TWM470395U - Chip antenna structure improvement - Google Patents

Description

Wafer antenna structure improvement

The present invention relates to an antenna, and more particularly to a single-polarized wafer antenna structure improvement.

With the development of wireless communication technology, portable electronic devices such as notebook computers, mobile phones, and personal digital assistants (PDAs) are designed and developed toward thin and light. The size of the antenna used to transmit and receive radio signals is relatively small, or the antenna structure can be changed to be built into the electronic product.

A multi-band multi-band antenna commonly used on the market currently has a chip antenna and a substrate. The chip antenna is made of a ceramic material and formed into a rectangular carrier, and the carrier is coated with at least one radiating metal portion for communication. When the chip antenna is electrically connected to the substrate, the wafer antenna is radiated. The metal portion is electrically connected to the microstrip line on the substrate (printed circuit board). After the microstrip line is electrically connected to the copper shaft cable, the radiation metal portion receives the signal and passes the signal through the microstrip. The wire is transmitted to the copper shaft cable, and then the copper shaft cable is transmitted to the motherboard of the electronic device for processing purposes.

Since the wafer antenna is made of a ceramic material, the volume of the wafer antenna is much smaller than that of a conventional antenna, but when the substrate used with the wafer antenna has a better matching characteristic with the wafer antenna, the volume of the substrate is larger than that of the wafer antenna. The chip antenna is several times larger, and it can reduce the thickness of the device when it is applied to mobile electronic devices. However, the size of the device cannot be reduced, so it cannot be applied to the current thin and light design. On the mobile electronic device.

Therefore, the main purpose of this creation is to solve the traditional lack and avoid the existence of the missing. This creation uses the glass fiber material as the carrier of the wafer antenna, which can make the volume of the wafer antenna of this creation shrink several times more than the traditional wafer. The volume of the substrate used in combination can be reduced by several times, so that the mobile electronic device can be reduced to a smaller size to meet the requirements of lightness and shortness.

In order to achieve the above object, the present invention provides a wafer antenna structure improvement comprising: a carrier, a glass fiber material having a top surface, a bottom surface and two end surfaces; a radiator having a spiral radiator and a spiral-shaped radiation system, the spiral-shaped radiation system is disposed on the top surface of the carrier and the bottom surface through the carrier, and the radial radiator is disposed on the top surface of the carrier and electrically connected to the spiral radiator; An electrode is disposed on the top surface and the bottom surface of the two end faces and portions of the carrier, and is electrically connected to the spiral radiator and the radial radiator.

Wherein, the carrier is made of a single layer of glass fiber material and is formed into a long strip shape or a long plate shape.

Wherein, the carrier is made of a plurality of layers of glass fiber material in the form of a long strip or a long plate.

Wherein, the spiral radiation system is composed of a plurality of metal line segments and a plurality of conductive columns penetrating through the carrier 1. The metal wire segments are respectively disposed on a top surface and a bottom surface of the carrier, and the conductive columns are respectively disposed through the carrier and respectively The top surface of the carrier and the ends of the metal line segments of the bottom surface are electrically connected to form a spiral radiator.

Wherein the braided radiation system is formed by connecting a plurality of metal wire segments and is disposed on a top surface of the carrier, the metal wire segment of the braided radiator and the metal of the spiral radiator The line segments are electrically connected.

The electrode is composed of a first electrode and a second electrode, and the first electrode and the second electrode are respectively disposed on the top surface and the bottom surface of the two end faces and portions of the carrier, and the spiral radiation The body and the braided radiator are electrically connected.

The first surface of the substrate has a first grounding metal layer, a signal extending metal layer and a first hollow portion. One side of the first hollow portion has a second hollow portion extending from the first hollow portion. The hollow portion and the second hollow portion have a signal feed line.

The first electrode and the second electrode of the electrode of the chip antenna are electrically connected to the signal extension metal layer and one end of the signal feed line.

The other end of the signal feeding line is electrically connected to a coaxial cable.

The back surface of the substrate has a second grounding metal layer and a third hollow portion. The third hollow portion corresponds to the first hollow portion of the front surface of the substrate, and a clearing portion is formed by the third hollow portion.

Wherein, an insulating layer is further disposed on the top surface, the bottom surface of the carrier and the radiator.

Wherein, the insulating layer is green lacquer.

Among them, there is a pattern layer.

The pattern layer is a company logo pattern, a product model number, and a serial number.

10‧‧‧Watt antenna

1‧‧‧ Carrier

11‧‧‧ top surface

12‧‧‧ bottom

13‧‧‧ end face

2‧‧‧ radiator

21‧‧‧Spiral radiator

211‧‧‧Metal segments

212‧‧‧conductive column

22‧‧‧Shape radiator

221‧‧‧Metal segments

3‧‧‧Electrode

31‧‧‧First electrode

32‧‧‧second electrode

4‧‧‧Insulation

5‧‧‧pattern layer

20‧‧‧Substrate

201‧‧‧First grounded metal layer

202‧‧‧Signal extension metal layer

203‧‧‧The first time

204‧‧‧Second Air Force

205‧‧‧Signal feed line

206‧‧‧Second grounded metal layer

207‧‧ Third Third Department

The first figure is a stereoscopic view of the appearance of the wafer antenna of the present invention.

The second figure is a perspective view of another perspective view of the wafer antenna of the present invention.

The third figure is a schematic cross-sectional view of the 3-3 position of the first figure.

The fourth figure is a schematic diagram of the decomposition of the wafer antenna and the substrate of the present invention.

The fifth figure is a schematic diagram of the combination of the wafer antenna and the substrate of the present invention.

The sixth figure is a schematic view of the other side of the combination of the wafer antenna and the substrate of the present invention.

The seventh figure is a schematic diagram of the antenna reflection coefficient curve measured by electrically connecting the wafer antenna of the present invention to the substrate.

The eighth figure is a schematic diagram of the antenna reflection coefficient curve measured by electrically connecting the wafer antenna of the present invention to the substrate.

The ninth figure is a three-dimensional diagram of the antenna reflection coefficient curve measured by the chip antenna of the present invention electrically connected to the substrate.

The tenth figure is a schematic diagram of the antenna reflection coefficient curve measured by the chip antenna of the present invention electrically connected to the substrate.

The eleventh figure is a schematic diagram of the fifth reflection coefficient curve of the antenna measured by the chip antenna of the present invention electrically connected to the substrate.

The technical content and detailed description of this creation are as follows:

Please refer to the first, second and third figures, which are schematic cross-sectional views of the appearance of the wafer antenna of the present invention and the appearance of the other perspective and the 3-3 position of the first figure. As shown in the figure, the wafer antenna structure of the present invention is improved. The wafer antenna 10 comprises at least a carrier 1, a radiator 2, an electrode layer 3, an insulating layer 4 and a pattern layer 5.

The carrier 1 is formed into a long strip or a long plate shape by a single or multi-layered glass fiber material, and has a top surface 11, a bottom surface 12 and two end surfaces 13 thereon.

The radiator 2 is composed of a spiral radiator 21 and a beam radiator 22 electrically connected to the spiral radiator 21. The spiral radiator 21 is composed of a plurality of metal segments 211 and a plurality of conductive pillars 212 extending through the carrier 1. The metal segments 211 are respectively disposed on the top surface 11 and the bottom surface 12 of the carrier 1, and the conductive pillars 212 are penetrated. The carrier 1 is electrically connected to the end portions of the metal wire segments 211 provided on the top surface 11 and the bottom surface 12 of the carrier 1 to be coupled to the spiral radiator 21 . The braid 22 is connected by a plurality of metal segments 221 and is disposed on the top surface 11 of the carrier 1. The metal segment 221 of the braid 22 and the metal segment 211 of the spiral radiator 21 Electrical connection.

The electrode 3 is composed of a first electrode 31 and a second electrode 32. The first electrode 31 and the second electrode 32 are respectively disposed on the two end faces 13 of the carrier 1 and a portion of the top surface 11 and the bottom surface 12 of the carrier 1. And electrically connected to the spiral radiator 21 and the radial radiator 22, the first electrode 31 and the second electrode 32 are electrically connected to the substrate of the wafer antenna 10 (not shown) The display of a monopole antenna can be used for communication of mobile electronic devices.

The insulating layer 4 is disposed on the top surface 11 and the bottom surface 12 of the carrier 1 and the radiator 2 to protect the carrier 1 and the radiator 2. In the figure, the insulating layer 4 is green lacquer.

The pattern layer 5 is disposed on the insulating layer 4, and the pattern layer 5 is a company logo pattern, a product model number, and a serial number.

Please refer to the fourth, fifth and sixth figures, which is another schematic diagram of the decomposition, combination and combination of the wafer antenna and the substrate of the present invention. As shown in the figure: the wafer antenna 10 is electrically connected to a The substrate 20 having the clearance area is described.

The front surface of the substrate 20 has a first grounding metal layer 201, a signal extending metal layer 202 and a first hollow portion 203. One side of the first hollow portion 203 extends with a second hollow portion 204. The first hollow portion The 203 and the second hollow portion 204 have a signal feed line 205 thereon. The back surface of the substrate 20 has a second ground metal layer 206 and a third hollow portion 207. The third hollow portion 207 corresponds to the first hollow portion 203 on the front surface of the substrate 20, and the third hollow portion 207 forms a first hollow portion 207. Clearance area.

When the chip antenna 10 is electrically connected to the substrate 20, the first electrode 31 and the second electrode 32 of the electrode 3 of the chip antenna 10 are electrically connected to the signal extension metal layer 202 and the signal feed line 205. The other end of the signal feeding line 205 is electrically connected to a coaxial cable (not shown). When the antenna receives a signal or transmits a signal, the coaxial cable transmits the signal to the signal feeding line 205, or The signal feed line 205 transmits a signal to the coaxial cable to achieve signal transmission and reception.

Please refer to the seventh figure, which is a schematic diagram of the antenna reflection coefficient curve measured by the chip antenna electrically connected to the substrate. as the picture shows:

When the m1 frequency is at 2.2665 GHz, it is -6.5988 dB.

When the m2 frequency is at 5.3089 GHz, it is -8.4880 dB.

Please refer to the eighth figure, which is a schematic diagram of the antenna reflection coefficient curve measured by electrically connecting the wafer antenna of the present invention to the substrate. as the picture shows:

When the m1 frequency is at 2.3876 GHz, it is -6.3776 dB.

When the m2 frequency is at 5.5939 GHz, it is -8.7311 dB.

Please refer to the ninth figure, which is measured by electrically connecting the wafer antenna of the present invention to the substrate. The schematic diagram of the antenna reflection coefficient curve is three. as the picture shows:

When the m1 frequency is at 2.5016 GHZ, it is -6.4142 dB.

When the m2 frequency is -9.2754dB at 5.6224GHZ.

Please refer to the tenth figure, which is a schematic diagram of the antenna reflection coefficient curve measured by the chip antenna of the present invention being electrically connected to the substrate. as the picture shows:

When the m1 frequency is 2.6370 GHz, it is -6.5900 dB.

When the m2 frequency is at -5.986 GHz, it is -10.9856 dB.

Please refer to the eleventh figure, which is a schematic diagram of the reflection coefficient curve of the antenna measured by the chip antenna of the present invention electrically connected to the substrate. as the picture shows:

When the m1 frequency is 6.7937 GHz, it is -6.7283 dB.

When the m2 frequency is at 6.0000 GHz, it is -9.2765 dB.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent.

10‧‧‧Watt antenna

1‧‧‧ Carrier

11‧‧‧ top surface

12‧‧‧ bottom

13‧‧‧ end face

2‧‧‧ radiator

21‧‧‧Spiral radiator

211‧‧‧Metal segments

212‧‧‧conductive column

22‧‧‧Shape radiator

221‧‧‧Metal segments

3‧‧‧Electrode

31‧‧‧First electrode

32‧‧‧second electrode

4‧‧‧Insulation

5‧‧‧pattern layer

Claims (14)

A wafer antenna structure improvement comprising: a carrier, a glass fiber material having a top surface, a bottom surface and two end surfaces; a radiator comprising a spiral radiator and a beam radiator The spiral radiation system is disposed on the top surface and the bottom surface of the carrier through the carrier, and the radial radiator is disposed on the top surface of the carrier and electrically connected to the spiral radiator; an electrode is disposed on the carrier The top surface and the top surface of the second end surface and the portion are electrically connected to the spiral radiator and the radial radiator. The wafer antenna structure according to claim 1, wherein the carrier is made of a single layer of glass fiber material in the form of a strip or a long plate. The wafer antenna structure as described in claim 2, wherein the carrier is made of a plurality of layers of glass fiber material in the form of a strip or a long plate. The improved structure of the wafer antenna according to claim 3, wherein the spiral radiation system is composed of a plurality of metal line segments and a plurality of conductive columns penetrating the carrier, wherein the metal wire segments are respectively disposed on a top surface of the carrier and the On the bottom surface, the conductive pillars are electrically connected to the ends of the metal line segments respectively disposed on the top surface and the bottom surface of the carrier to be connected to form a spiral radiator. The improved structure of the wafer antenna according to claim 4, wherein the braided radiation system is formed by connecting a plurality of metal segments and is disposed on a top surface of the carrier, and the metal segments of the braided radiator The metal wire segments of the spiral radiator are electrically connected. The wafer antenna structure improvement according to claim 5, wherein the electrode The first electrode and the second electrode are respectively disposed on the top surface and the bottom surface of the two end faces and portions of the carrier, and the spiral radiator and the cymbal The braided radiator is electrically connected. The improved structure of the wafer antenna according to the sixth aspect of the invention, further comprising a substrate having a first ground metal layer, a signal extension metal layer and a first hollow portion on the front surface of the substrate, the first A second hollow portion extends from one side of the hollow portion, and the first hollow portion and the second hollow portion have a signal feeding line thereon. The improved structure of the wafer antenna according to claim 7, wherein the first electrode and the second electrode of the electrode of the wafer antenna are electrically connected to the signal extension metal layer and one end of the signal feed line. The improved structure of the wafer antenna according to claim 8 is characterized in that the other end of the signal feeding line is electrically connected to a coaxial cable. The improved structure of the wafer antenna according to claim 9, wherein the back surface of the substrate has a second ground metal layer and a third hollow portion, and the third hollow portion corresponds to the first hollow portion of the front surface of the substrate. And forming a clearance area with the third hollow portion. The wafer antenna structure improvement according to claim 10, further comprising an insulating layer disposed on the top surface, the bottom surface of the carrier and the radiator. The wafer antenna structure improvement according to claim 11, wherein the insulating layer is green lacquer. The wafer antenna structure improvement according to claim 12, further comprising a pattern layer. The improved structure of the wafer antenna according to claim 13 is characterized in that the pattern layer is a company logo pattern, a product model number, and a serial number.