TWM480428U - Gluing device - Google Patents

Description

Dispensing device

The present invention is to provide a dispensing device, in particular to a device having a dispensing dispensing head for providing a glue droplet of a glue to a workpiece to be glued, for the workpiece to be glued, especially for the application. In a horizontal shape to be glued.

The dispensing head of the existing dispensing device is usually arranged vertically, and the working process is to first drive the dispensing head to move in the vertical direction by the power device, and when the dispensing head moves to the height of the dispensing position of the workpiece, the power device Stop driving the dispensing head to move in the vertical direction. Then, the driving device drives the dispensing head to move in the horizontal direction. When the dispensing head moves to contact the processing member, the dispensing head discharges the glue, thereby completing the dispensing process.

Since the lifting device for controlling the movement of the dispensing head can only adjust the position of the dispensing head from the vertical direction, the control of the position of the dispensing head is limited, and the dispensing position cannot be accurately dispensed, which also affects the quality of the dispensing. Therefore, the existing dispenser is inconvenient to operate and has low work efficiency. Therefore, some conventional dispensing devices place the dispensing head obliquely to improve the quality of the dispensing.

However, for the state of the positive side dispensing, the above two dispensing devices are still not applicable. Especially for the three-dimensional stack packaging technology of the semiconductor process, in the parallel lamination of the substrate or the wafer, not only the vertical dispensing device is not suitable, the inclined dispensing device can only obliquely spray the glue. Drops are still not ideal in the quality of the glue. Furthermore, the existing semiconductor technology has utilized a three-dimensional integrated wafer (substrate) assembly for bonding two wafers, the glued portion is completely horizontal, the vertical dispensing device is not suitable, and the inclined dispensing is applied. A slight deviation of the device may make the glue The agent falls on the wafer and affects the quality of the dispense and even damages the wafer assembly.

The purpose of this creation is to solve the shortcomings of the above-mentioned conventional dispensers. For the workpieces having the side to be glued, whether the glue is to be on the same horizontal line or whether there is a depression or protrusion, the glue can be ensured. quality.

This creation is suitable for a wafer (substrate) assembly of wafer bonding technology in a three-dimensional integrated structure, where the glue to be glued is completely horizontal, including grooves or flat edges, and the glue quality can be maintained.

In order to achieve the above, the present invention provides a dispensing device for dispensing a workpiece having a plurality of portions to be glued, the dispensing device including a carrying platform for carrying the workpiece; the camera module includes a top view lens disposed above the workpiece and capturing information on the horizontal position of the to-be-bonded portion, and a side view lens disposed on a side of the workpiece and adjacent to the jet dispensing head, the side view lens capturing the side view lens The vertical position information of the glue to be glued; a jet dispensing head sprays a plurality of glue droplets in a horizontal direction toward the portions to be glued of the workpiece; and a moving module, according to the position information of the glue to be glued, The spray dispensing head is moved and raised, and the glue drops are sprayed to the portions to be glued of the jet dispensing head.

This creation has at least the following advantages: the dispensing device of the present invention uses a horizontally sprayed glue drop and cooperates with the moving module, and the glued part of the workpiece to be glued is located on the side of the workpiece, still ensuring the quality of the glue, including dripping. Position accuracy, and the accuracy of the amount of glue.

The above description of the present invention and the following description of the embodiments are provided to illustrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention.

100‧‧‧ Dispensing device

9‧‧‧Processed parts

90‧‧‧to be glued

92‧‧‧ Groove

10‧‧‧Base

12‧‧‧Human Machine Interface Module

121‧‧‧ display

122‧‧‧ keyboard

123‧‧‧ Mouse

20‧‧‧Loading platform

21‧‧‧Rotary support

22‧‧‧ Guide column

23‧‧‧Optical alignment unit

30‧‧‧ camera module

31‧‧‧Look down lens

32‧‧‧Side view lens

40‧‧‧Spray dispensing head

42‧‧‧Nozzles

44‧‧‧colloid injection tube

45‧‧‧Control valve

46‧‧‧ main cavity

48‧‧‧stroke adjustment knob

49‧‧‧ pedestal

50‧‧‧Mobile Module

51‧‧‧ Track

52‧‧‧Sliding seat

53‧‧‧First motor

54‧‧‧Adapter

56‧‧‧second motor

60‧‧‧Curing module

61‧‧‧Cure energy components

62‧‧‧ ‧ frame

63‧‧‧Shielding unit

70‧‧‧ Weight verification module

80‧‧‧ cleaning module

82‧‧‧Test spray board

G‧‧‧ Path

Figure 1 is a perspective view of the dispensing device of the present invention.

