TWM461160U - Wireless transceiver module - Google Patents

Description

Wireless transceiver module (1)

For the creation of an antenna system of the present, particularly to a IEEE 802.11a / b / g / n / ac (2.4 ~ 2.5GHz & 5.15 ~ 5.85GH Z) for a single-band dual-mode feed antenna.

It is known that current personal portable electronic devices, such as smart phones, tablets, notebook computers, personal mobile assistant devices, digital music players and navigation devices, have wireless local area network antennas (wifi or Bluetooth, GPS and FM antennas to provide users with access to wireless base station Internet access or data transmission, navigation or use in public places, companies or homes with wireless base stations The FM antenna receives the FM radio program.

Since the wireless area network antennas, GPS and FM antennas used in the portable electronic devices are all single entities or integrated with other antennas, these antennas have a given volume, and the wireless local area network is required. When the antenna and the FM antenna are installed inside the portable electronic device, the installation space inside the portable electronic device will be occupied, and the appearance shape of the portable electronic device cannot be reduced.

At present, many portable electronic devices are designed to be light, thin and short, and the antennas of different frequency bands are integrated to form a multi-frequency antenna or a broadband antenna. The multi-frequency antenna or broadband antenna is installed in one. When the internal part of the portable electronic device does not occupy the internal space of the portable electronic device, the multi-frequency antenna or the broadband antenna has a plurality of signal feeding ends, and each signal feeding end is electrically connected to a coaxial cable. As a result, the number of coaxial cables is too large, which will cause difficulties in the internal wiring of the portable electronic device, and will also affect the heat dissipation of internal electronic components, resulting in difficulties in the installation of portable electronic devices and antennas. .

Therefore, the main purpose of this creation is to solve the traditional lack. This design integrates the antennas of different frequency bands, and when a different frequency band antenna is used, it shares a signal feeding line segment, making the antenna easier to install and wire. simple. Moreover, the different frequency bands are controlled by the coupling relationship between the two radiators, and the predetermined target impedance, resonance frequency, bandwidth and radiation effect are achieved, and the antenna size can be effectively reduced.

For the purpose of the above, the present invention provides a wireless transceiver module (1), comprising: a chip antenna, comprising: a carrier having at least one top surface, one bottom surface and two side surfaces; a first radiator Provided on the left inner side of the carrier; a second radiator disposed inside the right side of the carrier and located in the first radiator Upper and adjacent to the top surface of the carrier, the first radiator and the second radiator are in a parallel overlapping coupling relationship; an electrical connection portion is electrically connected to the first radiator and the second radiator; An electrode portion is electrically connected to the electrical connection portion on a bottom surface of the carrier; a substrate having a ground metal layer and a first hollow portion on a front surface thereof, and a second hollow portion extending from a side of the first hollow portion a first contact portion electrically connected to the electrode portion, the first contact portion adjacent to a signal electrically connected to the electrode portion and extending in the second hollow portion And feeding the line segment, and adjacent to the signal feeding line segment, a second contact electrically connected to the electrode portion and the grounding metal layer.

Wherein, the carrier is a rectangular shape composed of a plurality of ceramic substrates or glass fiber sheets.

The first radiator is a metal material of a sheet body, and the first radiator has a first end portion and a second end portion.

The second radiator is made of a metal material of a sheet body, and the second radiator has a third end portion and a fourth end portion.

The first radiator and the portion of the second radiator are coupled in parallel so that the third end of the second radiator is disposed opposite to the first end of the first radiator.

The parallel overlapping coupling relationship between the first radiator and the second radiator controls or adjusts the frequency according to the coupling area and the coupling distance.

The electrode portion includes a first electrode portion, a second electrode portion and a third electrode portion. The first electrode portion electrically connects the first contact portion, and the second electrode portion and the signal feed line segment are electrically connected. The third electrode portion is electrically connected to the second contact portion, and the wafer antenna can be surface-attached to the substrate.

The electrical connection portion includes a first electrical connection portion, a second electrical connection portion, and a third electrical connection portion; the first electrical connection portion and the second electrical connection portion and the first radiator and the The first electrode portion and the second electrode portion electrically connect the second radiator and the third electrode portion.

Wherein, a pattern layer is further disposed on the top surface of the carrier, and the pattern layer is a model number and a company logo pattern.

The signal feeding line segment has a first metal line segment and a second metal line segment extending from the second hollow portion, and a spacing between the first metal line segment and the second metal line segment forms a first matching circuit.

The second metal line segment of the signal feeding line segment is electrically connected to a coaxial cable.

