TWM466754U - Substrate retaining ring having slip-guiding gaining function - Google Patents

Description

Substrate retaining ring with guide slip gain function

The present invention relates to a substrate holding ring, and more particularly to an innovative substrate retaining ring structure with a sliding gain function.

Press, the substrate retaining ring is also commonly referred to as a wafer grinding positioning ring, which is a unit component in the structure of the wafer grinder, and its function is mainly to limit the wafer to be polished.

The substrate holding ring is assembled in a state in which the bottom end of a rotating head disposed on the upper portion of the wafer grinder is in a movable state, and wherein the rotating head structure is designed to perform a rotary motion. The vertical direction is also floatable by the configuration of the air floating mechanism, so that the substrate retaining ring assembled at the bottom end of the rotating head also floats up and down. However, in the conventional structure, The substrate retaining ring has the following problems and disadvantages in the process of floating up and down: because the outer side of the substrate holding ring is usually bounded by a ring frame assembled on the outer side of the rotating head, and the ring is The frame and the substrate holding ring are only in frictional contact relationship with each other, and are not fixed to each other. Therefore, when the substrate holding ring floats up and down, the outer side of the substrate holding ring will have a certain degree of friction with the inner wall of the ring frame. Phenomenon, at this time, since the structure of the substrate holding ring itself is usually composed of polymer plastic, the plasticity of the surface does not have a good smoothness (or a low coefficient of friction), so it is still between the inner wall of the ring frame. The method achieves a better smoothing state. As a result, the substrate holding ring is prone to stagnation and horizontal deviation during the up and down floating process, and the higher the frequency of occurrence of such a state, the direct influence on the crystal Precision and product of round grinding operation Quality, this is an important part of the wafer polishing process that cannot be ignored. The reason is that the cost of wafer grinding operations is expensive, that is, whether the fine precision can have a high achievement rate.

Therefore, in view of the problems existing in the above-mentioned conventional substrate retention ring structure, how to develop an innovative structure that is more ideal and practical, and the related industry must further strive to develop the breakthrough goal and direction.

In view of this, the creator has been engaged in the manufacturing development and design experience of related products for many years. After the detailed design and careful evaluation of the above objectives, the creator will have a practical and practical creation.

The main purpose of this creation is to provide a substrate retaining ring with a sliding gain function. The technical problem to be solved is to think about how to develop a new type of substrate retaining ring structure with more ideal practicability. breakthrough.

The technical feature of the present invention is mainly that the substrate holding ring comprises a ring-shaped frame formed by a polymer plastic material, and the annular frame body comprises an assembly surface, a polishing surface, and a wafer limit side. On the outer peripheral side, the assembly surface is provided with a positioning screw hole of the spacer ring row, and an annular recessed groove which is concave in the lateral direction is provided at a height position on the outer peripheral side, and a soft rubber ring is assembled and positioned in the annular recessed groove. The soft rubber ring comprises an inner edge of the insert, an outer edge of the protrusion and a meandering section, wherein the inner edge of the insert is positioned in the annular recessed groove by the embedded group, and the outer edge of the convex protrusion is in the form of a toroidal expansion type. An outer circumference of the outer peripheral side; and wherein an annular groove is formed in the laterally concave portion of the outer peripheral side of the annular recessed groove, and a guide sliding gain element is embedded in the annular groove. The guide-sliding gain element has an annular guide surface that is flush with the outer peripheral side of the annular frame, and the friction coefficient of the annular guide surface is relatively smaller than the friction coefficient of the outer circumference of the annular frame.

With this innovative and unique design, this creation is compared with the prior art, when the substrate holding ring is assembled to the rotating head of the existing wafer grinding machine. The outer side of the substrate holding ring can achieve a smoother and unobstructed sliding-sliding gain function between the annular sliding surface of the sliding-gaining element and the inner wall of the ring frame provided by the rotating head, thereby improving the wafer grinding operation. Practical advancement of precision and quality and better industrial utilization.

A‧‧‧ substrate retention ring

10‧‧‧Ring-shaped frame

11‧‧‧ Assembly surface

12‧‧‧Grinding surface

13‧‧‧ Wafer Limit Side

14‧‧‧ peripheral side

15‧‧‧ Positioning screw holes

16‧‧‧ring recessed groove

17‧‧‧ annular groove

173‧‧‧ditch

18‧‧‧ trench

19‧‧‧Assembled guide holes

20‧‧‧Soft rubber ring

21‧‧‧Inset inner edge

22‧‧‧ protruding outer edge

23‧‧‧Zigzag

30‧‧‧Sliding gain element

301‧‧‧unit components

31‧‧‧Circular guide surface

32‧‧‧ Inserts

40‧‧‧Rotating head

41‧‧‧ ring frame

42‧‧‧ inner wall

Fig. 1 is a perspective view showing a combination of a preferred embodiment of the substrate holding ring structure of the present invention.

Fig. 2 is a perspective view showing a combination of a bottom view angle of a preferred embodiment of the present invention.

Fig. 3 is an exploded perspective view showing the structure of the substrate holding ring structure of the present invention.

Figure 4 is a partial enlarged view of the guide sliding gain element of the present invention.

Fig. 5 is a vertical sectional view showing a partial structure of the substrate holding ring of the present invention.

Fig. 6 is a schematic view showing the application state of the present invention in which the substrate holding ring is assembled to the rotary head of the wafer grinding machine.

Please refer to FIGS. 1 to 5 for a preferred embodiment of the substrate retaining ring having the function of guiding the sliding gain. However, these embodiments are for illustrative purposes only and are not limited by the structure in the patent application. . The substrate holding ring A comprises an annular frame 10 composed of a polymer plastic material, and the annular frame 10 includes an assembly surface 11 , a polishing surface 12 , a wafer limiting side 13 and an outer circumference. Side 14 , wherein the assembly surface 11 is provided with a positioning screw hole 15 of the spacer ring row, and the outer circumferential side 14 is provided with an annular recessed groove 16 which is concave in the lateral direction at a height position, and the annular recessed groove 16 16Assemble and position a soft rubber ring 20, the soft rubber ring 20 includes an embedded inner edge 21, a convex outer edge 22, and a meandering segment formed between the inner edge 21 and the convex outer edge 22. 23, wherein the inner edge 21 of the insert is positioned in the annular recessed groove 16 by an embedded group The convex outer edge 22 protrudes from the outer circumference of the outer peripheral side 14 in a toroidal expansion pattern; and wherein the outer peripheral side 14 has a laterally inwardly spaced position above the annular recessed groove 16 A concave annular groove 17 is defined in the circular groove 17 and a guide sliding gain member 30 is disposed. The sliding guide gain member 30 has an annular sliding surface 31 and an outer peripheral side of the annular frame 10. 14 is in a flush joint relationship, and the friction coefficient of the annular guide surface 31 is relatively smaller than the friction coefficient of the outer peripheral side 14 of the annular frame 10.

With the above structural composition design, as shown in FIG. 6, when the substrate holding ring A is assembled to the rotary head 40 of the existing wafer grinding machine, the outer side edge 14 of the substrate holding ring A is floated up and down (eg, During the process of the arrow L1, a more smooth and unobstructed guide-slip gain function can be achieved between the annular guide surface 31 of the guide-sliding gain member 30 and the inner wall 42 of the ring frame 41 provided by the rotary head 40.

The guide gain element 30 may be made of ceramic or Teflon material so that the friction coefficient of the annular guide surface 31 can be relatively smaller than the friction coefficient of the outer peripheral side 14 of the annular frame 10.

As shown in Figures 3 and 4, wherein the guide-slip gain element 30 can be assembled by at least two unit assemblies 301, 301 to form a ring-shaped pattern.

For example, as shown in FIGS. 4 and 5, the upper and lower sides of the guide-sliding gain member 30 are relatively convexly provided with the molding 32 so that the upper and lower sides of the annular groove 17 are provided on the outer peripheral side 14 of the annular frame 10. The corresponding recess is provided with a recess 173 which can be engaged with the insert.

The polishing surface 12 of the annular frame 10 may be provided with a groove 18 of a spacer ring array (as shown in FIGS. 1 to 4), and each groove 18 is transversely penetrated through the crystal of the annular frame 10. The circular limit side 13 and the outer peripheral side 14 are provided. The function of the trench 18 is mainly to discharge the slurry accumulated inside the annular frame 10 during the wafer polishing operation.

In addition, the assembly surface 11 of the annular frame 10 is at the quarter point of the assembly surface 11 except for the positioning screw holes 15 of the spacer ring row. The assembly can be provided with four assembly guide holes 19 (only shown in FIG. 1), and the assembly guide holes 19 function mainly as an orientation matching structure when the substrate holding ring A is assembled.

Efficacy description:

The "substrate retaining ring with a guide-sliding gain function" disclosed in the present invention mainly has an annular groove at an interval above the annular recessed groove on the outer peripheral side of the annular frame to define the guide-sliding gain. The innovative unique structural form and technical characteristics of the element, and the frictional coefficient of the annular sliding surface of the guiding and sliding gain element is relatively smaller than the outer peripheral side friction coefficient of the annular frame, so that the creation is compared with the conventional structure proposed by the prior art. When the substrate holding ring is assembled to the rotating head of the existing wafer grinding machine, the outer side of the substrate holding ring can pass between the annular sliding surface of the guiding and sliding gain element and the inner wall of the ring frame provided by the rotating head. A smoother and more unobstructed guide-slip gain function is achieved, thereby achieving practical advancement and better industrial utilization benefits for improving the accuracy and quality of wafer grinding operations.

The person disclosed in the above embodiment is used to specify the creation However, although the text is explained by specific terms, it is not possible to limit the scope of patents of this new creation; those who are familiar with the technical field can change and modify them after understanding the spirit and principles of the creation. The purpose of this change, and such changes and modifications, should be covered in the scope defined by the scope of the patent application as described later.

A‧‧‧ substrate retention ring

10‧‧‧Ring-shaped frame

11‧‧‧ Assembly surface

12‧‧‧Grinding surface

13‧‧‧ Wafer Limit Side

14‧‧‧ peripheral side

16‧‧‧ring recessed groove

17‧‧‧ annular groove

173‧‧‧ditch

18‧‧‧ trench

20‧‧‧Soft rubber ring

21‧‧‧Inset inner edge

22‧‧‧ protruding outer edge

23‧‧‧Zigzag

30‧‧‧Sliding gain element

31‧‧‧Circular guide surface

32‧‧‧ Inserts

Claims (5)

A substrate retaining ring having a sliding-sliding gain function, the substrate retaining ring comprising a ring-shaped frame formed of a polymer plastic material, the annular frame body comprising an assembly surface, an abrasive surface, and a wafer limit a side and an outer peripheral side, wherein the assembly surface is provided with a positioning screw hole of the spacer ring row, and the outer peripheral side is provided with an annular recessed groove which is concave in the lateral direction at a height position, and is assembled in the annular recessed groove Positioning a soft apron, the soft apron comprising an inner edge of the insert, a convex outer edge, and a meandering segment formed between the inner edge of the inner panel and the outer edge of the protruding portion, wherein the inner edge of the inner layer The outer edge of the convex protrusion is protruded from the outer circumference of the outer circumferential side in a toroidal expansion pattern; and wherein the outer circumferential side of the annular recessed groove is further disposed at a position above the annular recessed groove An annular groove recessed laterally inwardly, and a guide sliding gain element is embedded in the annular groove, the guide sliding gain element having an annular guide surface and an outer peripheral side of the annular frame In a flush relationship, and the friction coefficient of the annular guide surface is relatively smaller than a circle The coefficient of friction of the outer peripheral side of the frame; thereby, when the substrate retaining ring is assembled for use in the rotary head of the existing wafer grinder, the outer side of the substrate retaining ring can pass through the annular guide surface of the guide-sliding gain element The inner wall of a ring frame provided by the rotary head has a smooth and unobstructed guide sliding gain function. The substrate retaining ring having the sliding-sliding gain function as claimed in claim 1, wherein the guiding-sliding gain element is made of ceramic or Teflon material, so that the friction coefficient of the annular sliding surface can be relatively smaller. The coefficient of friction of the outer circumference of the annular frame. The substrate holding ring with a guide sliding gain function according to claim 2, wherein the sliding-sliding gain element is assembled by at least two units to form a ring-shaped type. The substrate holding ring with the guiding and sliding gain function as claimed in claim 3, wherein the upper and lower sides of the guiding and sliding gain element are oppositely convexly provided with a molding strip so that the annular groove of the outer circumference of the annular frame is arranged The side corresponding recess is provided with a recess that can be engaged with the insert. The substrate holding ring with a guide sliding gain function according to claim 4, wherein the grinding surface of the annular frame body is provided with a groove of a spacer ring, and each groove is a crystal which penetrates the annular frame transversely. Round limit side and outer circumference side.