TWI509873B - Package structure with antenna and the fabrication method thereof - Google Patents

Description

Package structure with antenna and manufacturing method thereof

The present invention relates to a method of fabricating an antenna, and more particularly to a method of fabricating an antenna on a package and a structure thereof.

Due to advances in technology, various high-tech electronic products have been developed to facilitate people's lives, including various electronic devices such as notebook computers, mobile phones, and personal digital assistants (PDAs). With the popularity of these high-tech electronic products and the increasing demand of people, in addition to the significant increase in the functions and applications deployed in these high-tech products, especially in order to meet the needs of people moving, the function of wireless communication has been increased. . Therefore, people can use these high-tech electronic products anywhere or at any time through these high-tech electronic devices with wireless communication capabilities. This greatly increases the flexibility and convenience of the use of these high-tech electronic products. Therefore, people no longer have to be confined to a fixed area, breaking the boundaries of use, making the application of these electronic products really convenient. people's lives.

In general, conventional antennas generally include a Dipole Antenna, a Monopole Antenna, a Patch Antenna, a Planar Inverted-F Antenna, and a Meandering Antenna (Meander). Line Antenna), Inverted-L Antenna, Loop Antenna, Spiral Antenna, and Spring Antenna. It is customary to fabricate the antenna directly on the surface of the board, which would allow the antenna to occupy an additional board area. For various electronic devices, the use of a larger circuit board represents a larger volume of electronic devices. However, the main purpose of the design and development of these electronic devices is to enable users to carry them. Therefore, how to reduce the area of the circuit board occupied by the antennas will be a problem that these electronic devices need to overcome.

The invention provides a method and a structure for fabricating an antenna on a surface of a package, so as to reduce the area of the substrate, reduce the design and manufacturing cost, and the like.

The invention provides a method and a structure for simultaneously fabricating an antenna and an electromagnetic shielding layer on a surface of a package, so as to reduce the area of the substrate, reduce the design and manufacturing cost, and the like.

The invention provides an antenna pattern and an electromagnetic shielding layer formed on a surface of a package body to reduce the area of the substrate, reduce the design and manufacturing cost, and the like.

The present invention provides a method for fabricating a package structure having an antenna, comprising: forming a circuit pattern and an IC chip on the substrate, and the IC chip is electrically connected to the circuit pattern; covering a package body on the substrate to The circuit pattern and the IC chip are coated; and an antenna pattern is formed on the package body, and the antenna pattern is electrically connected to the circuit pattern by using a first through hole penetrating the package body.

The present invention provides a package structure having an antenna, comprising: a substrate; a circuit pattern disposed on the surface of the substrate; an IC chip disposed on the substrate and electrically connected to the circuit pattern; a package disposed on the substrate On the substrate, and covering the circuit pattern and the IC chip, the package has a first through hole; and an antenna pattern is disposed on the surface of the package, and electrically connected to the circuit pattern through the first through hole .

The inventor of the present invention has proposed the inventive concept of the present invention. The mechanism of the present invention is completely different from the known technology, and provides a method and structure for fabricating an antenna on the surface of the package to promote industrial upgrading.

The above summary, the following detailed description and the annexed drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings.

1A and 1B are a cross-sectional view and a top view of an antenna structure according to a first embodiment of the present invention.

As shown in the first A picture and the first B picture. A circuit pattern 18 is formed on the surface of a substrate 10, and at least one IC chip 11 is electrically connected to the circuit pattern 18 through a solder ball array (BGA) or other packaging method to achieve one. Predetermined circuit function. A chip 12 is overlaid on the IC chip 11, the circuit pattern 18, and the substrate 10 to cover the IC chip 11 and the circuit pattern 18 to prevent the IC chip 11 and the circuit pattern 18 from being affected by the external environment. The substrate 10 can be a standard FR4 fiberglass board or other kinds of circuit boards; the IC chip 11 can be a communication IC chip or other kinds of IC chips; the package 12 can be filled with germanium filler, epoxy resin and others. The main function of the additive packaging material is to protect the IC chip 11 and the circuit pattern 18 from external environmental influences such as moisture or damage of hard objects.

According to the first embodiment of the present invention, the package body 12 covers the IC chip 11 and the circuit pattern 18, and two through holes 14 (first through holes) 15 are formed at predetermined positions of the package body 12 to expose the circuit pattern 18. One of the high frequency circuits is an antenna signal end point and a ground terminal. A layer of conductive metal 13 is further plated on the surface of the package 12, which can be achieved by sputtering or other coating methods, and the conductive metal layer 13 can be gold, silver, copper, aluminum, titanium and alloys thereof. Other conductive materials. The shape of the antenna pattern 16 and the grounding plane 17 is formed on the conductive metal layer 13 by means of a laser engraving machine or a conventional yellow light process and an etching process. Finally, the through holes 14 and 15 are filled by means of coating to connect the feed end of the antenna signal of the antenna pattern 16 with the antenna signal end of the circuit pattern 18, and ground the ground plane 17 and the circuit pattern 18. The terminal connection is such that the package structure having the antenna 1 of the first embodiment of the present invention is completed, wherein the antenna 1 includes the antenna pattern 16 and the ground plane 17.

According to the present invention, the structure of the antenna 1 can be applied to applications such as WiFi (2.4 GHz or 5 GHz). The antenna signal of the high frequency circuit of the circuit pattern 18 can be transmitted to the antenna signal feed end of the antenna pattern 16 through the antenna signal end point of the circuit pattern 18, so that the antenna signal can be transmitted or received by the structure of the antenna 1.

In the present embodiment, the antenna 1 is formed on the side of the IC wafer 11, and does not overlap the IC wafer 11. Thereby, the antenna 1 can be overlapped with a part of the circuit pattern 18 to reduce the area occupied by the antenna 1 by the additional substrate 10, thereby reducing the design and manufacturing cost. Moreover, in this embodiment, the antenna pattern 16 and the ground plane 17 of the antenna 1 are respectively connected to the antenna signal end point and the ground end point of the circuit pattern 18 by using the two through holes 14 and 15 penetrating the package body 12, so that Avoiding the wires from the outside of the package 12 to connect the antenna 1 and the circuit pattern 18 can prevent the circuit pattern 18 and the wires from being exposed to the outside of the package 12, thereby protecting the circuit pattern 18 and further reducing the occupation of the substrate 1 by the antenna 1. area.

Further, in the present invention, the shape of the antenna pattern 16 and the ground plane 17 can be directly formed on the conductive metal layer 13 by means of a laser engraving machine. The laser engraving machine can accurately engrave the size of the antenna pattern 16, but does not affect the state of the package 12, whereby the structure of forming an antenna 1 on the surface of the package 12 can be realized.

2A and 2B are a cross-sectional view and a top view of an antenna structure according to a second embodiment of the present invention.

As shown in FIG. 2A and FIG. 2B, the difference between the first A and the first B is that an electromagnetic shielding layer 21 is formed on the surface of the package 12 above the IC wafer 11, and is completely The IC chip 11 is shielded. Since the IC chip 11 usually generates large electromagnetic wave interference, the conductive metal layer 13 can be formed by using the above-mentioned conductive metal layer 13 by using a laser engraving machine or a conventional yellow light process and an etching process. The structure of the antenna 1 and the electromagnetic shielding layer 21 are taken out. That is, the antenna 1 and the electromagnetic shielding layer 21 are simultaneously formed on the surface of the package 12, and are located at the side positions and the upper positions of the IC wafer 11, respectively, and do not overlap each other. And as described above, a through hole 22 (second perforation) can be formed and the plating film can be electrically connected to the ground end of the circuit pattern 18 to achieve the function of shielding electromagnetic waves.

Thereby, an electromagnetic shielding layer 21 is formed on the surface of the package body 12, the IC wafer 11 is completely shielded to reduce electromagnetic wave interference, and an antenna 1 is simultaneously generated on the side of the IC wafer 11 to achieve the purpose of transmitting/receiving the antenna signal. . By integrating the electromagnetic shielding layer 21 and the antenna 1, the use area of the substrate 10 can be reduced, and the design and manufacturing cost can be reduced. And through the through holes 14, 15, 22, respectively, the antenna pattern 16 of the antenna 1 and the ground plane 17 and the electromagnetic shielding layer 21 are connected to the antenna signal end point and the ground end point of the circuit pattern 18, so that the package 12 can be avoided. The wires are disposed on the outer side to prevent the circuit pattern 18 and the wires from being exposed to the outside of the package body 12, thereby protecting the circuit pattern 18, and further reducing the area occupied by the antenna 1 and the electromagnetic shielding layer 21 of the substrate 10.

3A and 3B are a cross-sectional view and a top view of the antenna structure according to the third embodiment of the present invention.

As shown in the third A diagram and the third diagram B, the difference from the second diagram is that the electromagnetic shielding layer 31, the insulating layer 32, and the antenna pattern 33 are formed in a laminated structure.

In the embodiment, an electromagnetic shielding layer 31 is formed on the surface of the package 12 to cover the entire IC chip 11 and the circuit pattern 18 on the surface of the substrate 10 to achieve the effect of shielding electromagnetic interference; above the electromagnetic shielding layer 31. The antenna pattern 33 is formed, and the insulating layer 32 is formed between the electromagnetic shielding layer 31 and the antenna pattern 33 by using an insulating material or an encapsulating material. By using the above-mentioned perforation and coating method, two through holes 34 and 35 are formed, so that the antenna signal feeding end point of the antenna pattern 33 is connected to the antenna signal end point of the circuit pattern 18 through the through hole 34 (first through hole), and The electromagnetic shielding layer 31 is connected to the ground terminal of the circuit pattern 18 by a via 35 (second via).

