TWI436500B - Light-emitting structure, light-emitting module, and light-emitting device - Google Patents

Description

Light-emitting structure, light-emitting module, and light-emitting device

The present invention relates to a light emitting structure, a light emitting module, and a light emitting device, and more particularly to a light emitting structure, a light emitting module, and a light emitting device that can cause the generated light source to emit light in different directions.

Compared with the traditional light source, the light-emitting diode (LED) has the advantages of small volume, power saving, good luminous efficiency, long life, fast reaction speed, and no pollution of toxic substances such as heat radiation and mercury. In recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source.

However, the conventional light-emitting diode package structure cannot be bent, and the generated light sources are all projected in the same direction. Therefore, how to design the light source so that the generated light source can be projected in different directions has become an important issue to be solved by the business personnel.

An embodiment of the present invention provides a light emitting structure, a light emitting module, and a light emitting device, which can cause the generated light source to emit light in different directions.

A light emitting structure according to an embodiment of the present invention includes: a substrate unit and a light emitting unit. The substrate unit includes at least one bendable substrate, wherein the bendable substrate includes a plurality of substrate portions and a plurality of bent portions, and each bent portion is disposed between each of the two corresponding substrate portions. Luminous single The light element includes a plurality of light-emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light-emitting groups includes at least one light-emitting element electrically connected to the corresponding substrate portion.

A light emitting module according to another embodiment of the present invention includes: a carrying unit, a substrate unit, and a light emitting unit. The carrying unit includes at least one carrying body, wherein the carrying body has a mounting portion. The substrate unit includes at least one bendable substrate, wherein the bendable substrate includes a plurality of substrate portions and a plurality of bent portions, the plurality of substrate portions are disposed on the mounting portion of the carrier body, and each of the bent portions is disposed at each Between two corresponding substrate sections. The light emitting unit includes a plurality of light emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light emitting groups includes at least one light emitting element electrically connected to the corresponding substrate portion.

A light emitting device according to another embodiment of the present invention includes: a base unit, a carrying unit, a substrate unit, a light emitting unit, and a light cover unit. The bottom end of the base unit includes at least one electrical connection element. The carrying unit includes at least one carrying body disposed on a top end of the base unit, wherein the carrying body has a mounting portion. The substrate unit includes at least one bendable substrate electrically connected to the electrical connection component, wherein the bendable substrate comprises a plurality of substrate portions and a plurality of bent portions, wherein the plurality of substrate portions are disposed on the mounting portion of the carrier body, and each A bent portion is disposed between each of the two corresponding substrate portions. The light emitting unit includes a plurality of light emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light emitting groups includes at least one light emitting element electrically connected to the corresponding substrate portion. The lampshade unit includes a light transmissive lampshade that cooperates with the base unit for protecting the substrate unit and the light unit.

In summary, the light-emitting structure, the light-emitting module, and the light-emitting device provided by the embodiments of the present invention can transmit the design of “the plurality of bent portions”. Since the plurality of substrate portions are bent and disposed on different planes, the light source generated by each of the light-emitting elements can be projected in different directions.

For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.

[First Embodiment]

Please refer to FIG. 1A and FIG. 1B. FIG. 1A is a top view of the front view before bending, and FIG. 1B is a side cross-sectional view before bending. As shown in the above figure, the first embodiment of the present invention provides a light emitting structure Z1, which includes a substrate unit 3 and a light emitting unit 4.

First, as shown in FIG. 1A and FIG. 1B, the substrate unit 3 includes at least one bendable substrate 30, wherein the bendable substrate 30 includes a plurality of substrate portions 301 and a plurality of bent portions 302, and each bent portion 302 It is disposed between every two corresponding substrate portions 301.

For example, the bendable substrate 30 can be any circuit substrate having a bending function. One of the plurality of substrate portions 301 may be an intermediate substrate portion 301A, and the remaining substrate portion 301 is a plurality of surrounding substrate portions 301B surrounding the intermediate substrate portion 301A, and each of the surrounding substrate portions 301B is connected to the intermediate substrate portion 301A and Extending outward from the intermediate substrate portion 301A. Since the intermediate substrate portion 301A is a square having four sides, four surrounding substrate portions 301B can be respectively connected to the four sides of the intermediate substrate portion 301A, and each of the bent portions 302 can be disposed on the intermediate substrate portion. 301A is located between each of the surrounding substrate portions 301B. In addition, each of the bent portions 302 may be formed at least one of each of the two corresponding substrate portions 301. The slit 302A (for example, the V-shaped slit shown in FIG. 1B), and the slit 302A may be located at the bottom end of the bendable substrate 30. However, the substrate unit 3 used in the present invention is not limited to the above-exemplified examples.