10‧‧‧Watt antenna

1‧‧‧ Carrier

11‧‧‧ top surface

12‧‧‧ bottom

13‧‧‧ side

2‧‧‧First radiator

21‧‧‧ first end

22‧‧‧ second end

3‧‧‧Second radiator

31‧‧‧ third end

32‧‧‧ fourth end

4‧‧‧Electrode

41‧‧‧First electrode section

42‧‧‧Second electrode section

43‧‧‧ third electrode

5‧‧‧Electrical connection

51‧‧‧First electrical connection

52‧‧‧Second electrical connection

53‧‧‧ Third electrical connection

6‧‧‧pattern layer

7‧‧‧Substrate

71‧‧‧Grounded metal layer

72‧‧‧The first time department

73‧‧‧Second Hollow Department

74‧‧‧First contact

75‧‧‧Signal feed line segment

751‧‧‧First metal line segment

752‧‧‧Second metal line segment

76‧‧‧Matching circuit

761‧‧‧ spacing

77‧‧‧second junction

The first picture is a three-dimensional diagram of the appearance of the dual-mode single-feed antenna of the present invention.

The second picture is a side cross-sectional view of the dual-mode single-feed antenna of the present invention.

The third picture is a front view of the substrate of the present creation.

The fourth figure is a schematic diagram of the combination of the substrate and the wafer antenna of the present invention.

The fifth picture is a partial enlarged view of the creation.

FIG Sixth, schematic view showing the curve and the Original 2.45GH _Z 5GH _Z dual-mode single-feed antenna signal feeding lines at the end of the non-grounded state chip antenna reflection power ratio.

FIG Seventh, the present system and the creation of the dual mode single 2.45GH _Z 5GH _Z is a schematic diagram of an antenna feed having a ratio of the reflected power and the coupling capacitance signal line feed resolution curve in the antenna signal feeding line wafer without a ground state .

The technical content and detailed description of this creation are as follows:

Please refer to the first and second figures. This is a three-mode single-proped antenna (1). As shown in the figure, the chip antenna 10 of the wireless transceiver module (1) of the present invention comprises: a carrier 1, a first radiator 2, a second radiator 3, an electrode portion 4, and an electrical connection portion 5. And a pattern layer 6.

The carrier 1 is a rectangular semiconductor wafer antenna composed of a plurality of ceramic substrates or glass fiber sheets, and has at least one top surface 11, one bottom surface 12 and two side surfaces 13 thereon.

The first radiator 2 is made of a metal material and is disposed on the left side of the carrier 1 . The first radiator 2 has a first end portion 21 and a second end portion 22 .

The second radiator 3 is made of a metal material and is disposed on the right side of the carrier 1 and located above the first radiator 2 and adjacent to the top surface 11 of the carrier 1 . The second radiator 3 has a third end portion 31 and a fourth end portion 32. The first A coupling relationship between the radiator 2 and the second radiator 3 is such that the third end 31 of the second radiator 3 is opposite to the first end 21 of the first radiator 2 .

The electrode portion 4 is made of a metal material and is disposed on the bottom surface 12 of the carrier 1. The electrode portion 4 includes a first electrode portion 41, a second electrode portion 42, and a third electrode portion 43. The first electrode portion 41, the second electrode portion 42, and the third electrode portion 43 allow the wafer antenna 10 to be adhered to a substrate (not shown).

The electrical connection portion 5 is made of a metal material and is disposed inside the carrier 1 . The electrical connection portion 5 includes a first electrical connection portion 51 , a second electrical connection portion 52 , and a third electrical connection portion 53 . The first electrical connection portion 51 and the second electrical connection portion 52 electrically connect the first radiator 2 , the first electrode portion 41 , and the second electrode portion 42 . The third electrical connection portion 53 electrically connects the second radiator 3 and the third electrode portion 43 .

The pattern layer 6 is disposed on the top surface 11 of the carrier 1. The pattern layer 6 can print the model number of the antenna and the company logo pattern.

In the above-described first radiator and the second radiator 2 3 2.45GH _Z with a composition of 5GH _Z mode single feed antenna. The impedance, resonance frequency, bandwidth and radiation effects of the 5 GHz band are controlled by adjusting the first radiator 2. And the coupling area and the coupling distance of the coupling relationship between the first radiator 2 and the second radiator 3 form a coupling capacitance of the two coupling capacitors to control the 2.45 GHz _Z- band to achieve a predetermined target impedance, Resonant frequency, bandwidth and radiation effects, and can effectively reduce the size of the antenna.

Please refer to the third, fourth and fifth figures, which are the combination of the front side of the substrate, the substrate and the wafer antenna, and a partial enlarged view. As shown in the figure, when the wafer antenna 10 of the present invention is used, the wafer antenna 10 is electrically connected to a substrate 7 having a clearance area.

The front surface of the substrate 7 has a grounding metal layer 71 and a first hollow portion 72. One side of the first hollow portion 72 extends with a second hollow portion 73. The first hollow portion 72 has a first contact 74. The first contact 74 is adjacent to a signal feeding line segment 75. The signal feeding line segment 75 has a first metal extending from the second hollow portion 73. The line segment 751 and a second metal line segment 752, the spacing 761 between the first metal line segment 751 and the second metal line segment 752 form a first matching circuit 76. In addition, a second contact 77 electrically connected to the ground metal layer 71 is adjacent to the signal feeding line segment 75.

When the wafer antenna 10 is electrically connected to the substrate 7, the first electrode portion 41 of the electrode portion 4 is electrically connected to the first contact 74 in a non-grounded state, and the second electrode portion 42 is electrically connected. On the signal feeding line segment 75, the third electrode portion 43 is electrically connected to the second contact 77.