In this embodiment, the electromagnetic shielding layer 31 is completely covered over the IC chip 11 and the circuit pattern 18 to achieve the effect of completely shielding electromagnetic interference, and the electromagnetic shielding layer 31 can be regarded as shown in FIG. With the ground plane 17, the antenna pattern 33 can form an antenna 1 with the electromagnetic shielding layer 31 to achieve the purpose of transmitting/receiving the antenna signal of the antenna 1.

With the above structure, electromagnetic wave interference can be greatly reduced. Further, by forming the antenna pattern 33 over the entire substrate 10, the antenna pattern 33 hardly needs to occupy the area of the additional substrate 10, so that the area occupied by the antenna pattern 33 can be ignored to reduce the area of the entire substrate 10.

According to the embodiment, the antenna signal is transmitted through the antenna signal end point of the circuit pattern 18 to the antenna signal feeding end point of the antenna pattern 33, and the electromagnetic wave shielding layer 31 is also passed through the techniques of the through holes 34, 35 and the coating. The connection to the ground terminal of the circuit pattern 18 prevents the circuit pattern 18 and the wires from being exposed to the outside of the package body 12, thereby protecting the circuit pattern 18, and further reducing the area occupied by the antenna 1 and the electromagnetic shielding layer 31.

However, the above description is only for the purpose of illustration and illustration of the embodiments of the present invention, and is not intended to limit the scope of the invention. Variations or modifications that may be readily conceived within the scope of the invention may be covered by the scope of the invention as defined in the following.

1. . . antenna

10. . . Substrate

11‧‧‧ IC chip

12‧‧‧Package

13‧‧‧ Conductive metal layer

14, 15, 22, 34, 35‧ ‧ piercing

16, 33‧‧‧ antenna pattern

17‧‧‧Grounding Plane

18‧‧‧ circuit pattern

21, 31‧‧ ‧ electromagnetic shielding

32‧‧‧Insulation

1A and 1B are a cross-sectional view and a top view of an antenna structure according to a first embodiment of the present invention.

2A and 2B are a cross-sectional view and a top view of an antenna structure according to a second embodiment of the present invention.

3A and 3B are a cross-sectional view and a top view of the antenna structure according to the third embodiment of the present invention.

1. . . antenna

10. . . Substrate

11. . . IC chip

12. . . Package

14,15. . . perforation

16. . . Antenna pattern

17. . . Grounding Plane

Claims (6)

A method for fabricating a package structure comprising: forming a circuit pattern and an IC chip on a substrate, wherein the IC chip is electrically connected to the circuit pattern; covering a package body on the substrate to pattern the circuit And the IC chip is coated; and an antenna pattern and an electromagnetic shielding layer are simultaneously formed on the surface of the package, and the antenna pattern is electrically connected to the circuit pattern by using a first through hole penetrating the package body; The electromagnetic shielding layer is formed on the IC chip, and the electromagnetic shielding layer is electrically connected to the circuit pattern by a second through hole penetrating the package body, and the antenna pattern is formed on a side of the IC chip. The manufacturing method of claim 1, wherein the step of forming the electromagnetic shielding layer is performed before the step of forming the antenna pattern, and before the step of forming the antenna pattern on the electromagnetic shielding layer An insulating layer is between the electromagnetic shielding layer and the antenna pattern, and the electromagnetic shielding layer and the antenna pattern are formed above the IC wafer. The manufacturing method of claim 1, wherein the electromagnetic shielding layer completely shields the IC wafer. A package structure having an antenna, comprising: a substrate; a circuit pattern disposed on the surface of the substrate; an IC chip disposed on the substrate, and the IC chip and the circuit pattern An electrical connection; a package disposed on the substrate, the package encapsulating the circuit pattern and the IC chip, the package having a first through hole; and an antenna pattern disposed on a surface of the package And the antenna pattern is electrically connected to the circuit pattern through the first through hole; an electromagnetic shielding layer is disposed on the surface of the package body, and the electromagnetic shielding layer uses a second through hole penetrating the one of the package body The circuit pattern is electrically connected; wherein the electromagnetic shielding layer is disposed on the surface of the package together with the antenna pattern, and the electromagnetic shielding layer is disposed above the IC wafer, and the antenna pattern is formed on a side of the IC chip . The package structure of claim 4, further comprising: an insulating layer disposed between the electromagnetic shielding layer and the antenna pattern, and the electromagnetic shielding layer and the antenna pattern are formed above the IC wafer. The package structure of claim 4, wherein the electromagnetic shielding layer completely shields the IC wafer.