TWM491140U - Liquid constant-temperature control device - Google Patents

Description

Liquid thermostat control device

This creation is about a liquid thermostat control device that allows the output fluid to achieve a constant temperature effect.

According to the increasing development of global technology, the integrated size of integrated circuits in semiconductors and related electronics industries is shrinking. Therefore, the precision and uniformity of etching required for wafers is also increased to increase the portability of the entire product. And precision, and in the wafer etching process, the cleaning agent fluid required for the cleaning step must first be raised to a constant temperature in a constant temperature device, and the operator then washes the cleaning agent fluid at the constant temperature. The device cleans the chemical reaction residue on the wafer surface.

The conventional thermostat device mainly has a heat exchanger, and a heating tube is continuously arranged inside, and a water inlet and a water outlet are arranged on both sides of the heat exchanger, and the water inlet can be cleaned at a normal temperature. The agent fluid flows in, and the heating tube can be supplied with a heat source, whereby the normal temperature fluid exchanges heat through the outside of the contact heating tube, so that a constant temperature cleaning agent fluid can be heated and discharged from the water outlet.

However, the mode of fluid flow in the conventional constant temperature water heater is usually laminar, and the fluid interstitial points are parallel to each other and do not interfere with each other. Therefore, when the cleaning agent fluid at normal temperature is heated, the temperature transfer between the fluids is not fast enough, resulting in constant temperature. The cleaning agent fluid is not fully temperature-constant and the temperature difference is large, so that when the cleaning agent fluid is cleaned, the temperature difference of the wafer is too large, and the integrated circuit on the surface of the wafer is broken due to the physical principle of expansion and contraction, thereby improving The scrap rate of the overall wafer.

Therefore, how to develop a thermostat device that can reduce the temperature difference of the fluid, so that the temperature of the cleaning agent fluid used for cleaning the wafer is completely constant, thereby reducing the scrap rate of the wafer is a problem that the relevant industry must solve at present.

In order to solve the above problems, the present invention provides a liquid constant temperature control device having an intake line for introducing a gas guide into the liquid constant temperature control device to cause a disturbance of a normal temperature fluid in the liquid constant temperature control device. The phenomenon, in turn, allows a constant temperature fluid to be formed when the ambient temperature fluid is heated.

In order to achieve the above objective, the present invention provides a liquid constant temperature control device, comprising: a body having an accommodating space; a liquid inlet pipe connected to the body and capable of introducing a normal temperature fluid into the body The accommodating space; a heating component disposed on the body and capable of heating the normal temperature fluid; an air inlet pipe connected to the body, and introducing a gas source of a high pressure gas source into the accommodating space of the body; In order to generate a turbulent flow phenomenon at a normal temperature fluid, a constant temperature fluid can be formed when the normal temperature fluid is heated, and a drain line is connected to the body for discharging the constant temperature fluid from the accommodating space of the body.

There is further included an exhaust line connected to the body, the exhaust line is provided with an exhaust valve for discharging high-pressure gas generated in the body, and the intake line is provided with an intake valve.

Wherein, the inlet pipe and the drain pipe are respectively provided with a water inlet valve and a water outlet valve.

Wherein, the heating component comprises a temperature controller and a heating component of the electrical connection thermostat, the thermostat is disposed outside the body, the heating component is disposed in the receiving space of the body, and the thermostat can regulate the heating component The temperature value of the heating is such that the heating member can heat the normal temperature fluid at a temperature value.

Furthermore, the present invention further provides a liquid constant temperature control device, comprising: two bodies each having an accommodating space; and two liquid inlet pipes respectively connected to the respective bodies, and respectively guiding a normal temperature fluid Each of the accommodating spaces; two heating components are respectively disposed on each of the bodies, and can heat the normal temperature fluid in each of the accommodating spaces; an air inlet pipe is connected to each of the bodies, and a gas source of a high-pressure gas source is introduced into each of the accommodating spaces to cause a disturbing phenomenon of the normal temperature fluid in each of the accommodating spaces, so that a constant temperature fluid can be formed when the normal temperature fluid in each of the accommodating spaces is heated; And a two-discharge pipeline connected to each of the bodies for respectively discharging the constant temperature fluid of each of the accommodating spaces.

By the above, the creation can cause a disturbing phenomenon of the normal temperature fluid in the housing space of the body, so that the temperature of the fluid between the fluids at normal temperature is rapidly transmitted, and the fluid can be uniformly diffused into the whole fluid, so by this creation, The normal temperature fluid can be formed into a constant temperature constant temperature fluid. If the operator uses the constant temperature fluid to wash the wafer, the temperature difference of the wafer can be reduced to reduce the probability of wafer breakage, thereby reducing the overall wafer. Scrap rate.

