CN112652611A - Sensor packaging structure and electronic equipment - Google Patents
Sensor packaging structure and electronic equipment Download PDFInfo
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- CN112652611A CN112652611A CN202011515217.8A CN202011515217A CN112652611A CN 112652611 A CN112652611 A CN 112652611A CN 202011515217 A CN202011515217 A CN 202011515217A CN 112652611 A CN112652611 A CN 112652611A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 29
- 239000005022 packaging material Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 3
- 238000002955 isolation Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
Abstract
The application discloses a sensor packaging structure and electronic equipment, wherein the sensor packaging structure comprises a carrier plate, a first chip, a second chip and packaging materials; the first chip and the second chip are both arranged on the carrier plate and are electrically connected with the carrier plate; a first through hole and a second through hole are formed in the carrier plate, an active area of the first chip is opposite to the first through hole, and an active area of the second chip is opposite to the second through hole; the packaging material wraps the first chip and the second chip.
Description
Technical Field
The application belongs to the technical field of sensors, and particularly relates to a sensor packaging structure and electronic equipment.
Background
In the related art, as the technology develops, a sensor is configured in the device to realize the function of the electronic device. In the existing sensor package structure, a chip is disposed on a carrier, an upper cover forms a groove structure and is fastened outside the chip, and transparent resin is filled in the groove structure.
The existing sensor packaging structure is complex in process, drilling needs to be carried out after transparent resin is filled in a space between the upper cover and the carrier plate, and silver glue needs to be filled in the space to fix the upper cover on the carrier plate.
The existing sensor packaging structure has large volume and occupies too much space, and when the sensor packaging structure is arranged in electronic equipment, enough space needs to be reserved, so that the sensor packaging structure occupies the internal space of the electronic equipment. The sensor package structure has a large volume, and the thickness of the electronic device cannot be further reduced.
In the process of implementing the present application, the applicant finds that at least the following problems exist in the prior art:
the existing sensor packaging structure has a complex structure and a large volume, and occupies too much space.
Disclosure of Invention
The application aims at providing a sensor packaging structure, and solves at least one of the problems of complex structure, large volume and excessive space occupation of the existing sensor packaging structure.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a sensor package structure, where the sensor package structure includes a carrier, a first chip, a second chip, and a package material;
the first chip and the second chip are both arranged on the carrier plate and are electrically connected with the carrier plate;
a first through hole and a second through hole are formed in the carrier plate, an active area of the first chip is opposite to the first through hole, and an active area of the second chip is opposite to the second through hole;
the packaging material wraps the first chip and the second chip.
In a second aspect, embodiments of the present application provide an electronic device, which includes the sensor package structure described above.
In the embodiment of this application, form optical isolation to first chip and second chip through packaging material, make first chip through first through-hole and external interaction, the second chip passes through the second through-hole and external interaction, thereby realize the function of sensor, need not set up the upper cover, and need not pack transparent resin in the upper cover, sensor packaging structure's structure is simpler, has reduced sensor packaging structure's volume, has reduced the space that the sensor occupy.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is one of schematic structural diagrams of a sensor package structure according to an embodiment of the present application;
FIG. 2 is a second schematic structural diagram of a sensor package structure according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a carrier according to an embodiment of the present application;
FIG. 4 is one of the partial schematic diagrams of an electronic device according to an embodiment of the application;
FIG. 5 is a second schematic diagram of a portion of an electronic device according to an embodiment of the present application;
fig. 6 is a third partial schematic diagram of an electronic device according to an embodiment of the present application.
Reference numerals:
10-a carrier plate, 101-a first through hole, 102-a second through hole, 103-a bonding pad, 11-a first chip, 12-a second chip, 13-packaging material, 14-a first bump, 15-a second bump, 2-light-transmitting material, 3-a main board, 33-a third through hole, 34-a fourth through hole, 4-a shell, 5-a flexible circuit board, 51-a fifth through hole and 52-a sixth through hole.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The features of the terms first and second in the description and in the claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality" means two or more unless otherwise specified. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
In the description of the present application, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A sensor package structure according to an embodiment of the present application is described below with reference to fig. 1-6.
As shown in fig. 1-3, a sensor package structure according to some embodiments of the present application includes a carrier board 10, a first chip 11, a second chip 12, and an encapsulation material 13.
The first chip 11 and the second chip 12 are both disposed on the carrier 10, and the first chip 11 and the second chip 12 are both electrically connected to the carrier 13.
The carrier 10 is provided with a first through hole 101 and a second through hole 102, an active area of the first chip 11 is opposite to the first through hole 101, and an active area of the second chip 12 is opposite to the second through hole 102.
