TWM473609U - Stereoscopic structure of circuit package - Google Patents

Description

Three-dimensional circuit package structure

The present invention relates to a three-dimensional circuit package structure, and more particularly to a circuit package structure having a light-sensing device for emitting a light-emitting element.

In a semiconductor package, if two different dies (eg, a illuminating element and a photo sensing element) are disposed on the same substrate, a plurality of different circuit package structures (eg, light sensing devices) can be formed. When an object intercepts the light path between the light-emitting element and the light-sensing element, the light-sensing element can determine the presence of the object, and if the light-sensing element can smoothly receive the light emitted by the light-emitting element, the light-sensing element can It is determined that the object does not exist. The reflective light sensing device is configured such that the light emitting element and the light sensing element are disposed on the same side, and whether the object reflects the light of the light emitting element back to the light sensing element to determine whether the object exists.

In order to ensure the accuracy of the light sensing device, in the conventional art, a plurality of components are added to the circuit package structure to ensure that the entire process is not interfered by the outside when the light emitting device emits light and the light sensing device is in operation. The most important thing is to prevent the light source emitted from the light-emitting element from being sensed by the light-sensing element; thus, the structure of the circuit package structure is usually complicated, and the process process is increased, and the semiconductor industry has been pursuing the product. The size is reduced, so the complicated structure and components will increase the time and cost of production, and the complicated process will increase the chance of error and reduce the reliability of the product.

Therefore, a three-dimensional circuit package structure has been proposed to simplify the process. After the three-dimensional circuit package structure is completed, the three-dimensional circuit package structure is usually configured on a printed circuit board to generate a module function. However, since the size of the package structure is limited, it is usually impossible to configure the size and distance of each electrical contact when the configuration of the three-dimensional circuit is performed, which may cause the electrical contact on the three-dimensional circuit package structure to fail. Electrical contacts on the printed circuit board are good Good connection.

For the above problems, the present invention proposes a three-dimensional circuit package structure. Through the improvement and design of the structure and the process, the circuit package can be completed in a small number of steps during the fabrication, thereby reducing the time and cost required for the process, and Effectively improve the yield and make the electrical contacts on the three-dimensional circuit package structure have a good connection with the printed circuit board.

In order to solve the above problems, one of the main purposes of the present invention is to provide a three-dimensional circuit package structure, which can effectively reduce the manufacturing cost of the circuit package by forming a substrate structure by injection molding and laser-engraving the positions of the plurality of pads. And time, further improve the reliability of the product.

In order to achieve the above object, the present invention provides a three-dimensional circuit package structure including a substrate having a first surface and a second surface opposite to the first surface, the first mask having a first recess and a second recess The first groove and the second groove have a retaining wall to be isolated from each other. The three-dimensional circuit package structure is characterized in that: the first groove comprises: a first through hole located at the bottom of the first groove and connected to the first a first groove wall, located between the bottom of the first groove and the first surface; a first welding point, located beside the first through hole at the bottom of the first groove, the first welding point and the first The groove wall extends to the first surface and forms a first electrical connection end; and a second solder joint is located beside the first through hole at the bottom of the first groove, opposite to the first solder joint, and the second solder joint is Extending to the first surface via the first groove wall and forming a second electrical connection end opposite to the first electrical connection end; the second groove includes: a second through hole located at the bottom of the second groove and connected To the second side; a second groove wall at the bottom of the second groove and the first And a plurality of third solder joints located at the bottom of the second recess and surrounding the second through hole, the third soldering point extending to the first surface via the second recess wall and forming a plurality of third electrical connecting ends a first die having a first upper end and a first lower end, the first upper end having a plurality of first pads, the first die disposed in the first groove, and the first upper end facing the first pass The first pad is electrically connected to the first pad and the second pad; the second die has a second upper end and a second lower end, and the second upper end has a plurality of second pads. The second die is disposed on the second groove, and the second upper end faces the second through hole, and the second pad is electrically connected to the third soldering point.

