TWM467878U - Interconnection structure and probe card structure using the same - Google Patents

Description

Interconnect structure and probe card structure using same

The present invention provides an interconnect structure and a probe card structure for use thereof, and more particularly, a modular interconnect structure for achieving excellent mechanical and electrical performance.

According to the general semiconductor chip and integrated circuit in the manufacturing process, in order to test the characteristics and parameters of the integrated circuit of each wafer, it will be connected to the devices under test (DUTs), so that each wafer needs to be used before cutting. The electrical interconnects are tested individually, mainly to ensure that the function of the integrated circuit is working properly. This test process should consider the chip design and density. It is obvious that the electrical interconnect must keep pace with the development of technology. .

In recent years, with the rapid growth of integrated circuit technology, the size of the semiconductor integrated circuit has been gradually reduced to obtain an increase in the unit area of the wafer and to increase the operating speed. In contrast, it is applied to at least two electrons. The electrical interconnects of the components also desire to achieve a smaller pitch, thereby developing a relatively tightly spaced contact pad. Furthermore, the space or pitch of the probe array must correspond to the electrical connection requirements of the contact pads or bumps. Increasingly, there is also an increasing demand for planarity.

However, if the electrical interconnects of the electronic components are inspected, if the pitch is too small, the operation speed, reliability and yield will be affected, and the above-mentioned slight defects may be solved by the license, but there is still no single electrical interconnection. The device is fully compliant with the requirements. In other words, the most urgent need for process technology to improve is the test equipment used at each electrical contact point on the semiconductor package to provide the required mechanical properties, such as springs. Force, compliance, and wiping action of the film removed from the surface of the contact pad or bump.

In view of this, the author has specially researched and improved the electrical interconnects of the conventional electronic components, and has improved the above problems with a better creation, and after a long period of research and development and continuous testing, the creation of this creation has begun.

The reason is that the purpose of this creation is to solve the limitations of the prior art. Our creators provide an interconnect structure and a probe card structure using the same, and when connected to the test equipment, the contact pads are dense with corresponding space or pitch. Or bumps, and indeed achieve good spring force, compliance and mechanical properties of the wiping action.

To achieve the above objects, our creators provide an interconnect structure comprising: at least one interconnecting member having a spacer and a plurality of first contact arms, the spacer comprising At least one sheet layer, a plurality of adhesive layers and a plurality of non-conductive layers, the sheet layer being located between the adhesive layers, and the adhesive layer is located between the non-conductive layers; the first contact arms are The extension extends from the spacer.

The interconnect structure according to the above, wherein the sheet layer comprises a conductive layer, and the first contact arms are integrally formed from the conductive layer, and the surface of the first contact arms is plated with a metal material.

According to the interconnect structure described above, the conductive layer material is selected from the group consisting of beryllium copper alloy, phosphor bronze, spring steel or nickel titanium alloy.

According to the interconnect structure described above, the metal material is selected from the group consisting of nickel, gold, palladium, rhodium or platinum.

According to the interconnect structure described above, wherein the first contact arms are reversed toward the spacer Extending the plurality of second contact arms.

According to the interconnection structure described above, the first contact arms are respectively formed from a joint segment, and the joint segments are arranged at intervals.

According to the interconnect structure described above, the two adjacent first contact arms are formed from a bonding section, and the bonding sections are arranged in a spaced arrangement.

According to the interconnection structure described above, the two adjacent first contact arms are formed from one joint segment, and the other first contact arm is formed from a joint segment, the joint segment and the joint segment They are arranged in intervals.

According to the above-mentioned interconnection structure, the first contact arm and the second contact arm are respectively formed with at least one bent portion, and a protrusion is formed at the top ends of the first contact arm and the second contact arm.

According to the interconnect structure described above, the first contact arms are spaced apart from the second contact arms by a different pitch.

According to the interconnect structure described above, the first contact arm and the second contact arm correspond to each other and are arranged at intervals.

According to the interconnect structure described above, the first contact arm and the second contact arm are respectively opposite to each other and arranged at intervals.

According to the interconnect structure described above, the first contact arm and the second contact arm are located in different planes.

