TWM468134U - Electronic device with rotatable circuit board - Google Patents

Electronic device with rotatable circuit board Download PDF

Info

Publication number
TWM468134U
TWM468134U TW102204112U TW102204112U TWM468134U TW M468134 U TWM468134 U TW M468134U TW 102204112 U TW102204112 U TW 102204112U TW 102204112 U TW102204112 U TW 102204112U TW M468134 U TWM468134 U TW M468134U
Authority
TW
Taiwan
Prior art keywords
circuit board
module
main circuit
electronic device
rotatable
Prior art date
Application number
TW102204112U
Other languages
Chinese (zh)
Inventor
Ting-Chiang Huang
Wen-Neng Liao
Original Assignee
Acer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acer Inc filed Critical Acer Inc
Priority to TW102204112U priority Critical patent/TWM468134U/en
Publication of TWM468134U publication Critical patent/TWM468134U/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

具有可旋轉電路板之電子裝置Electronic device with rotatable circuit board

本創作係關於一種電子裝置,特別是一種應用可旋轉電路板執行散熱功能之電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device that uses a rotatable circuit board to perform a heat dissipation function.

電子裝置內部因元件作動會產生熱量,因此一般會對應發熱元件(例如中央處理單元、圖形處理單元等)設置散熱模組,來提供電子裝置內部之散熱效果。習知電子裝置之散熱方式大多以風扇或熱管等配合散熱鰭片之設置,與空氣或熱傳導介質進行熱交換。The internal heat of the electronic device generates heat due to component operation. Therefore, a heat dissipation module is generally provided corresponding to the heat generating component (for example, a central processing unit, a graphics processing unit, etc.) to provide a heat dissipation effect inside the electronic device. Conventionally, the heat dissipation method of the electronic device is mostly performed by a fan or a heat pipe or the like in combination with a heat dissipating fin, and exchanges heat with air or a heat transfer medium.

隨著整體系統與內部處理晶片之效能增進,使得其散熱需求亦隨之增加,往往需要設置較大型之風扇、較大面積之散熱鰭片或對應之熱管迴路配置等,以便提供裝置更佳之散熱效率。然而,前述散熱元件之設置相對地需要預留更多的內部空間,對於內部空間有限之電子裝置而言,如何能妥善安排其內部空間之元件,對設計製造者而言是一大考驗。倘若這些散熱元件之配置必須增加電子裝置之厚度,又與現行電子裝置之輕薄化趨勢背道而馳,如此一來對製造者同樣會造成困擾。As the performance of the overall system and the internal processing chip is increased, the heat dissipation requirement is also increased, and it is often necessary to provide a larger fan, a larger area of heat sink fins or a corresponding heat pipe loop configuration, etc., in order to provide better heat dissipation of the device. effectiveness. However, the arrangement of the aforementioned heat dissipating components requires relatively more internal space. For an electronic device with limited internal space, how to properly arrange the components of the internal space is a great test for the design manufacturer. If the arrangement of these heat dissipating components must increase the thickness of the electronic device, and it runs counter to the trend of thinning and thinning of current electronic devices, it will also cause trouble to the manufacturer.

因此,如何能針對習知設計進一步改良,以設計出能符合輕薄化設計又能確保裝置之散熱效率之電子裝置,實為一值得研究之課題。Therefore, how to further improve the conventional design to design an electronic device that can meet the thin and light design and ensure the heat dissipation efficiency of the device is a subject worthy of study.

本創作之主要目的係在提供一種應用可旋轉電路板執行散熱功能之電子裝置。The main purpose of this creation is to provide an electronic device that performs a heat dissipation function using a rotatable circuit board.