In addition, as shown in FIG. 1A and FIG. 1B, the light-emitting unit 4 includes a plurality of light-emitting groups 40 respectively disposed on the plurality of substrate portions 301, wherein each of the light-emitting groups 40 includes at least one electrical connection corresponding to the corresponding one. Light-emitting element 400 of substrate portion 301.

For example, each of the light-emitting elements 400 includes a light-emitting diode wafer 400B (for example, an LED bare wafer) disposed on the corresponding substrate portion 301 and a corresponding substrate portion 301 disposed to cover the light-emitting diode wafer 400B. Encapsulation colloid 400C. In other words, for each of the light-emitting elements 400, the light-emitting diode wafer 400B can be electrically connected to the corresponding substrate portion 301 by being directly disposed on the corresponding substrate portion 301 (Chip On Board, COB), and then The light emitting diode wafer 400B is then covered via the encapsulant 400C such that the light emitting diode wafer 400B is protected by the encapsulant 400C. Furthermore, when the LED chip 400B is a blue LED chip and the encapsulant 400C is a phosphor colloid, the blue light source generated by the blue LED chip can pass through the phosphor colloid to be converted into White light source. However, the light-emitting unit 4 used in the present invention is not limited to the above-exemplified examples.

Referring to FIG. 1C and FIG. 1D , FIG. 1C is a schematic side view of the bent side view, and FIG. 1D is a schematic view of the side view of the bent side. As shown in the above figure, the first embodiment of the present invention provides a light-emitting module Z2 using the light-emitting structure Z1, comprising: a carrying unit 2, a substrate unit 3, and a light-emitting unit 4. In addition, the carrying unit 2 includes at least one carrying body 20, wherein the carrying body 20 has a mounting portion 200, and The plurality of substrate portions 301 are disposed on the mounting portion 200 of the carrier body 20 .

Before each of the surrounding substrate portions 301B is bent relative to the intermediate substrate portion 301A (as shown in FIG. 1B), the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are substantially flush. After each of the surrounding substrate portions 301B is passed through the corresponding bent portion 302 (ie, the slit 302A) and is bent relative to the intermediate substrate portion 301A (as shown in FIG. 1C), each of the surrounding substrate portions 301B is still connected. The intermediate substrate portion 301A extends obliquely downward from the intermediate substrate portion 301A. After each of the surrounding substrate portions 301B is bent, the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are on different planes, so that the light source generated by each of the light-emitting elements 400 can be cast in different directions. Light.

For example, the mounting portion 200 has at least one top mounting surface 200A disposed on the most top end of the carrier body 20 and a plurality of surrounding mounting surfaces 200B surrounding the carrier body 20, and each of the mounting surfaces 200A is connected to the mounting surface 200B. And it extends obliquely downward from the top mounting surface 200A. Further, one of the plurality of substrate portions 301 is disposed on the top end mounting surface 200A, and the remaining substrate portions 301 are bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B. In other words, as shown in FIG. 1D, the intermediate substrate portion 301A may be disposed on the top mounting surface 200A, and the plurality of surrounding substrate portions 301B may be bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B, so that each of the light is emitted The light source produced by element 400 can be flooded in different directions to increase the illumination range of the present invention.

Referring to FIG. 1E, a first embodiment of the present invention provides a light-emitting device Z3 using the light-emitting module Z2, which includes: a base unit 1, a carrier unit 2, a substrate unit 3, a light-emitting unit 4, and Lampshade Yuan 5. The bottom end of the base unit 1 comprises at least one electrical connection element 10. The carrying unit 2 includes at least one carrying body 20 disposed on the top end of the base unit 1. The substrate unit 3 includes at least one bendable substrate 30 electrically connected to the electrical connection element 10. The light emitting unit 4 includes a plurality of light emitting groups 40 disposed on the bendable substrate 30. The lamp cover unit 5 includes a light-transmitting lamp cover 50 that cooperates with the base unit 1 for protecting the substrate unit 3 and the light-emitting unit 4.