The present invention further provides a three-dimensional circuit package structure, including a substrate having a first surface and a second surface opposite to the first surface, the first mask having a first recess and a second recess, the first recess The first and second recesses are separated from each other by a retaining wall. The first recess includes a first through hole at the bottom of the first recess and communicates with the second surface. a first groove wall is located between the bottom of the first groove and the first surface; a first welding point is located beside the first through hole at the bottom of the first groove, and the first welding point extends through the first groove wall a first electrical connection end is formed to the first surface; and a second soldering point is located beside the first through hole at the bottom of the first groove, opposite to the first soldering point, and the second soldering point is via the first recess The groove wall extends to the first surface and forms a second electrical connection end opposite to the first electrical connection end; the second groove includes: a second through hole located at the bottom of the second groove and communicating to the second surface a second groove wall located between the bottom of the second groove and the first face; and plural a third soldering point is located at the bottom of the second recess and surrounds the second through hole, and the third soldering point extends to the first surface via the second recess wall and forms a plurality of third electrical connecting ends; a first die Having a first upper end and a first lower end, the first upper end has a plurality of first pads, the first die is disposed in the first groove, and the first upper end faces the first through hole, the first pad And electrically connected to the first soldering point and the second soldering point respectively; a second die has a second upper end and a second lower end, the second upper end has a plurality of second pads, and the second die is disposed on a second recess, and the second upper end faces the second through hole, and the second pad is electrically connected to the third soldering point respectively; a soft board having a third surface and an opposite fourth surface, the third The surface has a plurality of first electrical contacts, the fourth surface is joined to the first surface, the fourth surface further has a plurality of second electrical contacts, and the second electrical contacts are opposite to the first solder joint and the second solder joint The arrangement of the points and the third welding points are arranged and electrically connected to the first welding point, the second welding point and the third welding point Connector, a second electrical contact and a plurality of perforated metal material of soft perforated plate is connected to the first electrical contacts electrically via a plurality of soft board.

The three-dimensional circuit package structure proposed by the present invention can complete the steps of forming the substrate and the wiring first, and then complete the packaging of the three-dimensional circuit by flip chip once, which can effectively reduce the steps of the circuit package and reduce the need for packaging. Cost and effectively improve the reliability of the product.

1‧‧‧Three-dimensional circuit package structure

1'‧‧‧Three-dimensional circuit package structure

1"‧‧‧Three-dimensional circuit package structure

12‧‧‧Substrate

122‧‧‧ first side

123‧‧‧Retaining wall

128‧‧‧ second side

14‧‧‧First groove

140‧‧‧First through hole

141‧‧‧First groove wall

1400‧‧‧3rd rubber layer

1402‧‧‧First Transmissive Cover

142‧‧‧First electrical connection

1420‧‧‧First solder joint

144‧‧‧Second electrical connection

1440‧‧‧second solder joint

148‧‧‧First adhesive layer

16‧‧‧second groove

160‧‧‧Second through hole

1600‧‧‧Four sealant

1602‧‧‧second translucent cover

161‧‧‧second groove wall

162‧‧‧The third electrical connection

1620‧‧‧ third welding point

1622‧‧‧ gap

168‧‧‧Second sealant

18‧‧‧First grain

180‧‧‧ first upper end

182‧‧‧ first lower end

184‧‧‧First solder joint

20‧‧‧Second grain

200‧‧‧second upper end

202‧‧‧second lower end

204‧‧‧second solder joint

3‧‧‧Soft board

31‧‧‧ third side

33‧‧‧ fourth side

35‧‧‧First electrical contact

350‧‧ ‧ gap

360‧‧‧Soft board perforation

361‧‧‧Metal materials

37‧‧‧Second electrical contacts

XX’‧‧‧ connection

1 is a schematic view of the creation substrate; FIG. 2 is a schematic view of the creation substrate; FIG. 3 is a schematic view of the creation substrate wiring; FIG. 4 is a schematic view of the creation of the three-dimensional circuit package structure; FIG. 6 is a cross-sectional view showing a second embodiment of a three-dimensional circuit package structure; FIG. 7 is a cross-sectional view showing a third embodiment of the three-dimensional circuit package structure; Figure is a schematic view of the creation soft board; Figure 8B is a schematic view of the creative soft board; Figure 9 is a schematic diagram of the combination of the creative soft board and the three-dimensional circuit package structure.