為達到上述之目的,本創作之具有可旋轉電路板之電子裝置,包括裝置本體、旋轉模組及主電路板。裝置本體包括電源供應模組。旋轉模組設置於裝置本體內。主電路板結合於旋轉模組,使得主電路板可藉由旋轉模組相對裝置本體旋轉主電路板包括至少一發熱元件及至少一鰭片結構,各鰭片結構對應各發熱元件而設置。當電源供應模組供電至旋轉模組時,旋轉模組會驅動主電路板相對於裝置本體執行一旋轉操作,來藉由處於旋轉操作中之至少一鰭片結構進行散熱。In order to achieve the above object, the electronic device with the rotatable circuit board of the present invention comprises a device body, a rotating module and a main circuit board. The device body includes a power supply module. The rotating module is disposed in the device body. The main circuit board is coupled to the rotating module, so that the main circuit board can be rotated relative to the device body by the rotating module. The main circuit board includes at least one heating element and at least one fin structure, and each fin structure is disposed corresponding to each heating element. When the power supply module is powered to the rotating module, the rotating module drives the main circuit board to perform a rotating operation with respect to the device body to dissipate heat by at least one fin structure in the rotating operation.

藉此,本創作之電子裝置可藉由主電路板自身之旋轉與裝置本體內部之空氣進行熱對流,以產生高效率之熱交換效果,而無需額外設置風扇等散熱元件,有效減少內部空間之使用;並且此設計可令裝置整體之溫度平均分布,不易產生局部區域溫度過高之狀態。Therefore, the electronic device of the present invention can be thermally convected by the rotation of the main circuit board itself and the air inside the device body to generate a high-efficiency heat exchange effect without additionally providing a heat dissipating component such as a fan, thereby effectively reducing the internal space. The use of this design can make the temperature of the whole device evenly distributed, and it is not easy to generate a state in which the local temperature is too high.

1‧‧‧電子裝置1‧‧‧Electronic device

10‧‧‧裝置本體10‧‧‧ device body

11‧‧‧電源供應模組11‧‧‧Power supply module

12‧‧‧控制模組12‧‧‧Control Module

13‧‧‧周邊設備13‧‧‧ Peripherals

14‧‧‧散熱孔14‧‧‧ vents

20、20a‧‧‧旋轉模組20, 20a‧‧‧Rotary Module

21‧‧‧轉子21‧‧‧Rotor

22‧‧‧定子22‧‧‧ Stator

221‧‧‧電性接觸部221‧‧‧Electrical contact

23‧‧‧第一感應元件23‧‧‧First sensing element

30、30a‧‧‧主電路板30, 30a‧‧‧ main circuit board

31‧‧‧發熱元件31‧‧‧heating components

32‧‧‧鰭片結構32‧‧‧Fin structure

33‧‧‧無線傳輸模組33‧‧‧Wireless Transmission Module

34‧‧‧電連接件34‧‧‧Electrical connectors

35‧‧‧第二感應元件35‧‧‧Second sensing element

36‧‧‧供電元件36‧‧‧Power supply components

圖1是本創作之具有可旋轉電路板之電子裝置之結構爆炸圖。1 is an exploded view of the structure of an electronic device having a rotatable circuit board of the present invention.

圖2是本創作之具有可旋轉電路板之電子裝置於運作狀態下之示意圖。FIG. 2 is a schematic diagram of the electronic device with the rotatable circuit board in the working state of the present invention.

圖3是本創作之具有可旋轉電路板之電子裝置以非接觸方式對主電路板供電之示意圖。FIG. 3 is a schematic diagram of the electronic device with a rotatable circuit board of the present invention for supplying power to the main circuit board in a non-contact manner.

圖4是本創作之具有可旋轉電路板之電子裝置以接觸方式對 主電路板供電之示意圖。Figure 4 is an electronic device with a rotatable circuit board in the present invention in contact mode Schematic diagram of the main board power supply.

為能讓 貴審查委員更瞭解本創作之技術內容,特舉出較佳實施例說明如下。In order to make your reviewer more aware of the technical content of this creation, the preferred embodiments are described below.

請先參考圖1是本創作之具有可旋轉電路板之電子裝置1之結構爆炸圖。在本創作之一實施例中,本創作可應用於電腦裝置,例如筆記型電腦、桌上型電腦等,但本創作不以此為限,亦可應用於具有類似架構之其他電子裝置。Please refer to FIG. 1 for an exploded view of the structure of the electronic device 1 having a rotatable circuit board. In one embodiment of the present invention, the present invention can be applied to a computer device such as a notebook computer, a desktop computer, etc., but the present invention is not limited thereto, and can be applied to other electronic devices having a similar architecture.