The second metal line segment 752 of the signal feeding line segment 75 is electrically coupled to a coaxial cable (not shown). When the antenna receives a signal or transmits a signal, the coaxial cable is transmitted to the signal feeding line segment 75. Or by the signal feeding line segment 75 to the coaxial cable.

The 5GH _Z- band impedance, resonant frequency, bandwidth, and radiation effects are controlled by adjusting the first radiator 2. And the coupling area and the coupling distance of the coupling relationship between the first radiator 2 and the second radiator 3 form a coupling capacitance of the two coupling capacitors to control the 2.45 GHz _Z- band to achieve a predetermined target impedance, Resonant frequency, bandwidth and radiation effects, and can effectively reduce the size of the antenna.

See FIG. Sixth, the present schematic view showing a graph and Creation 2.45GH _Z 5GH _Z dual-mode single-feed antenna signal feeding lines at the end of the non-grounded state chip antenna reflection power ratio. As shown in the figure: △1 frequency is -5.0054dB at 2.4999GHZ, △2 frequency is -9.7014dB at 4.3563GHZ, and △3 frequency is -9.8376dB at 6.2751GHZ.

Please refer to the seventh figure, which is the ratio of the reflected power of the coupling capacitor in the signal feeding line segment of the chip antenna and the signal feeding line segment of the 2.45GH _Z and 5GH _Z dual-mode single-input antenna. Schematic diagram of the curve. As shown in the figure: △1 frequency is -14.721dB at 2.6271GHZ, △2 frequency is -7.1994dB at 5.014GHZ, and △3 frequency is -8.0845dB at 6.3509GHZ.

The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, the equal changes and modifications made by the patent application scope of this creation are covered by the scope of the creation patent.

10‧‧‧Watt antenna

7‧‧‧Substrate

71‧‧‧Grounded metal layer

72‧‧‧The first time department

73‧‧‧Second Hollow Department

74‧‧‧First contact

75‧‧‧Signal feed line segment

751‧‧‧First metal line segment

752‧‧‧Second metal line segment

76‧‧‧Matching circuit

761‧‧‧ spacing

77‧‧‧second junction

Claims (11)

A wireless transceiver module (1) comprising: a chip antenna comprising: a carrier having at least one top surface, a bottom surface and two side surfaces; a first radiator disposed inside the left side of the carrier; The second radiator is disposed inside the right side of the carrier and located above the first radiator and adjacent to the top surface of the carrier, and the first radiator and the second radiator are in parallel coupling relationship; an electrical connection portion And electrically connected to the first radiator and the second radiator; an electrode portion is electrically connected to the electrical connection portion on a bottom surface of the carrier; a substrate having a grounded metal layer on the front surface thereof a first hollow portion having a second hollow portion extending from a side of the first hollow portion, the first hollow portion having a first contact electrically connected to the electrode portion, the first contact being adjacent to the first contact portion And a signal feeding line segment electrically connected to the electrode portion and extending in the second hollow portion, and a second contact electrically connected to the electrode portion and the ground metal layer adjacent to the signal feeding line segment. The wireless transceiver module (1) according to claim 1, wherein the carrier is a rectangular ceramic substrate or a fiberglass plate. The wireless transceiver module (1) of claim 2, wherein the first radiator is a metal material of a sheet body, and the first radiator has a first end portion and a second end portion unit. The wireless transceiver module (1) according to claim 3, wherein the The second radiator is a metal material of the sheet body, and the second radiator has a third end portion and a fourth end portion. The wireless transceiver module (1) of claim 4, wherein the first radiator and the second radiation system are partially overlapped and coupled in parallel, so that the third end of the second radiator is The first end of the first radiator is disposed in a reverse direction. The wireless transceiver module (1) of claim 5, wherein the parallel overlapping coupling relationship between the first radiator and the second radiator controls or adjusts the frequency by a coupling area and a coupling distance. The wireless transceiver module (1) of claim 6, wherein the electrode portion comprises a first electrode portion, a second electrode portion and a third electrode portion, the first electrode portion being the first The second electrode portion is electrically connected to the signal feeding line segment, and the third electrode portion is electrically connected to the second contact portion, so that the wafer antenna can be surface-attached to the substrate. The wireless transceiver module (1) of claim 7, wherein the electrical connection portion includes a first electrical connection portion, a second electrical connection portion, and a third electrical connection portion; The electrical connection portion and the second electrical connection portion and the first radiator, the first electrode portion and the second electrode portion, the third electrical connection portion electrically connecting the second radiator and the third electrode portion. The wireless transceiver module (1) of claim 8, further comprising a pattern layer disposed on a top surface of the carrier, the pattern layer being a model number and a company logo pattern. The wireless transceiver module (1) of claim 9, wherein the signal feeding line segment has a first metal line segment extending from the second hollow portion and A second metal line segment, the spacing between the first metal line segment and the second metal line segment forms a first matching circuit. The wireless transceiver module (1) of claim 10, wherein the second metal line segment of the signal feeding line segment is electrically connected to a coaxial cable.