TWM469627U - Efficient heat dissipation LED light source - Google Patents

Description

Efficient cooling LED light source

The present invention relates to an LED light-emitting device, and more particularly to an efficient heat-dissipating LED light source that uniformly dissipates thermal energy generated by LED light emission through a temperature equalizing plate in a two-dimensional manner.

According to the rapid development of technology, the lighting technology of LED lamps has been continuously improved. At present, high-power LED lamps on the market have been developed and produced, which has greatly improved the living standards of the public, and the power of LED lamps has been accompanied by the increase. It is a problem that heat dissipation is not easy. These waste heats that are not easily dissipated will have a negative impact on the service life and luminous efficacy of the LED lamps. Therefore, the LED lamps will be equipped with a heat dissipating device such as a heat pipe to dissipate the high temperature in a timely manner; Although these heat sinks have good heat dissipation effects, there is still room for improvement. For example, the heat conduction mode of the heat pipe is one-dimensional, that is, the so-called heat conduction mode of the wire, and the heat dissipation effect is limited.

Therefore, how to eliminate the above problems is the technical difficulty point that the creators of the case want to solve.

Therefore, in view of the above-mentioned deficiencies, the creators have collected relevant information, and through multi-party evaluation and consideration, and through years of experience in the industry, through continuous trial and modification, we have designed such a new patent holder to improve heat dissipation performance. .

The main purpose of the present invention is to bond at least one LED to one surface of an alumina substrate, and then bond a temperature equalizing plate to the other side of the alumina substrate, thereby providing a reverse arrangement, so that the heat generated by the LED light is passed through The temperature equalizing plate averages the dispersion in a two-dimensional manner to achieve efficient heat dissipation.

The secondary purpose of this creation is to weld the LED to one side of the alumina substrate with a high-temperature soldering material, tin metal, and solder with a high-temperature soldering material, metal tin, or a low-temperature curing heat-conducting material to bond the uniform temperature plate to the aluminum oxide substrate. On the one hand, the bonding method is adopted so that the heat generated by the LED can be obtained without affecting the luminous efficacy and the service life of the LED, and the heat generated by the heat can be efficiently escaped.

1‧‧‧High efficiency cooling LED light source

2‧‧‧Substrate

3‧‧‧LED

31‧‧‧High temperature welding materials

4‧‧‧Wall plate

41‧‧‧High temperature welding materials

42‧‧‧Low-temperature curing heat conductive material

The first drawing is a schematic diagram of the composition of the present invention; the second drawing is a schematic view of the joint of the first embodiment of the present creation; and the third drawing is a schematic view of the joining of the second embodiment of the present creation.

In order to achieve the above objectives and effects, the technical means and structure adopted by the present invention are described in detail in the preferred embodiment of the present creation, and the features and functions are as follows.

Please refer to the first to second figures, which respectively show the schematic diagram and the joint schematic diagram of the present creation. As shown in the figure, the high-efficiency heat-dissipating LED light source 1 is mainly composed of a substrate 2, at least one LED 3 and an average temperature. The board 4 is composed of a substrate 4; the substrate 2 is an alumina substrate, and an electric circuit is disposed thereon, one side of which is connected to the LEDs 3, and the other side is joined The temperature equalizing plate 4, and the other side of the substrate is pre-plated with a nickel-cobalt alloy layer; thereby, in reverse arrangement, the heat energy generated by the LED3 light is directly transmitted from the substrate 2 to the temperature equalizing plate 4, and then transmitted through The temperature equalizing plate 4 is uniformly dissipated in a two-dimensional manner, thereby achieving the purpose of efficient heat dissipation.

In the first embodiment of the present invention, the LEDs 3 are bonded to one side of the substrate 2 by a high temperature solder material 31, and the temperature equalizing plate 4 is also bonded to the other side of the substrate 2 by a high temperature solder material 41. The high-temperature soldering material is made of metal tin; in the second embodiment of the present invention, the LEDs 3 are bonded to one side of the substrate 2 by a high-temperature soldering material 31, and the temperature-regulating board 4 is bonded by a low-temperature curing heat-conductive material 42. On the other side of the substrate 2; by the bonding method of the above different embodiments, not only the two sides of the substrate 2 can perform high-efficiency heat conduction, but also can be lifted without affecting the luminous efficacy and service life of the LED 3, so that the heat generated by the substrate can be generated. Get high efficiency escape.

The above description is only the second preferred embodiment of the present invention, and thus the scope of the patent is not limited thereby, and the equivalent structure of the present specification and the illustrated content is directly or indirectly applied to other related technologies. All those in the field should be included in the scope of the spirit of this creation and be combined with Chen Ming.

1‧‧‧High efficiency cooling LED light source

2‧‧‧Substrate

3‧‧‧LED

4‧‧‧Wall plate

Claims (8)

An efficient heat-dissipating LED light source, comprising: a substrate on which a circuit is disposed; at least one LED connected to one side of the substrate; and a temperature equalizing plate bonded to the other side of the substrate It is used to dissipate the thermal energy generated by the LED illumination on average. The high-efficiency heat-dissipating LED light source of claim 1, wherein the substrate is an aluminum oxide substrate. The high-efficiency heat-dissipating LED light source of claim 1, wherein the LEDs are bonded to one side of the substrate by a high-temperature solder material. The high-efficiency heat-dissipating LED light source according to claim 3, wherein the high-temperature soldering material is metal tin. The high-efficiency heat-dissipating LED light source of claim 1, wherein the temperature-regulating plate is joined to the other side of the substrate by a high-temperature solder material. The high-efficiency heat-dissipating LED light source according to claim 5, wherein the high-temperature soldering material is metal tin. The high-efficiency heat-dissipating LED light source of claim 1, wherein the temperature-averaging plate is bonded to the other side of the substrate by a low-temperature curing heat conductive material. The high-efficiency heat-dissipating LED light source of claim 1, wherein the other side of the substrate is pre-plated with a nickel-cobalt alloy layer.