The encapsulation material 13 encapsulates the first chip 11 and the second chip 12. The encapsulant 13 forms optical isolation of the first chip 11 from the second chip 12 while the encapsulant 13 forms optical isolation of the first chip 11 from the second chip 12 from the portions of the first chip 11 other than the active region and the second chip 12.
In this embodiment, the encapsulation material 13 forms an optical isolation of the first chip 11 and the second chip 12, so that the active region of the first chip 11 can only interact with the outside through the first channel 101. The active region of the first chip 11 is a functional region of the first chip 11, and the functional region of the first chip 11 interacts with the outside through the first channel 101. The active area of the second chip 12 is a functional area of the second chip 12, and the functional area of the second chip 12 interacts with the outside through the second channel 102. The encapsulation material 13 forms encapsulation and optical isolation for the first chip 11 and the second chip 12, so that interference of external light to the first chip 11 and the second chip 12 is avoided, and mutual interference between the first chip 11 and the second chip 12 is also avoided.
In the sensor package structure, a first chip 11 and a second chip 12 are packaged on a carrier board 10 by a packaging material 13, and can interact with the outside through a first through hole 101 and a second through hole 102 provided on the carrier board 10. Compared with the prior art, the sensor packaging structure has the advantages that the upper cover does not need to be arranged and the transparent resin does not need to be filled in the upper cover, so that the structure of the sensor packaging structure is simpler, the thickness and the size are reduced, the size of the sensor packaging structure is reduced, and the space occupied by the sensor packaging structure is reduced.
The sensor packaging structure is arranged in the electronic equipment, so that the internal space of the electronic equipment occupied by the sensor packaging structure can be reduced. The sensor packaging structure can reduce the volume of the electronic equipment and optimize the size of the electronic equipment.
The structure of the sensor package structure is simpler than that of the existing sensor package structure, and the first chip 11 and the second chip 12 are easier to package on the carrier 10. The processing technology of the sensor packaging structure is simplified.
Optionally, the first chip 11 is a Light Emitting chip, such as a Light Emitting Diode (LED). The active region of the first chip 11 is a functional region of the light emitting diode, which is used for emitting light. The second chip 12 is a light receiving chip, such as a Photodiode (PD), and the active region of the second chip 12 is a functional region of the photodiode, which is used for receiving light. The sensor package structure is a package structure of a proximity sensor. The first chip 11 emits light, and the second chip 12 receives the reflected light, so that the distance between the object and the proximity sensor can be obtained.
Optionally, the encapsulating material 13 includes a black resin or a blue resin.
The encapsulation material 13 forms an optical isolation for the first chip 11 and the second chip 12 to ensure that the first chip 11 interacts with the outside from the first via 101 and the second chip 12 interacts with the outside through the second via 102. The black resin or the blue resin can effectively form optical isolation and facilitate the encapsulation of the first chip 11 and the second chip 12 on the carrier board 10.
For example, the light emitting chip can emit light of different colors according to different compositions, and the black resin can effectively optically isolate light. When the light color emitted by the light emitting chip does not belong to blue, blue resin may be used for encapsulation. The non-transparent resin capable of forming optical isolation may be provided according to the color of the light emitted from the first chip 11.
In one embodiment, as shown in fig. 2, the first via hole 101 and the second via hole 102 are filled with a light transmissive material 2.
In this embodiment, the light transmissive material 2 in the first and second through holes 101 and 102 can pass light. The light-transmitting material 2 forms a shield at the first through hole 101 and the second through hole 102, and prevents foreign matters from entering from the first through hole 101 or the second through hole 102 to interfere with the first chip 11 and the second chip 12.
Optionally, the light transmissive material 2 comprises glass or transparent resin.
Both the glass and the transparent resin have excellent light transmission performance, light can penetrate through the light transmission material 2, and effective encapsulation can be formed at the first through hole 101 and the second through hole 102 to effectively protect the first chip 11 and the second chip 12.
In one embodiment, as shown in fig. 1 to fig. 3, the first chip 11 is provided with a first bump 14, the first chip 11 is electrically connected to the carrier board 10 through the first bump 14, the second chip 12 is provided with a second bump 15, and the second chip 12 is electrically connected to the carrier board 10 through the second bump 15.
In this embodiment, the first chip 11 is electrically connected to the carrier board 10 through the first bumps 14, so that the carrier board 10 ensures that the first chip 11 can perform the function of emitting light. The second chip 12 is electrically connected to the carrier 10 through the second bumps 15, so that the carrier 10 ensures that the second chip 12 can receive light.
