TWI436500B - Light-emitting structure, light-emitting module, and light-emitting device - Google Patents
Light-emitting structure, light-emitting module, and light-emitting device Download PDFInfo
- Publication number
- TWI436500B TWI436500B TW100133447A TW100133447A TWI436500B TW I436500 B TWI436500 B TW I436500B TW 100133447 A TW100133447 A TW 100133447A TW 100133447 A TW100133447 A TW 100133447A TW I436500 B TWI436500 B TW I436500B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- light
- portions
- disposed
- emitting
- Prior art date
Links
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Description
本發明係有關於一種發光結構、發光模組、及發光裝置,尤指一種可使得所產生的光源朝向不同的方向來進行投光之發光結構、發光模組、及發光裝置。The present invention relates to a light emitting structure, a light emitting module, and a light emitting device, and more particularly to a light emitting structure, a light emitting module, and a light emitting device that can cause the generated light source to emit light in different directions.
發光二極體(LED)與傳統光源比較,發光二極體係具有體積小、省電、發光效率佳、壽命長、操作反應速度快、且無熱輻射與水銀等有毒物質的污染等優點,因此近幾年來,發光二極體的應用面已極為廣泛。過去由於發光二極體之亮度還無法取代傳統之照明光源,但隨著技術領域之不斷提升,目前已研發出高照明輝度之高功率發光二極體,其足以取代傳統之照明光源。Compared with the traditional light source, the light-emitting diode (LED) has the advantages of small volume, power saving, good luminous efficiency, long life, fast reaction speed, and no pollution of toxic substances such as heat radiation and mercury. In recent years, the application of light-emitting diodes has been extremely extensive. In the past, the brightness of the light-emitting diodes could not replace the traditional illumination source. However, with the continuous improvement of the technical field, high-power light-emitting diodes with high illumination brightness have been developed, which is sufficient to replace the traditional illumination source.
然而,傳統發光二極體封裝結構皆無法進行彎折,而導致所產生的光源皆朝向相同的方向來進行投光。故,如何藉由結構的設計,以使得所產生的光源可以朝向不同的方向來進行投光,已成為該項事業人事所欲解決的重要課題。However, the conventional light-emitting diode package structure cannot be bent, and the generated light sources are all projected in the same direction. Therefore, how to design the light source so that the generated light source can be projected in different directions has become an important issue to be solved by the business personnel.
本發明實施例在於提供一種發光結構、發光模組、及發光裝置,其可使得所產生的光源朝向不同的方向來進行投光。An embodiment of the present invention provides a light emitting structure, a light emitting module, and a light emitting device, which can cause the generated light source to emit light in different directions.
本發明其中一實施例所提供的一種發光結構,其包括:一基板單元及一發光單元。基板單元包括至少一可彎折基板,其中可彎折基板包括多個基板部及多個彎折部,且每一個彎折部設置於每兩個相對應的基板部之間。發光單 元包括多個分別設置在上述多個基板部上的發光群組,其中每一個發光群組包括至少一電性連接於相對應基板部的發光元件。A light emitting structure according to an embodiment of the present invention includes: a substrate unit and a light emitting unit. The substrate unit includes at least one bendable substrate, wherein the bendable substrate includes a plurality of substrate portions and a plurality of bent portions, and each bent portion is disposed between each of the two corresponding substrate portions. Luminous single The light element includes a plurality of light-emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light-emitting groups includes at least one light-emitting element electrically connected to the corresponding substrate portion.
本發明另外一實施例所提供的一種發光模組,其包括:一承載單元、一基板單元、及一發光單元。承載單元包括至少一承載本體,其中承載本體具有一安裝部。基板單元包括至少一可彎折基板,其中可彎折基板包括多個基板部及多個彎折部,上述多個基板部設置於承載本體的安裝部上,且每一個彎折部設置於每兩個相對應的基板部之間。發光單元包括多個分別設置在上述多個基板部上的發光群組,其中每一個發光群組包括至少一電性連接於相對應基板部的發光元件。A light emitting module according to another embodiment of the present invention includes: a carrying unit, a substrate unit, and a light emitting unit. The carrying unit includes at least one carrying body, wherein the carrying body has a mounting portion. The substrate unit includes at least one bendable substrate, wherein the bendable substrate includes a plurality of substrate portions and a plurality of bent portions, the plurality of substrate portions are disposed on the mounting portion of the carrier body, and each of the bent portions is disposed at each Between two corresponding substrate sections. The light emitting unit includes a plurality of light emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light emitting groups includes at least one light emitting element electrically connected to the corresponding substrate portion.
本發明另外一實施例所提供的一種發光裝置,其包括:一底座單元、一承載單元、一基板單元、一發光單元、及一燈罩單元。底座單元的底端包括至少一電連接元件。承載單元包括至少一設置於底座單元的頂端上的承載本體,其中承載本體具有一安裝部。基板單元包括至少一電連接於電連接元件的可彎折基板,其中可彎折基板包括多個基板部及多個彎折部,上述多個基板部設置於承載本體的安裝部上,且每一個彎折部設置於每兩個相對應的基板部之間。發光單元包括多個分別設置在上述多個基板部上的發光群組,其中每一個發光群組包括至少一電性連接於相對應基板部的發光元件。燈罩單元包括一與底座單元配合以用於保護基板單元與發光單元的透光燈罩。A light emitting device according to another embodiment of the present invention includes: a base unit, a carrying unit, a substrate unit, a light emitting unit, and a light cover unit. The bottom end of the base unit includes at least one electrical connection element. The carrying unit includes at least one carrying body disposed on a top end of the base unit, wherein the carrying body has a mounting portion. The substrate unit includes at least one bendable substrate electrically connected to the electrical connection component, wherein the bendable substrate comprises a plurality of substrate portions and a plurality of bent portions, wherein the plurality of substrate portions are disposed on the mounting portion of the carrier body, and each A bent portion is disposed between each of the two corresponding substrate portions. The light emitting unit includes a plurality of light emitting groups respectively disposed on the plurality of substrate portions, wherein each of the light emitting groups includes at least one light emitting element electrically connected to the corresponding substrate portion. The lampshade unit includes a light transmissive lampshade that cooperates with the base unit for protecting the substrate unit and the light unit.