The present invention is a three-dimensional circuit package structure, in particular, a structure that simplifies the packaging process, and further reduces the time and cost required for packaging, and the techniques required for the packaging process are well known, so In the description, and need to be incomplete description. In addition, the illustrations in the following texts are not completely drawn according to the actual relevant dimensions, and their function is only to express the schematic diagram related to the present creative features.

First, please refer to Figure 1, which is a schematic view of the substrate of the creation. As shown in FIG. 1, the substrate 12 has a first surface 122 and a second surface 128 opposite to the first surface 122. The first surface 122 has a first recess 14 and a second recess 16 and a retaining wall. 123 isolating the first groove 14 and the second groove 16 from each other; a first groove wall 141 is formed between the first surface 122 and the bottom of the first groove 14, and at the same time, the first surface 122 and the bottom of the second groove 16 A second groove wall 161 is formed between the bottom of the first groove 14 and a second through hole 160 through the bottom of the first groove 14 to the second surface 128. The bottom of the second groove is to the second face 128.

Next, please refer to Fig. 2, which is a schematic view of the substrate of the creation. As shown in FIG. 2, the second surface 128 of the substrate 12 is the first through hole 140 and the second through hole 160. In this In the created embodiment, the substrate 12 and the structure thereof as described above may be formed by injection molding of a polymer material, but the creation does not limit the material and forming manner of the substrate 12; In the preferred embodiment, the first through hole 140 and the second through hole 160 are circular holes, and the aperture sizes of the first through hole 140 and the second through hole 160 are the largest on the second surface 128, and are close to the first concave The bottom of the groove 14 and the second groove 16 are decremented.

Next, please refer to FIG. 3, which is a schematic diagram of the wiring of the original substrate. As shown in FIG. 3, a first solder joint 1420 is formed beside the first through hole 140 at the bottom of the first recess 14. The first solder joint 1420 extends to the first surface 122 via the first recess wall 141 and forms a The first electrical connection end 142; in the preferred embodiment of the present invention, the first solder joint 1420 is geometric; for example, semi-circular; meanwhile, there is a second solder joint 1440 at the bottom of the first recess 14 The first through hole 140 is opposite to the second soldering point 1420. The second soldering point 1440 extends to the first surface 122 via the first recessed wall 141, and forms a second electrical connecting end 144. The second electrical connecting end 144 And a first recess 14 is opposite to the first electrical connection end 142; in addition, a plurality of third solder joints 1620 are disposed at the bottom of the second recess 16 and surround the second through hole 160, and the third solder joints 1620 are respectively Extending to the first surface 122 via the second groove wall 161 and forming a plurality of third solder joints 162, while the third solder joint 162 surrounds the second recess 16; wherein the third electrical connection end 162 is adjacent to the substrate 12 A third electrical connection end 162 on the outer side may further have a notch 1622 as an identification leg.

In this embodiment, the first electrical connection end 142, the second electrical connection end 144, the third electrical connection end 162, the first solder joint 1420, the second solder joint 1440, and the third solder joint on the substrate 12 The 1620 is formed by first laser-depositing the first surface 122, the first groove wall 141, the first groove 14, the second groove wall 161, and the second groove 16 on the substrate 12. The position is then formed by electroplating or evaporation; however, the creation does not form the first electrical connection end 142, the second electrical connection end 144, the third electrical connection end 162, the first solder joint 1420, and the second soldering. The manner, flow and materials of the components such as the point 1440 and the third solder joint 1620 are limited.

Next, please refer to FIG. 4 and FIG. 5 at the same time, respectively, which are schematic diagrams of the schematic diagram of the creation of the three-dimensional circuit package structure and a schematic diagram of the package structure of the creation of the three-dimensional circuit, wherein the connection line XX' at both ends of the fourth figure corresponds to the first Figure 5 shows the line XX'. As shown in FIG. 4 and FIG. 5, the inventive three-dimensional circuit package structure 1 is provided with a first die 18 and a second die 20 on the substrate 12 as shown in FIG. 3; The die 18 has a first upper end 180 and a first lower The first upper end 180 has a plurality of first pads 184; the first die 18 is disposed on the first recess 14 and the first upper end 180 faces the first through hole 140, and the first pad The second die 20 has a second upper end 200 and a second lower end 202, and the second upper end 200 has a plurality of second pads 204; When the second die 20 is a light sensing component, the light sensing region (not shown) on the die 20 is concentrated in a region of the second upper end 200; the second die 20 is disposed in the first The second recess 16 has a light sensing region (not shown) facing the second through hole 160, and the second pad 204 is electrically connected to the third solder joint 1620.