2, 2A and 3 are partial enlarged views of the dispensing device of the present invention.

Figure 4 is a side view of the dispensing device of the present invention.

4A is a partial perspective view of the dispensing device of the dispensing device of the present invention.

Figure 5 is a top plan view of the dispensing device of the present invention.

Fig. 5A is an enlarged view of a portion 5A of Fig. 5.

Figure 6 is another side view of the dispensing device of the present invention.

The embodiments described below are referred to by the number or the like, and the scope of application of the present invention should not be limited by the number or the like unless otherwise stated. The directional terms mentioned in this creation, such as left, right, front or back, are only used to refer to the direction of the additional schema, and are used to illustrate and not to limit the creation.

Please refer to FIG. 1 to FIG. 3 , which are perspective views of a dispensing device of the present invention and a partial enlarged view thereof. The present invention provides a dispensing device 100 for dispensing a workpiece 9 having a plurality of portions 90 to be glued. The dispensing device 100 includes a base 10, a carrying platform 20, a camera module 30, and an injection point. The rubber head 40, a moving module 50, a curing module 60, a weight verification module 70, and a cleaning module 80.

The main body of the base 10 is for accommodating an electronic control device and a power device (not shown) and carrying the above components. A human interface module 12 is disposed on one side of the base 10. The human interface module 12 includes a display 121, a keyboard 122, and a mouse 123, but is not limited thereto. For example, it can also be a touch screen.

The carrying platform 20 is for carrying the workpiece 9 and preferably rotating the workpiece 9 to fit the jet dispensing head 40. The application of the dispensing device of the present embodiment is a wafer assembly containing two bonded wafers as the workpiece 9, and the various component arrangements of the present embodiment are described in conjunction with the needs of the wafer assembly. However, this creation is not limited to wafer assemblies, but can be applied to other workpieces that require gluing.

The above wafer (substrate) bonding can be applied to optical assembly or vertical volume circuit (3D IC) technology. About wafer bonding processes including Fusion Bonding, Metal Thermal Compression Bonding, and Polymer Bonding Polymer Adhesive Bonding, and special eutectic bonding. Since it is not the technical point of this creation, it will not be described. After bonding, the gap around the wafer needs to be glued, including the notch or flat of the wafer.

In conjunction with the wafer assembly, the carrier platform 20 of the present embodiment is a pre-aligner for collating and positioning the wafer assembly at a correct processing position by providing substrate placement. Non-contact measurement of the accuracy of eccentricity and direction to overcome the positioning error caused by vibration during transmission. Pre-aligner operation, including measurement of wafer displacement, calculation of necessary compensation, and orientation of the groove (or flat edge) to the desired angle. The upstream of the pre-aligner can be coupled to a wafer handler delivers to transport the wafer assembly to be processed, and can be coupled to different machines in tandem with appropriate communication protocols to obtain information from each other into a production line.

Please refer to FIG. 4 and FIG. 4A. FIG. 4 is a side view of the dispensing device of the present invention; FIG. 4A is a partial perspective view of the dispensing device of the dispensing device of the present invention. The pre-aligner (the carrier platform 20) of the embodiment includes a rotating support base 21 for supporting and rotating the wafer assembly (the workpiece 9), and a plurality of guiding posts 22 abutting the bottom surface of the wafer assembly. And an optical alignment unit 23 disposed at an edge of the wafer assembly.

The camera module 30 is configured to capture and record the contour of the portion to be glued 90, and then transmit the contour to the electronic processing unit for subsequent control of the reference of the jet dispensing head 40. The camera module 30 includes a top view lens 31 and a side view lens 32. The top view lens 31 is disposed above the processing member 9 for capturing horizontal position information of the parts to be glued. The side view lens 32 is disposed. The side of the workpiece 9 is adjacent to the jetting head 40 for capturing the vertical position information of the portion to be glued.

Referring to FIG. 2A, the jet dispensing head 40 sprays a plurality of glue drops in a horizontal direction toward the portions to be bonded 90 of the workpiece 9. The jet dispensing head 40 is a non-contacting spray head that provides controlled dispensing of high speed and large capacity for adhesive liquids such as sealants, underfills, UV adhesives, surface coating materials, and the like. The jet dispensing head 40 includes a nozzle 42 including a thermal control member, a gel injection tube 44 connected to the rear of the nozzle 42, a main chamber 46 located behind the nozzle 42, a stroke adjusting knob 48, and A control valve 45. The main cavity 46 houses the components for adjustment. Regarding the cartridge (not shown) to which the dispensing dispensing head 40 is attached to the colloidal injection tube 44 to provide a glue, it may be vertically or obliquely disposed.

The curing module 60 cures the glue droplets. The curing module 60 includes a curing energy component 61, a frame 62 that fixes the curing energy component 61, and a shielding unit 63 adjacent to the curing energy component 61. The curing energy element 61 can be a source of ultraviolet light, or other curable colloid, or heated. The curing energy element 61 of the present embodiment is disposed above the base 10 in a circular arc shape by the frame body 62, adjacent to the bearing platform 20, and adjacent to the workpiece 9 to be glued. This embodiment is disposed below a portion of the circumferential perimeter of the wafer assembly. A preferred arrangement of the curing energy element 61 is to place the dispensing head 40 adjacent one end of the curing energy element 61. After the wafer assembly (machined part 9) is sized, one end of the curing energy element 61 is rotated toward the other end, so that the position of the dispensing passes through the curing energy element 61 to cure the glue.

For the glued portion of the arc-shaped periphery of the wafer assembly, the distance from the jet head 40 is substantially the same distance, and the jet can be fixed by rotating the wafer assembly (machined part 9) of the carrier platform 20 regularly. The dispensing head 40 is in the same position and ejects the glue droplets at the same frequency and speed. Frequency refers to the number of drops that are ejected at a fixed time. Speed refers to the initial velocity at which the glue drops away from the jetting head 40. These can be controlled by the stroke adjustment knob 48 and the control valve 45 of the above-described jet dispensing head 40.

Referring to FIG. 5 and FIG. 5A, the groove 92 (notch) or the flat edge of the wafer assembly is to be glued slightly away from the jet dispensing head 40. If the glue drops still maintain the above-mentioned spraying conditions, the glue drops will not fall in the proper position; in addition, since the contour of the groove is longer than the generally arc-shaped periphery, the density of the glue may not be satisfactory. In this embodiment, the moving module 50 is further used to move the jet dispensing head 40 to adjust the initial ejection position of the glue droplet, and even to adjust the injection frequency of the jet dispensing head 40 to make the waiting time longer. On the gluing contour line, the same number of glue drops are provided within the same distance, so that the quality of the glue (including the glue spot position and the glue density) is the same as other arc-shaped perimeters.

One of the features of the present invention is that the mobile module 50 moves and raises and drops the jet dispensing head 40 according to the position information of the to-be-bonded portion 90 captured by the camera module 30, and ejects the droplets to the The portions to be glued 90 of the dispensing head 40 are sprayed. Thereby, it is possible to match the portions to be glued in a slightly distant groove or protrusion so that the glue drops still fall in the correct position.

For example, when the glue 90 is formed away from the recess of the jetting head 40, the present invention causes the glue droplet to fall parabolically further by raising the jetting head 40 to make the glue drop It can still accurately fall on the recess of the glue 90. On the other hand, for the recessed portion of the gluing portion 90, the jet dispensing head 40 can appropriately increase the dispensing speed so that the depressed portion has the same amount of glue per unit length. When the glue 90 is protruded toward the jet dispensing head 40 in the horizontal direction, the jet dispensing head 40 can maintain the home position, but the jetting head 40 is ejected because the protruding glue 90 has a long contour. The dispensing speed can be appropriately increased so that the protruding glue 90 has the same amount of glue per unit length.

In this embodiment, a mounting base 49 is disposed on the moving module 50. The side view lens 32 and the jet dispensing head 40 are horizontally disposed on the mounting base 49. The side view lens 32 is disposed on the mounting base 49. The jet is on one side of the dispensing head 40.

Referring to FIG. 2A , the mobile module 50 of the present embodiment includes a track 51 , a sliding seat 52 movably disposed on the track 51 , a first motor 53 fixed to the sliding seat 52 , and a connection An adapter 54 of the first motor 53 and a second motor 56 connecting the adapter 54 and the mounting base 49, wherein the first motor 53 drives the adapter 54 in a horizontal direction and perpendicular to The track 51 moves, wherein the second motor 56 drives the erection base 49 to move in the vertical direction. According to the present embodiment, the direction in which the dispensing head 40 is ejected is set to the X axis, the direction of the rail 51 is set to the Y axis, and the vertical moving direction of the erecting base 49 is set to the Z axis. Thereby, the present embodiment can move the erecting base 49 and the dispensing head 40 in the X, Y and Z axis directions. By moving the above-described jet dispensing head 40 in the Z-axis direction, the initial point of ejection of the glue droplets of the jet dispensing head 40 is raised, and the parabola is directed toward the wafer assembly (machined member 9). In setting At the same jetting speed, the glue drops can fall farther away to compensate for the difference in distance due to the grooves.

In addition, the present invention captures and records the position information of the to-be-bonded portion 90 by the camera module 30, and then transmits the position information to the electronic processing unit for subsequent control of the reference of the jet dispensing head 40. Therefore, even if the shape of the groove or the flat side of the wafer assembly is somewhat different, the embodiment can adjust the above-mentioned jet dispensing head 40 accordingly.

Referring to FIG. 6, the weight verification module 70 of the present embodiment is located on the moving path of the erection base 49 for spraying the dispensing head 40 thereon to accurately check the weight of the glue droplet. The cleaning module 80 is placed between the weight verification module 70 and the carrying platform 20, and is used to clean the spray dispensing head 40 after use or at a desired timing to prevent the residual gel from getting stuck in the jet flow path. In this embodiment, the cleaning module 80 includes a test spray plate 82 adjacent to the load bearing platform 20 and located on the moving path of the spray head 40, and the spray head 40 sprays the spray heads 40. The glue drops on the test spray plate 82 and displays the path G of the glue drops (see Fig. 2).

Therefore, through the dispensing device of the present invention, the following features and functions are provided: the dispensing dispensing head 40 of the present dispensing device is arranged horizontally, and is suitable for processing parts having a horizontal position to be glued, in particular A wafer assembly containing two bonded wafers. In addition, the present invention moves the jet dispensing head 40 by the moving module 50 to adjust the initial ejection position of the glue droplet, thereby maintaining the bonding quality of the groove or the flat edge of the wafer assembly, including the position of the glue droplet and the glue thereof. Volume density.

The above disclosure is only for the preferred embodiment of the present invention, and the scope of the right to the present invention is not limited thereto. Therefore, the equivalent changes or modifications made according to the scope of the present application are still covered by the present application.

100‧‧‧ Dispensing device

9‧‧‧Processed parts

90‧‧‧to be glued

10‧‧‧Base

12‧‧‧Human Machine Interface Module

121‧‧‧ display

122‧‧‧ keyboard

123‧‧‧ Mouse

20‧‧‧Loading platform

30‧‧‧ camera module

31‧‧‧Look down lens

32‧‧‧Side view lens

40‧‧‧Spray dispensing head

49‧‧‧ pedestal

50‧‧‧Mobile Module

60‧‧‧Curing module

70‧‧‧ Weight verification module

80‧‧‧ cleaning module

Claims (9)

a dispensing device for dispensing a workpiece having a plurality of parts to be glued, the dispensing device comprising: a carrying platform for carrying the workpiece; the camera module comprising a device disposed above the workpiece Taking a top view lens of the horizontal position information of the glue to be glued, and a side view lens disposed on a side of the workpiece and adjacent to the spray head, the side view lens captures the vertical position information of the portion to be glued; a jet dispensing head that sprays a plurality of glue droplets in a horizontal direction toward the portions to be glued of the workpiece; and a moving module that moves and lifts the jet dispensing head according to the position information to be glued The glue drops are sprayed to the portions to be glued of the jet dispensing head. The dispensing device of claim 1, wherein the carrier platform is a pre-aligner, the workpiece is a wafer assembly comprising two bonded wafers, the pre-aligner collates and positions the wafer The assembly is in the correct machining position. The dispensing device of claim 2, wherein the pre-aligner includes a rotating support that supports and rotates the wafer assembly, a plurality of guiding posts abutting a bottom surface of the wafer assembly, and a An optical alignment unit placed at the edge of the wafer assembly described above. The dispensing device of claim 3, further comprising a curing module for curing the glue droplet, the curing module comprising a curing energy component adjacent to the processing component, a frame for fixing the curing energy component, and A shielding unit is adjacent to the curing energy element. The dispensing device of claim 1, further comprising a mounting base connected to the moving module, the side view lens and the jet dispensing head being horizontally disposed on the mounting base, the side view lens setting On the side of the jet dispensing head. The dispensing device of claim 5, wherein the mobile module comprises a track, a sliding seat movably disposed on the rail, a first motor fixed to the sliding seat, an adapter connected to the first motor, and a first connecting the adapter and the mounting base A second motor, wherein the first motor drives the adapter to move in a horizontal direction and perpendicular to the track, wherein the second motor drives the mounting base to move in a vertical direction. The dispensing device of claim 5, further comprising a weight verification module, the weight verification module being located on the moving path of the erection base to verify the weight of the glue droplet. The dispensing device of claim 7, further comprising a cleaning module disposed between the weight verification module and the carrier platform. The dispensing device of claim 8, wherein the cleaning module comprises a test spray plate adjacent to the load bearing platform and located on a moving path of the spray head, wherein the spray head is sprayed by the spray head Some glue is dropped on the test spray plate and the paths of the glue drops are displayed.