綜上所述,本發明實施例所提供的發光結構、發光模組、及發光裝置,其可透過“上述多個彎折部”的設計, 以將上述多個基板部彎折而設置在不同的平面上,所以每一個發光元件所產生的光源可以朝向不同的方向來進行投光。In summary, the light-emitting structure, the light-emitting module, and the light-emitting device provided by the embodiments of the present invention can transmit the design of “the plurality of bent portions”. Since the plurality of substrate portions are bent and disposed on different planes, the light source generated by each of the light-emitting elements can be projected in different directions.
為使能更進一步瞭解本發明之特徵及技術內容,請參閱以下有關本發明之詳細說明與附圖,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。For a better understanding of the features and technical aspects of the present invention, reference should be made to the accompanying drawings.
請參閱圖1A及圖1B所示,圖1A為彎折前的上視示意圖,圖1B為彎折前的側視剖面示意圖。由上述圖中可知,本發明第一實施例提供一種發光結構Z1,其包括:一基板單元3及一發光單元4。Please refer to FIG. 1A and FIG. 1B. FIG. 1A is a top view of the front view before bending, and FIG. 1B is a side cross-sectional view before bending. As shown in the above figure, the first embodiment of the present invention provides a light emitting structure Z1, which includes a substrate unit 3 and a light emitting unit 4.
首先,配合圖1A與圖1B所示,基板單元3包括至少一可彎折基板30,其中可彎折基板30包括多個基板部301及多個彎折部302,且每一個彎折部302設置於每兩個相對應的基板部301之間。First, as shown in FIG. 1A and FIG. 1B, the substrate unit 3 includes at least one bendable substrate 30, wherein the bendable substrate 30 includes a plurality of substrate portions 301 and a plurality of bent portions 302, and each bent portion 302 It is disposed between every two corresponding substrate portions 301.
舉例來說,可彎折基板30可為任何具有彎折功能的電路基板。上述多個基板部301的其中一個可為一中間基板部301A,其餘的基板部301為多個圍繞中間基板部301A的圍繞基板部301B,且每一個圍繞基板部301B連接於中間基板部301A且從中間基板部301A向外延伸而出。由於中間基板部301A為一具有四個側邊的正方形,所以有4個圍繞基板部301B可分別連接於中間基板部301A的四個側邊,而且每一個彎折部302可以設置於中間基板部301A與每一個相對應的圍繞基板部301B之間。此外,每一個彎折部302可為至少一形成於每兩個相對應基板部301之 間的切槽302A(例如圖1B所示的V形切槽),且切槽302A可位於可彎折基板30的底端。然而,本發明所使用的基板單元3不以上述所舉的例子為限。For example, the bendable substrate 30 can be any circuit substrate having a bending function. One of the plurality of substrate portions 301 may be an intermediate substrate portion 301A, and the remaining substrate portion 301 is a plurality of surrounding substrate portions 301B surrounding the intermediate substrate portion 301A, and each of the surrounding substrate portions 301B is connected to the intermediate substrate portion 301A and Extending outward from the intermediate substrate portion 301A. Since the intermediate substrate portion 301A is a square having four sides, four surrounding substrate portions 301B can be respectively connected to the four sides of the intermediate substrate portion 301A, and each of the bent portions 302 can be disposed on the intermediate substrate portion. 301A is located between each of the surrounding substrate portions 301B. In addition, each of the bent portions 302 may be formed at least one of each of the two corresponding substrate portions 301. The slit 302A (for example, the V-shaped slit shown in FIG. 1B), and the slit 302A may be located at the bottom end of the bendable substrate 30. However, the substrate unit 3 used in the present invention is not limited to the above-exemplified examples.
再者,配合圖1A與圖1B所示,發光單元4包括多個分別設置在上述多個基板部301上的發光群組40,其中每一個發光群組40包括至少一電性連接於相對應基板部301的發光元件400。In addition, as shown in FIG. 1A and FIG. 1B, the light-emitting unit 4 includes a plurality of light-emitting groups 40 respectively disposed on the plurality of substrate portions 301, wherein each of the light-emitting groups 40 includes at least one electrical connection corresponding to the corresponding one. Light-emitting element 400 of substrate portion 301.