In this embodiment, the first die 18 and the second die 20 are disposed on the substrate 12 by Flip chip bonding, and the first die 18 is taken as an example, first in the first die 18 . The first upper end 180 forms a first pad 184, and the first pad 184 may be tin, lead or alloy; then, the first die 18 is turned over and placed at the bottom of the first groove 14, so that the first upper end 180 is facing the first The first die 184 is consistently perforated 180, and the first pad 184 is contacted with the first pad 1420 and the second pad 1440, and then the first pad 184 is melted and solidified to complete the connection of the first die 18 to the substrate 12; The configuration of the second die 20 is similar to that of the first die 18, and therefore will not be described again. However, the present invention does not limit the method, the steps, and the soldering materials used for the first die 18 and the second die 20; In this embodiment, the first die 18 is a light emitting diode (LED) of the same side electrode, such as a blue LED or a green LED.

Next, please refer to FIG. 6 , which is a cross-sectional view of a second embodiment of the inventive three-dimensional circuit package structure. As shown in FIG. 6, a first encapsulation layer 148 and a second encapsulation layer 168 are formed in the first recess 14 and the second recess 16 of the three-dimensional circuit package structure 1 as shown in FIG. An adhesive layer 148 covers the first lower end 182 of the first die 18, and the second sealant 168 covers the second lower end 202 of the second die 20. Thus, the three-dimensional circuit package structure 1' can be The first sealant layer 148 and the second sealant layer 168 can be epoxy; then, the third sealant layer 1400 is formed in the first through hole 140, and the third sealant layer is formed. 1400 and covering the first upper end 180 of the first die 18; meanwhile, a fourth sealant layer 1600 is formed in the second through hole 160, and the fourth sealant layer 1600 covers the second upper end 200 of the second die 20, In this way, the three-dimensional circuit package structure 1 ′ can further have better reliability; wherein the third sealant layer 1400 and the fourth sealant layer 1600 can be transparent epoxy; and the three-dimensional circuit package structure 1 ′ yuan The components and structures are the same as those of the three-dimensional circuit package structure 1, and therefore will not be described again.

Next, please refer to FIG. 7 , which is a cross-sectional view of a third embodiment of the creative three-dimensional circuit package structure. As shown in FIG. 7 , a first transparent cover 1402 is disposed in the first through hole 140 of the three-dimensional circuit package structure 1′′, and a second transparent cover 1602 is disposed in the second through hole 160. The cover 1402 can be a lens of a convex structure, such that the light emitted by the first die 18 can condense when passing through the first reticle 1402; the first transparent cover 1402 can also be a planar diffuser film (Diffuser) structure. The first light transmissive cover 1402 can have the effect of diffusing light, so that when light is emitted from the first die 18 and passes through the first transmissive cover 1402, the area of the light irradiation can be increased by scattering; The light transmissive cover 1602 can be a lens of a concave structure, so that the light entering the second through hole 160 can produce a focusing effect, and can increase the light sensing efficiency of the second die 20; wherein, the first transparent cover 1402 and The second transparent cover 1602 can be formed by grinding, molding, etc., and then placed into the first through hole 140 and the second through hole 160 respectively; and the top end of the first transparent cover 1402 can be higher than, equal to or Lower than the second surface 128, the top end of the second transparent cover 1602 may be higher than, equal to or lower than the second surface 128; The present invention does not limit the structure, material, method or flow of forming the first transparent cover 1402 and the second light cover 1602; as for the other components and structures of the three-dimensional circuit package structure 1", the same as the three-dimensional circuit package structure 1, Therefore, it will not be repeated.

