TWM483941U - Closing the wafer transfer box - Google Patents

Closing the wafer transfer box Download PDF

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Publication number
TWM483941U
TWM483941U TW103202498U TW103202498U TWM483941U TW M483941 U TWM483941 U TW M483941U TW 103202498 U TW103202498 U TW 103202498U TW 103202498 U TW103202498 U TW 103202498U TW M483941 U TWM483941 U TW M483941U
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TW
Taiwan
Prior art keywords
cover
wafer transfer
transfer cassette
closed
closed wafer
Prior art date
Application number
TW103202498U
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Chinese (zh)
Inventor
zhi-mao Jiang
Guo-Jun Hong
Original Assignee
Chung King Entpr Co Ltd
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Filing date
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Application filed by Chung King Entpr Co Ltd filed Critical Chung King Entpr Co Ltd
Priority to TW103202498U priority Critical patent/TWM483941U/en
Publication of TWM483941U publication Critical patent/TWM483941U/en
Priority to CN201420799940.7U priority patent/CN204271058U/en

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  • Packaging Frangible Articles (AREA)

Description

密閉式晶圓傳送盒Closed wafer transfer box

本創作係關於一種裝載晶圓的設備,尤指一種用於半導體製程工作站與工作站之間進行搬運或移動所需能開啟閉合的一種密閉式晶圓傳送盒。This creation relates to a wafer-loading device, and more particularly to a closed wafer cassette that can be opened and closed for handling or moving between a semiconductor process workstation and a workstation.

晶圓是半導體積體電路製作時的矽晶片,從晶棒切割研磨後多呈現圓形薄片狀,依不同的尺寸可分為6吋、8吋、12吋不等,由於晶圓十分薄,在搬運時會藉由膠膜以將晶圓黏附固定於晶圓框架上而放入晶圓傳送盒內,透過承載多片晶圓框架的晶圓傳送盒來搬送。The wafer is a germanium wafer when the semiconductor integrated circuit is fabricated. After the wafer is cut and polished, it is rounded and formed into a thin sheet. According to different sizes, it can be divided into 6吋, 8吋, 12吋, because the wafer is very thin. During transportation, the wafer is adhered and fixed to the wafer frame by a film, placed in a wafer transfer cassette, and transported through a wafer transfer cassette carrying a plurality of wafer frames.

按,目前的晶圓傳送盒並無設計外蓋,當在半導體製程之工作站/機台與工作站/機台之間搬運時容易有細微的灰塵沾覆在晶圓上使後續的晶圓在使用上良率降低。According to the current wafer transfer cassette, there is no design cover. When handling between the workstation/machine station of the semiconductor process and the workstation/machine, it is easy to have fine dust on the wafer to make the subsequent wafers in use. The upper yield is reduced.

本創作之目的即在提供一種密閉式晶圓傳送盒,讓晶圓傳送盒在密閉至開啟或是在開啟至密閉的操作過程中,晶圓傳送盒內部的晶圓框架不會因操作所受到的應力而受損,進而破壞晶圓的結構。The purpose of this creation is to provide a closed wafer transfer cassette that allows the wafer cassette inside the wafer cassette to be protected from operation during the process of sealing to opening or opening to sealing. The stress is damaged, which in turn destroys the structure of the wafer.

為達上述之目的,本創作之技術手段在於:一盒體,係具有提供容置複數晶圓框架的容置空間; 一導引元件,係固設在該盒體之一面上並具有至少一導引槽;一片體,具有至少一樞接滑動部,而該至少一樞接滑動部係以可滑動及可樞轉的方式容置於該導引元件內的至少一導引槽中,使該片體予以相對該至少一導引槽作滑動及樞轉;一蓋子,係以可樞轉的方式與該片體結合並選擇性地密閉該盒體的容置空間;及至少一支撐塊,其固設於該盒體之一面上並具有凹口,其中,藉由該至少一樞接滑動部而使該片體在該至少一導引槽滑動及樞轉,以便讓該盒體與該蓋子分離,並可將該蓋子的一邊穩固地放置於該至少一支撐塊的凹口上,讓該盒體呈開啟狀態,同時確保該蓋子在開啟的過程中的樞轉空間不會牴觸周圍的精密機台或儀器等。For the above purposes, the technical means of the creation is: a box body having a receiving space for accommodating a plurality of wafer frames; a guiding member fixed on one surface of the casing and having at least one guiding groove; a body having at least one pivoting sliding portion, wherein the at least one pivoting sliding portion is slidable and pivotable The method is received in at least one guiding groove in the guiding element to slide and pivot the piece relative to the at least one guiding groove; a cover is pivotally connected to the piece Combining and selectively sealing the accommodating space of the casing; and at least one supporting block fixed on one side of the casing and having a recess, wherein the piece is made by the at least one pivoting sliding portion The body slides and pivots in the at least one guiding groove to separate the box from the cover, and one side of the cover is stably placed on the recess of the at least one supporting block, so that the box is opened At the same time, ensure that the pivoting space of the cover during the opening process does not touch the surrounding precision machine or instrument.

