plurality of separate segments that are arranged along an edge of the upper substrate.
在本新型創作的一實施例中，上述的上基板在下基板上的一垂直投影不重疊於晶片。In an embodiment of the present invention, a vertical projection of the upper substrate on the lower substrate does not overlap the wafer.
在本新型創作的一實施例中，上述的接合件為藉由固化一流動膠體而得的一硬質材料，且在填入上基板與下基板之間後經由固化而固定在上基板與下基板之間。In an embodiment of the present invention, the bonding member is a hard material obtained by curing a flowing gel, and is fixed between the upper substrate and the lower substrate and then fixed to the upper substrate and the lower substrate by curing. between.
在本新型創作的一實施例中，上述的上基板包括一彩色濾光基板，顯示介質層包括一液晶層，而下基板包括一主動陣列基板。In an embodiment of the present invention, the upper substrate includes a color filter substrate, the display medium layer includes a liquid crystal layer, and the lower substrate includes an active array substrate.
在本新型創作的一實施例中，上述的顯示面板更包括一黏膠件，配置在晶片與下基板之間。In an embodiment of the present invention, the display panel further includes an adhesive member disposed between the wafer and the lower substrate.
在本新型創作的一實施例中，上述的顯示面板更包括兩偏光片，分別配置在上基板的一外表面與下基板的一外表面上。In an embodiment of the present invention, the display panel further includes two polarizers disposed on an outer surface of the upper substrate and an outer surface of the lower substrate.
基於上述，在本新型創作的顯示面板中，下基板具有相鄰的顯示區與非顯示區，且接合件配置在上基板與下基板之間，以固定上基板與下基板。如此，在將晶片配置於下基板的製程中，由於上基板與下基板已藉由接合件固定，且接合件位在晶片與密封件之間，故接合件可減緩下基板對應於晶片之處所產生的變形傳遞至顯示區，以降低顯示區的漏光現象。據此，本新型創作的顯示面板具有良好的顯示品質。Based on the above, in the display panel of the present invention, the lower substrate has adjacent display areas and non-display areas, and the bonding member is disposed between the upper substrate and the lower substrate to fix the upper substrate and the lower substrate. In this way, in the process of disposing the wafer on the lower substrate, since the upper substrate and the lower substrate have been fixed by the bonding member, and the bonding member is located between the wafer and the sealing member, the bonding member can slow down the position of the lower substrate corresponding to the wafer. The resulting deformation is transmitted to the display area to reduce light leakage in the display area. Accordingly, the display panel created by the present invention has good display quality.
為讓本新型創作的上述特徵和優點能更明顯易懂，下文 特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above features and advantages of the novel creation more obvious, the following The embodiments are described in detail with reference to the accompanying drawings.
100‧‧‧顯示面板100‧‧‧ display panel
110‧‧‧下基板110‧‧‧lower substrate
120‧‧‧上基板120‧‧‧Upper substrate
130‧‧‧密封件130‧‧‧Seal
140‧‧‧顯示介質層140‧‧‧Display media layer
150‧‧‧晶片150‧‧‧ wafer
160‧‧‧接合件160‧‧‧Joint parts
170‧‧‧黏膠件170‧‧‧Viscose parts
180a、180b‧‧‧偏光片180a, 180b‧‧‧ polarizer
AA‧‧‧顯示區AA‧‧‧ display area
NA‧‧‧非顯示區NA‧‧‧Non-display area
R1‧‧‧接合區域R1‧‧‧ joint area
S1‧‧‧密封空間S1‧‧‧ sealed space
W1‧‧‧寬度W1‧‧‧Width
圖1是本新型創作一實施例的顯示面板的俯視示意圖。1 is a top plan view of a display panel in accordance with an embodiment of the present invention.
圖2是圖1的顯示面板沿A-A’線的剖面示意圖。Figure 2 is a cross-sectional view of the display panel of Figure 1 taken along line A-A'.