舉例來說,每一個發光元件400包括一設置於相對應基板部301上的發光二極體晶片400B(例如LED裸晶片)及一設置於相對應基板部301上以覆蓋發光二極體晶片400B的封裝膠體400C。換言之,針對每一個發光元件400而言,發光二極體晶片400B可透過直接設置在相對應基板部301上的方式(Chip On Board,COB),以電性連接於相對應基板部301,然後再經由封裝膠體400C來覆蓋發光二極體晶片400B,以使得發光二極體晶片400B受到封裝膠體400C的保護。再者,當發光二極體晶片400B為藍色發光二極體晶片且封裝膠體400C為螢光膠體時,藍色發光二極體晶片所產生的藍色光源可穿過螢光膠體以轉換成白色光源。然而,本發明所使用的發光單元4不以上述所舉的例子為限。For example, each of the light-emitting elements 400 includes a light-emitting diode wafer 400B (for example, an LED bare wafer) disposed on the corresponding substrate portion 301 and a corresponding substrate portion 301 disposed to cover the light-emitting diode wafer 400B. Encapsulation colloid 400C. In other words, for each of the light-emitting elements 400, the light-emitting diode wafer 400B can be electrically connected to the corresponding substrate portion 301 by being directly disposed on the corresponding substrate portion 301 (Chip On Board, COB), and then The light emitting diode wafer 400B is then covered via the encapsulant 400C such that the light emitting diode wafer 400B is protected by the encapsulant 400C. Furthermore, when the LED chip 400B is a blue LED chip and the encapsulant 400C is a phosphor colloid, the blue light source generated by the blue LED chip can pass through the phosphor colloid to be converted into White light source. However, the light-emitting unit 4 used in the present invention is not limited to the above-exemplified examples.
請參閱圖1C及圖1D所示,圖1C為彎折後的側視剖面分解示意圖,圖1D為彎折後的側視剖面組合示意圖。由上述圖中可知,本發明第一實施例提供一種使用上述發光結構Z1的發光模組Z2,其包括:一承載單元2、一基板單元3、及一發光單元4。此外,承載單元2包括至少一承載本體20,其中承載本體20具有一安裝部200,且 上述多個基板部301設置於承載本體20的安裝部200上。Referring to FIG. 1C and FIG. 1D , FIG. 1C is a schematic side view of the bent side view, and FIG. 1D is a schematic view of the side view of the bent side. As shown in the above figure, the first embodiment of the present invention provides a light-emitting module Z2 using the light-emitting structure Z1, comprising: a carrying unit 2, a substrate unit 3, and a light-emitting unit 4. In addition, the carrying unit 2 includes at least one carrying body 20, wherein the carrying body 20 has a mounting portion 200, and The plurality of substrate portions 301 are disposed on the mounting portion 200 of the carrier body 20 .
當每一個圍繞基板部301B相對於中間基板部301A來進行彎折前(如圖1B所示),中間基板部301A與上述多個圍繞基板部301B處於實質上齊平的情況。當每一個圍繞基板部301B透過相對應的彎折部302(亦即切槽302A)且相對於中間基板部301A來進行彎折後(如圖1C所示),每一個圍繞基板部301B仍然連接於中間基板部301A且從中間基板部301A向下傾斜延伸而出。當每一個圍繞基板部301B進行彎折後,中間基板部301A與上述多個圍繞基板部301B皆處於不同的平面上,以使得每一個發光元件400所產生的光源可以朝向不同的方向來進行投光。Before each of the surrounding substrate portions 301B is bent relative to the intermediate substrate portion 301A (as shown in FIG. 1B), the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are substantially flush. After each of the surrounding substrate portions 301B is passed through the corresponding bent portion 302 (ie, the slit 302A) and is bent relative to the intermediate substrate portion 301A (as shown in FIG. 1C), each of the surrounding substrate portions 301B is still connected. The intermediate substrate portion 301A extends obliquely downward from the intermediate substrate portion 301A. After each of the surrounding substrate portions 301B is bent, the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are on different planes, so that the light source generated by each of the light-emitting elements 400 can be cast in different directions. Light.
舉例來說,安裝部200具有至少一設置於承載本體20的最頂端上的頂端安裝面200A及多個圍繞承載本體20周圍的圍繞安裝面200B,且每一個圍繞安裝面200B連接頂端安裝面200A且從頂端安裝面200A向下傾斜延伸而出。另外,上述多個基板部301的其中一個設置於頂端安裝面200A上,且其餘的基板部301被彎折以分別設置於上述多個圍繞安裝面200B上。換言之,如圖1D所示,中間基板部301A可設置於頂端安裝面200A上,且上述多個圍繞基板部301B可被彎折以分別設置於上述多個圍繞安裝面200B上,所以每一個發光元件400所產生的光源可以朝向不同的方向來進行投光,以增加本發明的照明範圍。For example, the mounting portion 200 has at least one top mounting surface 200A disposed on the most top end of the carrier body 20 and a plurality of surrounding mounting surfaces 200B surrounding the carrier body 20, and each of the mounting surfaces 200A is connected to the mounting surface 200B. And it extends obliquely downward from the top mounting surface 200A. Further, one of the plurality of substrate portions 301 is disposed on the top end mounting surface 200A, and the remaining substrate portions 301 are bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B. In other words, as shown in FIG. 1D, the intermediate substrate portion 301A may be disposed on the top mounting surface 200A, and the plurality of surrounding substrate portions 301B may be bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B, so that each of the light is emitted The light source produced by element 400 can be flooded in different directions to increase the illumination range of the present invention.
請參閱圖1E所示,本發明第一實施例提供一種使用上述發光模組Z2的發光裝置Z3,其包括:一底座單元1、一承載單元2、一基板單元3、一發光單元4、及燈罩單 元5。底座單元1的底端包括至少一電連接元件10。承載單元2包括至少一設置於底座單元1的頂端上的承載本體20。基板單元3包括至少一電連接於電連接元件10的可彎折基板30。發光單元4包括多個設置在可彎折基板30上的發光群組40。燈罩單元5包括一與底座單元1配合以用於保護基板單元3與發光單元4的透光燈罩50。Referring to FIG. 1E, a first embodiment of the present invention provides a light-emitting device Z3 using the light-emitting module Z2, which includes: a base unit 1, a carrier unit 2, a substrate unit 3, a light-emitting unit 4, and Lampshade Yuan 5. The bottom end of the base unit 1 comprises at least one electrical connection element 10. The carrying unit 2 includes at least one carrying body 20 disposed on the top end of the base unit 1. The substrate unit 3 includes at least one bendable substrate 30 electrically connected to the electrical connection element 10. The light emitting unit 4 includes a plurality of light emitting groups 40 disposed on the bendable substrate 30. The lamp cover unit 5 includes a light-transmitting lamp cover 50 that cooperates with the base unit 1 for protecting the substrate unit 3 and the light-emitting unit 4.
舉例來說,電連接元件10可為一表面具有鎖固螺紋100的電連接器,因此本發明可透過上述具有鎖固螺紋100之電連接元件10的使用,將發光裝置Z3以旋轉的方式鎖固於一供電插槽(圖未示)上,以使得電連接元件10可取得供電插槽(圖未示)的電源供應。再者,底座單元1亦可包括一設置於底座單元1內的驅動積體電路11,且驅動積體電路11電性連接於電連接元件10與發光單元4之間,以將交流電(AC)轉換成直流電(DC),此直流電(DC)即可直接提供給發光單元4使用。For example, the electrical connection component 10 can be an electrical connector having a locking thread 100 on the surface, so that the present invention can rotatably lock the illumination device Z3 through the use of the electrical connection component 10 having the locking thread 100 described above. It is fixed on a power supply slot (not shown) so that the electrical connection component 10 can obtain power supply from a power supply slot (not shown). Furthermore, the base unit 1 can also include a driving integrated circuit 11 disposed in the base unit 1, and the driving integrated circuit 11 is electrically connected between the electrical connecting element 10 and the light emitting unit 4 to exchange alternating current (AC). Converted to direct current (DC), this direct current (DC) can be directly supplied to the light-emitting unit 4.
請參閱圖2所示,本發明第二實施例提供一種發光結構Z1,其包括:一基板單元3及一發光單元4。由圖2與圖1A的比較可知,第二實施例與第一實施例最大的不同在於:在第二實施例中,由於中間基板部301A為一具有三個側邊的三角形,所以有3個圍繞基板部301B可分別連接於中間基板部301A的三個側邊,而且每一個彎折部302(例如切槽302A)可以設置於中間基板部301A與每一個相對應的圍繞基板部301B之間。換言之,當中間基板部301A有N個側邊時,就可以搭配N個圍繞基板部301B,以分別連接於中間基板部301A的N個側邊。因此,本發 明中間基板部301A的形狀(或側邊的數量)及圍繞基板部301B的數量皆可隨著不同的設計需求來作改變,而並非用以限定本發明。Referring to FIG. 2, a second embodiment of the present invention provides a light emitting structure Z1, which includes a substrate unit 3 and a light emitting unit 4. 2 and FIG. 1A, the second embodiment is most different from the first embodiment in that, in the second embodiment, since the intermediate substrate portion 301A is a triangle having three sides, there are three The three sides of the intermediate substrate portion 301A may be respectively connected around the substrate portion 301B, and each of the bent portions 302 (for example, the slits 302A) may be disposed between the intermediate substrate portion 301A and each of the corresponding surrounding substrate portions 301B. . In other words, when the intermediate substrate portion 301A has N sides, it is possible to match the N surrounding substrate portions 301B to be respectively connected to the N side edges of the intermediate substrate portion 301A. Therefore, this issue The shape (or the number of sides) of the intermediate substrate portion 301A and the number of the surrounding substrate portions 301B may vary depending on various design requirements, and are not intended to limit the present invention.
請參閱圖3所示,本發明第三實施例提供一種發光結構Z1,其包括:一基板單元3及一發光單元4。由圖3與圖1A的比較可知,第三實施例與第一實施例最大的不同在於:在第三實施例中,由於中間基板部301A為一具有五個側邊的五角形,所以有5個圍繞基板部301B可分別連接於中間基板部301A的五個側邊,而且每一個彎折部302(例如切槽302A)可以設置於中間基板部301A與每一個相對應的圍繞基板部301B之間。換言之,當中間基板部301A有N個側邊時,就可以搭配N個圍繞基板部301B,以分別連接於中間基板部301A的N個側邊。因此,本發明中間基板部301A的形狀(或側邊的數量)及圍繞基板部301B的數量皆可隨著不同的設計需求來作改變,而並非用以限定本發明。Referring to FIG. 3, a third embodiment of the present invention provides a light emitting structure Z1, which includes a substrate unit 3 and a light emitting unit 4. As can be seen from a comparison between FIG. 3 and FIG. 1A, the third embodiment is most different from the first embodiment in that, in the third embodiment, since the intermediate substrate portion 301A is a pentagon having five sides, there are five The surrounding sides of the substrate portion 301B may be respectively connected to the five sides of the intermediate substrate portion 301A, and each of the bent portions 302 (for example, the slits 302A) may be disposed between the intermediate substrate portion 301A and each of the corresponding surrounding substrate portions 301B. . In other words, when the intermediate substrate portion 301A has N sides, it is possible to match the N surrounding substrate portions 301B to be respectively connected to the N side edges of the intermediate substrate portion 301A. Therefore, the shape (or the number of sides) of the intermediate substrate portion 301A of the present invention and the number of the surrounding substrate portions 301B may be changed according to different design requirements, and are not intended to limit the present invention.