The first chip 11 is provided with two first bumps 14, and the two first bumps 14 form an electrical connection between the active region of the first chip 11 and the carrier board 10. The second chip 12 is provided with two second bumps 15, and the two second bumps 15 form an electrical connection between the active region of the second chip 15 and the carrier board 10.
In an embodiment of the application, there is provided an electronic device comprising a sensor package structure as described in any of the embodiments above.
In this embodiment, the volume of the sensor package structure is smaller, and the internal space of the electronic device is less occupied, so that the volume of the electronic device can be further reduced. For example, the sensor package structure has a smaller dimension in the thickness direction of the stack of the carrier 10 and the package material 13, so that the thickness dimension of the electronic device can be further reduced in the thickness direction, and the electronic device can be thinner and lighter.
In one embodiment, as shown in fig. 4 and 5, the electronic device further includes a housing 4 and a main board 3, the housing 4 forms a receiving cavity, and the main board 3 and the sensor package structure are disposed in the receiving cavity.
The carrier plate 10 is disposed on the main board 3, the main board 3 is electrically connected to the carrier plate 10, a third through hole 33 and a fourth through hole 34 are disposed on the main board 3, the third through hole 33 is opposite to the first through hole 101, and the fourth through hole 34 is opposite to the second through hole 102.
In this embodiment, the sensor package is disposed on the main board 3, and the first channel 101 and the third channel 33 form a light emitting channel of the first chip 11, so that the first chip 11 can emit light along the light emitting channel. The second channel 102 and the fourth channel 34 form a receiving channel of the second chip 12 so that the second chip 12 can receive light through the receiving channel.
The thickness dimension that this sensor packaging structure occupy is littleer, can make the thickness dimension of electronic equipment littleer. The third through hole 33 and the fourth through hole 34 provided on the main board 3 enable the main board 3 to be located between the sensor package structure and the housing 4, and do not affect the functions of the first chip 11 and the second chip 12 in the sensor package structure.
The case 4 has a face opposite to the third through hole 33 and the fourth through hole 34, and the first chip 11 and the second chip 12 in the sensor package structure face the face and interact with the outside. For example, the side is a back or display side of the electronic device. The mainboard 3 is located between the sensor packaging structure and the surface, and the distance between the surface and the mainboard 3 can be effectively reduced.
Compared with the prior art, the distance between the shell 4 and the mainboard 3 can be reduced, and the thickness size of the electronic equipment is reduced.
In one embodiment, as shown in fig. 1 to 5, at least one pad 103 is disposed on the carrier 10, and the motherboard 3 is electrically connected to the carrier 10 through the at least one pad 103.
At least one of which is one or more, the number of pads 103 being set according to the actual requirements of the electrical connection. The pads 103 on the carrier board 10 are used for electrically connecting with the motherboard 3, so that the first chip 11 and the second chip 12 can interact with the motherboard 3, and the first chip 11 and the second chip 12 can be controlled by the motherboard 3. For example, the main board 3 is provided with connection portions corresponding to the pads 103. Each pad 103 is electrically connected to a corresponding connection site.
In one embodiment, as shown in fig. 6, the electronic device further includes a housing 4 and a flexible printed circuit board 5, the housing 4 forms a receiving cavity, and the flexible printed circuit board 5 and the sensor package structure are disposed in the receiving cavity.
The flexible printed circuit 5 is attached to the housing 4, the carrier plate 10 is disposed on the flexible printed circuit 5, the carrier plate 10 is electrically connected to the flexible printed circuit 5, a fifth through hole 51 and a sixth through hole 52 are disposed on the flexible printed circuit 5, the fifth through hole 51 is opposite to the first through hole 101, and the sixth through hole 52 is opposite to the second through hole 102.
In this embodiment, the flexible wiring board 5 is attached to the side of the housing 4 on the display surface of the electronic apparatus, or the flexible wiring board 5 is attached to the side of the housing 4 on the back surface of the electronic apparatus. The carrier board 10 is disposed on the flexible wiring board 5 such that the first through hole 101 is opposed to the fifth through hole 51 and the second through hole 102 is opposed to the sixth through hole 52. The first through hole 101 and the fifth through hole 51 form a light emitting channel of the first chip 11, and the first chip 11 emits light to the outside through the light emitting channel. The second through hole 102 and the sixth channel 52 form a receiving channel of the second chip 12, and the second chip 12 receives external light through the receiving channel.
The carrier board 10 is electrically connected to the flexible wiring board 5, and the flexible wiring board 5 provides a path for electrically connecting the first chip 11 and the second chip 12 to a main board of the electronic device. The structure of the flexible circuit board 5 is light and thin, the stacking thickness of the sensor packaging structure and the flexible circuit board 5 stacked on the shell 4 is smaller, and the assembly between the structures is more compact. The thickness dimension of the electronic device is further reduced.