圖1是本新型創作一實施例的顯示面板的俯視示意圖。圖2是圖1的顯示面板沿A-A’線的剖面示意圖。請參考圖1與圖2，在本實施例中，顯示面板100包括下基板110、上基板120、密封件130、顯示介質層140、晶片150以及接合件160。下基板110具有相鄰的顯示區AA與非顯示區NA。上基板120配置在下基板110的上方。密封件130配置在上基板120與下基板110之間，並在上基板120與下基板110之間形成對應於顯示區AA的密封空間S1。顯示介質層140填充於密封空間S1內，並對應於顯示區AA。晶片150配置在下基板110上，並對應於非顯示區NA。接合件160配置在上基板120與下基板110之間，以固定上基板120與下基板110，且接合件160位在晶片150與密封件130之間。換言之，下基板110、上基板120、密封件130與顯示介質層140構成顯示面板100的基本架構，用以顯示畫面，而晶片150則用於驅動顯示面板100的電子元件(詳如後續說明)。藉此，在 將晶片150配置於下基板110的製程中，由於上基板120與下基板110已藉由接合件160固定，且接合件160位在晶片150與密封件130之間，故接合件160可減緩下基板110對應於晶片150之處所產生的變形傳遞至顯示區AA，以降低顯示區AA的漏光現象。據此，本實施例的顯示面板100具有良好的顯示品質。1 is a top plan view of a display panel in accordance with an embodiment of the present invention. Figure 2 is a cross-sectional view of the display panel of Figure 1 taken along line A-A'. Referring to FIG. 1 and FIG. 2 , in the embodiment, the display panel 100 includes a lower substrate 110 , an upper substrate 120 , a sealing member 130 , a display medium layer 140 , a wafer 150 , and a bonding member 160 . The lower substrate 110 has adjacent display areas AA and non-display areas NA. The upper substrate 120 is disposed above the lower substrate 110. The sealing member 130 is disposed between the upper substrate 120 and the lower substrate 110, and forms a sealed space S1 corresponding to the display area AA between the upper substrate 120 and the lower substrate 110. The display medium layer 140 is filled in the sealed space S1 and corresponds to the display area AA. The wafer 150 is disposed on the lower substrate 110 and corresponds to the non-display area NA. The bonding member 160 is disposed between the upper substrate 120 and the lower substrate 110 to fix the upper substrate 120 and the lower substrate 110, and the bonding member 160 is positioned between the wafer 150 and the sealing member 130. In other words, the lower substrate 110, the upper substrate 120, the sealing member 130 and the display medium layer 140 constitute a basic structure of the display panel 100 for displaying a picture, and the wafer 150 is used to drive the electronic components of the display panel 100 (detailed as described later). . In this way, In the process of disposing the wafer 150 in the lower substrate 110, since the upper substrate 120 and the lower substrate 110 have been fixed by the bonding member 160, and the bonding member 160 is located between the wafer 150 and the sealing member 130, the bonding member 160 can be slowed down. The deformation generated by the substrate 110 corresponding to the wafer 150 is transmitted to the display area AA to reduce the light leakage phenomenon of the display area AA. Accordingly, the display panel 100 of the present embodiment has good display quality.
具體而言，在本實施例中，顯示面板100所採用的下基板110例如是主動陣列基板，其包括玻璃基板與配置於其上的主動元件及連接線等構件，其中主動元件例如是薄膜電晶體(thin film transistor，TFT)元件，但本新型創作不以此為限制。再者，顯示面板100所採用的上基板120例如是彩色濾光基板，其包括玻璃基板與配置於其上的彩色濾光(color filter，CF)單元及黑矩陣(black matrix)等構件，但本新型創作不以此為限制。Specifically, in the embodiment, the lower substrate 110 used by the display panel 100 is, for example, an active array substrate, which includes a glass substrate and active components and connecting wires disposed thereon, wherein the active device is, for example, a thin film battery. A thin film transistor (TFT) element, but the novel creation is not limited thereto. Furthermore, the upper substrate 120 used in the display panel 100 is, for example, a color filter substrate, and includes a glass substrate and a color filter (CF) unit and a black matrix disposed thereon, but This new creation is not limited by this.