請參閱圖4A及圖4B所示,圖4A為彎折前的上視示意圖,圖4B為彎折前的側視剖面示意圖。由上述圖中可知,本發明第四實施例提供一種發光結構Z1,其包括:一基板單元3及一發光單元4。Referring to FIG. 4A and FIG. 4B, FIG. 4A is a top view of the front view before bending, and FIG. 4B is a side cross-sectional view before bending. As shown in the above figure, a fourth embodiment of the present invention provides a light emitting structure Z1 including a substrate unit 3 and a light emitting unit 4.
首先,配合圖4A與圖4B所示,基板單元3包括至少一可彎折基板30,其中可彎折基板30包括多個基板部301及多個彎折部302,且每一個彎折部302設置於每兩個相對應的基板部301之間。First, as shown in FIG. 4A and FIG. 4B, the substrate unit 3 includes at least one bendable substrate 30, wherein the bendable substrate 30 includes a plurality of substrate portions 301 and a plurality of bent portions 302, and each bent portion 302 It is disposed between every two corresponding substrate portions 301.
舉例來說,可彎折基板30可為任何具有彎折功能的電路基板。上述多個基板部301的其中一個可為一中間基板部301A,其餘的基板部301為多個圍繞中間基板部301A的圍繞基板部301B,且每一個圍繞基板部301B連接於中間基板部301A且從中間基板部301A向外延伸而出。由於中間基板部301A為一具有四個側邊的正方形,所以有4個圍繞基板部301B可分別連接於中間基板部301A的四個側邊,而且每一個彎折部302可以設置於中間基板部301A與每一個相對應的圍繞基板部301B之間。此外,每一個彎折部302可為多個形成於每兩個相對應基板部301之間的穿孔302B,且每一個穿孔302B可穿過可彎折基板30的。然而,本發明所使用的基板單元3不以上述所舉的例子為限。For example, the bendable substrate 30 can be any circuit substrate having a bending function. One of the plurality of substrate portions 301 may be an intermediate substrate portion 301A, and the remaining substrate portion 301 is a plurality of surrounding substrate portions 301B surrounding the intermediate substrate portion 301A, and each of the surrounding substrate portions 301B is connected to the intermediate substrate portion 301A and Extending outward from the intermediate substrate portion 301A. Since the intermediate substrate portion 301A is a square having four sides, four surrounding substrate portions 301B can be respectively connected to the four sides of the intermediate substrate portion 301A, and each of the bent portions 302 can be disposed on the intermediate substrate portion. 301A is located between each of the surrounding substrate portions 301B. In addition, each of the bent portions 302 may be a plurality of through holes 302B formed between each of the two corresponding substrate portions 301, and each of the through holes 302B may pass through the bendable substrate 30. However, the substrate unit 3 used in the present invention is not limited to the above-exemplified examples.
再者,配合圖4A與圖4B所示,發光單元4包括多個分別設置在上述多個基板部301上的發光群組40,其中每一個發光群組40包括至少一電性連接於相對應基板部301的發光元件400。In addition, as shown in FIG. 4A and FIG. 4B, the light-emitting unit 4 includes a plurality of light-emitting groups 40 respectively disposed on the plurality of substrate portions 301, wherein each of the light-emitting groups 40 includes at least one electrical connection corresponding to the corresponding one. Light-emitting element 400 of substrate portion 301.
舉例來說,每一個發光元件400包括一設置於相對應基板部301上的發光二極體晶片400B(例如LED裸晶片)及一設置於相對應基板部301上以覆蓋發光二極體晶片400B的封裝膠體400C。換言之,針對每一個發光元件400而言,發光二極體晶片400B可透過直接設置在相對應基板部301上的方式(COB),以電性連接於相對應基板部301,然後再經由封裝膠體400C來覆蓋發光二極體晶片400B,以使得發光二極體晶片400B受到封裝膠體400C的保護。再者,當發光二極體晶片400B為藍色發光二極 體晶片且封裝膠體400C為螢光膠體時,藍色發光二極體晶片所產生的藍色光源可穿過螢光膠體以轉換成白色光源。然而,本發明所使用的發光單元4不以上述所舉的例子為限。For example, each of the light-emitting elements 400 includes a light-emitting diode wafer 400B (for example, an LED bare wafer) disposed on the corresponding substrate portion 301 and a corresponding substrate portion 301 disposed to cover the light-emitting diode wafer 400B. Encapsulation colloid 400C. In other words, for each of the light-emitting elements 400, the light-emitting diode wafer 400B can be electrically connected to the corresponding substrate portion 301 by being directly disposed on the corresponding substrate portion 301 (COB), and then via the encapsulant. The LED chip 400B is covered by 400C so that the light emitting diode wafer 400B is protected by the encapsulant 400C. Furthermore, when the LED chip 400B is a blue light emitting diode When the bulk wafer and the encapsulant 400C are fluorescent colloids, the blue light source generated by the blue LED wafer can pass through the phosphor colloid to be converted into a white light source. However, the light-emitting unit 4 used in the present invention is not limited to the above-exemplified examples.