如圖1所示,電子裝置1包括裝置本體10、旋轉模組及主電路板30。裝置本體10可為電子裝置1之殼體,其內部包括電源供應模組11、控制模組12及複數周邊設備13。電源供應模組11用以供應裝置本體10內各元件所需之電力,在本實施例中,裝置本體10可為一電池單元。控制模組12主要用以管控裝置本體10內各元件與主電路板30之間的訊號傳輸及處理。As shown in FIG. 1 , the electronic device 1 includes a device body 10 , a rotating module, and a main circuit board 30 . The device body 10 can be a housing of the electronic device 1 and includes a power supply module 11 , a control module 12 , and a plurality of peripheral devices 13 . The power supply module 11 is configured to supply power required for each component in the device body 10. In this embodiment, the device body 10 can be a battery unit. The control module 12 is mainly used for controlling signal transmission and processing between components in the device body 10 and the main circuit board 30.

複數周邊設備13則用以提供電子裝置1之各項功能,例如在本實施例中,複數周邊設備13可包括用以與外部裝置進行資料傳輸之輸入輸出埠模組、用以儲存資料之儲存模組及用以提供網路連線功能之網路通訊模組等,但本創作不以此為限,亦可包括如揚聲器、光碟機等具特定功能之其他周邊設備。The plurality of peripheral devices 13 are used to provide various functions of the electronic device 1. For example, in the embodiment, the plurality of peripheral devices 13 may include an input/output module for data transmission with an external device, and a storage for storing data. Modules and network communication modules for providing network connection functions, but this creation is not limited to this, and may include other peripheral devices with specific functions such as speakers and CD players.

此外,裝置本體10更包括複數散熱孔14,各散熱孔14設置在裝置本體10之周邊部位,以供裝置本體10內部之熱空氣能自複數散熱孔14排出。在本實施例中,複數散熱孔14 分設於裝置本體10後端之兩側,使得熱空氣自裝置本體10內部排出之路徑不易受其他周邊設備所阻擋,但複數散熱孔14之設置位置可依據裝置本體10內部元件配置不同而改變。In addition, the device body 10 further includes a plurality of heat dissipation holes 14 disposed at peripheral portions of the device body 10 so that hot air inside the device body 10 can be discharged from the plurality of heat dissipation holes 14. In this embodiment, the plurality of heat dissipation holes 14 It is disposed on both sides of the rear end of the device body 10, so that the path of the hot air discharged from the inside of the device body 10 is not easily blocked by other peripheral devices, but the position of the plurality of heat dissipation holes 14 can be changed according to the internal component configuration of the device body 10. .

旋轉模組20固定設置於裝置本體10內,且旋轉模組20與電源供應模組11電性連接,使得旋轉模組20可藉由電源供應模組11供電並加以驅動,而相對裝置本體10旋轉。在本實施例中,旋轉模組20為具有轉子21及定子22之馬達組件,定子22固定於裝置本體10,而轉子21之一端固定於主電路板30,另一端則可轉動地固定於定子22處。The rotating module 20 is fixedly disposed in the device body 10 , and the rotating module 20 is electrically connected to the power supply module 11 , so that the rotating module 20 can be powered and driven by the power supply module 11 , and the device body 10 is opposite to the device body 10 . Rotate. In the present embodiment, the rotary module 20 is a motor assembly having a rotor 21 and a stator 22. The stator 22 is fixed to the device body 10, and one end of the rotor 21 is fixed to the main circuit board 30, and the other end is rotatably fixed to the stator. 22 places.