此外，顯示面板100所採用的密封件130例如是框膠，而顯示介質層140例如是液晶層(liquid crystal layer)，其中密封件130呈現環形(如圖1所示)，並連接至上基板120與下基板110，故下基板110、上基板120與密封件130之間形成密封空間S1，顯示介質層140填充於密封空間S1內而位在下基板110、上基板120與密封件130之間。如此，採用液晶層作為顯示介質層140的顯示面板100可為液晶顯示面板。然而，本新型創作並不限制顯示面板100、下基板110、上基板120、密封件130與顯示介質層140的種類，其可依據需求選擇。藉此，下基板110、上基板120、密封件130與顯示介質層140構成顯示面板100的基本架構， 其中顯示介質層140所對應之處形成顯示區AA，用以顯示畫面，而顯示區AA以外的區域則可視為非顯示區NA。In addition, the sealing member 130 used in the display panel 100 is, for example, a sealant, and the display medium layer 140 is, for example, a liquid crystal layer, wherein the sealing member 130 is annular (as shown in FIG. 1) and connected to the upper substrate 120. The sealing substrate S1 is formed between the lower substrate 110 and the upper substrate 120 and the sealing member 130. The display dielectric layer 140 is filled in the sealing space S1 and is located between the lower substrate 110 and the upper substrate 120 and the sealing member 130. As such, the display panel 100 using the liquid crystal layer as the display medium layer 140 may be a liquid crystal display panel. However, the present creation does not limit the types of display panel 100, lower substrate 110, upper substrate 120, seal 130, and display medium layer 140, which may be selected as desired. Thereby, the lower substrate 110, the upper substrate 120, the sealing member 130 and the display medium layer 140 constitute a basic structure of the display panel 100, Wherein the display medium area 140 corresponds to the display area AA for displaying the picture, and the area other than the display area AA can be regarded as the non-display area NA.
再者，在本實施例中，顯示面板100所採用的晶片150例如是積體電路(integrated circuit，IC)晶片，其適用於驅動顯示面板100內的電子元件(例如是前述配置在下基板110上的主動元件)。其中，晶片150配置在下基板110的非顯示區NA，而上基板120在下基板110上的垂直投影不重疊於晶片150。換言之，下基板110的部分側邊的長度大於上基板120的部分側邊的長度，而延伸至上基板120的一側，以構成非顯示區NA，而晶片150配置在下基板110的非顯示區NA而暴露於上基板120外。再者，顯示面板100內的電子元件，例如是前述配置在下基板110上的主動元件，可藉由未繪示的連接線往外延伸至非顯示區NA，並連接至配置在非顯示區NA的晶片150，以藉由晶片150驅動而啟動顯示面板100。Furthermore, in the present embodiment, the wafer 150 used in the display panel 100 is, for example, an integrated circuit (IC) chip, which is suitable for driving electronic components in the display panel 100 (for example, the foregoing configuration is on the lower substrate 110). Active component). The wafer 150 is disposed on the non-display area NA of the lower substrate 110, and the vertical projection of the upper substrate 120 on the lower substrate 110 does not overlap the wafer 150. In other words, the length of a portion of the side of the lower substrate 110 is greater than the length of a portion of the side of the upper substrate 120, and extends to one side of the upper substrate 120 to constitute the non-display area NA, and the wafer 150 is disposed at the non-display area NA of the lower substrate 110. It is exposed to the outside of the upper substrate 120. Furthermore, the electronic components in the display panel 100, for example, the active components disposed on the lower substrate 110, can be extended to the non-display area NA by a connecting line not shown, and connected to the non-display area NA. The wafer 150 is activated by the wafer 150 to activate the display panel 100.