請參閱圖4C及圖4D所示,圖4C為彎折後的側視剖面分解示意圖,圖4D為彎折後的側視剖面組合示意圖。由上述圖中可知,本發明第四實施例提供一種使用上述發光結構Z1的發光模組Z2,其包括:一承載單元2、一基板單元3、及一發光單元4。此外,承載單元2包括至少一承載本體20,其中承載本體20具有一安裝部200,且上述多個基板部301設置於承載本體20的安裝部200上。Referring to FIG. 4C and FIG. 4D, FIG. 4C is a schematic side view of the bent side view, and FIG. 4D is a schematic view of the side view of the bent side. As shown in the above figure, the fourth embodiment of the present invention provides a light-emitting module Z2 using the above-mentioned light-emitting structure Z1, comprising: a carrying unit 2, a substrate unit 3, and a light-emitting unit 4. In addition, the carrying unit 2 includes at least one carrying body 20 , wherein the carrying body 20 has a mounting portion 200 , and the plurality of substrate portions 301 are disposed on the mounting portion 200 of the carrying body 20 .
當每一個圍繞基板部301B相對於中間基板部301A來進行彎折前(如圖4B所示),中間基板部301A與上述多個圍繞基板部301B處於實質上齊平的情況。當每一個圍繞基板部301B透過相對應的彎折部302(亦即穿孔302B)且相對於中間基板部301A來進行彎折後(如圖4C所示),每一個圍繞基板部301B仍然連接於中間基板部301A且從中間基板部301A向下傾斜延伸而出。當每一個圍繞基板部301B進行彎折後,中間基板部301A與上述多個圍繞基板部301B皆處於不同的平面上,以使得每一個發光元件400所產生的光源可以朝向不同的方向來進行投光。Before each of the surrounding substrate portions 301B is bent relative to the intermediate substrate portion 301A (as shown in FIG. 4B), the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are substantially flush. After each of the surrounding substrate portions 301B is passed through the corresponding bent portion 302 (ie, the through hole 302B) and is bent relative to the intermediate substrate portion 301A (as shown in FIG. 4C), each of the surrounding substrate portions 301B is still connected to The intermediate substrate portion 301A extends obliquely downward from the intermediate substrate portion 301A. After each of the surrounding substrate portions 301B is bent, the intermediate substrate portion 301A and the plurality of surrounding substrate portions 301B are on different planes, so that the light source generated by each of the light-emitting elements 400 can be cast in different directions. Light.
舉例來說,安裝部200具有至少一設置於承載本體20的最頂端上的頂端安裝面200A及多個圍繞承載本體20周圍的圍繞安裝面200B,且每一個圍繞安裝面200B連接頂端安裝面200A且從頂端安裝面200A向下傾斜延伸而出。 另外,上述多個基板部301的其中一個設置於頂端安裝面200A上,且其餘的基板部301被彎折以分別設置於上述多個圍繞安裝面200B上。換言之,如圖4D所示,中間基板部301A可設置於頂端安裝面200A上,且上述多個圍繞基板部301B可被彎折以分別設置於上述多個圍繞安裝面200B上,所以每一個發光元件400所產生的光源可以朝向不同的方向來進行投光,以增加本發明的照明範圍。For example, the mounting portion 200 has at least one top mounting surface 200A disposed on the most top end of the carrier body 20 and a plurality of surrounding mounting surfaces 200B surrounding the carrier body 20, and each of the mounting surfaces 200A is connected to the mounting surface 200B. And it extends obliquely downward from the top mounting surface 200A. Further, one of the plurality of substrate portions 301 is disposed on the top end mounting surface 200A, and the remaining substrate portions 301 are bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B. In other words, as shown in FIG. 4D, the intermediate substrate portion 301A may be disposed on the top surface mounting surface 200A, and the plurality of surrounding substrate portions 301B may be bent to be respectively disposed on the plurality of surrounding mounting surfaces 200B, so each of the light emitting The light source produced by element 400 can be flooded in different directions to increase the illumination range of the present invention.
請參閱圖4E所示,本發明第四實施例提供一種使用上述發光模組Z2的發光裝置Z3,其包括:一底座單元1、一承載單元2、一基板單元3、一發光單元4、及燈罩單元5。底座單元1的底端包括至少一電連接元件10。承載單元2包括至少一設置於底座單元1的頂端上的承載本體20。基板單元3包括至少一電連接於電連接元件10的可彎折基板30。發光單元4包括多個設置在可彎折基板30上的發光群組40。燈罩單元5包括一與底座單元1配合以用於保護基板單元3與發光單元4的透光燈罩50。Referring to FIG. 4E, a fourth embodiment of the present invention provides a light-emitting device Z3 using the light-emitting module Z2, which includes: a base unit 1, a carrying unit 2, a substrate unit 3, a light-emitting unit 4, and Lamp unit 5. The bottom end of the base unit 1 comprises at least one electrical connection element 10. The carrying unit 2 includes at least one carrying body 20 disposed on the top end of the base unit 1. The substrate unit 3 includes at least one bendable substrate 30 electrically connected to the electrical connection element 10. The light emitting unit 4 includes a plurality of light emitting groups 40 disposed on the bendable substrate 30. The lamp cover unit 5 includes a light-transmitting lamp cover 50 that cooperates with the base unit 1 for protecting the substrate unit 3 and the light-emitting unit 4.