Optionally, the main board 3 and the sensor package structure in the electronic device are in a mutual avoidance, and the main board 3 is electrically connected to the carrier board 10 in the sensor package structure through the flexible circuit board 5.
Optionally, at least one pad 103 is disposed on the carrier 10, and the flexible printed circuit 5 is electrically connected to the carrier 10 through the at least one pad 103. The flexible circuit board 5 is used for forming electric connection between the carrier board 10 and the main board 3 in the electronic device, and the thickness of the flexible circuit board 5 is small and thinner, so that the thickness occupied by the sensor packaging structure is reduced. For example, the touch sensor package structure and the main board 3 are mutually avoided, so that the size of the electronic device in thickness is further reduced, and the electronic device is thinner and thinner.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A sensor packaging structure is characterized by comprising a carrier plate, a first chip, a second chip and packaging materials;
the first chip and the second chip are both arranged on the carrier plate and are electrically connected with the carrier plate;
a first through hole and a second through hole are formed in the carrier plate, an active area of the first chip is opposite to the first through hole, and an active area of the second chip is opposite to the second through hole;
the packaging material wraps the first chip and the second chip.
2. The sensor package structure of claim 1, wherein the first chip is a light emitting chip and the second chip is a light receiving chip.
3. The sensor package structure of claim 1, wherein the first and second vias are filled with a light transmissive material.
4. The sensor package structure of claim 3, wherein the light transmissive material comprises glass or a transparent resin.
5. The sensor package structure of claim 1, wherein the encapsulation material comprises a black resin or a blue resin.
6. The sensor package structure of claim 1, wherein the first chip is provided with a first bump, the first chip is electrically connected to the carrier board through the first bump, the second chip is provided with a second bump, and the second chip is electrically connected to the carrier board through the second bump.
7. An electronic device comprising a sensor package structure according to any one of claims 1-6.
8. The electronic device of claim 7, further comprising a housing and a motherboard;
the shell forms an accommodating cavity, and the mainboard and the sensor packaging structure are arranged in the accommodating cavity;
the support plate is arranged on the mainboard, the mainboard is electrically connected with the support plate, a third through hole and a fourth through hole are arranged on the mainboard, the third through hole is opposite to the first through hole, and the fourth through hole is opposite to the second through hole.
9. The electronic device of claim 8, wherein the carrier board has at least one pad disposed thereon, and the motherboard is electrically connected to the carrier board through the at least one pad.
10. The electronic device of claim 7, further comprising a housing and a flexible wiring board;
the shell forms an accommodating cavity, and the flexible circuit board and the sensor packaging structure are arranged in the accommodating cavity;
the flexible circuit board is attached to the shell, the carrier plate is arranged on the flexible circuit board, the carrier plate is electrically connected with the flexible circuit board, a fifth through hole and a sixth through hole are formed in the flexible circuit board, the fifth through hole is opposite to the first through hole, and the sixth through hole is opposite to the second through hole.
11. The electronic device of claim 10, wherein the carrier board has at least one pad disposed thereon, and the flexible printed circuit board is electrically connected to the carrier board through the at least one pad.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011515217.8A CN112652611A (en) | 2020-12-18 | 2020-12-18 | Sensor packaging structure and electronic equipment |
| PCT/CN2021/137365 WO2022127726A1 (en) | 2020-12-18 | 2021-12-13 | Sensor encapsulation structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011515217.8A CN112652611A (en) | 2020-12-18 | 2020-12-18 | Sensor packaging structure and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN112652611A true CN112652611A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011515217.8A Pending CN112652611A (en) | 2020-12-18 | 2020-12-18 | Sensor packaging structure and electronic equipment |
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| CN (1) | CN112652611A (en) |
| WO (1) | WO2022127726A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127726A1 (en) * | 2020-12-18 | 2022-06-23 | 维沃移动通信有限公司 | Sensor encapsulation structure and electronic device |
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| CN108140689A (en) * | 2015-12-10 | 2018-06-08 | 京瓷株式会社 | Sensor substrate and sensor device |
| CN109872986A (en) * | 2017-12-04 | 2019-06-11 | 新加坡有限公司 | The encapsulating structure of optical sensor and the packaging method of optical sensor |
| CN109063621A (en) * | 2018-07-25 | 2018-12-21 | 维沃移动通信有限公司 | A kind of mobile terminal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127726A1 (en) * | 2020-12-18 | 2022-06-23 | 维沃移动通信有限公司 | Sensor encapsulation structure and electronic device |
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| Publication number | Publication date |
|---|---|
| WO2022127726A1 (en) | 2022-06-23 |
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