更進一步地說，在本實施例中，晶片150可藉由覆晶玻璃(chip on glass，COG)技術配置在下基板110的玻璃基板上。具體而言，在本實施例中，顯示面板100更包括黏膠件170，配置在晶片150與下基板110之間。黏膠件170例如是異方性導電膜(anisotropic conductive film，ACF)，但本新型創作不以此為限制。在將晶片150配置於下基板110的製程中，晶片150透過黏膠件170配置在下基板110上，並透過未繪示的治具在高溫下施壓，進而接合在下基板110的玻璃基板上。在此過程中，下基板 110對應於晶片150之處(位在非顯示區NA)之處容易產生變形，而此變形可能經由下基板110的非顯示區NA朝向顯示區AA的方向傳遞。此時，由於上基板120與下基板110已藉由接合件160固定，且接合件160位在晶片150與密封件130之間，故接合件160可維持上基板120與下基板110之間的相對位置，且下基板110在對應於晶片150之處的變形可在傳遞至顯示區AA之前即受到接合件160的阻擋。藉此，本實施例的接合件160可減緩下基板110對應於晶片150之處所產生的變形傳遞至顯示區AA，以降低顯示面板100在顯示區AA處的漏光現象。據此，本實施例的顯示面板100具有良好的顯示品質。Furthermore, in the present embodiment, the wafer 150 can be disposed on the glass substrate of the lower substrate 110 by chip on glass (COG) technology. Specifically, in the embodiment, the display panel 100 further includes an adhesive member 170 disposed between the wafer 150 and the lower substrate 110. The adhesive member 170 is, for example, an anisotropic conductive film (ACF), but the novel creation is not limited thereto. In the process of disposing the wafer 150 on the lower substrate 110, the wafer 150 is placed on the lower substrate 110 through the adhesive member 170, and is pressed at a high temperature by a jig (not shown) to be bonded to the glass substrate of the lower substrate 110. In the process, the lower substrate 110 is easily deformed at a position corresponding to the wafer 150 (positioned in the non-display area NA), and this deformation may be transmitted via the non-display area NA of the lower substrate 110 toward the display area AA. At this time, since the upper substrate 120 and the lower substrate 110 have been fixed by the bonding member 160 and the bonding member 160 is located between the wafer 150 and the sealing member 130, the bonding member 160 can maintain the interface between the upper substrate 120 and the lower substrate 110. The relative position and deformation of the lower substrate 110 at a location corresponding to the wafer 150 may be blocked by the joint 160 prior to delivery to the display area AA. Thereby, the bonding member 160 of the embodiment can slow the transmission of the deformation generated by the lower substrate 110 corresponding to the wafer 150 to the display area AA to reduce the light leakage phenomenon of the display panel 100 at the display area AA. Accordingly, the display panel 100 of the present embodiment has good display quality.
以下將詳細描述本實施例的接合件160。在本實施例中，接合件160為藉由固化一流動膠體而得的一硬質材料，且在填入上基板120與下基板110之間後經由固化而固定在上基板120與下基板110之間。具體而言，上基板120與下基板110各自具有內表面。上基板120與下基板110以內表面彼此相對，而接合件160接觸上基板120與下基板110的內表面，以固定上基板120與下基板110。亦即，接合件160的原型為流動膠體，其黏度較佳地是小於50000厘泊(centipoises，cps)/25℃。如此，接合件160可藉由其流動性而順利填充於上基板120與下基板110之間，且接觸上基板120的內表面與下基板110的內表面。之後，作為接合件160的流動膠體藉由光照或加熱而固化成硬質材料，其硬度較佳地是大於15HD。如此，連接上基板120與下基板110的內表 面的接合件160在固化後固定在上基板120與下基板110之間。亦即，上基板120與下基板110對應於接合件160之處被限制在固定的相對位置。藉此，當下基板110在晶片150的配置過程中產生變形時，下基板110的變形可受到接合件160的阻擋而不傳遞至顯示區AA，且上基板120與下基板110受到接合件160的固定而不產生位移或扭曲，以避免顯示面板100因下基板110變形而在顯示區AA處產生漏光現象。The joint member 160 of the present embodiment will be described in detail below. In the present embodiment, the bonding member 160 is a hard material obtained by curing a flow gel, and is fixed between the upper substrate 120 and the lower substrate 110 after being filled between the upper substrate 120 and the lower substrate 110. between. Specifically, the upper substrate 120 and the lower substrate 110 each have an inner surface. The upper substrate 120 and the lower substrate 110 face each other with the inner surface, and the bonding member 160 contacts the inner surfaces of the upper substrate 120 and the lower substrate 110 to fix the upper substrate 120 and the lower substrate 110. That is, the prototype of the joint member 160 is a flow gel having a viscosity of preferably less than 50,000 centipesises (cps) / 25 °C. As such, the bonding member 160 can be smoothly filled between the upper substrate 120 and the lower substrate 110 by its fluidity, and contacts