After the three-dimensional circuit package structure 1, 1 ', 1" is completed, the three-dimensional circuit package structure 1, 1 ', 1" is usually disposed on a printed circuit board (not shown) to generate a module. Features. However, since the size of the package structure is limited, it is usually impossible to configure the size and distance of each electrical contact when the configuration of the three-dimensional circuit is performed, which may result in the three-dimensional circuit package structure 1, 1 ', 1" The electrical contacts cannot be well connected to the electrical contacts on the printed circuit board (not shown). To overcome this practical difficulty, please refer to Figure 8A and Figure 8B at the same time. A cross-sectional view of the third embodiment of the present invention is a three-dimensional circuit package structure; wherein, FIG. 8A and FIG. 8B are respectively a schematic view of the creation soft board, and a schematic diagram of the original soft board, as shown in FIG. 8A and FIG. 8B. The third surface 31 has a plurality of first electrical contacts 35, and the fourth surface 33 has a plurality of second electrical contacts 37. The first surface 33 has a plurality of second electrical contacts 37. The electrical contact 35 and the second electrical contact 37 are electrically connected to the metal material 361 through a plurality of flexible plate through holes 360; wherein the second electrical contact 37 is arranged at the first position of the substrate 12 The first electrical connection end 142, the second electrical connection end 144, and the third electric power on the surface 122 The connector 162 is opposite; in addition, one of the first electrical connection points 35 located at the corner of the third face 31 has a notch 350 as an identification pin.

Then, please refer to FIG. 9 , which is a schematic diagram of the combination of the creative soft board and the three-dimensional circuit package structure. As shown in FIG. 9, the fourth surface 33 of the flexible board 3 and the first surface 122 of the three-dimensional circuit package structure 1 are bonded to each other, and the first electrical connection end 142, the second electrical connection end 144, and the third electrical connection. The connection end 162 is electrically connected to the second electrical contact 37. Because the space of the first surface 122 is limited, the first electrical connection end 142, the second electrical connection end 144, and the third electrical connection end are provided. 162 can not be neatly arranged, which may affect the subsequent process of the three-dimensional circuit package structure 1. If the present embodiment is implemented in the above embodiment, the three-dimensional circuit package structure 1 can be transmitted through the aligned first electrical contacts 35 and other The device (for example, a printed circuit board) is electrically connected, and the soft board 3 can be formed by using a polymer material (for example, epoxy resin-Epoxy), so that the soft board 3 of the present invention can be made relatively thin, so that the soft board is added. The volume of the three-dimensional circuit package structure 1 after the board 3 is not significantly increased.

According to the three-dimensional circuit package structure 1, 1', 1" proposed by the present invention, since the wiring structure of the substrate 12 as shown in FIG. 3 can be formed by injection molding, laser engraving, plating, or the like, the semiconductor factory is performing. In the package, the first die 18 and the second die 20 can be combined with the substrate 12 through the flip chip bonding to complete the package, which can effectively reduce the steps and time required for the packaging process, further reducing the cost, and also because The reduction of the steps can improve the reliability of the packaged product, and because of the additional modular soft board 3, the three-dimensional circuit structure 1, 1 ', 1" can also have a good external circuit connection when performing subsequent packaging. .

Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of patent protection of the creation shall be subject to the definition of the scope of the patent application attached to this specification.

1‧‧‧Three-dimensional circuit package structure

12‧‧‧Substrate

122‧‧‧ first side

123‧‧‧Retaining wall

128‧‧‧ second side

14‧‧‧First groove

141‧‧‧First groove wall

142‧‧‧First electrical connection

144‧‧‧Second electrical connection

16‧‧‧second groove

161‧‧‧second groove wall

162‧‧‧The third electrical connection

1622‧‧‧ gap

18‧‧‧First grain

182‧‧‧ first lower end

20‧‧‧Second grain

202‧‧‧second lower end

XX’‧‧‧ connection

Claims (13)