1‧‧‧盒體1‧‧‧Box

11‧‧‧導引元件11‧‧‧Guide elements

111‧‧‧長條塊體111‧‧‧Long block

112‧‧‧導引槽112‧‧‧ guiding slot

1120‧‧‧樞接滑動部1120‧‧‧ pivot joint

1120'‧‧‧樞接滑動部1120'‧‧‧ pivot joint

1121‧‧‧擋止部1121‧‧‧stops

113‧‧‧片體113‧‧‧ tablets

114‧‧‧支撐凸塊114‧‧‧Support bumps

115‧‧‧扣件115‧‧‧fasteners

1151‧‧‧勾狀物1151‧‧‧hook

1152‧‧‧連接件1152‧‧‧Connecting parts

1153‧‧‧滑鈕1153‧‧‧ slider

1154‧‧‧鑰匙1154‧‧‧ key

1155‧‧‧鎖片1155‧‧‧Locks

1156‧‧‧活動連桿1156‧‧‧Active connecting rod

116‧‧‧支撐片116‧‧‧Support film

2‧‧‧蓋子2‧‧‧ cover

21‧‧‧第一彈性夾持件21‧‧‧First elastic clamp

210‧‧‧間隔條210‧‧‧ spacer

211‧‧‧間隙211‧‧‧ gap

212‧‧‧凹口212‧‧‧ notch

213‧‧‧凸部213‧‧‧ convex

3‧‧‧晶圓3‧‧‧ wafer

4‧‧‧晶圓框架4‧‧‧ Wafer Frame

5‧‧‧膠膜5‧‧‧film

H‧‧‧方向H‧‧ Direction

w1、w2‧‧‧寬度W1, w2‧‧‧ width

h‧‧‧距離H‧‧‧distance

117‧‧‧第二彈性夾持件117‧‧‧Second elastic clamp

118‧‧‧限制部118‧‧‧Restrictions

第1圖為本創作較佳實施例之密閉式晶圓傳送盒(密閉狀態)的立體圖;第2A~2C圖為本創作較佳實施例之密閉式晶圓傳送盒的平面作動圖,分別示意蓋子作動的位置;第3為本創作較佳實施例之密閉式晶圓傳送盒(開啟狀態)的立體圖;第4A~4C圖為本創作較佳實施例之密閉式晶圓傳送盒,其內部容置空間的平面圖及立體圖;第4D圖為本創作較佳實施例之密閉式晶圓傳送盒,其 第一彈性夾持件的結構立體圖;第5A~5B圖為本創作較佳實施例之密閉式晶圓傳送盒,其內部容置空間放置晶圓狀態的平面圖及立體圖;第6A~6C圖為本創作較佳實施例之密閉式晶圓傳送盒所採用的第一種扣件,其平面作動圖;第7A~7C圖為本創作較佳實施例之密閉式晶圓傳送盒所採用的第二種扣件,其立體作動圖;及第8A~8B圖為本創作較佳實施例之密閉式晶圓傳送盒所採用的連動鎖,其立體作動圖。1 is a perspective view of a closed wafer transfer cassette (closed state) of the preferred embodiment of the present invention; and FIGS. 2A-2C are plan views of the closed wafer transfer cassette of the preferred embodiment of the present invention, respectively The position at which the cover is actuated; the third is a perspective view of the closed wafer transfer cassette (open state) of the preferred embodiment; and the fourth to fourth embodiments of the present invention are the closed wafer transfer cassette of the preferred embodiment. A plan view and a perspective view of the accommodating space; FIG. 4D is a closed wafer transfer box of the preferred embodiment of the present invention, FIG. 5A-5B is a plan view and a perspective view of a closed wafer transfer cassette of the preferred embodiment of the present invention, in which a wafer state is placed in an internal housing space; FIGS. 6A-6C are The first type of fastener used in the closed wafer transfer cassette of the preferred embodiment of the present invention has a planar actuation diagram; and the seventh embodiment of the present invention is the first embodiment of the closed wafer transfer cassette of the preferred embodiment. Two kinds of fasteners, the three-dimensional actuation diagram thereof; and the eighth embodiment of the present invention are the interlocking locks used in the closed wafer cassette of the preferred embodiment, and the three-dimensional actuation diagram.