主電路板30與旋轉模組20之轉子21彼此結合固定,使得轉子21相對於定子22旋轉時,轉子21能帶動主電路板30相對於裝置本體10旋轉。主電路板30包括至少一發熱元件31、至少一鰭片結構32及無線傳輸模組33,發熱元件31在執行大量運算處理時會產生熱能,例如中央處理單元(CPU)、圖形處理單元(GPU)等主要處理元件。在本實施例中,為配合令主電路板30易於執行旋轉操作,主電路板30採用一圓盤狀設計,以其圓心部位結合轉子21;但主電路板30之型式亦可隨需求不同而改變。The main circuit board 30 and the rotor 21 of the rotary module 20 are coupled to each other such that when the rotor 21 is rotated relative to the stator 22, the rotor 21 can drive the main circuit board 30 to rotate relative to the apparatus body 10. The main circuit board 30 includes at least one heating element 31, at least one fin structure 32, and a wireless transmission module 33. The heating element 31 generates thermal energy when performing a large amount of arithmetic processing, such as a central processing unit (CPU) and a graphics processing unit (GPU). ) and other main processing components. In the present embodiment, in order to make the main circuit board 30 easy to perform the rotating operation, the main circuit board 30 adopts a disc-shaped design, and the rotor 21 is combined at its center portion; however, the type of the main circuit board 30 can also be varied according to requirements. change.

各鰭片結構32對應各發熱元件31而設置,例如鰭片結構32可視需求直接疊設在發熱元件31上;或將鰭片結構32設置於主電路板30上較空曠處,再以其他導熱件將發熱元件31產生之熱傳導至鰭片結構32。其中鰭片結構31設置在主電路板 30靠近外側邊緣之部位,使得主電路板30旋轉時可提供鰭片結構32較大之旋轉路徑,以利於散熱。無線傳輸模組33則用以與裝置本體10之控制模組12進行無線訊號傳輸,以便與控制模組12或其他周邊設備13進行溝通。Each of the fin structures 32 is disposed corresponding to each of the heat generating elements 31. For example, the fin structure 32 may be directly stacked on the heat generating component 31 as needed; or the fin structure 32 may be disposed on the main circuit board 30 at a relatively empty space, and then thermally conductive. The heat is transferred to the fin structure 32 by the heat generated by the heat generating component 31. Wherein the fin structure 31 is disposed on the main circuit board The portion near the outer edge 30 provides a larger rotational path for the fin structure 32 when the main circuit board 30 is rotated to facilitate heat dissipation. The wireless transmission module 33 is configured to perform wireless signal transmission with the control module 12 of the device body 10 to communicate with the control module 12 or other peripheral devices 13.

以下請一併參考圖1及圖2。圖2是本創作之具有可旋轉電路板之電子裝置1於運作狀態下之示意圖。當本創作之電子裝置1之電源開啟後,裝置本體10之電源供應模組11會開始供電至旋轉模組20,此時旋轉模組20會被驅動而帶動主電路板30相對於裝置本體1執行一旋轉操作。藉由主電路板30所執行之旋轉操作,至少一鰭片結構32亦隨之旋轉並與四周空氣產生熱對流效應,以利於裝置散熱之進行;而經熱交換後之空氣可藉由裝置本體10周邊之複數散熱孔14排出。此外,本創作之電子裝置1亦可針對鰭片結構32之各鰭片角度加以調整,使主電路板旋轉時能將熱空氣更均勻地四散於裝置本體1內部。Please refer to Figure 1 and Figure 2 below. FIG. 2 is a schematic diagram of the electronic device 1 with a rotatable circuit board in the present operating state. After the power supply of the electronic device 1 of the present invention is turned on, the power supply module 11 of the device body 10 starts to supply power to the rotating module 20, and the rotating module 20 is driven to drive the main circuit board 30 relative to the device body 1. Perform a rotation operation. By rotating the main circuit board 30, at least one fin structure 32 also rotates and generates a heat convection effect with the surrounding air to facilitate the heat dissipation of the device; and the heat exchanged air can be passed through the device body. The plurality of heat dissipation holes 14 in the periphery of 10 are discharged. In addition, the electronic device 1 of the present invention can also adjust the fin angles of the fin structure 32 so that the hot air can be more evenly dispersed inside the device body 1 when the main circuit board rotates.

除了前述供電至旋轉模組20以驅動主電路板30達到散熱效果外,要讓主電路板30上之各元件能順利運作,必須順利供電給主電路板30。因此,本創作之電子裝置1主要以電源供應模組11為供電來源,並藉由旋轉模組20對主電路板30進行供電。In addition to the aforementioned power supply to the rotating module 20 to drive the main circuit board 30 to achieve the heat dissipation effect, the components on the main circuit board 30 must be smoothly supplied to the main circuit board 30 in order to operate smoothly. Therefore, the electronic device 1 of the present invention mainly uses the power supply module 11 as a power supply source, and supplies power to the main circuit board 30 by the rotation module 20.

以下請一併參考圖1及圖3。圖3是本創作之具有可旋轉電路板之電子裝置1以非接觸方式對主電路板30供電之示意圖。需注意的是,為了清楚說明主電路板30與旋轉模組20 間之元件相對關係,在圖3中省略了裝置本體10及主電路板30上之部分元件,特此說明。Please refer to Figure 1 and Figure 3 below. FIG. 3 is a schematic diagram of the electronic device 1 having the rotatable circuit board of the present invention supplying power to the main circuit board 30 in a non-contact manner. It should be noted that, in order to clearly illustrate the main circuit board 30 and the rotating module 20 The components in the relative relationship between the device body 10 and the main circuit board 30 are omitted in FIG.

如圖1及圖3所示,在本實施例中,旋轉模組20包括第一感應元件23,其固定設置於定子22處;此第一感應元件23電性連接電源供應模組11,以接收來自電源供應模組11之電源供應。主電路板30更包括第二感應元件35,其設置於主電路板30面對定子22之一側,且第二感應元件35電性連接主電路板30上之供電元件36,此供電元件36可處理並供應主電路板30上各元件所需之電源。此處第一感應元件23及第二感應元件35均為一感應線圈,但本創作不以此為限。As shown in FIG. 1 and FIG. 3 , in the embodiment, the rotating module 20 includes a first sensing component 23 , which is fixedly disposed at the stator 22 . The first sensing component 23 is electrically connected to the power supply module 11 . The power supply from the power supply module 11 is received. The main circuit board 30 further includes a second inductive component 35 disposed on one side of the main circuit board 30 facing the stator 22, and the second inductive component 35 is electrically connected to the power supply component 36 on the main circuit board 30. The power supply component 36 The power required for each component on the main circuit board 30 can be processed and supplied. Here, the first sensing element 23 and the second sensing element 35 are both an induction coil, but the present invention is not limited thereto.

當旋轉模組20由電源供應模組11供電以驅動主電路板30執行旋轉操作時,第一感應元件23因供電而產生電磁感應,並開始影響到第二感應元件35而產生共振現象,使得藉由第一感應元件23可以向第二感應元件35進行無線電力傳輸效果。因此,電源供應模組11即可藉由此旋轉模組20之第一感應元件23及主電路板30之第二感應元件35間之電磁感應,供電至主電路板30之供電元件36,以提供主電路板30運作時所需電源。When the rotating module 20 is powered by the power supply module 11 to drive the main circuit board 30 to perform a rotating operation, the first sensing element 23 generates electromagnetic induction due to power supply, and begins to affect the second sensing element 35 to generate a resonance phenomenon, so that The wireless power transmission effect can be performed to the second inductive element 35 by the first inductive element 23. Therefore, the power supply module 11 can be powered to the power supply component 36 of the main circuit board 30 by electromagnetic induction between the first sensing component 23 of the rotating module 20 and the second sensing component 35 of the main circuit board 30. The power required to operate the main circuit board 30 is provided.

除了前述無線電力供應之設計外,本創作亦可應用元件間直接電性接觸來提供主電路板30所需電力。請參考圖4是本創作之具有可旋轉電路板之電子裝置以接觸方式對主電路板30a供電之示意圖。需注意的是,為了清楚說明主電路板30a 與旋轉模組20a間之元件相對關係,在圖4中省略了裝置本體10及主電路板30a上之部分元件,特此說明。如圖4所示,在本實施例中,旋轉模組20a之定子22包括電性接觸部221,此電性接觸部221電性連接電源供應模組11,以接收來自電源供應模組11之電源供應;此電性接觸部221為以導電性佳之金屬等材質所製成之片狀結構件,例如一環形片。In addition to the aforementioned wireless power supply design, the present application can also apply direct electrical contact between components to provide the power required by the main circuit board 30. Please refer to FIG. 4 , which is a schematic diagram of the electronic device with the rotatable circuit board of the present invention supplying power to the main circuit board 30 a in a contact manner. It should be noted that in order to clearly illustrate the main circuit board 30a The components in the opposing relationship between the rotating module 20a and the device body 10 and the main circuit board 30a are omitted in FIG. As shown in FIG. 4 , in the embodiment, the stator 22 of the rotating module 20 a includes an electrical contact portion 221 , and the electrical contact portion 221 is electrically connected to the power supply module 11 for receiving the power supply module 11 . The power supply portion 221 is a sheet-like structural member made of a material such as a metal having good conductivity, such as an annular piece.

主電路板30a更包括電連接件34,電連接件34設置於主電路板30a面對定子22之一側,且電連接件34電性連接主電路板30a上之供電元件36,此供電元件36可處理並供應主電路板30a上各元件所需之電源。電連接件34可為一金屬彈性接腳,在一般狀態下,主電路板30a之電連接件34即直接接觸旋轉模組20a之定子22之電性接觸部221。The main circuit board 30a further includes an electrical connector 34. The electrical connector 34 is disposed on one side of the main circuit board 30a facing the stator 22. The electrical connector 34 is electrically connected to the power supply component 36 on the main circuit board 30a. 36 can process and supply the power required by the various components on the main circuit board 30a. The electrical connector 34 can be a metal resilient pin. In the normal state, the electrical connector 34 of the main circuit board 30a directly contacts the electrical contact portion 221 of the stator 22 of the rotating module 20a.

當旋轉模組20a由電源供應模組11供電以驅動主電路板30a執行旋轉操作過程中,由於主電路板30a之電連接件34仍保持與定子22之電性接觸部221之電性連接狀態,使得主電路板30a與旋轉模組20a之間藉由電連接件34配合定子22之電性接觸部221形成一電源供應路徑;因此,電源供應模組11能藉由此電源供應路徑供電至主電路板30a之供電元件36,以提供主電路板30a運作時所需電源。When the rotating module 20a is powered by the power supply module 11 to drive the main circuit board 30a to perform the rotating operation, the electrical connection member 34 of the main circuit board 30a remains electrically connected to the electrical contact portion 221 of the stator 22. The power supply path is formed between the main circuit board 30a and the rotating module 20a by the electrical connection member 221 of the stator 22; therefore, the power supply module 11 can be powered by the power supply path to The power supply component 36 of the main circuit board 30a provides the power required for operation of the main circuit board 30a.

藉此,本創作之電子裝置可藉由主電路板自身之旋轉,以熱對流方式進行散熱,無需額外設置風扇等散熱元件,有效減少內部空間之使用;而主電路板可藉由旋轉模組之對應元件 以接觸或非接觸方式取得所需電源,使得主電路板上各元件能順利運作。Therefore, the electronic device of the present invention can be cooled by the heat convection method by the rotation of the main circuit board itself, without additionally providing a heat dissipating component such as a fan, thereby effectively reducing the use of the internal space; and the main circuit board can be rotated by the module Corresponding component The required power is obtained in a contact or non-contact manner so that the components on the main circuit board can operate smoothly.

綜上所陳,本創作無論就目的、手段及功效,在在均顯示其迥異於習知技術之特徵。惟須注意,上述實施例僅為例示性說明本創作之原理及其功效,而非用於限制本創作之範圍。任何熟於此項技藝之人士均可在不違背本創作之技術原理及精神下,對實施例作修改與變化。本創作之權利保護範圍應如後述之申請專利範圍所述。In summary, this creation shows its characteristics different from conventional technology in terms of purpose, means and efficacy. It should be noted that the above-described embodiments are merely illustrative of the principles of the present invention and its effects, and are not intended to limit the scope of the present invention. Any person skilled in the art can make modifications and changes to the embodiments without departing from the technical principles and spirit of the present invention. The scope of protection of this creation should be as described in the scope of the patent application described later.

1‧‧‧電子裝置1‧‧‧Electronic device

10‧‧‧裝置本體10‧‧‧ device body

11‧‧‧電源供應模組11‧‧‧Power supply module

12‧‧‧控制模組12‧‧‧Control Module

13‧‧‧周邊設備13‧‧‧ Peripherals

14‧‧‧散熱孔14‧‧‧ vents

20‧‧‧旋轉模組20‧‧‧Rotary Module

21‧‧‧轉子21‧‧‧Rotor

22‧‧‧定子22‧‧‧ Stator

23‧‧‧第一感應元件23‧‧‧First sensing element

30‧‧‧主電路板30‧‧‧ main board

31‧‧‧發熱元件31‧‧‧heating components

32‧‧‧鰭片結構32‧‧‧Fin structure

33‧‧‧無線傳輸模組33‧‧‧Wireless Transmission Module

35‧‧‧第二感應元件35‧‧‧Second sensing element

36‧‧‧供電元件36‧‧‧Power supply components

Claims (9)

一種具有可旋轉電路板之電子裝置,包括:一裝置本體,包括一電源供應模組;一旋轉模組,設置於該裝置本體內;以及一主電路板,結合於該旋轉模組,使得該主電路板可藉由該旋轉模組相對該裝置本體旋轉,該主電路板包括至少一發熱元件及至少一鰭片結構,各該鰭片結構對應各該發熱元件而設置;當該電源供應模組供電至該旋轉模組時,該旋轉模組會驅動該主電路板相對於該裝置本體執行一旋轉操作,來藉由處於該旋轉操作中之該至少一鰭片結構進行散熱。An electronic device having a rotatable circuit board includes: a device body including a power supply module; a rotation module disposed in the device body; and a main circuit board coupled to the rotation module to enable the The main circuit board is rotatable relative to the apparatus body by the rotating module, the main circuit board includes at least one heating element and at least one fin structure, and each of the fin structures is disposed corresponding to each of the heating elements; When the group is powered to the rotating module, the rotating module drives the main circuit board to perform a rotating operation with respect to the device body to dissipate heat by the at least one fin structure in the rotating operation. 如申請專利範圍第1項所述之具有可旋轉電路板之電子裝置,其中該電源供應模組藉由該旋轉模組供電至該主電路板。The electronic device with a rotatable circuit board as described in claim 1, wherein the power supply module is powered by the rotating module to the main circuit board. 如申請專利範圍第2項所述之具有可旋轉電路板之電子裝置,其中該旋轉模組包括一電性接觸部,且該主電路板更包括一電連接件,於該旋轉操作中該電連接件保持與該電性接觸部之電性連接,以使該電源供應模組能藉由該旋轉模組供電至該主電路板。The electronic device with a rotatable circuit board according to claim 2, wherein the rotating module comprises an electrical contact portion, and the main circuit board further comprises an electrical connector, wherein the electrical circuit is in the rotating operation The connector is electrically connected to the electrical contact portion to enable the power supply module to be powered by the rotating module to the main circuit board. 如申請專利範圍第2項所述之具有可旋轉電路板之電子裝置,其中該旋轉模組包括一第一感應元件,且該主電路板更包括一第二感應元件,於該旋轉操作中藉由該第一感應元件與該第二感應元件間之電磁感應,以使該電源供應模組能藉由該旋轉模組供電至該主電路板。The electronic device with a rotatable circuit board according to claim 2, wherein the rotating module comprises a first sensing element, and the main circuit board further comprises a second sensing element, which is borrowed in the rotating operation. The electromagnetic induction between the first sensing element and the second sensing element enables the power supply module to be powered by the rotating module to the main circuit board. 如申請專利範圍第1項所述之具有可旋轉電路板之電子裝置,其中該裝置本體更包括一控制模組,且該主電路板包括一無線傳輸模組,該裝置本體與該主電路板之間藉由該控制模組與該無線傳輸模組進行無線訊號傳輸。The electronic device with a rotatable circuit board as described in claim 1, wherein the device body further comprises a control module, and the main circuit board comprises a wireless transmission module, the device body and the main circuit board Wireless signal transmission is performed between the control module and the wireless transmission module. 如申請專利範圍第5項所述之具有可旋轉電路板之電子裝置,其中該裝置本體更包括複數周邊設備,各該周邊設備藉由該控制模組與該主電路板進行訊號傳輸。The electronic device with a rotatable circuit board as described in claim 5, wherein the device body further comprises a plurality of peripheral devices, and each of the peripheral devices transmits signals to the main circuit board by using the control module. 如申請專利範圍第6項所述之具有可旋轉電路板之電子裝置,其中該複數周邊設備包括一輸入輸出埠模組、一儲存模組及一網路通訊模組。The electronic device with a rotatable circuit board as described in claim 6, wherein the plurality of peripheral devices comprise an input/output port module, a storage module and a network communication module. 如申請專利範圍第1項所述之具有可旋轉電路板之電子裝置,其中該裝置本體包括複數散熱孔,該複數散熱孔設置在該裝置本體之周邊。The electronic device with a rotatable circuit board according to claim 1, wherein the device body comprises a plurality of heat dissipation holes, and the plurality of heat dissipation holes are disposed at a periphery of the device body. 如申請專利範圍第1項所述之具有可旋轉電路板之電子裝置,其中該鰭片結構設置在該主電路板靠近外側邊緣之部位。The electronic device with a rotatable circuit board according to claim 1, wherein the fin structure is disposed at a portion of the main circuit board near an outer edge.
TW102204112U 2013-03-06 2013-03-06 Electronic device with rotatable circuit board TWM468134U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW102204112U TWM468134U (en) 2013-03-06 2013-03-06 Electronic device with rotatable circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102204112U TWM468134U (en) 2013-03-06 2013-03-06 Electronic device with rotatable circuit board