For example, the electrical connection component 10 can be an electrical connector having a locking thread 100 on the surface, so that the present invention can rotatably lock the illumination device Z3 through the use of the electrical connection component 10 having the locking thread 100 described above. It is fixed on a power supply slot (not shown) so that the electrical connection component 10 can obtain power supply from a power supply slot (not shown). Furthermore, the base unit 1 can also include a driving integrated circuit 11 disposed in the base unit 1, and the driving integrated circuit 11 is electrically connected between the electrical connecting element 10 and the light emitting unit 4 to exchange alternating current (AC). Converted to direct current (DC), this direct current (DC) can be directly supplied to the light-emitting unit 4.

[Second embodiment]

Referring to FIG. 2, a second embodiment of the present invention provides a light emitting structure Z1, which includes a substrate unit 3 and a light emitting unit 4. 2 and FIG. 1A, the second embodiment is most different from the first embodiment in that, in the second embodiment, since the intermediate substrate portion 301A is a triangle having three sides, there are three The three sides of the intermediate substrate portion 301A may be respectively connected around the substrate portion 301B, and each of the bent portions 302 (for example, the slits 302A) may be disposed between the intermediate substrate portion 301A and each of the corresponding surrounding substrate portions 301B. . In other words, when the intermediate substrate portion 301A has N sides, it is possible to match the N surrounding substrate portions 301B to be respectively connected to the N side edges of the intermediate substrate portion 301A. Therefore, this issue The shape (or the number of sides) of the intermediate substrate portion 301A and the number of the surrounding substrate portions 301B may vary depending on various design requirements, and are not intended to limit the present invention.

[Third embodiment]

Referring to FIG. 3, a third embodiment of the present invention provides a light emitting structure Z1, which includes a substrate unit 3 and a light emitting unit 4. As can be seen from a comparison between FIG. 3 and FIG. 1A, the third embodiment is most different from the first embodiment in that, in the third embodiment, since the intermediate substrate portion 301A is a pentagon having five sides, there are five The surrounding sides of the substrate portion 301B may be respectively connected to the five sides of the intermediate substrate portion 301A, and each of the bent portions 302 (for example, the slits 302A) may be disposed between the intermediate substrate portion 301A and each of the corresponding surrounding substrate portions 301B. . In other words, when the intermediate substrate portion 301A has N sides, it is possible to match the N surrounding substrate portions 301B to be respectively connected to the N side edges of the intermediate substrate portion 301A. Therefore, the shape (or the number of sides) of the intermediate substrate portion 301A of the present invention and the number of the surrounding substrate portions 301B may be changed according to different design requirements, and are not intended to limit the present invention.

[Fourth embodiment]

Referring to FIG. 4A and FIG. 4B, FIG. 4A is a top view of the front view before bending, and FIG. 4B is a side cross-sectional view before bending. As shown in the above figure, a fourth embodiment of the present invention provides a light emitting structure Z1 including a substrate unit 3 and a light emitting unit 4.

First, as shown in FIG. 4A and FIG. 4B, the substrate unit 3 includes at least one bendable substrate 30, wherein the bendable substrate 30 includes a plurality of substrate portions 301 and a plurality of bent portions 302, and each bent portion 302 It is disposed between every two corresponding substrate portions 301.

For example, the bendable substrate 30 can be any circuit substrate having a bending function. One of the plurality of substrate portions 301 may be an intermediate substrate portion 301A, and the remaining substrate portion 301 is a plurality of surrounding substrate portions 301B surrounding the intermediate substrate portion 301A, and each of the surrounding substrate portions 301B is connected to the intermediate substrate portion 301A and Extending outward from the intermediate substrate portion 301A. Since the intermediate substrate portion 301A is a square having four sides, four surrounding substrate portions 301B can be respectively connected to the four sides of the intermediate substrate portion 301A, and each of the bent portions 302 can be disposed on the intermediate substrate portion. 301A is located between each of the surrounding substrate portions 301B. In addition, each of the bent portions 302 may be a plurality of through holes 302B formed between each of the two corresponding substrate portions 301, and each of the through holes 302B may pass through the bendable substrate 30. However, the substrate unit 3 used in the present invention is not limited to the above-exemplified examples.

In addition, as shown in FIG. 4A and FIG. 4B, the light-emitting unit 4 includes a plurality of light-emitting groups 40 respectively disposed on the plurality of substrate portions 301, wherein each of the light-emitting groups 40 includes at least one electrical connection corresponding to the corresponding one. Light-emitting element 400 of substrate portion 301.

For example, each of the light-emitting elements 400 includes a light-emitting diode wafer 400B (for example, an LED bare wafer) disposed on the corresponding substrate portion 301 and a corresponding substrate portion 301 disposed to cover the light-emitting diode wafer 400B. Encapsulation colloid 400C. In other words, for each of the light-emitting elements 400, the light-emitting diode wafer 400B can be electrically connected to the corresponding substrate portion 301 by being directly disposed on the corresponding substrate portion 301 (COB), and then via the encapsulant. The LED chip 400B is covered by 400C so that the light emitting diode wafer 400B is protected by the encapsulant 400C. Furthermore, when the LED chip 400B is a blue light emitting diode When the bulk wafer and the encapsulant 400C are fluorescent colloids, the blue light source generated by the blue LED wafer can pass through the phosphor colloid to be converted into a white light source. However, the light-emitting unit 4 used in the present invention is not limited to the above-exemplified examples.

Referring to FIG. 4C and FIG. 4D, FIG. 4C is a schematic side view of the bent side view, and FIG. 4D is a schematic view of the side view of the bent side. As shown in the above figure, the fourth embodiment of the present invention provides a light-emitting module Z2 using the above-mentioned light-emitting structure Z1, comprising: a carrying unit 2, a substrate unit 3, and a light-emitting unit 4. In addition, the carrying unit 2 includes at least one carrying body 20 , wherein the carrying body 20 has a mounting portion 200 , and the plurality of substrate portions 301 are disposed on the mounting portion 200 of the carrying body 20 .

Before each of the surrounding substrate portions 301B is bent relative to the intermediate substrate portion 301A (as shown in FIG. 4B), the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are substantially flush. After each of the surrounding substrate portions 301B is passed through the corresponding bent portion 302 (ie, the through hole 302B) and is bent relative to the intermediate substrate portion 301A (as shown in FIG. 4C), each of the surrounding substrate portions 301B is still connected to The intermediate substrate portion 301A extends obliquely downward from the intermediate substrate portion 301A. After each of the surrounding substrate portions 301B is bent, the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are on different planes, so that the light source generated by each of the light-emitting elements 400 can be cast in different directions. Light.

For example, the mounting portion 200 has at least one top mounting surface 200A disposed on the most top end of the carrier body 20 and a plurality of surrounding mounting surfaces 200B surrounding the carrier body 20, and each of the mounting surfaces 200A is connected to the mounting surface 200B. And it extends obliquely downward from the top mounting surface 200A. Further, one of the plurality of substrate portions 301 is disposed on the top end mounting surface 200A, and the remaining substrate portions 301 are bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B. In other words, as shown in FIG. 4D, the intermediate substrate portion 301A may be disposed on the top surface mounting surface 200A, and the plurality of surrounding substrate portions 301B may be bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B, so each of the light emitting The light source produced by element 400 can be flooded in different directions to increase the illumination range of the present invention.

Referring to FIG. 4E, a fourth embodiment of the present invention provides a light-emitting device Z3 using the light-emitting module Z2, which includes: a base unit 1, a carrying unit 2, a substrate unit 3, a light-emitting unit 4, and Lamp unit 5. The bottom end of the base unit 1 comprises at least one electrical connection element 10. The carrying unit 2 includes at least one carrying body 20 disposed on the top end of the base unit 1. The substrate unit 3 includes at least one bendable substrate 30 electrically connected to the electrical connection element 10. The light emitting unit 4 includes a plurality of light emitting groups 40 disposed on the bendable substrate 30. The lamp cover unit 5 includes a light-transmitting lamp cover 50 that cooperates with the base unit 1 for protecting the substrate unit 3 and the light-emitting unit 4.

For example, the electrical connection component 10 can be an electrical connector having a locking thread 100 on the surface, so that the present invention can rotatably lock the illumination device Z3 through the use of the electrical connection component 10 having the locking thread 100 described above. It is fixed on a power supply slot (not shown) so that the electrical connection component 10 can obtain power supply from a power supply slot (not shown). Furthermore, the base unit 1 can also include a driving integrated circuit 11 disposed in the base unit 1, and the driving integrated circuit 11 is electrically connected between the electrical connecting element 10 and the light emitting unit 4 to exchange alternating current (AC). Converted to direct current (DC), this direct current (DC) can be directly supplied to the light-emitting unit 4.

[Fifth Embodiment]

Referring to FIG. 5, a fifth embodiment of the present invention provides another illumination unit 4, which includes a plurality of illumination groups 40 respectively disposed on a plurality of substrate portions 301 of the bendable substrate 30, wherein each illumination group The group 40 includes at least one light emitting element 400 electrically connected to the corresponding substrate portion 301. 5 and FIG. 1B, the fifth embodiment is different from the first embodiment in that, in the fifth embodiment, each of the light-emitting elements 400 includes a circuit board 400A disposed on the corresponding substrate portion 301. A light emitting diode chip 400B disposed on the circuit board 400A and electrically connected to the circuit board 400A, and an encapsulant 400C disposed on the circuit board 400A to cover the light emitting diode chip 400B. In other words, each of the light-emitting groups 40 can be disposed on the corresponding substrate portion 301 through a surface adhesion technology (SMT) and electrically connected to the corresponding substrate portion 301.

[Possible effects of the examples]

In summary, the light-emitting structure, the light-emitting module, and the light-emitting device provided by the embodiments of the present invention can transmit the plurality of substrate portions by bending the plurality of substrate portions through different designs. On the plane, the light source generated by each of the light-emitting elements can be projected in different directions.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.

Z1‧‧‧Lighting structure

Z2‧‧‧Light Module

Z3‧‧‧Lighting device

1‧‧‧Base unit

10‧‧‧Electrical connection elements

100‧‧‧Locking thread

11‧‧‧Drive integrated circuit

2‧‧‧bearing unit

20‧‧‧ Carrying ontology

200‧‧‧Installation Department

200A‧‧‧ top mounting surface

200B‧‧‧ around the mounting surface

3‧‧‧Substrate unit

30‧‧‧Flexible substrate

301‧‧‧Parts Department

301A‧‧‧Intermediate substrate

301B‧‧‧round the substrate

302‧‧‧Bending

302A‧‧‧ slotting

302B‧‧‧Perforation

4‧‧‧Lighting unit

40‧‧‧Lighting group

400‧‧‧Lighting elements

400A‧‧‧ circuit board

400B‧‧‧Light Diode Wafer

400C‧‧‧Package Colloid

5‧‧‧shade unit

50‧‧‧Lighting lampshade

1A is a top plan view showing a bendable substrate before being bent according to a first embodiment of the present invention.

1B is a side cross-sectional view showing the bendable substrate before being bent according to the first embodiment of the present invention.

1C is a side elevational, cross-sectional, exploded view of a light emitting module according to a first embodiment of the present invention.

1D is a side cross-sectional view of a lighting module according to a first embodiment of the present invention.

1E is a side elevational cross-sectional view of a light emitting device according to a first embodiment of the present invention.

2 is a top plan view showing a bendable substrate before being bent according to a second embodiment of the present invention.

3 is a top plan view showing a bendable substrate before being bent according to a third embodiment of the present invention.

4A is a top plan view showing a bendable substrate before being bent according to a fourth embodiment of the present invention.

4B is a side cross-sectional view showing the bendable substrate before bending according to the fourth embodiment of the present invention.

4C is a side elevational, cross-sectional, exploded view of a lighting module in accordance with a fourth embodiment of the present invention.

4D is a side cross-sectional view of a lighting module according to a fourth embodiment of the present invention.

4E is a side elevational cross-sectional view of a light emitting device according to a fourth embodiment of the present invention.

Fig. 5 is a side cross-sectional view showing a light emitting unit according to a fifth embodiment of the present invention.

