TWM349047U - IC package antenna - Google Patents

Description

M349047 • VIII. New Description: [New Technology Field] This work is about an IC Package Antenna, especially an antenna in which an antenna substrate is packaged in an integrated circuit to achieve standardization. Miniaturized antenna. Also considered 'and suitable for surface adhesion technology (SurfaceM_tTechn〇l〇gy, SMT) application. [Prior Art] The antenna is a necessary component for the New Zealand communication. In the miniaturization and f-realization requirements of the imprisoned non-exotic equipment, such as the good antenna structure of the furnace wire, it is the pursuit of the industry. technology. At present, the electronic component wire on the printed circuit board, ^ is the watchmaking_contact completion, which is mainly printed on the printed circuit board with solder paste, and then the surface is attached to the device (^ coffee

After the electronic components of DevIce, SMD are placed in the correct position, the solder paste is melted by (4) (10), and the electric parts are soldered to the printed circuit board. Such a combination of techniques, in terms of conventional antennas, and how to provide an innovative antenna structure to match the application in the window, is the main subject of this creation. [New content] In order to change the problem of the first technology, this creation provides an integrated circuit package antenna (1C Package Antenna), which mainly arranges gold hybrids on the substrate to form an antenna substrate. At least L dots are formed on the substrate; the antenna substrate is encapsulated by the integrated circuit and packaged at the bottom of the package, and the integrated circuit chip is formed. The integrated circuit package has a σ-extension multi-leg from the M349047 P, and the inner end of the towel-pin is soldered to the feed point of the antenna substrate. + The integrated circuit package antenna provided by this creation can meet the standardization and miniaturization of the antenna design. Applied in Surface Adhesion Technology (SurfaceM_tTechn〇i〇gy, smt). ☆ The integrated circuit package antenna provided by this creation can further integrate RF components such as inductors, ferrites, switching components, amplifiers, etc. on the antenna substrate to form a matching circuit with adjustable antenna characteristics or with RF Functional circuit. Into the 'integrated circuit provided by this creation is difficult antenna, in which the metal light-emitting system on the antenna substrate can be sprayed or plated with metal material to form an antenna metal nucleus on the surface of the substrate, such as county spraying After the metal material forms a metal material layer on the outer surface of the substrate, the metal material layer (four) f, m shape is provided in a line shape; or, the antenna pattern is first carved out on the outer surface of the substrate, and then the metal material is electrocuted. In the antenna pattern. In addition, this creation can also be made by attaching a metal patch to the inner surface of the circuit sealing case and then connecting it to the pin. In the following, the structure and features of the present invention will be added in detail in accordance with the embodiments of the drawings. [Embodiment] Please refer to the first to third figures. The integrated circuit package antenna provided by the present invention is mainly composed of an antenna base, an integrated circuit package casing 2 and a package bottom (4). The antenna substrate 1 of the present invention has a metal radiator 1 1 disposed on a substrate 1 2 and a feed point 13 and a short-circuit point 14 formed on the US board 12; see the -A m ^ a / brother A diagram, feed The entry point 3 and the short-circuit point 丄4 may be disposed on the other side of the substrate 丄2 opposite to the metal radiator ,2, and the substrate 6 M349047 12 may be a microwave substrate, a ceramic substrate or a plastic material.

A receiving space 21 is formed inside the integrated circuit package housing 2 to accommodate the antenna substrate I1. A plurality of pins 22 extend from the inside of the outer casing 2 to the outside, and (4) of the two pins 22 are respectively welded to the town point 13 and the short-circuit point 14 of the antenna substrate 1 (refer to the third figure), Pins 2 2 can be fixed pins for support. In addition, the package bottom 3 covers the bottom of the integrated circuit package casing 2 to completely encapsulate the antenna substrate i. The integrated package antenna provided by this creation, the (four) circuit packaging process will be antenna antenna

And an SMD can be formed to suit the SMT _ package antenna Wei _ _ (to hip), this material refurbishment and small i-antenna design requirements, and the fixed position of the pin, the application. For the test, please refer to the fourth figure. The μ 古 顿 四 四 四 四 四 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种In the antenna test loop, the dimensions of the integrated circuit package antenna a are as follows: A1 = 12. 5mm A2 = 18mm A3 = 2. 5mm The size of the ground plane on board B is as follows.

Bl = 107ram B2=40mm 25mm B4 = 17 deleted in the fifth and sixth _ Lin created Wei Yizhen results, the efficiency of the domain is as follows 7 M349047 - Table below: Frequency (MHz) 824 880 960 1710 1880 1990 2170 3D gain (dBi> ; -4.67 -3.27 - -5.81 -3.30 -2.23 -2.44 -4.68 Efficiency % ~ ----- 28.88 43.46 51.03 51.84 60.65 34.03 tk .LU U . 1 κ It can be seen that this creation is a good antenna design. Referring to the seventh figure, the present invention can be integrated with a set of RF circuit components 1 5 ' on the antenna substrate 1 to form an adjustable antenna or a circuit with a radio frequency.

A few of the roads 15 can be capacitors, inductors, filters, switchboards, and amplifiers. ·Inch financial frequency 7L Incoming, this _ can be designed on the celestial board i (four) antenna structure, such as _ multi-layer board to design different antenna frequency bands in different layers, and can achieve an integrated circuit package antenna has a different Working frequency. As shown in the eighth figure, the integrated circuit package antenna has multiple connections 1 to 2 212, which provide different operation in different frequency bands. For example: pin 2 2 0 1 is (WLAN) pin 2 2 0 2 is (BT) pin 2 2 0 3 is fixed pin pin 2 2 0 4 is fixed pin pin 2 2 0 5 is ( WIMAX) Pin 2 2 0 6 is (UWB) Pin 2 2 0 7 is (GSM/DCS/PCS/WCDMA) Pin 2 2 0 8 is (DCS/PCS) Pin 2 2 0 9 is fixed pin 8 M349047 - Pin 2210 is a fixed pin pin 2 2 1 1 is (WCDMA) pin 2 2 1 2 is (GPS) Into the 'integrated circuit package antenna provided by this creation, its towel antenna substrate The metal light-emitting body 1 1 process can be formed by spraying or Wei metal material on the outer surface of the substrate - an antenna metal illuminator. For example, after spraying a metal material on the outer surface of the substrate to form a metal material layer, the metal material layer is cut to form an antenna shape; or the laser is first formed on the substrate surface, and the green color is The gold riding material is electroplated in the antenna pattern. According to this process, the metal radiant body can be formed on the inner surface of the integrated circuit package casing 2, see ninth W, the integrated circuit package casing 2 and the package bottom 3 are the same as the previous embodiment. The radiator 11 is not disposed on the circuit substrate 4, but is known to be etched or plated with a metal material on the surface of the battery. The metal Koda field 11 has at least a feed point i 3 which is disconnected from one of the contacts 2 of the integrated circuit package casing 2. In this configuration, a housing space 21 is formed inside the integrated circuit package casing 2 to accommodate the circuit board 4. The feed point 13 of the metal light projecting body 11 can be designed to be connected to the circuit substrate 4 and to be connected to the pin 2 2 therein. In addition, the metal radiator work can also be first placed on the inner core of the outer casing 2 (four), and then the metal material is electro-mineralized in the antenna pattern, which is a simple change design of the creation. Another structure created by the 7F in the ninth figure can also be used to standardize and miniaturize the effects of antenna design. [Simple description of the diagram] 9 M349047 The first diagram represents the exploded view of the creation, the first diagram A represents the top view of the antenna substrate of the creation, the first diagram represents the combination diagram of the creation, and the second diagram represents the cross-sectional view of the creation. The fourth picture represents the real environment of the creation of the creation, the fifth picture represents the antenna VSWR test results of the embodiment of the creation, the eighth picture represents the antenna sample test results of the embodiment of the creation, a represents another creation of the creation An external view of an antenna substrate according to an embodiment, wherein a matching circuit formed by a radiating element-adjustable antenna impedance characteristic is disposed on the antenna substrate

The multi-pin is applied to different operating frequency bands, and the eighth figure represents the implementation of the multi-pin in the present drawing. The ninth figure represents the exploded view of the other embodiment of the present invention. [Main component symbol description] Antenna substrate 1 Metal radiator 1丄Substrate 1 2 Feeding point 1 3 Short circuit point 1 4 RF circuit component 15 Integrated circuit package housing 2 Housing space 21 Pin 22, 22〇1~2212 Package bottom 3 10 M349047

. Integrated circuit package antenna A

Al = 12. 5mm A2 = 18ram A3 = 2. 5mm Board B

Bl = 107mm B2 = 40mm B3=25mm • B4 = 17mm circuit board 4

Claims (1)

M349047. Nine, the scope of application for patents: 1. An integrated circuit package antenna, comprising: - an antenna substrate - a metal radiator is arranged on the substrate, and at least one feed point is formed on the wire plate; - an integrated circuit Package housing, (4) shaft - receiving space to accommodate the antenna substrate, and a little external view from inside - there are mosquito feet; the inner end of the towel - the foot is welded with the feeding point of the antenna substrate; and - the bottom of the package is ' Cover the bottom of the oblique shell of the bribe (10) The Tianxian board is completely encapsulated. The integrated circuit package antenna described in the first item of the scope of the invention is characterized in that the substrate is selected from the group consisting of a microwave substrate, a ceramic substrate and a plastic material. 3. According to φ, please generalize the integrated circuit package antenna, and integrate a set of RF circuit components on the towel antenna substrate to form a matching circuit that can adjust the impedance characteristics of the antenna. 4. According to the integrated circuit package antenna described in the third item of the patent, the RF circuit component of the towel can be selected from the group consisting of a capacitor, an inductor, a filter, a switching element, and an amplifier. 5 The integrated circuit package antenna according to claim 1, wherein the antenna substrate is provided with more than 50 antenna structures, and the feed point of each antenna structure and other multiples of the integrated circuit package outer casing Pins provide different operations for different frequency bands. 6. The integrated circuit package antenna according to claim 5, wherein the 12 M349047 design antenna structure on the antenna substrate is a multi-layer board to design different antenna frequency bands in different layers. 7. The integrated circuit package antenna according to claim 1, wherein the antenna substrate has a short circuit point, and the inner end of the other pin of the integrated circuit package outer casing is soldered to the short circuit point of the antenna substrate. . 8 · According to the t-item _ ! item of the integrated circuit package antenna, the metal light projecting body of the t-antenna substrate is formed by forming a metal material layer on the outer surface of the wire plate, and then the metal material layer Cut to form an antenna shape. - According to the injection (5), the integrated circuit package antenna described in the article, the gold s, the system of the technical substrate, the antenna pattern is first laser-extended on the surface of the substrate, and then the metal material is electroscoped on the antenna. In the graphics. 1〇· An integrated circuit package antenna includes: an integrated circuit package housing having a plurality of pins extending from the inside to the outside; to, and 2, the body of the body is molded inside the package of the integrated circuit package The metal radiant=having-feeding point is connected to the inner end of one of the integrated circuit package casings; and the bottom of the package is covered at the bottom of the integrated circuit package to be completely packaged . Circuit-packaged antenna, in which the metal radiant garment is covered by the first layer of the first item described in item 1 Q. 13 M349047 material layer system is first sprayed with gold powder on the inner surface of the integrated circuit package casing - metal after ' The layer of remineralized metal material is shaped by a butterfly shape. i 3 . According to the age of the patent range! The integrated circuit package antenna according to Item Q, wherein the metal light-emitting body first engraves the antenna pattern on the outer surface of the integrated circuit package outer casing, and then electroplates the metal material into the antenna pattern. 14