Publications (1)

Publication Number Publication Date
TWM468134U true TWM468134U (en) 2013-12-11

Family

ID=50155769

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102204112U TWM468134U (en) 2013-03-06 2013-03-06 Electronic device with rotatable circuit board

Country Status (1)

Country Link
TW (1) TWM468134U (en)

Similar Documents

Publication Publication Date Title
US8897012B2 (en) Electronic device and heat dissipation module thereof
US8804331B2 (en) Portable computing device with thermal management
EP3602235A1 (en) Flexible heat spreader
US10386898B2 (en) Thermal dock for a mobile computing device
US20150169014A1 (en) Notebook metal hinge as heat sink element
US20200089292A1 (en) Apparatus And Method To Improve Thermal Management For One Or More Heat Generating Components Within An Information Handling System
US20140257591A1 (en) Modular computer and thermal management
JP2014115993A (en) Solid-state drive and mother board for mounting the same
WO2020134729A1 (en) Electronic device heat dissipation method and electronic device
WO2011147112A1 (en) Computer power supply
CN104503556A (en) Air cooling and liquid cooling combination-based redundant backup server radiation system
TWM496156U (en) Heat dissipating structure of mobile electronic device
US20140334094A1 (en) Heat-Dissipation Structure and Electronic Apparatus Using the Same
US20120314366A1 (en) Electronic device
TWM468134U (en) Electronic device with rotatable circuit board
US20120134098A1 (en) Computing device thermal module
US8027160B2 (en) Heat sink including extended surfaces
US20150185793A1 (en) Heat dissipation structure of mobile device
CN207867432U (en) A kind of built-in heat radiator for notebook computer
TWI548977B (en) Electronic device and expansion device thereof
CN206162359U (en) Wireless network interface card with heat dissipation function
CN205581763U (en) Heat dissipation device of computer case
JP2000349482A (en) Electronic apparatus
CN212910505U (en) Intelligent device radiator
JP3144048U (en) Heat dissipation structure of electronic equipment

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees