TWM470397U - Wireless signal transceiver module (II) - Google Patents
Wireless signal transceiver module (II) Download PDFInfo
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- TWM470397U TWM470397U TW102212129U TW102212129U TWM470397U TW M470397 U TWM470397 U TW M470397U TW 102212129 U TW102212129 U TW 102212129U TW 102212129 U TW102212129 U TW 102212129U TW M470397 U TWM470397 U TW M470397U
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Description
本創作係有關一種天線，尤指一種用於IEEE802.11a/b/g/n/ac(2.4~2.5
GHz& 5.15~5.85GHZ
)頻段的無線信號收發模組。This creation is related to an antenna, especially one used for IEEE802.11a/b/g/n/ac (2.4~2.5).
Wireless signal transceiver module in GHz & 5.15~5.85GH Z ) frequency band.
已知，目前的個人攜帶式電子裝置，如智慧型手機、平板電腦、筆記型電腦、個人行動助理裝置、數位音樂播放器及導航裝置等裝置中，都具備有無線區域網路天線(wifi或藍芽)、GPS及FM天線，以提供使用者在有架設無線基地台的公共場所、公司或家裡，可以透過無線區域網路天線連結無線基地台上網際網路使用或傳送資料，導航或者利用FM天線來接收調頻廣播節目。It is known that current personal portable electronic devices, such as smart phones, tablets, notebook computers, personal mobile assistant devices, digital music players and navigation devices, have wireless local area network antennas (wifi or Bluetooth, GPS and FM antennas to provide users with access to wireless base station Internet access or data transmission, navigation or use in public places, companies or homes with wireless base stations The FM antenna receives the FM radio program.
由於攜帶式電子裝置上所使用的無線區域網路天線、GPS及FM天線都是屬於單一個體或者與其他天線整合在一起設計，這些天線都具有一既定的體積下，若要將無線區域網路天線及FM天線安裝於攜帶式電子裝置內部時，將會占去攜帶式電子裝置內部的安裝空間，造成攜帶式電子裝置的外觀形狀無法縮小。
Since the wireless area network antennas, GPS and FM antennas used in the portable electronic devices are all single entities or integrated with other antennas, these antennas have a given volume, and the wireless local area network is required. When the antenna and the FM antenna are installed inside the portable electronic device, the installation space inside the portable electronic device will be occupied, and the appearance shape of the portable electronic device cannot be reduced.
目前有許多攜帶式電子裝置都朝輕薄短小的外觀設計時，都會將各種不同頻段的天線整合在一起，以形成一支多頻天線或寬頻天線，此種多頻天線或寬頻天線在安裝於一個攜帶式電子裝置內部時，雖然不會占去攜帶式電子裝置內部空間，但是多頻天線或寬頻天線上具有多個信號饋入端，每一個信號饋入端都要電性連結一條同軸電纜線，如此一來，同軸電纜線的數量一多，將會造成該攜帶式電子裝置內部配線游走的困難，也會影響到內部電子零件散熱問題，而導致攜帶式電子裝置、天線安裝上的困難。
At present, many portable electronic devices are designed to be light, thin and short, and the antennas of different frequency bands are integrated to form a multi-frequency antenna or a broadband antenna. The multi-frequency antenna or broadband antenna is installed in one. When the internal part of the portable electronic device does not occupy the internal space of the portable electronic device, the multi-frequency antenna or the broadband antenna has a plurality of signal feeding ends, and each signal feeding end is electrically connected to a coaxial cable. As a result, the number of coaxial cables is too large, which will cause difficulties in the internal wiring of the portable electronic device, and will also affect the heat dissipation of internal electronic components, resulting in difficulties in the installation of portable electronic devices and antennas. .
因此，本創作之主要目的，在於解決傳統的缺失，本創作將不同頻段的天線整合後，在不同頻段的天線使用時，共用一只信號饋入線段，讓天線在安裝及配線上更加容易簡單。而且以二輻射體之間的耦合關係來控制不同頻段，而達到預定的目標阻抗、共振頻率、頻寬與輻射效應，且可有效縮小天線尺寸。Therefore, the main purpose of this creation is to solve the traditional lack. This design integrates the antennas of different frequency bands, and when a different frequency band antenna is used, it shares a signal feeding line segment, making the antenna easier to install and wire. . Moreover, the different frequency bands are controlled by the coupling relationship between the two radiators, and the predetermined target impedance, resonance frequency, bandwidth and radiation effect are achieved, and the antenna size can be effectively reduced.
為達上述之目的，本創作提供一種無線信號收發模組(一)，包含：
For the above purposes, the present invention provides a wireless signal transceiving module (1) comprising:
一晶片天線，包括：
A wafer antenna comprising:
一玻璃纖維板，其上至少具有一頂面、一底面及二側面；
a fiberglass board having at least one top surface, one bottom surface and two side surfaces thereon;
一第一輻射體，係設於該玻璃纖維板的左側內部，該第一輻射體上具有一第一端部及一第二端部；
a first radiator is disposed on a left inner side of the fiberglass board, the first radiator has a first end portion and a second end portion;
一第二輻射體，係設於該玻璃纖維板右側內部並位於該第一輻射體上方且近鄰該玻璃纖維板的頂面，該第一輻射體與該第二輻射體呈平行重疊的耦合關係，該第二輻射體上具有一第三端部及一第四端部；
a second radiator is disposed inside the right side of the fiberglass board and located above the first radiator and adjacent to a top surface of the fiberglass board, and the first radiator and the second radiator are in a parallel overlapping coupling relationship. The second radiator has a third end portion and a fourth end portion;
一電連接部，係與該第一輻射體及該第二輻射體電性連結；
An electrical connection portion electrically connected to the first radiator and the second radiator;
一電極部，設於該玻璃纖維板的底面上與該電連接部電性連結；
An electrode portion is electrically connected to the electrical connection portion on a bottom surface of the fiberglass board;
一電路板，其正面上具有一接地金屬層及一第一鏤空部，該第一鏤空部的一側延伸有一第二鏤空部，該第一鏤空部上具有一與該電極部電性連結的第一接點，該第一接點相鄰有一與該電極部電性連結的且延伸於該第二鏤空部中的信號饋入線段，另於該信號饋入線段相鄰有一與該電極部及該接地金屬層電性連結的第二接點。
a circuit board having a grounded metal layer and a first hollow portion on a front surface thereof, and a second hollow portion extending from a side of the first hollow portion, the first hollow portion having an electrical connection with the electrode portion a first contact, the first contact adjacent to a signal feeding line segment electrically connected to the electrode portion and extending in the second hollow portion, and the signal feeding portion adjacent to the electrode portion and the signal portion A second junction electrically connected to the ground metal layer.
其中，該玻璃纖維板為多層的玻璃纖維板組成的長方形。
Wherein, the fiberglass board is a rectangle composed of a plurality of layers of fiberglass sheets.
其中，該第一輻射體及該第二輻射體為片狀體的金屬材質。
The first radiator and the second radiator are metal materials of a sheet body.
其中，該第一輻射體與該第二輻射體的部份平行重疊耦合，使該第二輻射體的第三端部與該第一輻射體的第一端部呈反方向設置。
The first radiator and the portion of the second radiator are coupled in parallel so that the third end of the second radiator is disposed opposite to the first end of the first radiator.
其中，該第一輻射體及該第二輻射體的平行重疊的耦合關係以耦合面積及耦合距離來控制或調整頻率高低。
The parallel overlapping coupling relationship between the first radiator and the second radiator controls or adjusts the frequency according to the coupling area and the coupling distance.
其中，該電極部包含一第一電極部、一第二電極部及一第三電極部，該第一電極部該第一接點電性連結，該第二電極部與該信號饋入線段電性連結，該第三電極部與該第二接點電性連結，供晶片天線可以表面黏著在該電路板上。
The electrode portion includes a first electrode portion, a second electrode portion and a third electrode portion. The first electrode portion electrically connects the first contact portion, and the second electrode portion and the signal feed line segment are electrically connected. The third electrode portion is electrically connected to the second contact portion, so that the chip antenna can be surface-attached to the circuit board.
其中，該電連接部，包含有一第一電連接部、一第二電連接部及一第三電連接部；該第一電連接部及該第二電連接部電性連結該第一輻射體及該第一電極部及該第二電極部，該第三電連接部電性連結該第二輻射體與該第三電極部。
The electrical connection portion includes a first electrical connection portion, a second electrical connection portion, and a third electrical connection portion. The first electrical connection portion and the second electrical connection portion are electrically connected to the first radiator. And the first electrode portion and the second electrode portion, the third electrical connection portion electrically connecting the second radiator and the third electrode portion.
其中，更包含有一圖案層，係設於該玻璃纖維板的頂面上，該圖案層為型號、公司商標圖案。
Wherein, a pattern layer is further disposed on the top surface of the fiberglass board, and the pattern layer is a model number and a company logo pattern.
其中，該信號饋入線段具有延伸於該第二鏤空部的一第一金屬線段及一第二金屬線段，該第一金屬線段及該第二金屬線段之間的間距形成一第一匹配電路。
The signal feeding line segment has a first metal line segment and a second metal line segment extending from the second hollow portion, and a spacing between the first metal line segment and the second metal line segment forms a first matching circuit.
其中，該信號饋入線段的第二金屬線段電性連結有一同軸電纜線。
The second metal line segment of the signal feeding line segment is electrically connected to a coaxial cable.
10‧‧‧晶片天線
1‧‧‧玻璃纖維板
11‧‧‧頂面
12‧‧‧底面
13‧‧‧側面
2‧‧‧第一輻射體
21‧‧‧第一端部
22‧‧‧第二端部
3‧‧‧第二輻射體
31‧‧‧第三端部
32‧‧‧第四端部
4‧‧‧電極部
41‧‧‧第一電極部
42‧‧‧第二電極部
43‧‧‧第三電極部
5‧‧‧電連接部
51‧‧‧第一電連接部
52‧‧‧第二電連接部
53‧‧‧第三電連接部
6‧‧‧圖案層
7‧‧‧電路板
71‧‧‧接地金屬層
72‧‧‧第一鏤空部
73‧‧‧第二鏤空部
74‧‧‧第一接點
75‧‧‧信號饋入線段
751‧‧‧第一金屬線段
752‧‧‧第二金屬線段
76‧‧‧匹配電路
761‧‧‧間距
77‧‧‧第二接點10‧‧‧Watt antenna
1‧‧‧glass fiberboard
11‧‧‧ top surface
12‧‧‧ bottom
13‧‧‧ side
2‧‧‧First radiator
21‧‧‧ first end
22‧‧‧ second end
3‧‧‧Second radiator
31‧‧‧ third end
32‧‧‧ fourth end
4‧‧‧Electrode
41‧‧‧First electrode section
42‧‧‧Second electrode section
43‧‧‧ third electrode
5‧‧‧Electrical connection
51‧‧‧First electrical connection
52‧‧‧Second electrical connection
53‧‧‧ Third electrical connection
6‧‧‧pattern layer
7‧‧‧ boards
71‧‧‧Grounded metal layer
72‧‧‧The first time department
73‧‧‧Second Hollow Department
74‧‧‧First contact
75‧‧‧Signal feed line segment
751‧‧‧First metal line segment
752‧‧‧Second metal line segment
76‧‧‧Matching circuit
761‧‧‧ spacing
77‧‧‧second junction
第一圖，係本創作之無線信號收發模組的晶片天線外觀立體示意圖。The first figure is a stereoscopic view of the appearance of the chip antenna of the wireless signal transceiver module of the present invention.
第二圖，係第一圖的側剖示意圖。
The second figure is a side cross-sectional view of the first figure.
第三圖，係本創作之電路板正面示意圖。
The third picture is a front view of the circuit board of the present creation.
第四圖，係本創作之電路板與晶片天線組合示意圖。
The fourth picture is a schematic diagram of the combination of the circuit board and the chip antenna of the present invention.
第五圖，係本創作之局部放大示意圖。
The fifth picture is a partial enlarged view of the creation.
第六圖，係本創作之2.45GHZ 與5GHZ 的無線信號收發模組的在晶片天線的信號饋入線端無接地狀態下的反射功率比值曲線示意圖。FIG Sixth, the present system and the creation of 2.45GH Z 5GH Z is a schematic view of a wireless signal transceiver module curves at the ratio of the reflected power signal feeding the antenna wire ends wafer without a ground state.
第七圖，係本創作之2.45GHZ
與5GHZ
的無線信號收發模組的在晶片天線的信號饋入線段無接地狀態下及信號饋入線段上具耦合電容的反射功率比值曲線示意圖。
FIG. Seventh, the present schematic view showing Creation 2.45GH Z 5GH Z with the wireless transceiver module in a non-grounded state signal feeding line of the chip antenna and the coupling capacitance with the signal feed line segment ratio of the reflected power curve.
茲有關本創作之技術內容及詳細說明，現配合圖式說明如下：The technical content and detailed description of this creation are as follows:
請參閱第一、二圖，係本創作之無線信號收發模組的晶片天線外觀立體及第一圖的側剖示意圖。如圖所示：本創作之無線信號收發模組(一)的晶片天線10，包括：一玻璃纖維板(Polyester boards)1、一第一輻射體2、一第二輻射體3、一電極部4、一電連接部5及一圖案層6。
Please refer to the first and second figures, which are the three-dimensional appearance of the wafer antenna of the wireless signal transceiver module of the present invention and a side cross-sectional view of the first figure. As shown in the figure, the chip antenna 10 of the wireless signal transceiver module (1) of the present invention comprises: a fiberglass board 1, a first radiator 2, a second radiator 3, and an electrode portion 4. An electrical connection portion 5 and a pattern layer 6.
該玻璃纖維板1，係由多層的電路板組成長方形，其上至少具有一頂面11、一底面12及二側面13。
The fiberglass board 1 is composed of a plurality of circuit boards and has a rectangular shape with at least one top surface 11, one bottom surface 12 and two side surfaces 13.
該第一輻射體2，為金屬材質製成片狀體，係設於該玻璃纖維板1的左側內部，該第一輻射體2上具有一第一端部21及一第二端部22。
The first radiator 2 is made of a metal material and is disposed on the left side of the fiberglass panel 1. The first radiator 2 has a first end portion 21 and a second end portion 22.
該第二輻射體3，為金屬材質製成片狀體，係設於該玻璃纖維板1右側內部並位於該第一輻射體2上方且近鄰該玻璃纖維板1的頂面11。該第二輻射體3上具有一第三端部31及一第四端部32。該第一輻射體2與該第二輻射體3部份呈平行重疊的耦合關係，使該第二輻射體3的第三端部31與該第一輻射體2的第一端部21呈反方向。
The second radiator 3 is made of a metal material and is disposed inside the right side of the fiberglass board 1 and above the first radiator 2 and adjacent to the top surface 11 of the fiberglass board 1. The second radiator 3 has a third end portion 31 and a fourth end portion 32. The first radiator 2 and the second radiator 3 are in a parallel overlapping relationship, such that the third end 31 of the second radiator 3 is opposite to the first end 21 of the first radiator 2 direction.
該電極部4，為金屬材質，係設於該玻璃纖維板1的底面12，該電極部4包含一第一電極部41、一第二電極部42及一第三電極部43。該第一電極部41、第二電極部42及該第三電極部43供晶片天線10可以表面黏著在電路板(圖中未示)上。
The electrode portion 4 is made of a metal material and is provided on the bottom surface 12 of the fiberglass board 1. The electrode portion 4 includes a first electrode portion 41, a second electrode portion 42, and a third electrode portion 43. The first electrode portion 41, the second electrode portion 42, and the third electrode portion 43 allow the wafer antenna 10 to be surface-attached to a circuit board (not shown).
該電連接部5，為金屬材質，且設於該玻璃纖維板1內部，該電連接部5包含有一第一電連接部51、一第二電連接部52及一第三電連接部53。該第一電連接部51及該第二電連接部52電性連結該第一輻射體2及該第一電極部41及該第二電極部42。該第三電連接部53電性連結該第二輻射體3與該第三電極部43。
The electrical connection portion 5 is made of a metal material and is disposed inside the fiberglass board 1 . The electrical connection portion 5 includes a first electrical connection portion 51 , a second electrical connection portion 52 , and a third electrical connection portion 53 . The first electrical connection portion 51 and the second electrical connection portion 52 electrically connect the first radiator 2 , the first electrode portion 41 , and the second electrode portion 42 . The third electrical connection portion 53 electrically connects the second radiator 3 and the third electrode portion 43 .
該圖案層6，係設於該玻璃纖維板1的頂面11上，該圖案層6可以印刷天線的型號、公司商標圖案。
The pattern layer 6 is disposed on the top surface 11 of the fiberglass board 1, and the pattern layer 6 can print the model number of the antenna and the company logo pattern.
以上述該第一輻射體2及該第二輻射體3組成一個2.45GHZ
與5GHZ
的無線信號收發模組。藉由調整該第一輻射體2來控制5GHZ
頻段阻抗、共振頻率、頻寬與輻射效應。且以該第一輻射體2及該第二輻射體3之間的耦合關係的耦合面積及耦合距離，形成二耦合電容彼此相配合調變，來控制2.45GHZ
頻段而達到預定的目標阻抗、共振頻率、頻寬與輻射效應，且可有效縮小天線尺寸。
In the above-described first radiator and the second radiator 2 3 composition with a 2.45GH Z 5GH Z wireless signal transceiver module. The 5GH Z- band impedance, resonant frequency, bandwidth, and radiation effects are controlled by adjusting the first radiator 2. And the coupling area and the coupling distance of the coupling relationship between the first radiator 2 and the second radiator 3 form a coupling capacitance of the two coupling capacitors to control the 2.45 GHz Z- band to achieve a predetermined target impedance, Resonant frequency, bandwidth and radiation effects, and can effectively reduce the size of the antenna.
請參閱第三、四、五圖，係本創作之電路板正面、電路板與晶片天線組合、局部放大示意圖。如圖所示：在本創作的晶片天線10運用時，將該晶片天線10電性連結在一個具有淨空區的電路板7上做說明。
Please refer to the third, fourth and fifth figures, which are the combination of the front of the circuit board, the circuit board and the chip antenna, and a partial enlargement. As shown in the figure, when the wafer antenna 10 of the present invention is used, the wafer antenna 10 is electrically connected to a circuit board 7 having a clearance area for explanation.
該電路板7正面上具有一接地金屬層71及一第一鏤空部72，該第一鏤空部72的一側延伸有一第二鏤空部73。該第一鏤空部72上具有一第一接點74，該第一接點74相鄰有一信號饋入線段75，該信號饋入線段75具有延伸於該第二鏤空部73的一第一金屬線段751及一第二金屬線段752，該第一金屬線段751及該第二金屬線段752之間的間距761形成一第一匹配電路76。另，於該信號饋入線段75相鄰有一與該接地金屬層71電性連結的第二接點77。
The front surface of the circuit board 7 has a grounding metal layer 71 and a first hollow portion 72. One side of the first hollow portion 72 extends with a second hollow portion 73. The first hollow portion 72 has a first contact 74. The first contact 74 is adjacent to a signal feeding line segment 75. The signal feeding line segment 75 has a first metal extending from the second hollow portion 73. The line segment 751 and a second metal line segment 752, the spacing 761 between the first metal line segment 751 and the second metal line segment 752 form a first matching circuit 76. In addition, a second contact 77 electrically connected to the ground metal layer 71 is adjacent to the signal feeding line segment 75.
在該晶片天線10與該電路板7電性連結時，將該電極部4的第一電極部41電性連結在該第一接點74上呈不接地狀態，該第二電極部42電性連結在該信號饋入線段75上，該第三電極部43電性連結在第二接點77上。
When the wafer antenna 10 is electrically connected to the circuit board 7, the first electrode portion 41 of the electrode portion 4 is electrically connected to the first contact 74 in an ungrounded state, and the second electrode portion 42 is electrically connected. The signal is fed to the line segment 75, and the third electrode portion 43 is electrically connected to the second contact 77.
且於該信號饋入線段75的第二金屬線段752電性連結有一同軸電纜線(圖中未示)，在天線接收信號或發射信號時，由該同軸電纜線傳遞給該信號饋入線段75，或由該信號饋入線段75傳給該同軸電纜線。
The second metal line segment 752 of the signal feeding line segment 75 is electrically coupled to a coaxial cable (not shown). When the antenna receives a signal or transmits a signal, the coaxial cable is transmitted to the signal feeding line segment 75. Or by the signal feeding line segment 75 to the coaxial cable.
藉由調整該第一輻射體2來控制5GHZ
頻段阻抗、共振頻率、頻寬與輻射效應。且以該第一輻射體2及該第二輻射體3之間的耦合關係的耦合面積及耦合距離，形成二耦合電容彼此相配合調變，來控制2.45GHZ
頻段而達到預定的目標阻抗、共振頻率、頻寬與輻射效應，且可有效縮小天線尺寸。
The 5GH Z- band impedance, resonant frequency, bandwidth, and radiation effects are controlled by adjusting the first radiator 2. And the coupling area and the coupling distance of the coupling relationship between the first radiator 2 and the second radiator 3 form a coupling capacitance of the two coupling capacitors to control the 2.45 GHz Z- band to achieve a predetermined target impedance, Resonant frequency, bandwidth and radiation effects, and can effectively reduce the size of the antenna.
請參閱第六圖，係本創作之2.45GHZ
與5GHZ
的無線信號收發模組的在晶片天線的信號饋入線端無接地狀態下的反射功率比值曲線示意圖。如圖所示：Δ1頻率在2.4999GHZ為-5.0054dB，Δ2頻率在4.3563GHZ為-9.7014dB，Δ3頻率在6.2751GHZ為-9.8376dB。
Please refer to the sixth figure, which is a schematic diagram of the ratio of the reflected power ratio of the wireless signal transceiver module of the 2.45GH Z and 5GH Z of the present invention when the signal feeding line end of the chip antenna is not grounded. As shown: Δ1 frequency is -5.0054dB at 2.4999GHZ, Δ2 frequency is -9.7014dB at 4.3563GHZ, and Δ3 frequency is -9.8376dB at 6.2751GHZ.
請參閱第七圖，係本創作之2.45GHZ
與5GHZ
的無線信號收發模組的在晶片天線的信號饋入線段無接地狀態下及信號號饋入線段上具耦合電容的反射功率比值曲線示意圖。如圖所示：Δ1頻率在2.6271GHZ為-14.721dB，Δ2頻率在5.014GHZ為-7.1994dB，Δ3頻率在6.3509GHZ為-8.0845dB。
Please refer to the seventh figure, which is the reflected power ratio curve of the coupling capacitor of the 2.45GH Z and 5GH Z wireless signal transceiver modules in the signal feeding line segment of the chip antenna and the signal number feeding segment. schematic diagram. As shown, the Δ1 frequency is -14.721 dB at 2.6271 GHz, the Δ2 frequency is -7.1994 dB at 5.014 GHz, and the Δ3 frequency is -8.0845 dB at 6.3509 GHz.
上述僅為本創作之較佳實施例而已，並非用來限定本創作實施之範圍。即凡依本創作申請專利範圍所做的均等變化與修飾，皆為本創作專利範圍所涵蓋。
The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent.
10‧‧‧晶片天線 10‧‧‧Watt antenna
7‧‧‧電路板 7‧‧‧ boards
71‧‧‧接地金屬層 71‧‧‧Grounded metal layer
72‧‧‧第一鏤空部 72‧‧‧The first time department
73‧‧‧第二鏤空部 73‧‧‧Second Hollow Department
74‧‧‧第一接點 74‧‧‧First contact
75‧‧‧信號饋入線段 75‧‧‧Signal feed line segment
751‧‧‧第一金屬線段 751‧‧‧First metal line segment
752‧‧‧第二金屬線段 752‧‧‧Second metal line segment
76‧‧‧匹配電路 76‧‧‧Matching circuit
761‧‧‧間距 761‧‧‧ spacing
77‧‧‧第二接點 77‧‧‧second junction
Claims (10)
一晶片天線，包括：
一玻璃纖維板，其上至少具有一頂面、一底面及二側面；
一第一輻射體，係設於該玻璃纖維板的左側內部，該第一輻射體上具有一第一端部及一第二端部；
一第二輻射體，係設於該玻璃纖維板右側內部並位於該第一輻射體上方且近鄰該玻璃纖維板的頂面，該第一輻射體與該第二輻射體呈平行重疊的耦合關係，該第二輻射體上具有一第三端部及一第四端部；
一電連接部，係與該第一輻射體及該第二輻射體電性連結；
一電極部，設於該玻璃纖維板的底面上與該電連接部電性連結；
一電路板，其正面上具有一接地金屬層及一第一鏤空部，該第一鏤空部的一側延伸有一第二鏤空部，該第一鏤空部上具有一與該電極部電性連結的第一接點，該第一接點相鄰有一與該電極部電性連結的且延伸於該第二鏤空部中的信號饋入線段，另於該信號饋入線段相鄰有一與該電極部及該接地金屬層電性連結的第二接點。A wireless signal transceiver module (1) comprising:
A wafer antenna comprising:
a fiberglass board having at least one top surface, one bottom surface and two side surfaces thereon;
a first radiator is disposed on a left inner side of the fiberglass board, the first radiator has a first end portion and a second end portion;
a second radiator is disposed inside the right side of the fiberglass board and located above the first radiator and adjacent to a top surface of the fiberglass board, and the first radiator and the second radiator are in a parallel overlapping coupling relationship. The second radiator has a third end portion and a fourth end portion;
An electrical connection portion electrically connected to the first radiator and the second radiator;
An electrode portion is electrically connected to the electrical connection portion on a bottom surface of the fiberglass board;
a circuit board having a grounded metal layer and a first hollow portion on a front surface thereof, and a second hollow portion extending from a side of the first hollow portion, the first hollow portion having an electrical connection with the electrode portion a first contact, the first contact adjacent to a signal feeding line segment electrically connected to the electrode portion and extending in the second hollow portion, and the signal feeding portion adjacent to the electrode portion and the signal portion A second junction electrically connected to the ground metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212129U TWM470397U (en) | 2013-06-28 | 2013-06-28 | Wireless signal transceiver module (II) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW102212129U TWM470397U (en) | 2013-06-28 | 2013-06-28 | Wireless signal transceiver module (II) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM470397U true TWM470397U (en) | 2014-01-11 |
Family
ID=50347845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102212129U TWM470397U (en) | 2013-06-28 | 2013-06-28 | Wireless signal transceiver module (II) |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM470397U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI550952B (en) * | 2014-09-15 | 2016-09-21 | 佳邦科技股份有限公司 | Antenna structure |
-
2013
- 2013-06-28 TW TW102212129U patent/TWM470397U/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI550952B (en) * | 2014-09-15 | 2016-09-21 | 佳邦科技股份有限公司 | Antenna structure |
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