Z1‧‧‧Lighting structure

Z2‧‧‧Light Module

2‧‧‧bearing unit

20‧‧‧ Carrying ontology

200A‧‧‧ top mounting surface

200B‧‧‧ around the mounting surface

3‧‧‧Substrate unit

30‧‧‧Flexible substrate

301‧‧‧Parts Department

302‧‧‧Bending

4‧‧‧Lighting unit

40‧‧‧Lighting group

400‧‧‧Lighting elements

400B‧‧‧Light Diode Wafer

400C‧‧‧Package Colloid

Claims (14)

A light emitting structure includes: a substrate unit including at least one bendable substrate, wherein the at least one bendable substrate comprises a plurality of substrate portions and a plurality of bent portions, and each bent portion is disposed at every two Between the corresponding substrate portions; and a light-emitting unit comprising a plurality of light-emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light-emitting groups includes at least one electrically connected to the corresponding substrate portion a light-emitting element; wherein each of the bent portions has at least one slit formed between each of the two corresponding substrate portions, and the at least all of the grooves are located at a bottom end of the at least one bendable substrate. The illuminating structure of claim 1, wherein one of the plurality of substrate portions is an intermediate substrate portion, and the remaining substrate portions are a plurality of surrounding substrate portions surrounding the intermediate substrate portion, and each surrounding the substrate The portion is connected to the intermediate substrate portion and extends obliquely downward from the intermediate substrate portion. The illuminating structure of claim 1, wherein each of the illuminating elements comprises a illuminating diode chip disposed on the corresponding substrate portion and a corresponding substrate portion disposed to cover the illuminating diode chip. The package component, wherein each of the light-emitting elements includes a circuit board disposed on the corresponding substrate portion, a light-emitting diode chip disposed on the circuit board and electrically connected to the circuit board, and a light-emitting diode chip disposed on the circuit The board covers the encapsulant of the LED chip. A light emitting structure includes: a substrate unit including at least one bendable substrate, wherein the at least one bendable substrate comprises a plurality of substrate portions and a plurality of bent portions, and each a bending portion disposed between each of the two corresponding substrate portions; and a light emitting unit including a plurality of light emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light emitting groups includes at least one The light-emitting elements are connected to the corresponding substrate portion; wherein each of the bent portions has a plurality of perforations formed between each of the two corresponding substrate portions, and each of the perforations passes through the at least one bendable substrate. A light-emitting module includes: a carrying unit, comprising at least one carrying body, wherein the at least one carrying body has a mounting portion; a substrate unit including at least one bendable substrate, wherein the at least one bendable The substrate includes a plurality of substrate portions and a plurality of bent portions, the plurality of substrate portions are disposed on the mounting portion of the at least one carrier body, and each of the bent portions is disposed between each of the two corresponding substrate portions; An illuminating unit comprising a plurality of illuminating groups respectively disposed on the plurality of substrate portions, wherein each of the illuminating groups comprises at least one illuminating element electrically connected to the corresponding substrate portion; wherein each of the bent portions Having at least one slot formed between each of the two corresponding substrate portions, and the at least all of the slots are located at a bottom end of the at least one bendable substrate and facing the at least one carrier body. The illuminating module of claim 5, wherein the mounting portion has at least one top mounting surface disposed on a topmost end of the at least one carrying body and a plurality of surrounding mounting surfaces surrounding the at least one carrying body And each of the at least one top mounting surface is connected around the mounting surface and extends obliquely downward from the at least one top mounting surface, wherein One of the plurality of substrate portions is disposed on the at least one top mounting surface, and the remaining substrate portions are bent to be respectively disposed on the plurality of surrounding mounting surfaces. The illuminating module of claim 5, wherein one of the plurality of substrate portions is an intermediate substrate portion, and the remaining substrate portions are a plurality of surrounding substrate portions surrounding the intermediate substrate portion, and each surrounding The substrate portion is connected to the intermediate substrate portion and extends obliquely downward from the intermediate substrate portion. The illuminating module of claim 5, wherein each of the illuminating elements comprises a illuminating diode chip disposed on the corresponding substrate portion and a corresponding substrate portion disposed to cover the illuminating diode The package of the wafer, wherein each of the light-emitting elements includes a circuit board disposed on the corresponding substrate portion, a light-emitting diode chip disposed on the circuit board and electrically connected to the circuit board, and a light-emitting diode chip disposed thereon The package board covers the package colloid of the LED chip. A light-emitting module includes: a carrying unit, comprising at least one carrying body, wherein the at least one carrying body has a mounting portion; a substrate unit including at least one bendable substrate, wherein the at least one bendable The substrate includes a plurality of substrate portions and a plurality of bent portions, the plurality of substrate portions are disposed on the mounting portion of the at least one carrier body, and each of the bent portions is disposed between each of the two corresponding substrate portions; a light-emitting unit comprising a plurality of light-emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light-emitting groups comprises at least one light-emitting element electrically connected to the corresponding substrate portion; Each of the bent portions has a plurality of perforations formed between each of the two corresponding substrate portions, and each of the perforations passes through the at least one bendable substrate and faces the at least one carrier body. A light-emitting device includes: a base unit having a bottom end including at least one electrical connection component; a load-bearing unit including at least one carrier body disposed on a top end of the base unit, wherein the at least one carrier body has an installation a substrate unit comprising at least one bendable substrate electrically connected to the at least one electrical connection component, wherein the at least one bendable substrate comprises a plurality of substrate portions and a plurality of bent portions, the plurality of substrate portions Provided on the mounting portion of the at least one carrying body, and each bent portion is disposed between each of the two corresponding substrate portions; and an illuminating unit includes a plurality of illuminating lights respectively disposed on the plurality of substrate portions a group, wherein each of the light-emitting groups includes at least one light-emitting element electrically connected to the corresponding substrate portion; and a light cover unit including a base unit for protecting the substrate unit and the light-emitting unit a light cover; wherein each of the bent portions has at least one slit formed between each of the two corresponding substrate portions, and the at least all of the grooves are located above A less bendable substrate and facing the bottom end of the at least one carrier body. The illuminating device of claim 10, wherein the mounting portion has at least one top mounting surface disposed on a topmost end of the at least one carrying body and a plurality of surrounding mounting surfaces surrounding the at least one carrying body. And each of the at least one top mounting surface is connected around the mounting surface and extends obliquely downward from the at least one top mounting surface, wherein One of the plurality of substrate portions is disposed on the at least one top mounting surface, and the remaining substrate portions are bent to be respectively disposed on the plurality of surrounding mounting surfaces. The illuminating device of claim 10, wherein one of the plurality of substrate portions is an intermediate substrate portion, and the remaining substrate portions are a plurality of surrounding substrate portions surrounding the intermediate substrate portion, and each surrounding the substrate The portion is connected to the intermediate substrate portion and extends obliquely downward from the intermediate substrate portion. The illuminating device of claim 10, wherein each of the illuminating elements comprises a illuminating diode chip disposed on the corresponding substrate portion and a corresponding substrate portion disposed to cover the illuminating diode chip. The package component, wherein each of the light-emitting elements includes a circuit board disposed on the corresponding substrate portion, a light-emitting diode chip disposed on the circuit board and electrically connected to the circuit board, and a light-emitting diode chip disposed on the circuit The board covers the encapsulant of the LED chip. A light-emitting device includes: a base unit having a bottom end including at least one electrical connection component; a load-bearing unit including at least one carrier body disposed on a top end of the base unit, wherein the at least one carrier body has an installation a substrate unit comprising at least one bendable substrate electrically connected to the at least one electrical connection component, wherein the at least one bendable substrate comprises a plurality of substrate portions and a plurality of bent portions, the plurality of substrate portions Provided on the mounting portion of the at least one carrier body, and each of the bent portions is disposed between each of the two corresponding substrate portions; and a light emitting unit includes a plurality of the plurality of substrate portions respectively disposed on the plurality of substrate portions a light-emitting group, wherein each of the light-emitting groups includes at least one light-emitting element electrically connected to the corresponding substrate portion; and a light cover unit including a mating unit for protecting the substrate unit and the light-emitting unit The translucent lampshade; wherein each of the bent portions has a plurality of perforations formed between each of the two corresponding substrate portions, and each of the perforations passes through the at least one bendable substrate and faces the at least one carrier body.