the inner surface of the upper substrate 120 and the inner surface of the lower substrate 110. Thereafter, the flowing colloid as the joining member 160 is cured into a hard material by light or heat, and its hardness is preferably greater than 15 HD. Thus, the inner table connecting the upper substrate 120 and the lower substrate 110 The surface bonding member 160 is fixed between the upper substrate 120 and the lower substrate 110 after curing. That is, the upper substrate 120 and the lower substrate 110 are constrained to a fixed relative position corresponding to the joint member 160. Thereby, when the lower substrate 110 is deformed during the configuration of the wafer 150, the deformation of the lower substrate 110 may be blocked by the bonding member 160 without being transmitted to the display area AA, and the upper substrate 120 and the lower substrate 110 are subjected to the bonding member 160. The fixing is performed without displacement or distortion to prevent the display panel 100 from generating light leakage at the display area AA due to deformation of the lower substrate 110.
再者，在本實施例中，上基板120的邊緣具有接合區域R1(繪示於圖1)。接合件160沿著上基板120的邊緣配置在接合區域R1，並連接至下基板110。換言之，接合件160較佳地是配置在上基板120的邊緣(接合區域R1)與下基板110之間，並且配置在晶片150與密封件130之間，而位在密封件130外側。其中，接合區域R1的寬度W1較佳地是介於0至10毫米(mm)之間。所述接合區域R1的寬度W1係指上基板120的邊緣至密封件130之間的距離，而接合件160適於配置在此區域中而位在密封件130外側。此外，在本實施例中，接合件160包括分離的多個區段，沿著上基板120的邊緣排列，如圖1所示。換言之，接合件160可以配置在上基板120的邊緣與下基板110之間，並對應於晶片150。亦即，接合件160可以僅配置在上基板120與下基板110上對應於晶片150之處，即可達到上述阻擋變形的功能。然而，在其他實施例中，接合件160亦可沿著上基板120的邊緣環繞上基板120而呈現環形，即接合件160亦可採用類似於密封件130的 型態而環繞在密封件130外側。此外，本實施例採用多個區段的接合件160係由於本實施例的顯示面板100繪示有三個晶片150，故接合件160對應具有三個區段。然而，在其他僅配置有單一晶片150的實施例中，接合件160可為對應於單一晶片150的單一區段，亦可環繞整個上基板120。本新型創作不限制接合件160的型態，其可依據需求調整。Furthermore, in the present embodiment, the edge of the upper substrate 120 has a bonding region R1 (shown in FIG. 1). The bonding member 160 is disposed along the edge of the upper substrate 120 at the bonding region R1 and is connected to the lower substrate 110. In other words, the bonding member 160 is preferably disposed between the edge (bonding region R1) of the upper substrate 120 and the lower substrate 110, and is disposed between the wafer 150 and the sealing member 130, and is positioned outside the sealing member 130. Here, the width W1 of the joint region R1 is preferably between 0 and 10 millimeters (mm). The width W1 of the joint region R1 refers to the distance between the edge of the upper substrate 120 and the seal 130, and the joint 160 is adapted to be disposed in this region to be positioned outside the seal 130. Further, in the present embodiment, the engaging member 160 includes a plurality of separate segments, arranged along the edge of the upper substrate 120, as shown in FIG. In other words, the bonding member 160 may be disposed between the edge of the upper substrate 120 and the lower substrate 110 and corresponds to the wafer 150. That is, the bonding member 160 can be disposed only on the upper substrate 120 and the lower substrate 110 corresponding to the wafer 150, thereby achieving the above-described function of blocking deformation. However, in other embodiments, the joint member 160 may also surround the upper substrate 120 along the edge of the upper substrate 120 to form a ring shape, that is, the joint member 160 may also adopt a seal similar to the seal member 130. The pattern surrounds the outside of the seal 130. In addition, the embodiment uses a plurality of segments of the bonding member 160. Since the display panel 100 of the present embodiment shows three wafers 150, the bonding member 160 has three segments correspondingly. However, in other embodiments in which only a single wafer 150 is disposed, the bonding member 160 may be a single segment corresponding to a single wafer 150, or may surround the entire upper substrate 120. The novel creation does not limit the type of engagement member 160, which can be adjusted as needed.
藉此，在本實施例的顯示面板100中，為了使接合件160在晶片150配置於下基板110的製程中發揮減緩下基板110的變形傳遞至顯示區AA的功效，接合件160需在晶片150配置於下基板110之前先填充在上基板120與下基板110之間並固化成硬質材料。亦即，接合件160的配置順序需早於晶片150的配置順序。再者，在本實施例中，由於接合件160位在密封件130外側(晶片150與密封件130之間)，故密封件130的配置順序較佳地是早於接合件160的配置順序。換言之，在本實施例中，在上基板120與下基板110藉由密封件130組立在一起並形成密封空間S1之後，顯示介質層140透過密封件130上未繪示的孔洞填入成密封空間S1，且所述孔洞在顯示介質層140填充完畢後又重新密封。如此，密封件130較佳地是在上基板120與下基板110組立的步驟中即藉由固化製程而固定並密封上基板120與下基板110。待下基板110、上基板120、密封件130與顯示介質層140配置完成後，接合件160填充於上基板120與下基板110之間，並在固化後固定上基板120與下基板110。亦即，密封件130與接合件 160較佳地是在不同步驟中製作。待接合件160配置在密封件130外側並固定上基板120與下基板110之後，晶片150才藉由黏膠件170配置在下基板110的非顯示區NA。Therefore, in the display panel 100 of the present embodiment, in order to make the bonding member 160 function to slow the transmission of the deformation of the lower substrate 110 to the display area AA in the process of disposing the wafer 150 in the lower substrate 110, the bonding member 160 needs to be on the wafer. The 150 is filled between the upper substrate 120 and the lower substrate 110 and solidified into a hard material before being disposed on the lower substrate 110. That is, the order in which the bonding members 160 are disposed needs to be earlier than the order in which the wafers 150 are disposed. Moreover, in the present embodiment, since the joint member 160 is located outside the seal member 130 (between the wafer 150 and the seal member 130), the arrangement order of the seal member 130 is preferably earlier than the arrangement order of the joint member 160. In other words, in the present embodiment, after the upper substrate 120 and the lower substrate 110 are assembled by the sealing member 130 and the sealed space S1 is formed, the display medium layer 140 is filled into the sealed space through the hole not shown in the sealing member 130. S1, and the hole is resealed after the display medium layer 140 is filled. As such, the sealing member 130 preferably fixes and seals the upper substrate 120 and the lower substrate 110 in the step of assembling the upper substrate 120 and the lower substrate 110, that is, by a curing process. After the lower substrate 110, the upper substrate 120, the sealing member 130 and the display medium layer 140 are disposed, the bonding member 160 is filled between the upper substrate 120 and the lower substrate 110, and the upper substrate 120 and the lower substrate 110 are fixed after curing. That is, the seal 130 and the joint 160 is preferably made in different steps. After the to-be-joined member 160 is disposed outside the sealing member 130 and the upper substrate 120 and the lower substrate 110 are fixed, the wafer 150 is disposed on the non-display area NA of the lower substrate 110 by the adhesive member 170.
在上述構件組裝完成之後，顯示面板100還可依據需求配置其他適用的構件。舉例而言，本實施例的顯示面板100更包括兩偏光片180a與180b，分別配置在上基板120的外表面與下基板110的外表面上，亦即偏光片180a與180b配置在顯示面板100的相對兩側，但本新型創作不限制偏光片180a與180b的配置與否。類似地，顯示面板100亦可配置有其他適用的構件，本新型創作不以此為限制。After the assembly of the above components is completed, the display panel 100 can also be configured with other suitable components as needed. For example, the display panel 100 of the present embodiment further includes two polarizers 180a and 180b disposed on the outer surface of the upper substrate 120 and the outer surface of the lower substrate 110, that is, the polarizers 180a and 180b are disposed on the display panel 100. The opposite sides, but the novel creation does not limit the configuration of the polarizers 180a and 180b. Similarly, the display panel 100 can also be configured with other suitable components, and the novel creation is not limited thereto.
綜上所述，在本新型創作的顯示面板中，下基板具有相鄰的顯示區與非顯示區，上基板配置在下基板上，密封件配置在上基板與下基板之間，並形成密封空間，而顯示介質層填充在密封空間內，並對應於顯示區。此外，晶片配置在下基板，並對應於非顯示區，而接合件配置在上基板與下基板之間，以固定上基板與下基板。如此，在將晶片配置於下基板的製程中，由於上基板與下基板已藉由接合件固定，且接合件位在晶片與密封件之間，故接合件可減緩下基板對應於晶片之處所產生的變形傳遞至顯示區。亦即，接合件可阻擋下基板的變形傳遞至顯示區，以減緩/降低顯示區的漏光現象。據此，本新型創作的顯示面板具有良好的顯示品質。In summary, in the display panel of the present invention, the lower substrate has adjacent display areas and non-display areas, the upper substrate is disposed on the lower substrate, and the sealing member is disposed between the upper substrate and the lower substrate to form a sealed space. And the display medium layer is filled in the sealed space and corresponds to the display area. Further, the wafer is disposed on the lower substrate and corresponds to the non-display area, and the bonding member is disposed between the upper substrate and the lower substrate to fix the upper substrate and the lower substrate. In this way, in the process of disposing the wafer on the lower substrate, since the upper substrate and the lower substrate have been fixed by the bonding member, and the bonding member is located between the wafer and the sealing member, the bonding member can slow down the position of the lower substrate corresponding to the wafer. The resulting deformation is transmitted to the display area. That is, the joint member can block the deformation of the lower substrate from being transmitted to the display area to slow down/reduce the light leakage phenomenon in the display area. Accordingly, the display panel created by the present invention has good display quality.
100‧‧‧顯示面板100‧‧‧ display panel
110‧‧‧下基板110‧‧‧lower substrate
120‧‧‧上基板120‧‧‧Upper substrate
130‧‧‧密封件130‧‧‧Seal
140‧‧‧顯示介質層140‧‧‧Display media layer
150‧‧‧晶片150‧‧‧ wafer
160‧‧‧接合件160‧‧‧Joint parts
170‧‧‧黏膠件170‧‧‧Viscose parts
180a、180b‧‧‧偏光片180a, 180b‧‧‧ polarizer
AA‧‧‧顯示區AA‧‧‧ display area
NA‧‧‧非顯示區NA‧‧‧Non-display area
S1‧‧‧密封空間S1‧‧‧ sealed space
W1‧‧‧寬度W1‧‧‧Width
Claims (10)
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| TW103217665U TWM496778U (en) | 2014-10-03 | 2014-10-03 | Display panel |
| CN201420757759.XU CN204241808U (en) | 2014-10-03 | 2014-12-04 | Display panel |
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| TW103217665U TWM496778U (en) | 2014-10-03 | 2014-10-03 | Display panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10831070B2 (en) | 2018-10-01 | 2020-11-10 | Himax Display, Inc. | Display panel |
| TWI750421B (en) * | 2018-10-30 | 2021-12-21 | 立景光電股份有限公司 | Display panel |
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2014
- 2014-10-03 TW TW103217665U patent/TWM496778U/en not_active IP Right Cessation
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10831070B2 (en) | 2018-10-01 | 2020-11-10 | Himax Display, Inc. | Display panel |
| TWI750421B (en) * | 2018-10-30 | 2021-12-21 | 立景光電股份有限公司 | Display panel |
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