According to the interconnect structure described above, wherein the interconnection elements are plural, the interconnection elements are stacked on each other and form an interconnection module.

In order to achieve the above objectives, our creators also provide an interconnection structure, which There is: at least one interconnecting component, the interconnecting component having at least two spacers and a plurality of third contact arms, the spacers being corresponding to each other and parallel, the spacers comprising at least one foil layer, a plurality of adhesive layers And a plurality of non-conductive layers, the sheet layer being located between the adhesive layers, and the adhesive layer is located between the non-conductive layers; the third contact arms are continuous with the spacers.

According to the interconnection structure described above, the sheet layer comprises a conductive layer, and the third contact arms are integrally formed from the conductive layer, and the surface of the third contact arms is plated with a metal material.

According to the interconnect structure described above, the third contact arms are bent such that the spacers are in different planes.

According to the interconnect structure described above, the third contact arms are respectively formed from a connecting segment, and the connecting segments are arranged in a spaced arrangement.

According to the interconnect structure described above, the two adjacent third contact arms are formed from a bonding section, and the bonding sections are arranged in a spaced arrangement.

According to the interconnect structure described above, the two adjacent third contact arms are formed from one joint segment, and the other third contact arm is formed from a joint segment, the joint segment and the joint segment They are arranged in intervals.

According to the interconnection structure described above, the third contact arm is formed with at least one bent portion, and a protrusion is formed at both ends of the third contact arm.

According to the interconnect structure described above, wherein the interconnection elements are plural, the interconnection elements are stacked on each other and form an interconnection module.

In order to achieve the above object, our creator provides a probe card structure comprising: a probe chip having a base body and an interconnect module disposed on the base body, the interconnect module The system includes a plurality of interconnecting elements having at least two spacers and a plurality of third contact arms, the spacers being corresponding to each other and parallel, the spacers comprising at least one sheet layer, a plurality of adhesive layers And a plurality of non-conductive layers, the sheet layer is located between the adhesive layers, and the adhesive layer is located between the non-conductive layers; the third contact arms are continuous with the spacers, and An interconnecting component is coupled to a device to be tested by one end of the third contact arm, and the other end of the third contact arm is coupled to a circuit board.

According to the probe card structure described above, the sheet layer comprises a conductive layer, and the third contact arms are integrally formed from the conductive layer, and the surface of the third contact arms is plated with a metal material.

According to the probe card structure described above, the third contact arms are bent such that the spacers are located in different planes.

According to the probe card structure described above, the device to be tested is provided with a plurality of first coupling points, and the circuit board is provided with a plurality of second coupling points, thereby defining that an interconnection component is located a first plane, and defining the first plane is a second plane, and the third contact arm is coupled to the first coupling point and the second coupling point is different from the second plane Pitch.

In order to achieve the above object, the creator further provides a probe card structure, comprising: a probe chip having a base body and a first interconnecting module disposed on the base body, the first The interconnect module includes at least one first interconnecting component, the first interconnecting component having a spacer and a plurality of first contact arms extending from the spacer in the same direction; and a The interposer has a frame and a second interconnect module disposed on the frame, the second interconnect module includes at least one second interconnecting component, and the second interconnecting component has a spacer member and a plurality of first contact arms extending in the same direction from the spacer and extending oppositely to the spacer a plurality of second contact arms; thereby, the first interconnecting module The first contact arm is coupled to the device to be tested, and the spacer is configured with a spacer transformer. The spacer transformer is coupled to the second interconnect module on the opposite side of the first interconnect module. The first contact arm, and the second interconnect module is coupled to a circuit board by using the second contact arm thereof.

The probe card structure according to the above, wherein the spacers of the first interconnecting member and the second interconnecting member respectively comprise at least one thin layer, a plurality of adhesive layers and a plurality of non-conductive layers, the thin layer Located between the adhesive layers, and the adhesive layer is between the non-conductive layers.

According to the probe card structure described above, the sheet layer comprises a conductive layer, and the first contact arm and the second contact arm are integrally formed from the conductive layer, and the first contact arm and the first contact arm The surface of the two contact arms is plated with a metallic material.

According to the probe card structure described above, the first contact arm of the second interconnect module and the second contact arm correspond to each other and are arranged at intervals.

