TWM470309U - Touch panel with hollow ground line - Google Patents

Description

Touch panel with hollow grounding wire

The present invention relates to a touch panel, and more particularly to a touch panel having a hollow ground plane.

Referring to FIG. 4, the touch panel is mainly formed with an electrode layer 52 formed on a substrate 50. The electrode layer 52 is formed by staggered sensing lines, and the sensing lines are respectively connected to a plurality of signal lines 54 and signals. The wire 54 extends to one side of the substrate 50 to form a terminal portion that can be electrically connected to a flexible board (FPC). A grounding wire 60 for shielding interference is formed along the periphery of the substrate 50. The grounding wire 60 surrounds the periphery of the electrode layer 60 and the signal line 54. The surface of the grounding wire 60 is a metal layer. It absorbs or isolates noise or electromagnetic interference from the outside into the touch panel to reduce the chance of malfunction or damage to the touch panel.

Although the grounding wire 60 can be configured to prevent external noise from interfering with the function of the touch panel, the bonding process for the touch panel has a troublesome problem. When the touch panel needs to be bonded to an attached object, the optical adhesive is used as a bond between the two, and then the ultraviolet light (UV) is used for the total irradiation to harden the optical adhesive to complete the bonding. However, the coverage area of the metal layer on the ground line 60 is too large, and the metal layer can block ultraviolet light, resulting in insufficient effective illumination area of the ultraviolet light, and the light intensity at the ground line 60. It is not enough to completely cure the optical adhesive, so the poor bonding rate between the touch panel and the attached object is significantly increased.

It is assumed that the illumination time of the ultraviolet light is further extended due to the above factors, and the temperature of the object to be irradiated rises, and the work efficiency of the bonding process is lowered.

In view of the fact that the grounding wire of the existing touch panel is excessively insulated from ultraviolet light and the bonding yield is not good, the main purpose of the present invention is to provide a hollow grounding wire which has both anti-noise interference and ultraviolet light irradiation area. Touch panel".

In order to achieve the foregoing objective, the touch panel having a hollow grounding wire includes: a substrate having an active region and a peripheral wiring region defined thereon; an electrode layer formed on an active region of the substrate, the electrode The layer includes a plurality of sensing lines; a plurality of signal lines extending from the wiring area of the substrate and electrically connected to the plurality of sensing lines, wherein one end of the plurality of signal lines is extended to one side of the substrate to form a terminal a grounding wire extending from the wiring region of the substrate and surrounding the electrode layer and the plurality of signal lines, the grounding wire having a metal circuit layer, wherein the metal circuit layer forms a plurality of hollow openings.

The creation forms a hollow opening on the metal circuit layer of the grounding wire, and the openings are provided to increase the light transmissive area compared with the conventional grounding wire covering the metal circuit layer. Therefore, when the touch panel is laminated During the process, the ultraviolet light can penetrate the opening to increase the illumination area, increase the light intensity required for the optical glue to harden, so that the optical glue can effectively harden and reduce the light irradiation time, thereby improving the yield of the bonding process.

10, 50‧‧‧ substrate

12, 52‧‧‧ electrode layer

20‧‧‧ signal line

30‧‧‧ Grounding wire

31‧‧‧Transparent circuit layer

32‧‧‧metal circuit layer

33‧‧‧ openings

331‧‧‧ tip

40‧‧‧ Terminals

Figure 1: Schematic diagram of the creation of the touch panel.

FIG. 2 is a schematic view showing the grounding line of the first preferred embodiment of the present touch panel.

FIG. 3 is a schematic view showing the grounding wire of the second preferred embodiment of the present touch panel.

Figure 4: Schematic diagram of the existing touch panel.

Referring to FIG. 1 , the touch panel comprises a substrate 10 , an electrode layer 12 formed on the substrate, a plurality of signal lines 20 , and a ground line 30 .

An active area and a wiring area on the periphery thereof are defined on the substrate 10. The electrode layer 12 includes a plurality of sensing lines in the X and Y directions. The sensing lines are formed in the active area and are vertically and vertically staggered and insulated. The sensing lines are formed by a plurality of sensing electrodes connected in series.

The plurality of signal lines 20 are disposed in the wiring area, and one end of each of the signal lines 20 is connected to a corresponding sensing line, and the other end is extended to one side of the substrate 10 to form a terminal portion 40. The touch panel uses the terminal portion 40 to overlap with a flexible printed circuit board (FPC) to receive data or control signals from the printed circuit board.