為便於 貴審查委員能對本創作之技術手段及運作過程有更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下。In order to facilitate your review committee to have a better understanding and understanding of the technical means and operation process of this creation, the following examples are combined with the drawings, which are described in detail below.

請參閱第1圖所示,本創作較佳實施例所提供之密閉式晶圓傳送盒,其包括一盒體1及一蓋子2,其中該盒體1具有提供放置多個晶圓框架(wafer frame)的容置空間與開口,而該蓋子2予以選擇性地覆蓋該盒體1的開口,使該盒體1的容置空間呈現密閉狀態。Referring to FIG. 1 , a closed wafer transfer cassette provided by the preferred embodiment of the present invention includes a case 1 and a cover 2, wherein the case 1 has a plurality of wafer frames (wafer). The accommodating space and the opening of the frame 2 selectively cover the opening of the casing 1 so that the accommodating space of the casing 1 is in a sealed state.

該盒體1之一面具有一導引元件11,其是由二相互平行的長條塊體111固設於該盒體1的面上所構成。該等長條塊體111在其縱身內部兩側凹設有兩導引槽112。此外可進一步分別在該等長條塊體111之一端凸設有一限制部118。One of the casings 1 has a guiding member 11 which is formed by two parallel blocks 111 which are parallel to each other and which are fixed to the surface of the casing 1. The elongated blocks 111 are recessed with two guiding grooves 112 on both sides of the longitudinal body. Further, a restricting portion 118 may be further protruded at one end of the elongated block 111.

該盒體1復具有一片體113,而該片體113又在其遠離該蓋子2之一端固設有兩樞接滑動部1120,請參閱第2A~2C圖。該等樞接滑 動部1120為圓柱狀並分別容置於該導引槽112中,使得該片體113藉由樞接滑動部1120沿著該導引槽112的導引進行雙向的滑動。再者,由於該樞接滑動部1120為圓柱狀的結構,使得該片體113予以相對該導引槽112作樞轉的動作。The casing 1 has a body 113, and the body 113 has two pivoting sliding portions 1120 fixed at one end thereof away from the cover 2, please refer to FIGS. 2A-2C. These pivotal slides The moving portion 1120 is cylindrical and is respectively received in the guiding groove 112, so that the sheet body 113 is bidirectionally slid by the guiding of the pivoting sliding portion 1120 along the guiding groove 112. Moreover, since the pivotal sliding portion 1120 has a cylindrical structure, the sheet body 113 is pivoted relative to the guiding groove 112.

該盒體1復具有一組支撐凸塊114,其固設於該片體113的兩側且靠近該盒體1與該蓋子2的結合處。The casing 1 has a plurality of supporting protrusions 114 fixed to both sides of the sheet body 113 and adjacent to the joint of the box body 1 and the cover 2.

該蓋子2與該片體113可藉由至少一軸承以可樞轉的方式相互結合。當該蓋子2覆蓋該盒體1的開口後,可藉由至少一扣件115將該蓋子1穩固地固定覆蓋於該盒體1的開口,如第1圖所示,使該盒體1的容置空間呈密閉。The cover 2 and the body 113 can be coupled to each other in a pivotable manner by at least one bearing. After the cover 2 covers the opening of the casing 1, the cover 1 can be firmly fixed to the opening of the casing 1 by at least one fastener 115. As shown in FIG. 1, the casing 1 is The accommodation space is sealed.

請再參閱第2A圖至第2C圖所示,為本創作較佳實施例所提供之密閉式晶圓傳送盒的平面側視圖。該蓋子2對應該盒體1的內側面固設有一第一彈性夾持件21,其結構特徵將於之後段落說明。另外,該支撐凸塊114的表面具有一凹口,作為該蓋子2打開後的支撐處,其詳細實施方式將於之後段落說明。Please refer to FIGS. 2A-2C for a plan view of the closed wafer transfer cassette provided by the preferred embodiment of the present invention. The cover 2 is fixed with a first elastic clamping member 21 corresponding to the inner side surface of the casing 1. The structural features will be described in the following paragraphs. In addition, the surface of the support projection 114 has a recess as a support after the cover 2 is opened, and a detailed embodiment thereof will be described later.

如第2A圖所示,欲打開該蓋子2以放置或拿取該盒體1內的晶圓時,首先可藉由該片體113的樞接滑動部1120沿水平方向遠離該盒體1而往前推開一預設距離h來進一步單向地推動該蓋子2,使該蓋子2的內側面沿著該片體113的滑動方向遠離該盒體1的開口,其中該預設距離h之長短係由實際作業環境中該片體可被接受之最小樞轉空間而決定者。值得注意的是,該片體113具有一寬度w2的內縮段,即在該片體113之特定區域的兩側邊分別凹設有一缺口以形成該 內縮段,如第1圖所示,使得該內縮段的寬度w2小於該片體113在非內縮段的寬度w1。由於該蓋子2在閉合而未被推動之前,寬度w2的內縮段與該限制部118彼此並未對準而使得該限制部118阻擋該蓋子2的樞轉,當藉由該片體113往前推開該蓋子2至該預設距離h以使在該內縮段之凹口對準該限制部118,此時該蓋子2可直接對應該盒體1作樞轉的動作。此外亦可進一步在該等長條塊體111之間設置一擋止部1121以避免將該片體113往前推開過多的距離。As shown in FIG. 2A, when the cover 2 is to be opened to take or take the wafer in the casing 1, the pivoting sliding portion 1120 of the sheet 113 can be firstly moved away from the casing 1 in the horizontal direction. Pushing a predetermined distance h forward to further push the cover 2 in a unidirectional manner so that the inner side surface of the cover 2 is away from the opening of the casing 1 along the sliding direction of the sheet 113, wherein the predetermined distance h The length is determined by the minimum pivoting space that the sheet can accept in the actual working environment. It should be noted that the sheet body 113 has a retracted section of a width w2, that is, a notch is respectively formed on both sides of a specific area of the sheet body 113 to form the sheet. The indented section, as shown in Fig. 1, is such that the width w2 of the indented section is less than the width w1 of the sheet 113 in the non-indented section. Since the cover 2 is closed and not pushed, the retracted section of the width w2 and the restricting portion 118 are not aligned with each other such that the restricting portion 118 blocks the pivoting of the cover 2 when the sheet 113 is moved by the sheet 113 The cover 2 is pushed forward to the predetermined distance h to align the recess of the retracted section with the restricting portion 118, and the cover 2 can directly pivot the corresponding action of the case 1. Further, a stopper portion 1121 may be further disposed between the elongated blocks 111 to prevent the sheet 113 from being pushed forward by an excessive distance.

接著,如第2B圖所示,該盒體1與該蓋子2推開後,該片 體113可藉由該導引槽112的樞接滑動部1120來進一步將該蓋子2樞轉上移至該盒體1的一側。Then, as shown in FIG. 2B, after the case 1 and the cover 2 are pushed open, the piece The body 113 can further pivotally move the cover 2 up to one side of the casing 1 by the pivoting sliding portion 1120 of the guiding groove 112.

如第2C圖所示,當該蓋子2上移至該盒體1的一側後,藉 由該片體113之樞接滑動部1120,可再將該片體113沿著一反向方向H滑動至該導引槽112的另一端(即從樞接滑動部1120所在原來位置平滑至樞接滑動部1120'所在新的位置),以便將該蓋子2的一側穩固地放置於該支撐凸塊114的凹口上,使該密閉式晶圓容置器呈開啟的靜止狀態。As shown in FIG. 2C, when the cover 2 is moved up to one side of the case 1, By sliding the sliding portion 1120 of the sheet 113, the sheet 113 can be slid in a reverse direction H to the other end of the guiding groove 112 (ie, smooth from the original position of the pivoting sliding portion 1120). The sliding portion 1120' is placed in a new position to firmly place one side of the cover 2 on the recess of the supporting protrusion 114, so that the sealed wafer container is in an open state.

請參閱第3圖所示,該盒體1之對稱內壁分別具有複數相互 平行的支撐片116。該密閉式晶圓傳送盒呈開啟狀態後,晶圓框架(或晶圓)便能順著該等支撐片116插入該盒體1中。Referring to FIG. 3, the symmetrical inner walls of the casing 1 have a plurality of mutual Parallel support pieces 116. After the closed wafer transfer cassette is in an open state, the wafer frame (or wafer) can be inserted into the cassette 1 along the support sheets 116.

請參閱第4A圖至第4C圖所示,分別是該密閉式晶圓傳送盒呈密閉狀態的平面剖視圖(第4A圖)及立體剖視圖(第4B、4C圖)。Please refer to FIGS. 4A to 4C, which are a plan sectional view (FIG. 4A) and a perspective cross-sectional view (FIGS. 4B and 4C) in which the sealed wafer transfer cassette is sealed.

請參閱第4A圖至第4D圖所示,該盒體1的內壁的對稱處又具有複數第二彈性夾持件117,其可由彎曲的彈性片體或彈性塊體所構 成,其中該等第二彈性夾持件117具有波浪狀且富彈性的表面用以卡持晶圓框架(如第5A圖所示)。此外,該蓋子2對應該盒體1的內側面固設有第一彈性夾持件21,而該第一彈性夾持件21的結構特徵如第4D圖所示,其係由複數間隔條210以水平陣列方式所構成,其中每一間隔條210之側面呈現一V型開口,以引導並抵靠在每一晶圓框架4相對於該蓋體2內面之對向邊,如第5A圖所示,而兩相鄰間隔條210之間具有一預設長度之間隙211,以供間隔條210彈性接觸每一晶圓框架之對向邊,此外兩相鄰間隔條210之兩相鄰邊,沿著該間隙211各凹設有多個凹口212及對應該等凹口212所凸設之多個凸部213,其中該每一凸部213用以導引定位每一晶圓框架無誤置於該V型開口內而非間隙211。Referring to FIGS. 4A to 4D, the symmetry of the inner wall of the casing 1 further has a plurality of second elastic clamping members 117 which may be constructed of curved elastic sheets or elastic blocks. The second elastic clamping member 117 has a wavy and elastic surface for holding the wafer frame (as shown in FIG. 5A). In addition, the cover 2 is fixed with a first elastic clamping member 21 corresponding to the inner side surface of the casing 1, and the first elastic clamping member 21 has the structural features as shown in FIG. 4D, which is composed of a plurality of spacer strips 210. The horizontal array is configured, wherein each side of the spacer 210 presents a V-shaped opening to guide and abut against the opposite side of each wafer frame 4 relative to the inner surface of the cover 2, as shown in FIG. 5A. Between the two adjacent spacer strips 210, there is a gap 211 of a predetermined length between the spacer strips 210 for elastically contacting the opposite sides of each wafer frame, and two adjacent sides of the two adjacent spacer strips 210. A plurality of notches 212 are formed in each of the gaps 211 and a plurality of protrusions 213 corresponding to the notches 212 are formed. The protrusions 213 are used to guide and position each wafer frame. Placed within the V-shaped opening instead of the gap 211.

請參閱第5A圖至第5B圖所示,分別是該密閉式晶圓傳送 盒呈密閉狀態之平面剖視圖(第5A圖)及立體剖視圖(第5B圖),並含有複數片放置晶圓框架4於其內之容置空間。該每一晶圓框架(wafer frame)4藉由膠膜5以將晶圓3黏附固定於晶圓框架4上,如第5A與5B圖所示。Please refer to Figures 5A to 5B, which are the closed wafer transfer The box has a closed cross-sectional view (Fig. 5A) and a perspective cross-sectional view (Fig. 5B), and includes a plurality of accommodating spaces in which the wafer frame 4 is placed. Each wafer frame 4 is adhered and fixed to the wafer frame 4 by a film 5 as shown in FIGS. 5A and 5B.

該等晶圓框架4主要係受到該等支撐片體116的支撐而分 布於該盒體1內的容置空間。為了避免該等晶圓框架4在搬運過程中沿著該等支撐片116的方向滑動,該第一彈性夾持件21和該等第二彈性夾持件117便提供其他方向上的夾持作用,同時藉由彈性提供緩衝的作用,避免該等晶圓框架4在運送過程中受到過大的應力而受損。The wafer frames 4 are mainly supported by the support sheets 116. An accommodation space disposed in the casing 1. In order to prevent the wafer frames 4 from sliding in the direction of the support sheets 116 during the handling, the first elastic clamping members 21 and the second elastic clamping members 117 provide clamping in other directions. At the same time, by providing cushioning by elasticity, the wafer frame 4 is prevented from being damaged by excessive stress during transportation.

由於該等支撐片116、該第一彈性夾持件21及該等第二彈性夾持件117並未接觸該等晶圓3,因此保護該等晶圓3的外表免於受損。Since the support sheets 116, the first elastic holding members 21 and the second elastic holding members 117 do not contact the wafers 3, the appearance of the wafers 3 is protected from damage.

請參閱第1圖與第6A圖至第6C圖所示,該密閉式晶圓傳 送盒所採用的該至少一扣件115可為一種二段式樞轉的活動扣件,其係由一勾狀物1151及一連接件1152所構成,該勾狀物1151以可樞轉的方式與該連接件1152結合,而該連接件1152又與該蓋子2以可樞轉的方式結合,藉此該勾狀物1151予以選擇性地勾持住該盒體1及該蓋子2,達到固定或鬆開的狀態。Please refer to Figure 1 and Figure 6A to Figure 6C for the closed wafer transfer. The at least one fastener 115 used for the delivery box can be a two-stage pivoting movable fastener, which is composed of a hook 1151 and a connecting member 1152. The hook 1151 is pivotally connected with The connector 1152 is coupled, and the connector 1152 is pivotally coupled to the cover 2, whereby the hook 1151 selectively hooks the case 1 and the cover 2 to a fixed or Released state.

請參閱第1圖與第7A圖至第7C圖所示,該密閉式晶圓傳 送盒所採用的該至少一扣件115可替換為為一種滑扣,其係由分別設置在該盒體1及該蓋子2表面上的二滑軌(未標號)及一可在該等滑軌上運行的滑鈕1153所構成,藉由該滑鈕1153選擇性的扣住該盒體1及該蓋子2上的滑軌,達到固定或鬆開的狀態。Please refer to Figure 1 and Figure 7A to Figure 7C for the closed wafer transfer. The at least one fastener 115 used in the delivery box can be replaced by a slider, which is provided with two sliding rails (not labeled) respectively disposed on the surface of the casing 1 and the cover 2, and a slide The slider 1153 is operated on the rail, and the slider 1153 selectively latches the slider 1 and the slide rail on the cover 2 to be in a fixed or loose state.

請參閱第1圖與第8A圖至第8B圖所示,該密閉式晶圓傳 送盒除了採用該至少一扣件115之外,亦可採用設置於該蓋子2內部的一種連動鎖,其係由一鑰匙1154、一組用來抵住該盒體1的鎖片1155及一組連接該等鎖片1155的活動連桿1156所構成。該鑰匙1154可選擇性地驅動該等活動連桿1156進而控制該等鎖片1155抵住該盒體1,達到固定或鬆開的狀態。此外,本創作所揭露之密閉式晶圓傳送盒所用之材質可以是選自於由塑膠、鋁、金屬合金所構成群組中之至少1種物質。Please refer to Figure 1 and Figure 8A to Figure 8B for the closed wafer transfer. In addition to the at least one fastener 115, the delivery box may also adopt a linkage lock disposed inside the cover 2, which is composed of a key 1154, a set of locking pieces 1155 for resisting the casing 1, and a A set of movable links 1156 that connect the lock pieces 1155 are formed. The key 1154 can selectively drive the movable links 1156 to control the locking pieces 1155 against the casing 1 to be in a fixed or loose state. In addition, the material used for the closed wafer transfer cassette disclosed in the present invention may be at least one selected from the group consisting of plastic, aluminum, and metal alloy.

上列詳細說明係針對本創作之可行實施例之具體說 明,惟該實施例並非用以限制本創作之專利範圍,凡未脫離本創作技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。The detailed description above is specific to the possible embodiments of this creation. It is to be understood that the examples are not intended to limit the scope of the patents of the present invention, and that equivalents or modifications may be included in the scope of the patent.

1‧‧‧盒體1‧‧‧Box

11‧‧‧導引元件11‧‧‧Guide elements

111‧‧‧長條塊體111‧‧‧Long block

112‧‧‧導引槽112‧‧‧ guiding slot

113‧‧‧片體113‧‧‧ tablets

114‧‧‧支撐凸塊114‧‧‧Support bumps

115‧‧‧扣件115‧‧‧fasteners

118‧‧‧限制部118‧‧‧Restrictions

2‧‧‧蓋子2‧‧‧ cover

w1‧‧‧寬度W1‧‧‧Width

w2‧‧‧寬度W2‧‧‧Width

Claims (13)

一種密閉式晶圓傳送盒,包括:一盒體,係具有提供容置複數個晶圓框架的容置空間;一導引元件,係固設在該盒體之一面上並具有至少一導引槽;一片體,具有至少一樞接滑動部,而該至少一樞接滑動部係以可滑動及可樞轉的方式容置於該導引元件內的該至少一導引槽中,使該片體相對該至少一導引槽作滑動及樞轉;及一蓋子,係以可樞轉的方式與該片體結合並選擇性地密閉該盒體的容置空間。 The invention relates to a closed wafer transfer cassette, comprising: a box body having an accommodating space for accommodating a plurality of wafer frames; a guiding element fixed on one side of the box body and having at least one guide a slot having at least one pivotal sliding portion, the at least one pivoting sliding portion being slidably and pivotally received in the at least one guiding slot in the guiding element, such that The sheet slides and pivots relative to the at least one guiding slot; and a cover pivotally engages the sheet and selectively seals the receiving space of the box. 如申請專利範圍第1項所述之密閉式晶圓傳送盒,其中該蓋子之內側面設有複數第一彈性夾持件,而該盒體內側面設有複數第二彈性夾持件與複數支撐片,該等晶圓框架藉由該等第一彈性夾持件與該等第二彈性夾持件的夾持,以及該等支撐片的支撐,使該該等晶圓框架穩固地容置於該盒體中。 The closed wafer transfer cassette of claim 1, wherein the inner side of the cover is provided with a plurality of first elastic clamping members, and the inner side of the casing is provided with a plurality of second elastic clamping members and a plurality of supports The wafer frames are firmly accommodated by the first elastic clamping members and the second elastic clamping members, and the supporting of the supporting sheets In the box. 如申請專利範圍第1至2項中任一所述之密閉式晶圓傳送盒,其中該蓋子與該盒體間的接合處設有至少一用於固定或鬆開該蓋子與該盒體兩者連接狀態的活動扣件。 The closed wafer transfer cassette of any one of claims 1 to 2, wherein the joint between the cover and the case is provided with at least one for fixing or releasing the cover and the case. The active fastener of the connected state. 如申請專利範圍第3項所述之密閉式晶圓傳送盒,其中該活動扣件其係由一勾狀物及一連接件所構成,該勾狀物以可樞轉的方式與該連接件結合,而該連接件又與該蓋子以可樞轉的方式結合,藉此該勾狀物予以選擇性地勾持住該盒體及該蓋子,達到固定或鬆開的狀 態。 The closed wafer transfer cassette of claim 3, wherein the movable fastener is composed of a hook and a connecting member, and the hook is pivotally connected to the connecting member. In combination, the connector is pivotally coupled to the cover, whereby the hook selectively hooks the case and the cover to a fixed or loose shape state. 如申請專利範圍第1至2項中任一所述之密閉式晶圓傳送盒,其中該蓋子與該盒體間的接合處設有至少一用於固定或鬆開該蓋子與該盒體兩者連接狀態的滑扣。 The closed wafer transfer cassette of any one of claims 1 to 2, wherein the joint between the cover and the case is provided with at least one for fixing or releasing the cover and the case. The slider of the connection state. 如申請專利範圍第5項所述之密閉式晶圓傳送盒,其中該滑扣係由分別設置在該盒體及該蓋子表面上的二滑軌及一可在該等滑軌上運行的滑鈕所構成,藉由該滑鈕選擇性的扣住該盒體及該蓋子上的滑軌,達到固定或鬆開的狀態。 The closed wafer transfer cassette of claim 5, wherein the slide fastener is provided by two slide rails respectively disposed on the cover body and the cover surface, and a slide that can be run on the slide rails. The button is formed by the slider selectively locking the box and the slide rail on the cover to achieve a fixed or loose state. 如申請專利範圍第1至2項中任一所述之密閉式晶圓傳送盒,其中該蓋子內部有一用於扣緊或鬆開該蓋子與該盒體兩者連接狀態的連動鎖。 The closed wafer transfer cassette of any one of claims 1 to 2, wherein the cover has a interlocking lock for fastening or releasing the connection between the cover and the case. 如申請專利範圍第7項所述之密閉式晶圓傳送盒,其中該連動鎖係由一鑰匙、一組用來抵住該盒體的鎖片及一組連接該等鎖片的活動連桿所構成。該鑰匙可選擇性地驅動該等活動連桿進而控制該等鎖片抵住該盒體,達到固定或鬆開的狀態。 The closed wafer transfer cassette of claim 7, wherein the interlocking lock is a key, a set of locking pieces for abutting the box, and a set of movable links connecting the locking pieces. Composition. The key selectively drives the movable links to control the locking tabs against the casing to achieve a fixed or loose state. 如申請專利範圍第1項所述之密閉式晶圓傳送盒,進一步包含至少一支撐塊,以將該蓋子的一邊穩固地放置於該至少一支撐塊的凹口上,讓該盒體呈開啟狀態。 The closed wafer transfer cassette of claim 1, further comprising at least one support block for firmly placing one side of the cover on the recess of the at least one support block to open the case . 如申請專利範圍第2項所述之密閉式晶圓傳送盒,其中第一彈性夾持件包含有複數間隔條,其中該各間隔條之側面呈現一V型開口,以引導並抵靠在該每一晶圓框架相對於該蓋體內面之對向邊,而該兩相鄰間隔條之間具有一間隙,以供該各間隔條彈性接觸該晶圓框 架之對向邊。 The closed wafer transfer cassette of claim 2, wherein the first elastic holding member comprises a plurality of spacer strips, wherein a side of each of the spacer strips presents a V-shaped opening to guide and abut the same Each wafer frame has a gap with respect to an inner side of the inner surface of the cover, and a gap is formed between the two adjacent spacer strips for the spacer strips to elastically contact the wafer frame The opposite side of the frame. 如申請專利範圍第10項所述之密閉式晶圓傳送盒,其中該等兩相鄰之間隔條之兩相鄰邊,沿著該間隙各凹設有複數凹口及對應該等凹口所凸設之複數凸部,而該每一凸部用以導引定位該每一晶圓框架。 The closed wafer transfer cassette of claim 10, wherein two adjacent sides of the two adjacent spacer strips are recessed with a plurality of recesses and corresponding recesses along the gap. A plurality of convex protrusions are protruded, and each convex portion is used to guide and position each of the wafer frames. 如申請專利範圍第1項所述之密閉式晶圓傳送盒,該密閉式晶圓傳送盒所用材質係選自於由塑膠、鋁、金屬合金所構成群組中之至少1種物質。 The closed wafer transfer cassette according to claim 1, wherein the material of the closed wafer transfer cassette is selected from at least one selected from the group consisting of plastic, aluminum, and metal alloy. 如申請專利範圍第1項所述之密閉式晶圓傳送盒,該片體更進一步設有一內縮段,而該內縮段在其兩側邊分別凹設有一缺口用以分別對準凸設在該導引元件之一限制部。The closed wafer transfer cassette of claim 1, wherein the sheet is further provided with a retracting section, and the retracted section is respectively recessed on both sides thereof for respectively aligning the protrusions At one of the guiding elements of the guiding element.
TW103202498U 2014-02-13 2014-02-13 Closing the wafer transfer box TWM483941U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
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TWI628122B (en) * 2016-03-15 2018-07-01 景碩科技股份有限公司 Card with open and close frame
TWI642602B (en) * 2017-03-15 2018-12-01 景碩科技股份有限公司 Cassette with retractable frame(s)

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Publication number Priority date Publication date Assignee Title
CN110379748B (en) * 2018-04-12 2024-08-06 特铨股份有限公司 Side cover type box body cover lifting equipment and side cover type box body cover lifting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI628122B (en) * 2016-03-15 2018-07-01 景碩科技股份有限公司 Card with open and close frame
TWI642602B (en) * 2017-03-15 2018-12-01 景碩科技股份有限公司 Cassette with retractable frame(s)

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