With the above arrangement, compared with the prior art, the present invention mainly implements a modular interconnection structure according to user requirements, wherein the sheet layer, the adhesive layer and the non-conductive layer are both planar structures, and Resetting the number of layers of the sheet layer, the adhesive layer and the non-conductive layer repeatedly according to requirements, that is, the interconnecting elements are variable in size to form an interconnect module, and the interconnect module can further form a three-dimensional structure And applied to the probe card structure, which can be configured or not configured according to the use requirement, to be connected to the device to be tested for electrical testing, and further, the spacer can prevent the first contact arm, the first The second contact arm or the third contact arm is excessively bent and damaged when subjected to force. The present invention can also be applied to an electronic component, which has good mechanical and electrical properties, such as spring force, compliance, and removal from the contact pad or The wiping action of the film on the surface of the bump can greatly reduce the advantages and effects of the pitch.

The present invention is an interconnect structure and a probe card structure using the same, and its implementation means, features and functions, and several preferred embodiments are described in detail below with reference to the drawings. And agree with this creation.

First, referring to FIG. 1 to FIG. 13 , the present invention is mainly an interconnect structure. The steps of the manufacturing method of the present invention are as follows: forming at least one patterned region 2 on a conductive layer 1 , The patterned regions 2 are arranged in an array, and the patterned regions 2 have at least one confluence portion 21 and a contact structure 22, and the contact structure 22 includes first contacts respectively formed on both sides of the confluence portion 21. The first contact arm 221 and the second contact arm 222 are respectively formed with at least one bent portion 2211, 2221, and at the top of the first contact arm 221 and the second contact arm 222. Forming a protrusion portion 2212, 2222, wherein the material of the conductive layer 1 is selected from the group consisting of beryllium copper alloy, phosphor bronze, spring steel or nickel titanium alloy; a conductive layer 1 is correspondingly disposed with a mask layer 3, The mask layer 3 has a shielding area 31 corresponding to the confluence portion 21, and the corresponding contact structure 22 has a non-shielding area 32, and the surface of the contact structure 22 is plated with a metal material, that is, the first contact arm 221 and the The surface of the two contact arms 222 is plated with a metal material, The metal material is selected from the group consisting of nickel, gold, palladium, rhodium or platinum, and the electroplating system is composed of nickel/gold composition, nickel/gold/palladium/gold composition, nickel/gold/ruthenium composition, nickel/gold/platinum. The composition or other composition is taken as an example to form a thin layer 4; at least one first opening 51 is formed in a non-conductive layer 5, and the first opening 51 is made corresponding to the patterned region 2, and The material of the conductive layer 5 is selected from the group consisting of epoxy resin (FR4), polyimide or ceramic; and at least one second opening 61 is formed in an adhesive layer 6. The second opening 61 is made corresponding to the patterned region 2, and the second opening 61 is selected from a lathe processing process using a process;

Laminating the sheet layer 4, the adhesive layer 6 and the non-conductive layer 5 by sequentially stacking and using two corresponding pressing plates 7;

The contact structure 22 is singulated according to the first opening 51 and the second opening 61, and the confluence portion 21 is completely removed according to the shielding area 31 to form at least one connecting section 23, as shown in FIG. Generally, the singulation of the contact structure 22 is performed by using a process selected from an etching process, a stamping process, a laser process, or a drilling process, and after grinding through a lathe process, forming at least one interconnecting component 8 The interconnecting elements 8 should be arranged in an array as well. For the sake of clearly showing the structure of the interconnecting elements 8, only one of them is shown. It is specifically described, and in this step, according to the shielding area 31. Partially removing the confluence portion 21 to form at least one joint segment 24 and at least one joint segment 25, as shown in FIG. 9, the two adjacent first contact arms 221 are formed from a joint portion 25, and The other first contact arm 221 is formed from a connecting portion 24, and the connecting portion 25 and the connecting portion 24 are arranged at intervals. It is obvious that the connecting portion 24 and the connecting portion 25 can be configured according to the use requirements. .

Referring again to FIG. 10, according to the foregoing manufacturing method, an embodiment of the present invention provides an interconnection structure including:

At least one interconnecting member 8a having a spacer 81a, a plurality of first contact arms 82a and a plurality of second contact arms 83a, the spacer 81a comprising at least one foil layer 811a, a plurality of adhesive layers 812a and a plurality of non-conductive layers 813a, the sheet layer 811a is located between the adhesive layers 812a, and the sheet layer 811a comprises a conductive layer selected from the group consisting of beryllium copper alloy, phosphor bronze, and spring. a group of steel or nickel-titanium alloys, and the first contact arms 82a are integrally formed from the conductive layer, and the surface of the first contact arms 82a is plated with a metal material selected from the group consisting of nickel and gold. a group of palladium, rhodium or platinum, the adhesive layer 812a being located between the non-conductive layers 813a; the first contact arms 82a extending in the same direction from the spacer 81a; the second contact arms 83a is oppositely extended toward the spacer 81a. Further, the first contact arms 82a and the second contact arms 83a correspond to each other and are arranged at intervals. The first contact arm 82a and the second contact arm 83a are Forming at least one curved portion 821a, 831a, respectively, and at the first Contact tip 83a and the arm 82a forming the second contact arm has a projection 822a, 832a.

Next, please refer to FIG. 11 again, again according to the foregoing manufacturing method, another embodiment of the present invention provides an interconnection structure including at least one interconnection element 8b having the interconnection element 8b a spacer 81b, a plurality of first contact arms 82b and a plurality of second contact arms 83b, the spacer 81b includes at least one thin layer 811b, a plurality of adhesive layers 812b and a plurality of non-conductive layers 813b, the first contact arms 82b And the second contact arm 83b is respectively formed with at least one curved portion 821b, 831b, and a protruding portion 822b, 832b is formed at the top end of the first contact arm 82b and the second contact arm 83b, the difference mainly being:

The first contact arm 82b and the second contact arm 83b are respectively opposite to each other and arranged at intervals;

In practical applications, please refer to FIGS. 12A to 12C, regardless of the first contact arms 82a, 82b or the second contact arms 83a, 83b, the curved portions 841c, 841d, 841e and the protruding portions 842c, 842d, The 842e may be in a different state, and the first contact arms 82a, 82b and the second contact arms 83a, 83b have different pitches and may be respectively located on different planes to form a three-dimensional The structure, in terms of the steps of the manufacturing method, is such that the first contact arms 82a, 82b and the second contact arms 83a, 83b are located on different planes by bending the sheet layers 811a, 811b.

To be continued, please refer to Figures 13 and 14, which are a method of manufacturing an interconnect structure, the steps of which further include:

Repeatingly stacking the plurality of thin layer 811b, the adhesive layer 812b and the non-conductive layer 813b and forming an interconnection module 9, that is, the interconnection element 8b is plural, and the figure is drawn to have two corresponding first The contact arm 82b and the second contact arm 83b of the interconnection element 8b as an example, the interconnection elements 8b are stacked on each other and form the interconnection module 9;

A selected area 91 is defined in the interconnect module 9, and a probe wafer or an interposer is cut and formed according to the selected area 91.

There are two aspects to the application of this creation. The first aspect is shown in Fig. 15. One embodiment of the present invention provides a probe card structure, which includes:

a probe wafer 10 having a base body 101 and a first interconnect module disposed on the base body 101, the first interconnect module including at least one first interconnecting component 102, the first mutual The connecting member 102 has a spacer 1021 and a plurality of first contact arms 1022 extending from the spacer 1021 in the same direction;

An interposer 20 having a frame 201 and a second interconnect module disposed on the frame 201, the second interconnect module including at least one second interconnecting component 202, the second The interconnecting component 202 has a spacer 2021 and a plurality of first contact arms 2022. The first contact arms 2022 extend in the same direction from the spacer 2021 and extend in the opposite direction to the spacer 2021. ;

The first contact arm 1022 of the first interconnect module is coupled to a device under test 30, and the spacer 1021 is provided with a spacer transformer 40. The spacer transformer 40 is configured to form the first interconnect. The opposite side of the module is coupled to the first contact arm 2022 of the second interconnect module, and the second interconnect module is coupled to a circuit board 50 by the second contact arm 2023.

Next, in the second aspect, please refer to FIG. 16. Another embodiment of the present invention provides a probe card structure, which comprises:

A probe wafer 60 having a base 601 and an interconnect module disposed on the base 601, the interconnect module including a plurality of interconnecting elements 602 having at least two spacers 6021 and a plurality of third contact arms 6022, the spacers 6021 are corresponding to each other and parallel; the third contact arms 6022 are continuous with the spacers 6021, and an interconnecting component 602 is utilized by the third component One end of the contact arm 6022 is coupled to a device to be tested 70. The device to be tested 70 is provided with a plurality of first coupling points 701, and the other ends of the third contact arms 6022 are coupled to a circuit board 80. The circuit board 80 is provided with a plurality of second coupling points 801;

By way of example, the interconnecting component 602 is located in a first plane, and the first plane is defined as a second plane, and the third contact arm 6022 is coupled to the first coupling point 701 and the first The two coupling points 801 have different pitches in the second plane.

According to the above description, the first aspect is configured with a spacer transformer 40, and in the second aspect, the spacer transformer 40 is not disposed. First, in the first aspect, the X direction and the Y direction are defined. The first contact arm 1022 of an interconnecting component 102 has a first pitch P ₁ in the X direction, a second pitch P ₂ in the Y direction, and a second contact of the second interconnecting component 202 . The arm 2023 has a third pitch P ₃ in the X direction, and has a fourth pitch P ₄ in the Y direction. Therefore, the second interconnecting member 202 passes through the spacer transformer 40 to change the third. The pitch P _{3 is} the first pitch P ₁ , and the first aspect has a total of four coupling points; for the second aspect, the X direction and the Y direction are also defined, and the first is connected to the first The third contact arm 6022 of the coupling point 701 has a fifth pitch P ₅ in the X direction, and the third contact arm 6022 connected to the second coupling point 801 has a sixth section in the X direction. The distance P ₆ has a seventh pitch P ₇ in the Y direction, so that the sixth pitch P ₆ is directly changed by the third contact arm 6022 to be the fifth pitch P ₅ , which means The spacer transformer 40 is not required to be disposed in the first mode, and the second embodiment has only two coupling points of the first coupling point 701 and the second coupling point 801.

Referring to FIG. 17, another embodiment of the present invention provides an interconnection structure including:

At least one interconnecting member 602a having at least two spacers 6021a and a plurality of third contact arms 6022a, the spacers 6021a being corresponding to each other and parallel; the third contact arms 6022a being consecutively connected Spacer 6021a;

The interconnecting component 602a can also be coupled to a device to be tested 70a by one end of the third contact arm 6022a, and the other end of the third contact arm 6022a is coupled to a circuit board 80a.

Here, the creator needs to specify that the third contact arm 6022a is in the manufacturing method, and the step is the step of forming the patterned region, and further includes: the confluent portions are two corresponding and parallel a confluence portion, wherein the contact structure includes a third contact arm 6022a that is continuous with the confluence portions; and the sheet layer is bent such that the confluence portions are located on different planes, as shown in FIG. 18, The three contact arms 6022a are bent such that the spacers 6021a are located on different planes to form a three-dimensional structure, and the pitch of the third contact arms 6022a at different planes can be changed. In summary, the third The contact arm 6022a can form not only a different pitch in the X direction but also a three-dimensional structure and a different pitch in the Y direction.

Finally, referring to FIG. 19, the interconnect structure of the present invention is further coupled to the electronic component 100 by using the interconnecting component 8b, and the electronic component 100 is suitable for being mounted on a battery or a power transmitter. Preferably, the electrical connection effect;; as shown in Fig. 20, the different interconnecting elements respectively form contact structures of different shapes and are mutually plugged, the symbols are 22a to 22g, and 23a to 23g, which can be regarded as public Inserted into the female insert, and the 21A to 21F are used to visualize the mutual insertion and have different appearances.

Looking at the above, the technical means exposed in this creation is not only unprecedented, but also achieves the intended purpose and effect, so it is both novel and progressive. It is a new type of patent law that is called the whole. In terms of structure, it has indeed met the statutory requirements of the Patent Law and has filed a new type of patent application in accordance with the law.

However, the above descriptions are only preferred embodiments of the present invention, and should not be used as a limitation to the scope of implementation of the creation, that is, the equivalent changes and modifications made by the applicant in accordance with the scope of the patent application and the contents of the specification should still be Belonging to the scope covered by this creation patent.

[this creation]

(1) ‧‧‧ Conductive layer
(2) ‧‧‧patterned areas
(21) ‧ ‧ Confluence Department
(22) ‧‧‧Contact structure
(23, 24) ‧ ‧ link segment
(25) ‧ ‧ joint section
(221)‧‧‧First contact arm
(222)‧‧‧Second contact arm
(2211, 2221) ‧ ‧ bending
(2212, 2222) ‧ ‧ protruding parts
(3) ‧ ‧ mask layer
(31)‧‧‧Shaded area
(32) ‧‧‧Unshielded areas
(4) ‧ ‧ sheet layer
(5) ‧ ‧ non-conductive layer
(51) ‧ ‧ first opening
(6) ‧ ‧ adhesive layer
(61) ‧ ‧ second opening
(7) ‧‧‧Pressure plate
(8, 8a) ‧‧‧Interconnect components
(81a) ‧‧‧ spacers
(811a)‧‧‧Sheet
(812a) ‧‧‧Adhesive layer
(813a)‧‧‧ Non-conductive layer
(82a)‧‧‧First contact arm
(83a) ‧‧‧second contact arm
(821a, 831a) ‧ ‧ bending
(822a, 832a) ‧ ‧ protruding parts
(8b)‧‧‧Interconnect components
(81b) ‧‧‧ spacers
(811b)‧‧‧Sheet
(812b)‧‧‧Adhesive layer
(813b)‧‧‧ Non-conductive layer
(82b)‧‧‧First contact arm
(83b)‧‧‧second contact arm
(821b, 831b) ‧ ‧ bending
(822b, 832b) ‧ ‧ highlights
(841c, 841d, 841e) ‧ ‧ bending
(842c, 842d, 842e) ‧ ‧ s
(9)‧‧‧Interconnect modules
(91)‧‧‧ Selected areas
(10)‧‧‧ probe wafer
(101) ‧ ‧ base
(102)‧‧‧First interconnected components
(1021) ‧‧‧ spacers
(1022)‧‧‧First contact arm
(20) ‧‧‧Intermediary
(201)‧‧‧Box
(202)‧‧‧Second interconnected components
(2021) ‧‧‧ spacers
(2022)‧‧‧First contact arm
(2023) ‧‧‧second contact arm
(30) ‧‧‧ components to be tested
(40) ‧‧‧Interval transformer
(50)‧‧‧ boards
(60)‧‧‧ probe wafer
(601) ‧ ‧ base
(602)‧‧‧Interconnect components
(6021) ‧‧‧ spacers
(6022) ‧‧ Third contact arm
(70) ‧‧‧ components to be tested
(701)‧‧‧First coupling point
(80)‧‧‧ boards
(801)‧‧‧Second coupling point
(602a)‧‧‧Interconnect components
(6021a) ‧‧‧ spacers
(6022a) ‧‧‧ third contact arm
(70a) ‧‧‧ components to be tested
(80a)‧‧‧ boards
(100)‧‧‧Electronic components
(22a, 22b, 22c, 22d, 22e, 22f, 22g) ‧ ‧ contact structure
(23a, 23b, 23c, 23d, 23e, 23f, 23g) ‧ ‧ contact structure

[Fig. 1] is a schematic view showing the formation of a conductive layer in the manufacturing method of the present invention.

[Fig. 2] A stacking diagram of a sheet layer, an adhesive layer, and a non-conductive layer in the manufacturing method of the present invention.

[Fig. 3] is an enlarged schematic view showing a partial structure of a sheet layer of the manufacturing method of the present invention.

[Fig. 4] is a schematic view showing the lamination of a pressure plate in the manufacturing method of the present invention.

[Fig. 5] is a schematic view showing the formation of a singular contact structure of the manufacturing method of the present invention.

[Fig. 6] is an enlarged schematic view showing a partial structure of Fig. 5.

[Fig. 7] is a schematic diagram showing the formation of a joining section of the manufacturing method of the present invention.

[Fig. 8] is a schematic structural view of one of the interconnection elements of the manufacturing method of the present invention.

[Fig. 9] is another schematic structural view of an interconnection element of the manufacturing method of the present invention.

[Fig. 10] is a perspective view of a stereoscopic appearance of an embodiment of the present invention.

[Fig. 11] is a perspective view showing a stereoscopic appearance of another embodiment of the present creation.

[Fig. 12A to Fig. 12C] The contact structure of the present invention has a schematic diagram of a different state.

[Fig. 13] is a schematic diagram showing the formation of an interconnection module of the manufacturing method of the present invention.

[Fig. 14] is a schematic view of a probe wafer or an interposer made by the present invention.

[Fig. 15] is a schematic view showing the structure of a probe card of an embodiment of the present invention.

[Fig. 16] Fig. 16 is a schematic view showing the structure of a probe card of another embodiment of the present invention.

[Fig. 17] Fig. 17 is a schematic view showing the structure of a probe card of still another embodiment of the present invention.

[Fig. 18] This is a schematic diagram of the three-dimensional structure further formed in Fig. 17.

[Fig. 19] is a schematic diagram of coupling to an electronic component according to another embodiment of the present creation.

[Fig. 20] is a schematic diagram of the interconnection of the interconnection elements of the present invention.

[21A to 21F] The interconnection elements of the present invention are interposed and have different patterns.

(8a)‧‧‧Interconnect components

(81a) ‧‧‧ spacers

(811a)‧‧‧Sheet

(812a) ‧‧‧Adhesive layer

(813a)‧‧‧ Non-conductive layer

(82a)‧‧‧First contact arm

(83a) ‧‧‧second contact arm

(821a, 831a) ‧ ‧ bending

(822a, 832a) ‧ ‧ protruding parts

Claims (30)

An interconnect structure comprising: at least one interconnecting component, the interconnecting component having a spacer and a plurality of first contact arms, the spacer comprising at least one foil layer, a plurality of adhesive layers, and a plurality of non-components a conductive layer, the thin layer is located between the adhesive layers, and the adhesive layer is located between the non-conductive layers; the first contact arms extend in the same direction from the spacer. The interconnecting structure of claim 1, wherein the sheet layer comprises a conductive layer, and the first contact arms are integrally formed from the conductive layer on the surface of the first contact arms. Electroplated with metal material. The interconnect structure of claim 2, wherein the conductive layer material is selected from the group consisting of beryllium copper alloy, phosphor bronze, spring steel or nickel titanium alloy. The interconnect structure of claim 2, wherein the metal material is selected from the group consisting of nickel, gold, palladium, rhodium or platinum. The interconnect structure of claim 1, wherein the first contact arms extend a plurality of second contact arms in a reverse direction toward the spacer. The interconnecting structure of claim 1, wherein the first contact arms are respectively formed from a connecting segment, and the connecting segments are arranged at intervals. The interconnect structure of claim 1, wherein the two adjacent first contact arms are formed from a bonding segment, and the bonding segments are arranged in a spaced arrangement. The interconnecting structure of claim 1, wherein the two adjacent first contact arms are formed from a joint segment and the other first contact arm is formed from a joint segment, The joint section and the joint section are arranged at intervals. The interconnect structure of claim 5, wherein the first contact arm and The second contact arm is respectively formed with at least one bent portion, and a protrusion is formed at the top end of the first contact arm and the second contact arm. The interconnect structure of claim 5, wherein the first contact arms have a different pitch from the second contact arms. The interconnect structure of claim 5, wherein the first contact arm and the second contact arm correspond to each other and are arranged at intervals. The interconnecting structure of claim 5, wherein the first contact arm and the second contact arm are respectively opposite to each other and arranged at intervals. The interconnect structure of claim 5, wherein the first contact arm and the second contact arm are located in different planes. The interconnect structure of any one of claims 1 to 13, wherein the interconnecting elements are plural, and the interconnecting elements are stacked on each other and form an interconnecting module. An interconnect structure comprising: at least one interconnecting member having at least two spacers and a plurality of third contact arms, the spacers being corresponding to each other and parallel, the spacers comprising Having at least one foil layer, a plurality of adhesive layers, and a plurality of non-conductive layers, the foil layers being located between the adhesive layers, and the adhesive layer is located between the non-conductive layers; the third contact arm systems Coherently the spacers. The interconnecting structure of claim 15, wherein the sheet layer comprises a conductive layer, and the third contact arm is integrally formed from the conductive layer, and is plated on the surface of the third contact arm. There are metal materials. The interconnect structure of claim 15 wherein the third contact arms are bent such that the spacers are in different planes. The interconnect structure of claim 15, wherein the third contact arm They are respectively formed from a joint segment, and the joint segments are arranged at intervals. The interconnecting structure of claim 15, wherein the two adjacent third contact arms are formed from a bonding section, and the bonding sections are arranged in a spaced arrangement. The interconnecting structure of claim 15, wherein the two adjacent third contact arms are formed from one joint segment and the other third contact arm is formed from a joint segment, The joint section and the joint section are arranged at intervals. The interconnecting structure of claim 15, wherein the third contact arm is formed with at least one bent portion, and a protruding portion is formed at both ends of the third contact arm. The interconnection structure according to any one of claims 15 to 21, wherein the interconnection elements are plural, and the interconnection elements are stacked on each other and form an interconnection module. A probe card structure comprising: a probe wafer having a substrate and an interconnection module disposed on the substrate, the interconnection module comprising a plurality of interconnection elements, the interconnection element Having at least two spacers and a plurality of third contact arms, the spacers are corresponding to each other and parallel, the spacers comprising at least one sheet layer, a plurality of adhesive layers and a plurality of non-conductive layers, the sheet layers are located Between the adhesive layers, and the adhesive layer is located between the non-conductive layers; the third contact arms are continuous with the spacers, and an interconnecting component thereof utilizes the third contacts One end of the arm is coupled to a device to be tested, and the other end of the third contact arm is coupled to a circuit board. The probe card structure of claim 23, wherein the sheet layer comprises a conductive layer, the third contact arms are integrally formed from the conductive layer, and the third contact arm surface is Electroplated with metal material. The probe card structure of claim 23, wherein the third contact arms are bent such that the spacers are located in different planes. The probe card structure of claim 23, wherein the device to be tested is provided with a plurality of first coupling points, and the circuit board is provided with a plurality of second coupling points, thereby defining the first The interconnecting component is located in a first plane, and defines a first plane perpendicular to the first plane, and the third contact arm is coupled to the first coupling point and the second coupling point. The two planes have different pitches. A probe card structure comprising: a probe chip having a base body and a first interconnect module disposed on the base body, the first interconnect module comprising at least one first interconnect The first interconnecting component has a spacer and a plurality of first contact arms extending from the spacer in the same direction; and an intermediate member having a frame and a setting a second interconnect module of the frame, the second interconnect module includes at least one second interconnecting component, the second interconnecting component having a spacer and a plurality of first contact arms, The first contact arm extends from the spacer in the same direction, and the plurality of second contact arms are oppositely extended toward the spacer; the first contact arm of the first interconnect module is coupled to a device to be tested. And the spacer is configured with a spacer transformer, the spacer transformer is coupled to the first contact arm of the second interconnect module on the opposite side of the first interconnect module, and the second interconnect mode The group is coupled to a circuit board by its second contact arm. The probe card structure of claim 27, wherein the spacers of the first interconnecting component and the second interconnecting component respectively comprise at least one thin layer, a plurality of adhesive layers and a plurality of non-conductive layers The sheet layer is located between the adhesive layers, and the adhesive layer is located between the non-conductive layers. The probe card structure of claim 28, wherein the sheet layer comprises a conductive layer, and the first contact arm and the second contact arm are integrally formed from the conductive layer. A contact arm and a surface of the second contact arm are plated with a metal material. The probe card structure of claim 27, wherein the first contact arm of the second interconnect module and the second contact arm correspond to each other and are arranged at intervals.