The grounding wire 30 is disposed in the wiring area 12 and surrounds the electrode The periphery of the layer and the signal line, wherein the line width of the ground line 30 is larger than the line width of each of the signal lines 20, and is a double-layer line structure. When the line width d1 of the ground line 30 is 0.5 mm, the ground plane The distance d2 from the edge of the substrate 10 may be 0.2 mm. As shown in FIG. 2, when the grounding wire 30 is formed, a transparent wiring layer 31 is formed on the surface of the substrate 10, and a metal wiring layer 32 is formed on the surface of the transparent wiring layer 31. The transparent wiring layer 21 can be formed. It is formed using ITO material. A plurality of hollow openings 33 are formed in the metal circuit layer 32 to expose the transparent circuit layer 31 therebelow, and each of the openings 33 has at least one tip end portion 331 oriented toward the edge of the substrate 10. When the tip end portion 331 is tested to face the outside, it can be In the first preferred embodiment shown in FIG. 2, the grounding wire 30 has a plurality of independent diamond-shaped independent openings 33. The openings 33 are not in communication with each other, and each of the n-diamond openings 33 has an angle toward the edge of the substrate 10. That is, the tip end portion 331 is formed. In the second preferred embodiment of FIG. 3, the grounding wire 30 has a plurality of diamond-shaped openings 33. Each of the openings 33 partially overlaps with the adjacent opening 33 to communicate with each other, and each of the openings 33 has an angle toward the edge of the substrate 10. This tip portion 331 is formed.

Although the creation of the opening 33 is formed on the metal wiring layer 32, the grounding wire 30 still has the capability of resisting electromagnetic noise. Please refer to the table below. In the two cases of power supply and no power supply to the touch panel, respectively, different test high voltages are applied under the contact and non-contact test conditions. The touch panel can still be tested smoothly. Pass the electrostatic discharge test (ESD).

Since the present invention forms a hollow opening 33 on the metal circuit layer 32 of the grounding wire 30, the present invention improves the light transmissive area of the grounding wire 30 compared to the conventional grounding wire structure of the full metal wiring layer. Therefore, the touch is improved. After entering the bonding process, the panel can increase the ultraviolet (UV) exposure area, increase the light intensity required for the optical glue to harden, so that the optical glue can effectively harden and reduce the light irradiation time, thereby avoiding the temperature rise of the irradiated object. Improve the efficiency of the bonding process.

10‧‧‧Substrate

12‧‧‧electrode layer

20‧‧‧ signal line

30‧‧‧ Grounding wire

31‧‧‧Transparent circuit layer

32‧‧‧metal circuit layer

33‧‧‧ openings

331‧‧‧ tip

40‧‧‧ Terminals

Claims (9)

A touch panel with a hollow grounding wire, comprising: a substrate having an active area and a peripheral wiring area defined thereon; an electrode layer formed on an active area of the substrate, the electrode layer comprising a plurality of sensing layers a plurality of signal lines extending from the wiring area of the substrate and electrically connected to the plurality of sensing lines, wherein one end of the plurality of signal lines is extended to one side of the substrate to form a terminal portion; a ground line And extending over the wiring area of the substrate and surrounding the electrode layer and the plurality of signal lines, the ground line has a metal circuit layer, wherein the metal circuit layer forms a plurality of hollow openings. The touch panel having a hollow grounding wire according to claim 1, wherein each opening on the metal circuit layer has at least one tip portion that faces outwardly toward an edge of the substrate. The touch panel having a hollow grounding wire according to claim 1 or 2, wherein the plurality of openings are independent of each other and are not connected. The touch panel having a hollow grounding wire according to claim 1 or 2, wherein the plurality of openings are in communication with each other. The touch panel with a hollow grounding wire according to claim 1 or 2, the grounding wire comprising a transparent circuit layer formed on the substrate and a metal circuit layer formed on the transparent circuit layer, wherein the metal The opening is formed on the wiring layer to expose the transparent wiring layer below it. The touch panel having a hollow grounding wire according to claim 3, wherein the grounding wire comprises a transparent circuit layer formed on the substrate and a transparent circuit layer formed on the substrate a metal circuit layer on the circuit layer, wherein the metal circuit layer forms the opening to expose a transparent circuit layer therebelow. The touch panel with a hollow grounding wire according to claim 4, the grounding wire comprising a transparent circuit layer formed on the substrate and a metal circuit layer formed on the transparent circuit layer, wherein the metal circuit layer The upper layer forms the opening to expose the transparent wiring layer below it. The touch panel with a hollow grounding wire as claimed in claim 5, wherein the opening is a diamond shape. The touch panel with a hollow grounding wire according to claim 5, wherein the grounding wire has a line width of 0.5 mm, and the grounding wire has a distance of 0.2 mm from the edge of the substrate.