舉例來說,電連接元件10可為一表面具有鎖固螺紋100的電連接器,因此本發明可透過上述具有鎖固螺紋100之電連接元件10的使用,將發光裝置Z3以旋轉的方式鎖固於一供電插槽(圖未示)上,以使得電連接元件10可取得供電插槽(圖未示)的電源供應。再者,底座單元1亦可包括一設置於底座單元1內的驅動積體電路11,且驅動積體電路11電性連接於電連接元件10與發光單元4之間,以將交流電(AC)轉換成直流電(DC),此直流電(DC)即可直接提供給發光單元4使用。For example, the electrical connection component 10 can be an electrical connector having a locking thread 100 on the surface, so that the present invention can rotatably lock the illumination device Z3 through the use of the electrical connection component 10 having the locking thread 100 described above. It is fixed on a power supply slot (not shown) so that the electrical connection component 10 can obtain power supply from a power supply slot (not shown). Furthermore, the base unit 1 can also include a driving integrated circuit 11 disposed in the base unit 1, and the driving integrated circuit 11 is electrically connected between the electrical connecting element 10 and the light emitting unit 4 to exchange alternating current (AC). Converted to direct current (DC), this direct current (DC) can be directly supplied to the light-emitting unit 4.
請參閱圖5所示,本發明第五實施例提供另外一種發光單元4,其包括多個分別設置在可彎折基板30的多個基板部301上的發光群組40,其中每一個發光群組40包括至少一電性連接於相對應基板部301的發光元件400。由圖5與圖1B的比較可知,第五實施例與第一實施例最大的不同在於:在第五實施例中,每一個發光元件400包括一設置於相對應基板部301上的電路板400A、一設置於電路板400A上且電性連接於電路板400A的發光二極體晶片400B、及一設置於電路板400A上以覆蓋發光二極體晶片400B的封裝膠體400C。換言之,每一個發光群組40可透過表面黏著技術(SMT)方式設置在相對應基板部301上且電性連接於相對應基板部301。Referring to FIG. 5, a fifth embodiment of the present invention provides another illumination unit 4, which includes a plurality of illumination groups 40 respectively disposed on a plurality of substrate portions 301 of the bendable substrate 30, wherein each illumination group The group 40 includes at least one light emitting element 400 electrically connected to the corresponding substrate portion 301. 5 and FIG. 1B, the fifth embodiment is different from the first embodiment in that, in the fifth embodiment, each of the light-emitting elements 400 includes a circuit board 400A disposed on the corresponding substrate portion 301. A light emitting diode chip 400B disposed on the circuit board 400A and electrically connected to the circuit board 400A, and an encapsulant 400C disposed on the circuit board 400A to cover the light emitting diode chip 400B. In other words, each of the light-emitting groups 40 can be disposed on the corresponding substrate portion 301 through a surface adhesion technology (SMT) and electrically connected to the corresponding substrate portion 301.
綜上所述,本發明實施例所提供的發光結構、發光模組、及發光裝置,其可透過“上述多個彎折部”的設計,以將上述多個基板部彎折而設置在不同的平面上,所以每一個發光元件所產生的光源可以朝向不同的方向來進行投光。In summary, the light-emitting structure, the light-emitting module, and the light-emitting device provided by the embodiments of the present invention can transmit the plurality of substrate portions by bending the plurality of substrate portions through different designs. On the plane, the light source generated by each of the light-emitting elements can be projected in different directions.
以上所述僅為本發明之較佳可行實施例,非因此侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之等效技術變化,均包含於本發明之範圍內。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalents of the invention are included in the scope of the invention.
Z1‧‧‧發光結構Z1‧‧‧Lighting structure
Z2‧‧‧發光模組Z2‧‧‧Light Module
Z3‧‧‧發光裝置Z3‧‧‧Lighting device
1‧‧‧底座單元1‧‧‧Base unit
10‧‧‧電連接元件10‧‧‧Electrical connection elements
100‧‧‧鎖固螺紋100‧‧‧Locking thread
11‧‧‧驅動積體電路11‧‧‧Drive integrated circuit
2‧‧‧承載單元2‧‧‧bearing unit
20‧‧‧承載本體20‧‧‧ Carrying ontology
200‧‧‧安裝部200‧‧‧Installation Department
200A‧‧‧頂端安裝面200A‧‧‧ top mounting surface
200B‧‧‧圍繞安裝面200B‧‧‧ around the mounting surface
3‧‧‧基板單元3‧‧‧Substrate unit
30‧‧‧可彎折基板30‧‧‧Flexible substrate
301‧‧‧基板部301‧‧‧Parts Department
301A‧‧‧中間基板部301A‧‧‧Intermediate substrate
301B‧‧‧圍繞基板部301B‧‧‧round the substrate
302‧‧‧彎折部302‧‧‧Bending
302A‧‧‧切槽302A‧‧‧ slotting
302B‧‧‧穿孔302B‧‧‧Perforation
4‧‧‧發光單元4‧‧‧Lighting unit
40‧‧‧發光群組40‧‧‧Lighting group
400‧‧‧發光元件400‧‧‧Lighting elements
400A‧‧‧電路板400A‧‧‧ circuit board
400B‧‧‧發光二極體晶片400B‧‧‧Light Diode Wafer
400C‧‧‧封裝膠體400C‧‧‧Package Colloid
5‧‧‧燈罩單元5‧‧‧shade unit
50‧‧‧透光燈罩50‧‧‧Lighting lampshade
圖1A為本發明第一實施例的可彎折基板彎折前的上視示意圖。1A is a top plan view showing a bendable substrate before being bent according to a first embodiment of the present invention.
圖1B為本發明第一實施例的可彎折基板彎折前的側視剖面示意圖。1B is a side cross-sectional view showing the bendable substrate before being bent according to the first embodiment of the present invention.
圖1C為本發明第一實施例的發光模組的側視剖面分解示意圖。1C is a side elevational, cross-sectional, exploded view of a light emitting module according to a first embodiment of the present invention.
圖1D為本發明第一實施例的發光模組的側視剖面組合示意圖。1D is a side cross-sectional view of a lighting module according to a first embodiment of the present invention.
圖1E為本發明第一實施例的發光裝置的側視剖面組合示意圖。1E is a side elevational cross-sectional view of a light emitting device according to a first embodiment of the present invention.
圖2為本發明第二實施例的可彎折基板彎折前的上視示意圖。2 is a top plan view showing a bendable substrate before being bent according to a second embodiment of the present invention.
圖3為本發明第三實施例的可彎折基板彎折前的上視示意圖。3 is a top plan view showing a bendable substrate before being bent according to a third embodiment of the present invention.
圖4A為本發明第四實施例的可彎折基板彎折前的上視示意圖。4A is a top plan view showing a bendable substrate before being bent according to a fourth embodiment of the present invention.
圖4B為本發明第四實施例的可彎折基板彎折前的側視剖面示意圖。4B is a side cross-sectional view showing the bendable substrate before bending according to the fourth embodiment of the present invention.
圖4C為本發明第四實施例的發光模組的側視剖面分解示意圖。4C is a side elevational, cross-sectional, exploded view of a lighting module in accordance with a fourth embodiment of the present invention.
圖4D為本發明第四實施例的發光模組的側視剖面組合示意圖。4D is a side cross-sectional view of a lighting module according to a fourth embodiment of the present invention.
圖4E為本發明第四實施例的發光裝置的側視剖面組合示意圖。4E is a side elevational cross-sectional view of a light emitting device according to a fourth embodiment of the present invention.
圖5為本發明第五實施例的發光單元的側視剖面示意圖。Fig. 5 is a side cross-sectional view showing a light emitting unit according to a fifth embodiment of the present invention.
Z1‧‧‧發光結構Z1‧‧‧Lighting structure
Z2‧‧‧發光模組Z2‧‧‧Light Module
2‧‧‧承載單元2‧‧‧bearing unit
20‧‧‧承載本體20‧‧‧ Carrying ontology
200A‧‧‧頂端安裝面200A‧‧‧ top mounting surface
200B‧‧‧圍繞安裝面200B‧‧‧ around the mounting surface
3‧‧‧基板單元3‧‧‧Substrate unit
30‧‧‧可彎折基板30‧‧‧Flexible substrate
301‧‧‧基板部301‧‧‧Parts Department
302‧‧‧彎折部302‧‧‧Bending
4‧‧‧發光單元4‧‧‧Lighting unit
40‧‧‧發光群組40‧‧‧Lighting group
400‧‧‧發光元件400‧‧‧Lighting elements
400B‧‧‧發光二極體晶片400B‧‧‧Light Diode Wafer
400C‧‧‧封裝膠體400C‧‧‧Package Colloid
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100133447A TWI436500B (en) | 2011-09-16 | 2011-09-16 | Light-emitting structure, light-emitting module, and light-emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100133447A TWI436500B (en) | 2011-09-16 | 2011-09-16 | Light-emitting structure, light-emitting module, and light-emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201314950A TW201314950A (en) | 2013-04-01 |
TWI436500B true TWI436500B (en) | 2014-05-01 |
Family
ID=48802643
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100133447A TWI436500B (en) | 2011-09-16 | 2011-09-16 | Light-emitting structure, light-emitting module, and light-emitting device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI436500B (en) |
-
2011
- 2011-09-16 TW TW100133447A patent/TWI436500B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201314950A (en) | 2013-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20230184394A1 (en) | Led lamp | |
US8672517B2 (en) | Light-emitting module | |
CN103180661A (en) | Lamp and lighting device | |
US20150214451A1 (en) | Light-emitting module | |
JP5555371B2 (en) | Light source device for illumination | |
JP2010161026A (en) | Illumination device | |
TW201506296A (en) | Light emitting diode bulb | |
JP2009272263A (en) | Led lamp | |
US20130062631A1 (en) | Light emitting structure, light emitting module, and light emitting device | |
JP2010010655A (en) | Led lamp | |
TWM498276U (en) | Illumination device | |
JP2014110301A (en) | Light-emitting device and illumination light source | |
TWI436500B (en) | Light-emitting structure, light-emitting module, and light-emitting device | |
TW201441527A (en) | Lamp | |
JP2014072154A (en) | Light source for lighting and lighting device | |
JP2014072149A (en) | Light source for lighting and lighting device | |
JP2013115005A (en) | Lighting apparatus | |
JP6085459B2 (en) | Lighting device | |
CN203150540U (en) | Light emitting diode packaging structure | |
JP2010021149A (en) | Led module with optical diffusion layer formed | |
TWM452457U (en) | Light emitting diode package structure | |
TWM491130U (en) | Lamp bulb | |
JP6198127B2 (en) | LIGHTING LIGHT MANUFACTURING METHOD, LIGHTING LIGHT SOURCE, AND LIGHTING DEVICE | |
JP2013050520A (en) | Light emission device and illumination device | |
CN110649138B (en) | LED light-emitting unit and LED light-emitting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |