TWM474873U - Light-emitting diode module - Google Patents

Light-emitting diode module Download PDF

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Publication number
TWM474873U
TWM474873U TW102213761U TW102213761U TWM474873U TW M474873 U TWM474873 U TW M474873U TW 102213761 U TW102213761 U TW 102213761U TW 102213761 U TW102213761 U TW 102213761U TW M474873 U TWM474873 U TW M474873U
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Taiwan
Prior art keywords
emitting diode
light
joint portion
disposed
diode module
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TW102213761U
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Chinese (zh)
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xiu-zhi Zhang
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Avatar Star Technology Corp
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Priority to TW102213761U priority Critical patent/TWM474873U/en
Publication of TWM474873U publication Critical patent/TWM474873U/en

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Description

發光二極體模組Light-emitting diode module

本創作係有關於一種照明模組,且特別係有關一種發光二極體模組。The present invention relates to a lighting module, and in particular to a light emitting diode module.

相較於傳統燈泡或燈管,發光二極體(LED)具有低耗電、長壽命等優點,故LED已廣泛地被運用於各種照明設備。在LED照明設備中,高亮度且高集成密度之LED伴隨長時間運作發光所產生的高溫,若不能加強散熱效果,容易導致其中之LED的使用壽命衰減,甚至損壞。Compared with conventional bulbs or tubes, LEDs have the advantages of low power consumption and long life, so LEDs have been widely used in various lighting devices. In the LED lighting equipment, the LED with high brightness and high integration density is accompanied by the high temperature generated by the long-time operation of the illumination. If the heat dissipation effect cannot be enhanced, the service life of the LED therein is easily attenuated or even damaged.

習用之LED照明設備係將高集成密度的LED設置於電路基板的一面(即『發光面』),而相對於LED將散熱件設置於電路基板的另一面(即『背光面』);接著,於發光面以燈罩鎖固在散熱件上,用以罩護住該等LED,而於背光面以燈殼鎖固在散熱件上,並用以容置該散熱件。此種習用之LED照明設備之散熱效果不佳,且若因其長時間點亮發光所產生的高溫導致部分之LED單元損壞,還須等到有一定損壞數量的LED才會進行維修更換的動作,造成LED照明設備之效能減低且使用及維護上之不便。Conventional LED lighting devices are provided with a high-integration density LED on one side of a circuit board (ie, a "light-emitting surface"), and a heat-dissipating member is disposed on the other side of the circuit board (ie, a "backlight surface") with respect to the LED; The light-emitting surface is fixed on the heat-dissipating member with a lamp cover for covering the LEDs, and is locked on the heat-dissipating member by the lamp housing on the backlight surface, and is used for accommodating the heat-dissipating member. Such conventional LED lighting devices have poor heat dissipation effects, and if some of the LED units are damaged due to the high temperature generated by the long-time lighting, it is necessary to wait for a certain amount of damaged LEDs to perform maintenance and replacement operations. The LED lighting device is reduced in performance and inconvenient to use and maintain.

有鑑於此,本創作人乃潛心研思、設計組製,期能提供一種單一模組化之發光二極體模組,以達到提高LED照明設備之效能且易於使用及維護之目的,為本創作所欲研創之創作動機者。In view of this, the creator is devoted to research and design, and can provide a single modular LED module to improve the performance of LED lighting equipment and to be easy to use and maintain. The creative motive of the creative research institute.

本創作之主要目的在於提供一種單一模組化之發光二極體模組。The main purpose of this creation is to provide a single modular LED module.

為達上述目的,本創作之發光二極體模組包含一座體、至少一第一結合部、至少一第二結合部、至少一散熱件以及一發光二極體基板。座體具有一第一表面、相對於第一表面之一第二表面以及一側表面,其中側表面形成於第一表面及第二表面之間。第一結合部配置於側表面。第二結合部相對於第一結合部而配置側表面,其中第二結合部適於配合第一結合部。散熱件配置於第一表面。發光二極體基板配置於第二表面。To achieve the above objective, the LED module of the present invention comprises a body, at least one first joint, at least one second joint, at least one heat sink and a light-emitting diode substrate. The seat body has a first surface, a second surface relative to the first surface, and a side surface, wherein the side surface is formed between the first surface and the second surface. The first joint portion is disposed on the side surface. The second joint portion is disposed with respect to the first joint portion, wherein the second joint portion is adapted to engage the first joint portion. The heat sink is disposed on the first surface. The light emitting diode substrate is disposed on the second surface.

承上所述之發光二極體模組,其中上述第一結合部及上述第二結合部為滑軌滑塊結構。According to the above-mentioned light-emitting diode module, the first joint portion and the second joint portion are a slide rail slider structure.

承上所述之發光二極體模組,其中上述第一結合部及上述第二結合部為上下疊層結構。In the above-described light-emitting diode module, the first joint portion and the second joint portion are vertically stacked.

承上所述之發光二極體模組,其中上述第一結合部及上述第二結合部為凸塊凹槽結構。According to the above-mentioned light-emitting diode module, the first joint portion and the second joint portion are a bump groove structure.

承上所述之發光二極體模組,其中上述第一結合部及上述第二結合部為榫接結構。The light-emitting diode module according to the above aspect, wherein the first joint portion and the second joint portion are spliced structures.

承上所述之發光二極體模組,其中上述座體更包含一通孔。通孔連通上述第一表面及上述第二表面。In the above described light-emitting diode module, the above-mentioned body further comprises a through hole. The through hole communicates with the first surface and the second surface.

承上所述之發光二極體模組,其更包含兩個側板、一電源供應器放置架、一電源供應器以及一提把。兩個側板相對固設於上述鎖固孔。放置架固設於兩個側板之間而位於上述散熱件之上方。電源供應器配置於放置架而經由上述通孔電性連接上述發光二極體基板。提把兩端分別連接 兩個側板而位於電源供應器之上方。The LED module further includes two side plates, a power supply placement frame, a power supply, and a handle. The two side plates are oppositely fixed to the locking holes. The placement frame is fixed between the two side plates and located above the heat dissipation member. The power supply device is disposed on the placement frame and electrically connected to the light emitting diode substrate via the through hole. Lift the two ends separately The two side panels are located above the power supply.

承上所述之發光二極體模組,其中上述第一結合部及上述第二結合部更分別包含相對設置之至少一個定位孔。In the above described light-emitting diode module, the first joint portion and the second joint portion respectively include at least one positioning hole disposed oppositely.

承上所述之發光二極體模組更包含一罩體以及一防水墊片。罩體配置於上述第二表面而覆蓋上述發光二極體基板。防水墊片環設於上述發光二極體基板之周圍而配置於上述第二表面及罩體之間。The light-emitting diode module further includes a cover body and a waterproof gasket. The cover is disposed on the second surface to cover the light emitting diode substrate. The waterproof gasket ring is disposed around the light-emitting diode substrate and disposed between the second surface and the cover.

本創作之發光二極體模組為單一規格化模組之設計,毋須使用習用之LED照明設備中之燈殼來容置散熱件,可減少模具及工序、降低生產成本、進而提升散熱效能;且重量輕、材積小,易於運送、使用及維護。故本創作之發光二極體模組可達到提高LED燈具之效能且易於使用及維護之目的。The LED module of the present invention is designed as a single normalized module, and it is not necessary to use the lamp housing in the conventional LED lighting device to accommodate the heat sink, which can reduce the mold and process, reduce the production cost, and further improve the heat dissipation performance; It is light in weight, small in volume, and easy to transport, use and maintain. Therefore, the LED module of the present invention can improve the performance of the LED lamp and is easy to use and maintain.

為了能夠更進一步瞭解本創作之特徵、特點和技術內容,請參閱以下有關本創作之詳細說明與附圖,惟所附圖式僅提供參考與說明用,非用以限制本創作。In order to further understand the features, features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, which are only for reference and description, and are not intended to limit the present invention.

10、20、30、40‧‧‧發光二極體模組10, 20, 30, 40‧‧‧Lighting diode modules

11‧‧‧座體11‧‧‧

12、22、32、42‧‧‧第一結合部12, 22, 32, 42‧ ‧ first joint

13、23、33、43‧‧‧第二結合部13, 23, 33, 43‧ ‧ second joint

14‧‧‧散熱件14‧‧‧ Heat sink

15‧‧‧發光二極體基板15‧‧‧Lighting diode substrate

16‧‧‧發光二極體16‧‧‧Lighting diode

17‧‧‧罩體17‧‧‧ Cover

18‧‧‧防水墊片18‧‧‧Waterproof gasket

44‧‧‧固定件44‧‧‧Fixed parts

100‧‧‧燈具組件100‧‧‧Lighting components

101‧‧‧側板101‧‧‧ side panels

102‧‧‧電源供應器放置架102‧‧‧Power supply rack

103‧‧‧電源供應器103‧‧‧Power supply

104‧‧‧提把104‧‧‧提提

111‧‧‧第一表面111‧‧‧ first surface

112‧‧‧第二表面112‧‧‧ second surface

113‧‧‧側表面113‧‧‧ side surface

114‧‧‧鎖固孔114‧‧‧Lock hole

115‧‧‧通孔115‧‧‧through hole

121、131、421、431‧‧‧定位孔121, 131, 421, 431‧‧ ‧ positioning holes

171‧‧‧透鏡171‧‧‧ lens

1011‧‧‧鎖件1011‧‧‧Locks

1041‧‧‧穿孔1041‧‧‧Perforation

第1圖係為本創作之第一實施例之立體分解圖。Figure 1 is an exploded perspective view of the first embodiment of the present invention.

第2圖係為本創作第一實施例所製燈具之組裝示意圖。Fig. 2 is a schematic view showing the assembly of the lamp manufactured by the first embodiment of the present invention.

第3圖係為本創作第一實施例之兩個發光二極體模組之組合示意圖。FIG. 3 is a schematic diagram of the combination of two LED modules of the first embodiment of the present invention.

第4圖係為本創作第一實施例之三個發光二極體模組所製燈具之組裝示意圖。FIG. 4 is a schematic view showing the assembly of the lamps manufactured by the three light-emitting diode modules of the first embodiment of the present invention.

第5圖係為本創作之第二實施例之立體圖。Figure 5 is a perspective view of a second embodiment of the present invention.

第6圖係為本創作第二實施例之兩個發光二極體模組之組合示意圖。Figure 6 is a schematic diagram showing the combination of two LED modules of the second embodiment of the present invention.

第7圖係為本創作之第三實施例之立體圖。Figure 7 is a perspective view of a third embodiment of the present invention.

第8圖及係為本創作第三實施例之兩個發光二極體模組之組合示意圖。Figure 8 is a schematic diagram showing the combination of two LED modules of the third embodiment of the present invention.

第9圖係為本創作之第四實施例之立體圖。Figure 9 is a perspective view of a fourth embodiment of the present invention.

第10圖係為本創作第四實施例之兩個發光二極體模組之組合示意圖。Figure 10 is a schematic diagram showing the combination of two LED modules of the fourth embodiment of the present invention.

第1圖係為本創作之第一實施例之立體分解圖。請參見第1圖,發光二極體模組10包含座體11、至少一第一結合部12、至少一第二結合部13、至少一散熱件14以及發光二極體基板15。座體11具有第一表面111、相對於第一表面111之第二表面112以及側表面113,其中側表面113形成於第一表面111及第二表面之間112。第一結合部12配置於側表面113。第二結合部13相對於第一結合部12而配置側表面113,其中第二結合部13適於配合第一結合部12。散熱件14配置於第一表面111。發光二極體基板15配置於第二表面112,發光二極體基板15上設置有複數個發光二極體16。Figure 1 is an exploded perspective view of the first embodiment of the present invention. Referring to FIG. 1 , the LED module 10 includes a base 11 , at least one first joint portion 12 , at least one second joint portion 13 , at least one heat sink 14 , and a light-emitting diode substrate 15 . The seat body 11 has a first surface 111, a second surface 112 opposite to the first surface 111, and a side surface 113, wherein the side surface 113 is formed between the first surface 111 and the second surface 112. The first joint portion 12 is disposed on the side surface 113. The second joint portion 13 is disposed with respect to the first joint portion 12 with the side surface 113, wherein the second joint portion 13 is adapted to fit the first joint portion 12. The heat sink 14 is disposed on the first surface 111. The light-emitting diode substrate 15 is disposed on the second surface 112, and the plurality of light-emitting diodes 16 are disposed on the light-emitting diode substrate 15.

進一步來說,本創作之發光二極體模組為單一規格化之設計,在每一發光二極體模組10中,第一結合部12及第二結合部13可選擇以:一體化成型、鎖固件固定或接著黏合等方式來配置於座體11之側表面113,本創作對此不做限制。第二結合部13之結構適於配合第一結合部12之結構,用以組合兩個以上之發光二極體模組10來因應照明設備之設計需求。散熱件14可選擇鰭片型散熱片組,但不以此為限。而散熱件14配置於座體11之第一表面111,毋須如習用之LED照明設備在座體上增設燈殼來容置散熱件,故可提升散熱效能,延長LED之使用壽命。Further, the LED module of the present invention is a single standardized design. In each LED module 10, the first bonding portion 12 and the second bonding portion 13 can be selected as follows: The side surface 113 of the seat body 11 is disposed in a manner that the fastener is fixed or adhesively bonded, which is not limited in the present invention. The structure of the second joint portion 13 is adapted to cooperate with the structure of the first joint portion 12 for combining two or more light-emitting diode modules 10 to meet the design requirements of the lighting device. The heat sink 14 may select a fin type heat sink group, but is not limited thereto. The heat dissipating member 14 is disposed on the first surface 111 of the base body 11. The LED lighting device is not required to be provided with a lamp housing on the base body to accommodate the heat dissipating member, thereby improving the heat dissipation performance and prolonging the service life of the LED.

在本實施例中,第一結合部12具有滑塊結構,而第二結合部13具有與第一結合部12相配合之滑軌結構,第一結合部12及第二結合部13更可分別增設相對之至少一個定位孔121、131,以供固定兩個以上之發光二極體模組之組合。座體11還可包含複數個鎖固孔114及通孔115。鎖固孔114形成於第一結合部12以及第二結合部13之兩側,以供發光二極體模組10鎖固於燈具組件形成燈具(圖未示)。通孔115連通第一表面111及第二表面112,以供電源供應裝置(圖未示)之導線1031通過座體11而電性連接電路基板15。此外,因外界水氣或雜質進入電路基板15會影響發光二極體模組10之效能及使用壽命,發光二極體模組10還可進一步包含罩體17以及防水墊片18。罩體17配置於第二表面112而覆蓋發光二極體基板15,罩體17還可包含透鏡171,以供發光二極體16點亮時所發出的光線通過透鏡171而改變發光角度。防水墊片18環設於發光二極體基板15之周圍而配置於第二表面112及罩體17之間,用以密合罩體17與座體11來防止外界水氣或雜質進入發光二極體基板15。In this embodiment, the first joint portion 12 has a slider structure, and the second joint portion 13 has a slide rail structure that cooperates with the first joint portion 12, and the first joint portion 12 and the second joint portion 13 are respectively respectively separable. At least one positioning hole 121, 131 is added to fix a combination of two or more light emitting diode modules. The base 11 can also include a plurality of locking holes 114 and through holes 115. The locking holes 114 are formed on both sides of the first joint portion 12 and the second joint portion 13 for locking the light-emitting diode module 10 to the lamp assembly to form a lamp (not shown). The through hole 115 communicates with the first surface 111 and the second surface 112 for electrically connecting the wire 1031 of the power supply device (not shown) to the circuit substrate 15 through the base 11. In addition, since the external moisture or impurities enter the circuit substrate 15 and affect the performance and service life of the LED module 10, the LED module 10 may further include a cover 17 and a waterproof gasket 18. The cover 17 is disposed on the second surface 112 to cover the LED substrate 15. The cover 17 may further include a lens 171 for the light emitted by the LED 26 to pass through the lens 171 to change the illumination angle. The waterproof gasket 18 is disposed around the light-emitting diode substrate 15 and disposed between the second surface 112 and the cover body 17 to closely cover the cover body 17 and the base body 11 to prevent external moisture or impurities from entering the light-emitting diode. The polar body substrate 15.

第2圖係為本創作之第一實施例所製燈具之組裝示意圖。請參見第2圖,複數個鎖件1011將燈具組件100組裝於發光二極體模組10之座體11。燈具組件100包含兩片側板101、電源供應器放置架102、電源供應器(driver)103以及提把104。兩片側板101分別設有相對於座體11之鎖固孔,以供鎖件1011將側板101固定於座體11上。電源供應器放置架102固設於兩片側板101之間而位於散熱件14之上方。請對照參見第1圖及第2圖,電源供應器103配置於電源供應器放置架102上,電源供應器103之導線1031穿過通孔115而電性連接發光二極體基板15。提把104兩 端分別連接兩片側板101,提把104還可形成穿孔1041,以供組裝燈具組件100後之發光二極體模組10設置於各種環境中做為LED燈具。由第2圖可知,發光二極體模組10與燈具組件100易於組裝,組裝燈具組件100後之發光二極體模組10不僅便於設置在各種環境,更具有優於習用之LED照明設備的散熱效果。Figure 2 is a schematic view showing the assembly of the lamp manufactured by the first embodiment of the present invention. Referring to FIG. 2, a plurality of lock members 1011 assemble the lamp assembly 100 to the base 11 of the LED module 10. The luminaire assembly 100 includes two side panels 101, a power supply placement rack 102, a power supply 103, and a handle 104. The two side plates 101 are respectively provided with locking holes with respect to the seat body 11 for the locking member 1011 to fix the side plate 101 to the seat body 11. The power supply placement rack 102 is fixed between the two side panels 101 and above the heat sink 14. Referring to FIG. 1 and FIG. 2 , the power supply 103 is disposed on the power supply placement rack 102 , and the wires 1031 of the power supply 103 are electrically connected to the LED substrate 15 through the through holes 115 . Lifting 104 two The two sides of the side plate 101 are respectively connected, and the handle 104 can also form a through hole 1041 for assembling the lamp assembly 100 and the LED module 10 is disposed in various environments as an LED lamp. It can be seen from FIG. 2 that the LED module 10 and the lamp assembly 100 are easy to assemble, and the LED module 10 after assembling the lamp assembly 100 is not only convenient to be installed in various environments, but also has better performance than conventional LED lighting devices. heat radiation.

第3圖係為本創作第一實施例之兩個發光二極體模組之組合示意圖。請參見第3圖,兩個發光二極體模組10中,一發光二極體模組10以第一結合部12之滑塊結構來連接另一發光二極體模組10中第二結合部13之滑軌結構。於兩個發光二極體模組10連接組合後,還可在第一結合部12及第二結合部13相互對位的定位孔121、131中加裝如插梢、螺栓、卡勾等固定件或擋止件(圖未示),用以固定兩個發光二極體模組10之組合。值得說明的是,第3圖中僅例示出兩個發光二極體模組10之組合,以相同的方式來延伸本創作之發光二極體模組之組合數目,即能以單一規格化模組設計之發光二極體模組來構成各種尺寸之LED燈具所需之LED光源模組,不僅可減少模具及工序來降低生產成本;且由於每一發光二極體模組之重量輕、體積小,更有利於運送、使用及維護。FIG. 3 is a schematic diagram of the combination of two LED modules of the first embodiment of the present invention. Referring to FIG. 3 , in the two LED modules 10 , a LED module 10 is connected to the second combination of the LED module 10 by the slider structure of the first bonding portion 12 . The slide rail structure of the portion 13. After the two LED modules 10 are connected and combined, the positioning holes 121 and 131 of the first joint portion 12 and the second joint portion 13 are fixed to each other such as a plug, a bolt, a hook, and the like. A member or a stopper (not shown) for fixing the combination of the two LED modules 10. It should be noted that only the combination of two LED modules 10 is illustrated in FIG. 3, and the number of combinations of the LED modules of the present invention is extended in the same manner, that is, the module can be molded in a single specification. The LED diode module designed by the group to form the LED light source module required for various sizes of LED lamps can not only reduce the mold and process to reduce the production cost; and because each light-emitting diode module is light in weight and volume Small, more conducive to transportation, use and maintenance.

第4圖係為本創作第一實施例之三個發光二極體模組與燈具組件之組裝示意圖。請參見第4圖,三個發光二極體模組10中,位於中間之發光二極體模組10如第2圖中所示與燈具組件100完成組裝後,其第一結合部(圖未示)及第二結合部13分別與第二及第三個發光二極體模組10之第一結合部12及第二結合部(圖未示)組合。電源供應器103可同時供應三個發光二極體模組10之電源。值得一提的是,燈具組件100與光二 極體模組10之組裝方式不限於第4圖所例示之型態,舉例來說,側板101也可分別跨置於兩個發光二極體模組10,亦即,每一燈具組件100可組裝兩個發光二極體模組10,如此,可增加設置發光二極體模組10做為燈具之選擇性。Figure 4 is a schematic view showing the assembly of the three LED modules and the lamp assembly of the first embodiment of the present invention. Referring to FIG. 4, in the three LED modules 10, the LED module 10 in the middle is assembled with the lamp assembly 100 as shown in FIG. 2, and the first joint portion thereof is not shown. The second and third bonding portions 13 are combined with the first bonding portion 12 and the second bonding portion (not shown) of the second and third LED modules 10, respectively. The power supply 103 can supply power to the three LED modules 10 at the same time. It is worth mentioning that the luminaire assembly 100 and the light two The assembly of the polar body module 10 is not limited to the one illustrated in FIG. 4 . For example, the side plates 101 can also be respectively disposed on the two LED modules 10 , that is, each of the lamp assemblies 100 can be The two light-emitting diode modules 10 are assembled, so that the selectivity of the light-emitting diode module 10 as a light fixture can be increased.

除了第一實施例中第一結合部及第二結合部之滑塊滑軌結構,本創作還提供各種可相配合之第一結合部及第二結合部之結構。為了便於說明,下列第5圖至第10圖中所繪示之發光二極體模組中,與第一實施例相同的結構援用第1圖中相同的符號來加以標示且不再贅述。In addition to the slider rail structure of the first joint portion and the second joint portion in the first embodiment, the present invention also provides a structure in which the first joint portion and the second joint portion can be matched. For the convenience of the description, the same components as those of the first embodiment are denoted by the same reference numerals in the first embodiment, and will not be described again, in the light-emitting diode modules shown in the following FIGS.

第5圖係為本創作之第二實施例之立體圖;第6圖係為本創作第二實施例之兩個發光二極體模組之組合示意圖。請參見第5圖,在本實施例中,發光二極體模組20之第一結合部22及第二結合部23為相配合之上下疊層結構。再請參見第6圖,兩個發光二極體模組20以第一結合部22之上層結構來組合另一發光二極體模組20中第二結合部23之下層結構。Figure 5 is a perspective view of a second embodiment of the present invention; Figure 6 is a schematic view showing the combination of two LED modules of the second embodiment. Referring to FIG. 5, in the embodiment, the first bonding portion 22 and the second bonding portion 23 of the LED module 20 are matched to the upper and lower laminated structures. Referring to FIG. 6 , the two LED modules 20 combine the lower structure of the second bonding portion 23 of the other LED module 20 with the upper layer structure of the first bonding portion 22 .

第7圖係為本創作之第三實施例之立體圖;第8圖係為本創作第三實施例之兩個發光二極體模組之組合示意圖。請參見第7圖,在本實施例中,發光二極體模組30之第一結合部32及第二結合部33為另一種相配合之上下疊層結構。再請參見第8圖,兩個發光二極體模組30以第一結合部32之上層結構來組合另一發光二極體模組30中第二結合部33之下層結構。Figure 7 is a perspective view of a third embodiment of the present invention; Figure 8 is a schematic view showing the combination of two LED modules of the third embodiment of the present invention. Referring to FIG. 7 , in the embodiment, the first bonding portion 32 and the second bonding portion 33 of the LED module 30 are another laminated structure. Referring to FIG. 8 , the two LED modules 30 combine the lower structure of the second bonding portion 33 of the other LED module 30 with the upper structure of the first bonding portion 32 .

第9圖係為本創作之第四實施例之立體圖;第10圖係為本創作第四實施例之兩個發光二極體模組之組合示意圖。請參見第9圖,在本實施例中,發光二極體模組40之第一結合部42及第二結合部43為相配 合之凸塊凹槽結構,而第一結合部42及第二結合部43之凸塊更各增設相對之定位孔421、431,以供如第9圖中所示之固定件44穿設於定位孔421、431來固定兩個發光二極體模組40之組合。再請參見第10圖,兩個發光二極體模組40以凸塊凹槽結構來組合,並以固定件44加以固定。FIG. 9 is a perspective view of a fourth embodiment of the present invention; FIG. 10 is a schematic view showing the combination of two light-emitting diode modules of the fourth embodiment of the present invention. Referring to FIG. 9 , in the embodiment, the first bonding portion 42 and the second bonding portion 43 of the LED module 40 are matched. And the protrusions of the first joint portion 42 and the second joint portion 43 are respectively provided with opposite positioning holes 421, 431 for the fixing member 44 as shown in FIG. The positioning holes 421, 431 are used to fix the combination of the two LED modules 40. Referring again to FIG. 10, the two LED modules 40 are combined in a bump recess structure and fixed by a fixing member 44.

值得一提的是,本創作之發光二極體模組中,第一結合部及第二配合部相配合結構不限於上述實施例中所例示之型式,還可包含如:榫接結構等,於此不一一繪示說明。It is to be noted that, in the LED module of the present invention, the first joint portion and the second mating portion are not limited to the type illustrated in the above embodiment, and may also include, for example, a splicing structure. This is not illustrated here.

綜上所述,本創作之發光二極體模組為單一規格化模組之設計,毋須使用習用之LED照明設備中之燈殼來容置散熱件,可減少模具及工序、降低生產成本、進而提升散熱效能;且重量輕、材積小,易於運送、使用及維護。故本創作之發光二極體模組不僅已改善習知技術之缺點之間,可達到提高LED燈具之效能且易於使用及維護之目的。In summary, the LED module of the present invention is designed as a single normalized module, and it is not necessary to use the lamp housing in the conventional LED lighting device to accommodate the heat sink, which can reduce the mold and process, reduce the production cost, In turn, it improves heat dissipation performance; it is light in weight, small in volume, and easy to transport, use and maintain. Therefore, the LED module of the present invention has not only improved the shortcomings of the prior art, but also improved the performance of the LED lamp and is easy to use and maintain.

以上所述僅為本創作之較佳可行實施例,非因此即侷限本創作之專利範圍,舉凡運用本創作說明書及圖式內容所為之等效結構變化,均理同包含於本創作之範圍內,合予陳明。The above description is only a preferred and feasible embodiment of the present invention, and thus does not limit the scope of the patents of the present invention. The equivalent structural changes that are made by using the present specification and the contents of the drawings are all included in the scope of the present creation. , combined with Chen Ming.

10‧‧‧發光二極體模組10‧‧‧Lighting diode module

11‧‧‧座體11‧‧‧

12‧‧‧第一結合部12‧‧‧ First Joint Department

13‧‧‧第二結合部13‧‧‧Second junction

14‧‧‧散熱件14‧‧‧ Heat sink

15‧‧‧發光二極體基板15‧‧‧Lighting diode substrate

16‧‧‧發光二極體16‧‧‧Lighting diode

17‧‧‧罩體17‧‧‧ Cover

18‧‧‧防水墊片18‧‧‧Waterproof gasket

111‧‧‧第一表面111‧‧‧ first surface

112‧‧‧第二表面112‧‧‧ second surface

113‧‧‧側表面113‧‧‧ side surface

114‧‧‧鎖固孔114‧‧‧Lock hole

115‧‧‧通孔115‧‧‧through hole

121、131‧‧‧定位孔121, 131‧‧‧ positioning holes

171‧‧‧透鏡171‧‧‧ lens

Claims (8)

一種發光二極體模組,包含:一座體,具有一第一表面、相對於該第一表面之一第二表面以及一側表面,其中該側表面形成於該第一表面及該第二表面之間;至少一第一結合部,配置於該側表面;至少一第二結合部,相對於該第一結合部而配置於該側表面,其中該第二結合部適於配合該第一結合部;至少一散熱件,配置於該第一表面;以及一發光二極體基板,配置於該第二表面。 A light emitting diode module comprising: a body having a first surface, a second surface opposite to the first surface, and a side surface, wherein the side surface is formed on the first surface and the second surface At least one first joint portion is disposed on the side surface; at least one second joint portion is disposed on the side surface with respect to the first joint portion, wherein the second joint portion is adapted to cooperate with the first joint portion At least one heat dissipating member disposed on the first surface; and a light emitting diode substrate disposed on the second surface. 如申請專利範圍第1項所述之發光二極體模組,其中該第一結合部及該第二結合部為滑軌滑塊結構。 The light-emitting diode module of claim 1, wherein the first joint portion and the second joint portion are slide rail slider structures. 如申請專利範圍第1項所述之發光二極體模組,其中該第一結合部及該第二結合部為上下疊層結構。 The light-emitting diode module according to claim 1, wherein the first joint portion and the second joint portion have an upper and lower laminated structure. 如申請專利範圍第1項所述之發光二極體模組,其中該第一結合部及該第二結合部為凸塊凹槽結構。 The light emitting diode module of claim 1, wherein the first bonding portion and the second bonding portion are bump recess structures. 如申請專利範圍第1項所述之發光二極體模組,其中該座體更包含一通孔,該通孔連通該第一表面及該第二表面。 The illuminating diode module of claim 1, wherein the pedestal further comprises a through hole communicating with the first surface and the second surface. 如申請專利範圍第5項所述之發光二極體模組,其更包含:兩個側板,相對配置於該第一表面;一電源供應器放置架,固設於該等側板之間而位於該散熱件之上方;一電源供應器,配置於該電源供應器放置架而經由該通孔電性連接該發光二極體基板;以及 一提把,兩端分別連接該等側板而位於該電源供應器之上方。 The light-emitting diode module of claim 5, further comprising: two side plates disposed opposite to the first surface; a power supply placement frame fixed between the side plates Above the heat dissipating member; a power supply device disposed on the power supply device mounting frame and electrically connecting the light emitting diode substrate via the through hole; As mentioned, the two ends are respectively connected to the side plates and are located above the power supply. 如申請專利範圍第1項所述之發光二極體模組,其中該第一結合部及該第二結合部更分別包含相對設置之至少一定位孔。 The illuminating diode module of claim 1, wherein the first bonding portion and the second bonding portion further comprise at least one positioning hole disposed oppositely. 如申請專利範圍第1項所述之發光二極體模組,其更包含:一罩體,配置於該第二表面而覆蓋該發光二極體基板,其包含複數個透鏡;以及一防水墊片,環設於該等發光二極體基板之周圍而配置於該第二表面及該罩體之間。 The light-emitting diode module of claim 1, further comprising: a cover disposed on the second surface to cover the light-emitting diode substrate, comprising a plurality of lenses; and a waterproof pad The sheet is disposed around the light-emitting diode substrate and disposed between the second surface and the cover.
TW102213761U 2013-07-22 2013-07-22 Light-emitting diode module TWM474873U (en)

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