Therefore, with the liquid temperature control device of the present invention, the additional production cost caused by wafer scrapping can be reduced, and the amount of fluid used for washing new wafers can be reduced, so the creation can reduce the overall water resources. Waste, more environmentally friendly and economical.

For the convenience of the description, the central idea expressed in the column of the above novel content is expressed by a specific embodiment. Various items in the embodiments are depicted in terms of ratios, dimensions, amounts of deformation, or displacements that are suitable for illustration, and are not drawn to the proportions of actual elements, as set forth above.

Referring to FIG. 1, the present invention provides a liquid constant temperature control device 100, which comprises:

A body 10 has an accommodating space 11.

An inlet conduit 20 is connected to the body 10 and disposed on a side adjacent to the bottom of the body 10, and the inlet conduit 20 is provided with a water inlet valve 21, and the inlet conduit 20 can be filled with a normal temperature by the inlet valve 21. The fluid 200 is guided into the accommodating space 11 of the body 10.

A heating unit 30 is disposed on the body 10 and includes a temperature controller 31, a heating element 32 electrically connected to the temperature controller 31, a first thermometer 33 and a second thermometer 34, wherein the temperature controller 31 The heating element 32, the first thermometer 33 and the second thermometer 34 are disposed in the accommodating space 11 of the body 10, and the heating element 32 is continuously curved, and can be an infrared heating tube or a The quartz heating tube, the first thermometer 33 is disposed at the upper end of the accommodating space 11, the second thermometer 34 is disposed at the bottom end of the accommodating space 11, and the temperature controller 31 is configured to regulate the temperature value of the heating of the heating member 32, The heating member 32 is configured to heat the ambient temperature fluid 200 in the body 10 at a temperature value.

An intake line 40 is connected to the body 10 and adjacent to the bottom of the body 10, and the intake line 40 is provided with an intake valve 41 and can be connected to a high-pressure gas source (not shown), and the high voltage The gas source can be a gas supply pump. When the intake valve 41 is opened, the intake line 40 can introduce a trace gas 400 of the high pressure gas source into the accommodating space 11 of the body 10, and the trace gas 400 can be The nitrogen or the outside air is used to cause a disturbing phenomenon of the normal temperature fluid 200 in the accommodating space 11, and a constant temperature fluid 300 can be formed when the normal temperature fluid 200 is heated.

A drain line 50 is connected to the body 10 and disposed at the bottom of the body 10, and the drain line 50 is provided with a water outlet valve 51. The drain valve 51 can discharge the drain line 50 into the accommodating space 11 The constant temperature fluid 300 inside.

An exhaust line 60 is connected to the body 10 and adjacent to the upper portion of the body 10, and the exhaust line 60 and the intake line 40 are disposed on the same side of the body 10, and the exhaust line 60 is provided. There is an exhaust valve 61 for discharging the high pressure gas 500 generated in the body 10.

A pressurized line 70 is connected to the body 10 and adjacent to the upper portion of the body 10, and the pressurized line 70 is disposed on the other side of the body 10 together with the inlet line 20, and the pressurized line 70 A pressurized intake valve 71 is provided, and another high pressure gas source (not shown) can be connected. When the pressurized intake valve 71 is opened, an external high pressure gas 600 can be introduced into the body 10 to The constant temperature fluid 300 is discharged from the drain line 50.

A water level pipe 80 can be respectively communicated with the body 10 at both ends, and the two ends of the water level pipe 80 are adjacent to the liquid inlet pipe 20 and the pressure pipe 70, respectively.

The above is an overview of the structure and connection of the creation, and the principles and methods of use that can be achieved by this creation are as follows:

Referring to FIG. 1 , when the liquid constant temperature control device 100 of the present invention is to be activated, the operator must first open the water inlet valve 21 of the liquid inlet pipe 20 and introduce a normal temperature fluid 200 into the accommodating space 11 of the body 10 . The water level of the normal temperature fluid 200 is observed by the water level tube 80. When the normal temperature fluid 200 is filled with water in the accommodating space 11, the temperature value of the heating element 32 is set in the temperature controller 31 to cause the normal temperature fluid 200 to touch. The heating element 32 is heated to exchange heat, so that the normal temperature fluid 200 starts the heating reaction. At this time, the intake valve 41 of the intake line 40 is opened, and a trace amount of the gas 400 is introduced into the accommodating space 11 . The intake line 40 is adjacent to the bottom of the body 10, so that the normal temperature fluid 200 can cause a turbulence phenomenon from bottom to top to break the temperature layer between the fluids, so that the normal temperature fluid 200 is heated when the fluid is between The temperature is transmitted rapidly and can be uniformly diffused to the entire fluid, so that the normal temperature fluid 200 can form a constant temperature constant temperature fluid 300.

In addition, the temperature values detected by the first thermometer 33 and the second thermometer 34 can be displayed on the thermostat 31 outside the body 10. Therefore, the first thermometer 33 and the second thermometer 34 can be used to monitor the heating of the normal temperature fluid 200. The situation is to ensure that the thermostatic fluid 300 formed is at a constant temperature.

Thereafter, the operator opens the exhaust valve 61 of the exhaust line 60 to discharge the high pressure gas 500 generated in the body 10, and when the constant temperature fluid 300 of the constant temperature is required to be discharged, the water outlet valve 51 of the drain line 50 is discharged. Turning on, the desired constant temperature fluid 300 can be discharged from the body 10, and opening the pressurized intake valve 71 can assist the constant temperature fluid 300 to be discharged from the drain line 50.

Therefore, by the present invention, a normal temperature fluid 200 for cleaning the wafer can be heated to form a constant temperature constant temperature fluid 300. When the operator washes the constant temperature fluid 300, the temperature difference of the wafer can be reduced. Reduce the probability of wafer breakage, which in turn reduces the scrap rate of the overall wafer.

Referring to FIG. 2, a schematic diagram of the operation of another embodiment of the present invention is different from the foregoing in that the present embodiment has two bodies 10 and two liquid inlet pipes 20 respectively disposed on the two bodies 10. The two heating units 30, the two drain lines 50, the two pressurized lines 70, and the two water level tubes 80 are the same as the foregoing, and the embodiment also has only one intake line 40 and one exhaust line 60. The intake line 40 and the exhaust line 60 are respectively connectable to the two bodies 10 .

The water inlet pipe 20 is provided with a water inlet valve 21 for controlling the introduction of a normal temperature fluid 200 into the accommodating space 11 of the two bodies 10, and the water level pipe 80 can separately observe each of the accommodating spaces. The water level of the ambient temperature fluid 200 in the space 11. The intake line 40 is provided with two intake valves 41 for respectively controlling the introduction of the trace gas 400 of the high-pressure gas source into the two bodies 10, and the two drain lines 50 are provided with a water outlet valve 51 for The constant temperature fluids 300 of the two bodies 10 are respectively controlled to be discharged, and an external high pressure gas 600 is introduced into the two bodies 10 through the two pressurized lines 70, so that the constant temperature fluids 300 of the bodies 10 can be assisted by the respective bodies. The drain line 50 is discharged. The exhaust line 60 is provided with two exhaust valves 61 for discharging the high pressure gas 500 generated in the two bodies 10. The operation mode and principle of the present embodiment are the same as those described above, and thus will not be further described herein.

Thereby, the operator can adjust the amount of the constant temperature fluid 300 of the wafer and the configuration of the different cleaning equipment, and the body 10, the heating assembly 30, the liquid inlet line 20, the liquid discharge line 50, and The pressure line 70 and the water level tube 80 are added to meet the needs of industrial utilization.

In summary, the present invention provides a liquid thermostatic control device 100 that allows the ambient temperature fluid 200 to form a constant temperature constant temperature fluid 300. If the operator uses the constant temperature fluid 300 to clean the wafer, the crystal can be reduced. The difference in temperature between the circles reduces the probability of wafer breakage, which in turn reduces the rejection rate of the overall wafer.

Therefore, with this creation, the additional production cost caused by wafer scrapping can be reduced, and the amount of fluid used for washing new wafers can be reduced. Therefore, the liquid constant temperature control device 100 of the present invention can reduce the overall water resources. Waste, more environmentally friendly and economical.

The above embodiments are merely illustrative of the present invention and are not intended to limit the scope of the present invention. All kinds of modifications or changes that are not in violation of the spirit of this creation are all in the scope of this creative intention.

100‧‧‧Liquid thermostat control device
10‧‧‧ Ontology
11‧‧‧ accommodating space
20‧‧‧Inlet line
21‧‧‧Inlet valve
30‧‧‧heating components
31‧‧‧ thermostat
32‧‧‧heating parts
33‧‧‧First thermometer
34‧‧‧Second thermometer
40‧‧‧Intake line
41‧‧‧Intake valve
50‧‧‧Draining line
51‧‧‧Outlet valve
60‧‧‧Exhaust line
61‧‧‧Exhaust valve
70‧‧‧Pressure pipe
71‧‧‧Pressure intake valve
80‧‧‧Water level tube
200‧‧‧Normal temperature fluid
300‧‧‧ Constant temperature fluid
400‧‧‧ trace gases
500‧‧‧High pressure gas
600‧‧‧ outside high pressure gas

Figure 1 is a schematic diagram of the operation of this creation. 2 is a schematic diagram of the operation of another embodiment of the present creation.

100‧‧‧Liquid thermostat control device

10‧‧‧ Ontology

11‧‧‧ accommodating space

20‧‧‧Inlet line

21‧‧‧Inlet valve

30‧‧‧heating components

31‧‧‧ thermostat

32‧‧‧heating parts

33‧‧‧First thermometer

34‧‧‧Second thermometer

40‧‧‧Intake line

41‧‧‧Intake valve

50‧‧‧Draining line

51‧‧‧Outlet valve

60‧‧‧Exhaust line

61‧‧‧Exhaust valve

70‧‧‧Pressure pipe

71‧‧‧Pressure intake valve

80‧‧‧Water level tube

200‧‧‧Normal temperature fluid

300‧‧‧ Constant temperature fluid

400‧‧‧ trace gases

500‧‧‧High pressure gas

600‧‧‧ outside high pressure gas

Claims (13)

A liquid constant temperature control device comprising: a body having an accommodating space; a liquid inlet pipe connected to the body, and introducing a normal temperature fluid into the accommodating space; a heating component; Provided on the body, and heating the normal temperature fluid; an air inlet pipe connected to the body, and introducing a gas of a high pressure gas source into the accommodating space to cause the ambient temperature fluid to be disturbed a flow phenomenon, which in turn causes the constant temperature fluid to form a constant temperature fluid; and a drain line connected to the body for discharging the constant temperature fluid from the accommodating space. The liquid thermostat control device of claim 1, wherein the heating component comprises a temperature controller and a heating element electrically connected to the thermostat, the thermostat is disposed outside the body, and the heating component is The temperature controller controls the temperature value of the heating element to be heated, so that the heating element can heat the normal temperature fluid at a temperature value. The liquid thermostatic control device according to claim 2, wherein the heating member is continuously curved and is an infrared heating tube or a quartz heating tube. The liquid thermostatic control device of claim 1, further comprising an exhaust line connected to the body, the exhaust line being provided with an exhaust valve for discharging the high pressure gas generated in the body. The liquid thermostat control device of claim 4, wherein the intake line is adjacent to a bottom of the body, the exhaust line is adjacent to an upper portion of the body, and the intake line and the exhaust The pipelines are disposed on the same side of the body. The liquid thermostatic control device of claim 1 or 5, further comprising a pressurization line connected to the body and adjacent to the upper portion of the body to facilitate the constant temperature fluid from the drain line discharge. The liquid thermostat control device according to claim 1, wherein the liquid inlet pipe and the liquid discharge pipe are respectively provided with a water inlet valve and a water outlet valve. The liquid thermostatic control device according to claim 1 or 7, wherein the liquid inlet pipe is disposed on a side adjacent to the bottom of the body, and the liquid discharge pipe is disposed at a bottom of the body. The liquid thermostatic control device of claim 1, further comprising a water level pipe, wherein the two ends of the water level pipe are respectively connected to the body. A liquid constant temperature control device comprises: two bodies each having an accommodating space; two liquid inlet pipes respectively connected to the respective bodies, and a normal temperature fluid can be separately introduced into each of the accommodating spaces; Two heating components are respectively disposed on each of the bodies, and can heat the normal temperature fluid in each of the accommodating spaces; an air inlet pipe is connected to each of the bodies, and a gas guide of a high pressure gas source can be Introducing each of the accommodating spaces to cause a turbulent flow phenomenon in the normal temperature fluid in each of the accommodating spaces, thereby forming a constant temperature fluid when the normal temperature fluid in each of the accommodating spaces is heated; and two drain lines, They are respectively connected to the respective bodies for respectively discharging the constant temperature fluids of the accommodating spaces. The liquid thermostatic control device of claim 10, wherein the two inlet conduits are each provided with a water inlet valve, and the two drainage conduits are each provided with a water outlet valve. The liquid thermostatic control device of claim 10, further comprising an exhaust line connected to the two bodies, wherein the exhaust line is provided with two exhaust valves for respectively discharging the two The high-pressure gas generated in the body, and the intake pipe is provided with two intake valves for respectively controlling the gas guides of the high-pressure gas source to be introduced into the accommodating spaces of the two bodies. The liquid thermostatic control device of claim 10, further comprising two pressurized pipelines connected to the respective bodies and adjacent to the upper portions of the bodies to facilitate constant temperature in each of the receiving spaces. Fluid is discharged from each of the drain lines.