A three-dimensional circuit package structure includes a substrate having a first surface and a second surface opposite to the first surface, the first mask having a first recess and a second recess, the first recess The first and second recesses are separated from each other by a retaining wall. The first recess includes a first through hole at a bottom of the first recess and connected to the a first surface of the first groove is located between the bottom of the first groove and the first surface; a first soldering point is located beside the first through hole at the bottom of the first groove, the first a soldering point extends to the first surface via the first groove wall and forms a first electrical connection end; and a second soldering point is located beside the first through hole at the bottom of the first groove, and The second soldering point is opposite to the first soldering surface and extends to the first surface and forms a second electrical connecting end opposite to the first electrical connecting end; the second recess The method includes: a second through hole at the bottom of the second groove and communicating to the second surface; a second groove wall Located between the bottom of the second groove and the first surface; and a plurality of third solder joints located at the bottom of the second groove and surrounding the second through hole, and the third solder joints are passed through the second recess The first sidewall has a first upper end and a first lower end, and the first upper end has a plurality of first pads, and the first upper end has a plurality of first pads The first die is disposed in the first recess, and the first upper end is opposite to the first through hole, and the first pads are electrically connected to the first solder joint and the second solder joint respectively; a second die having a second upper end and a second lower end, the second upper end having a plurality of second pads, the second die being disposed in the second groove, and the second upper end is facing The second through holes are electrically connected to the third solder joints. The first recess is further provided with an adhesive layer covering the first lower end of the first die. The second recess is further provided with a glue layer covering the second lower end of the second die. According to the three-dimensional circuit package structure of claim 3, the sealant layer of the second groove is an epoxy resin. The first through hole further has a glue layer covering the first upper end of the first die. The second through hole further has a glue layer covering the second upper end of the second die. According to the three-dimensional circuit package structure of claim 6, the sealant layer of the second through hole is a transparent epoxy resin. According to the three-dimensional circuit package structure of claim 1, the third electrical connection end of the third electrical connection end further has a notch at the third electrical connection end of the first corner. According to the three-dimensional circuit package structure of claim 1, the first through hole further has a first light transmissive cover. According to the three-dimensional circuit package structure of claim 9, the first transparent cover is a lens or a diffusion mold. According to the three-dimensional circuit package structure of claim 1, the second through hole further has a second transparent cover. According to the three-dimensional circuit package structure of claim 11, the second transparent cover is a lens. A three-dimensional circuit package structure includes a substrate having a first surface and a second surface opposite to the first surface, the first mask having a first recess and a second recess, the first recess The first and second recesses are separated from each other by a retaining wall. The first recess includes a first through hole at a bottom of the first recess and connected to the Second side; a first groove wall is located between the bottom of the first groove and the first surface; a first soldering point is located beside the first through hole at the bottom of the first groove, and the first soldering point is via The first groove wall extends to the first surface and forms a first electrical connection end; and a second soldering point is located beside the first through hole at the bottom of the first groove, and the first solder joint The second soldering point extends to the first surface via the first recessed wall and forms a second electrical connecting end opposite to the first electrical connecting end; the second recess includes: a second through hole at the bottom of the second groove and communicating to the second surface; a second groove wall located between the bottom of the second groove and the first surface; and a plurality of third welding points located at The second groove bottom surrounds the second through hole, and the third soldering points extend to the first surface via the second groove wall and form a plurality of third electrical connecting ends; a first die Having a first upper end and a first lower end, the first upper end has a plurality of first pads, and the first die is disposed on the first a groove, and the first upper end is opposite to the first through hole, the first pads are electrically connected to the first soldering point and the second soldering point respectively; and a second die has a second An upper end and a second lower end, the second upper end has a plurality of second pads, the second die is disposed in the second groove, and the second upper end is facing the second through hole, the second welding The pads are electrically connected to the third solder joints respectively; and a flexible board has a third surface and an opposite fourth surface, the third surface having a plurality of first electrical contacts, the fourth surface Bonding with the first surface, the fourth surface further has a plurality of second electrical contacts, the second electrical contacts being opposite to the first solder joint, the second solder joint, and the third solder joints Arranging and electrically connecting the first soldering point, the second soldering point and the third soldering point, the second electrical contacts are through a plurality of flexible board perforations and a plurality of the soft board perforations The metal material is electrically connected to the first electrical contacts.