TWM466754U - Substrate retaining ring having slip-guiding gaining function - Google Patents
Substrate retaining ring having slip-guiding gaining function Download PDFInfo
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- TWM466754U TWM466754U TW102215091U TW102215091U TWM466754U TW M466754 U TWM466754 U TW M466754U TW 102215091 U TW102215091 U TW 102215091U TW 102215091 U TW102215091 U TW 102215091U TW M466754 U TWM466754 U TW M466754U
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Description
本創作係有涉及一種基板保持環,特別是指一種具導滑增益功能之創新基板保持環結構型態。The present invention relates to a substrate holding ring, and more particularly to an innovative substrate retaining ring structure with a sliding gain function.
按,基板保持環一般又稱為晶圓研磨定位環,為晶圓研磨機結構中的一個單元組件,其功用主要係藉以限位欲進行研磨的晶圓片。Press, the substrate retaining ring is also commonly referred to as a wafer grinding positioning ring, which is a unit component in the structure of the wafer grinder, and its function is mainly to limit the wafer to be polished.
所述基板保持環於使用狀態下,係被組裝於晶圓研磨機上部所設一旋轉頭底端呈可與之同動狀態,而其中該旋轉頭結構設計上除了可進行旋轉運動之外,其垂直方向亦藉由氣浮機構的配置而具有可上下浮動性,如此一來,造成組裝於該旋轉頭底端的基板保持環亦會隨之上下浮動,然而,就目前習知結構型態而言,該基板保持環於上下浮動過程中係存在下述問題與缺弊:因為該基板保持環的外側邊通常係藉由旋轉頭外側所組裝的一環框加以框圍限位,且該環框與基板保持環之間僅為相互磨擦接觸關係,並未相互結合固定,是以,當基板保持環上下浮動時,基板保持環的外側邊會與該環框內壁產生一定程度的摩擦現象,此時由於基板保持環本身結構通常為高分子塑膠構成,其表面的塑料質性並不具較佳光滑度(或稱較低摩擦係數),故與環框內壁之間尚無法達到較佳的滑順配合狀態,如此一來,造成基板保持環於上下浮動過程中容易發生卡動不順、水平度偏差等狀態,而此種狀態的發生頻率越高,勢必直接影響到晶圓研磨作業的精度與品 質,此顯為晶圓研磨製程中不可被忽視的一個重要環節,概因,晶圓研磨作業的成本之所以昂貴,即在於其細微精度能否有高達成率的部份。The substrate holding ring is assembled in a state in which the bottom end of a rotating head disposed on the upper portion of the wafer grinder is in a movable state, and wherein the rotating head structure is designed to perform a rotary motion. The vertical direction is also floatable by the configuration of the air floating mechanism, so that the substrate retaining ring assembled at the bottom end of the rotating head also floats up and down. However, in the conventional structure, The substrate retaining ring has the following problems and disadvantages in the process of floating up and down: because the outer side of the substrate holding ring is usually bounded by a ring frame assembled on the outer side of the rotating head, and the ring is The frame and the substrate holding ring are only in frictional contact relationship with each other, and are not fixed to each other. Therefore, when the substrate holding ring floats up and down, the outer side of the substrate holding ring will have a certain degree of friction with the inner wall of the ring frame. Phenomenon, at this time, since the structure of the substrate holding ring itself is usually composed of polymer plastic, the plasticity of the surface does not have a good smoothness (or a low coefficient of friction), so it is still between the inner wall of the ring frame. The method achieves a better smoothing state. As a result, the substrate holding ring is prone to stagnation and horizontal deviation during the up and down floating process, and the higher the frequency of occurrence of such a state, the direct influence on the crystal Precision and product of round grinding operation Quality, this is an important part of the wafer polishing process that cannot be ignored. The reason is that the cost of wafer grinding operations is expensive, that is, whether the fine precision can have a high achievement rate.
是以,針對上述習知基板保持環結構所存在之問題點,如何開發一種更具理想實用性之創新結構,實係相關業者須再努力研發突破之目標及方向。Therefore, in view of the problems existing in the above-mentioned conventional substrate retention ring structure, how to develop an innovative structure that is more ideal and practical, and the related industry must further strive to develop the breakthrough goal and direction.
有鑑於此,創作人本於多年從事相關產品之製造開發與設計經驗,針對上述之目標,詳加設計與審慎評估後,終得一確具實用性之本創作。In view of this, the creator has been engaged in the manufacturing development and design experience of related products for many years. After the detailed design and careful evaluation of the above objectives, the creator will have a practical and practical creation.
本創作之主要目的,係在提供一種具導滑增益功能之基板保持環,其所欲解決之技術問題,係針對如何研發出一種更具理想實用性之新式基板保持環結構為目標加以思索創新突破。The main purpose of this creation is to provide a substrate retaining ring with a sliding gain function. The technical problem to be solved is to think about how to develop a new type of substrate retaining ring structure with more ideal practicability. breakthrough.
本創作解決問題之技術特點,主要在於所述基板保持環係包括高分子塑膠材料所構成之一圓環狀框體,該圓環狀框體包括有組裝面、研磨面、晶圓限位側及外周側,該組裝面設有間隔環列的定位螺孔,外周側一高度位置處設有呈橫側向內凹的環形嵌凹溝,並於環形嵌凹溝組裝定位一軟質膠圈,該軟質膠圈包括嵌組內緣、凸伸外緣及曲摺段,該嵌組內緣係藉以嵌組定位於環形嵌凹溝中,凸伸外緣則呈環面擴增型態凸伸於外周側的外周;且其中,外周側的環形嵌凹溝上方間隔位置處更設有呈橫側向內凹的一環形凹槽,並於環形凹槽中嵌組定位一導滑增益元件,該導滑增益元件具有一環形導滑面與圓環狀框體的外周側呈平齊銜接關係,且令環形導滑面的摩擦係數相對小於圓環狀框體外周側的摩擦係數。The technical feature of the present invention is mainly that the substrate holding ring comprises a ring-shaped frame formed by a polymer plastic material, and the annular frame body comprises an assembly surface, a polishing surface, and a wafer limit side. On the outer peripheral side, the assembly surface is provided with a positioning screw hole of the spacer ring row, and an annular recessed groove which is concave in the lateral direction is provided at a height position on the outer peripheral side, and a soft rubber ring is assembled and positioned in the annular recessed groove. The soft rubber ring comprises an inner edge of the insert, an outer edge of the protrusion and a meandering section, wherein the inner edge of the insert is positioned in the annular recessed groove by the embedded group, and the outer edge of the convex protrusion is in the form of a toroidal expansion type. An outer circumference of the outer peripheral side; and wherein an annular groove is formed in the laterally concave portion of the outer peripheral side of the annular recessed groove, and a guide sliding gain element is embedded in the annular groove. The guide-sliding gain element has an annular guide surface that is flush with the outer peripheral side of the annular frame, and the friction coefficient of the annular guide surface is relatively smaller than the friction coefficient of the outer circumference of the annular frame.
藉此創新獨特設計,使本創作對照先前技術而言,當基板保持環組裝於既有晶圓研磨機之旋轉頭使用 時,基板保持環的外側邊能夠通過該導滑增益元件的環形導滑面與旋轉頭所設環框內壁之間獲致更加滑順無阻之導滑增益功能,進而達到提昇晶圓研磨作業精度與品質之實用進步性與較佳產業利用效益。With this innovative and unique design, this creation is compared with the prior art, when the substrate holding ring is assembled to the rotating head of the existing wafer grinding machine. The outer side of the substrate holding ring can achieve a smoother and unobstructed sliding-sliding gain function between the annular sliding surface of the sliding-gaining element and the inner wall of the ring frame provided by the rotating head, thereby improving the wafer grinding operation. Practical advancement of precision and quality and better industrial utilization.
A‧‧‧基板保持環A‧‧‧ substrate retention ring
10‧‧‧圓環狀框體10‧‧‧Ring-shaped frame
11‧‧‧組裝面11‧‧‧ Assembly surface
12‧‧‧研磨面12‧‧‧Grinding surface
13‧‧‧晶圓限位側13‧‧‧ Wafer Limit Side
14‧‧‧外周側14‧‧‧ peripheral side
15‧‧‧定位螺孔15‧‧‧ Positioning screw holes
16‧‧‧環形嵌凹溝16‧‧‧ring recessed groove
17‧‧‧環形凹槽17‧‧‧ annular groove
173‧‧‧嵌溝173‧‧‧ditch
18‧‧‧溝槽18‧‧‧ trench
19‧‧‧組裝導引孔19‧‧‧Assembled guide holes
20‧‧‧軟質膠圈20‧‧‧Soft rubber ring
21‧‧‧嵌組內緣21‧‧‧Inset inner edge
22‧‧‧凸伸外緣22‧‧‧ protruding outer edge
23‧‧‧曲摺段23‧‧‧Zigzag
30‧‧‧導滑增益元件30‧‧‧Sliding gain element
301‧‧‧單元組件301‧‧‧unit components
31‧‧‧環形導滑面31‧‧‧Circular guide surface
32‧‧‧嵌條32‧‧‧ Inserts
40‧‧‧旋轉頭40‧‧‧Rotating head
41‧‧‧環框41‧‧‧ ring frame
42‧‧‧內壁42‧‧‧ inner wall
第1圖係本創作基板保持環結構較佳實施例之俯視角度組合立體圖。Fig. 1 is a perspective view showing a combination of a preferred embodiment of the substrate holding ring structure of the present invention.
第2圖係本創作基板保持環結構較佳實施例之仰視角度組合立體圖。Fig. 2 is a perspective view showing a combination of a bottom view angle of a preferred embodiment of the present invention.
第3圖係本創作基板保持環結構較佳實施例之構件分解立體圖。Fig. 3 is an exploded perspective view showing the structure of the substrate holding ring structure of the present invention.
第4圖係本創作之導滑增益元件局部立體放大圖。Figure 4 is a partial enlarged view of the guide sliding gain element of the present invention.
第5圖係本創作基板保持環之局部結構立向剖視圖。Fig. 5 is a vertical sectional view showing a partial structure of the substrate holding ring of the present invention.
第6圖係本創作基板保持環組裝於晶圓研磨機之旋轉頭之應用實施狀態示意圖。Fig. 6 is a schematic view showing the application state of the present invention in which the substrate holding ring is assembled to the rotary head of the wafer grinding machine.
請參閱第1至5圖所示,係本創作具導滑增益功能之基板保持環之較佳實施例,惟此等實施例僅供說明之用,在專利申請上並不受此結構之限制。所述基板保持環A係包括高分子塑膠材料所構成之一圓環狀框體10,該圓環狀框體10包括有一組裝面11、一研磨面12、一晶圓限位側13以及一外周側14,其中該組裝面11設有間隔環列的定位螺孔15,該外周側14一高度位置處設有呈橫側向內凹的一環形嵌凹溝16,並於該環形嵌凹溝16組裝定位一軟質膠圈20,該軟質膠圈20包括一嵌組內緣21、一凸伸外緣22以及形成於該嵌組內緣21與凸伸外緣22之間的一曲摺段23,其中該嵌組內緣21係藉以嵌組定位於環形嵌凹溝16中 ,該凸伸外緣22則呈環面擴增型態凸伸於外周側14的外周;且其中,該外周側14的環形嵌凹溝16上方間隔位置處係更設有呈橫側向內凹的一環形凹槽17,並於該環形凹槽17中嵌組定位一導滑增益元件30,該導滑增益元件30具有一環形導滑面31係與圓環狀框體10的外周側14呈平齊銜接關係,且令該環形導滑面31的摩擦係數相對小於圓環狀框體10外周側14的摩擦係數。Please refer to FIGS. 1 to 5 for a preferred embodiment of the substrate retaining ring having the function of guiding the sliding gain. However, these embodiments are for illustrative purposes only and are not limited by the structure in the patent application. . The substrate holding ring A comprises an annular frame 10 composed of a polymer plastic material, and the annular frame 10 includes an assembly surface 11 , a polishing surface 12 , a wafer limiting side 13 and an outer circumference. Side 14 , wherein the assembly surface 11 is provided with a positioning screw hole 15 of the spacer ring row, and the outer circumferential side 14 is provided with an annular recessed groove 16 which is concave in the lateral direction at a height position, and the annular recessed groove 16 16Assemble and position a soft rubber ring 20, the soft rubber ring 20 includes an embedded inner edge 21, a convex outer edge 22, and a meandering segment formed between the inner edge 21 and the convex outer edge 22. 23, wherein the inner edge 21 of the insert is positioned in the annular recessed groove 16 by an embedded group The convex outer edge 22 protrudes from the outer circumference of the outer peripheral side 14 in a toroidal expansion pattern; and wherein the outer peripheral side 14 has a laterally inwardly spaced position above the annular recessed groove 16 A concave annular groove 17 is defined in the circular groove 17 and a guide sliding gain member 30 is disposed. The sliding guide gain member 30 has an annular sliding surface 31 and an outer peripheral side of the annular frame 10. 14 is in a flush joint relationship, and the friction coefficient of the annular guide surface 31 is relatively smaller than the friction coefficient of the outer peripheral side 14 of the annular frame 10.
藉由上述結構組成設計,如第6圖所示,當該基板保持環A組裝於既有晶圓研磨機之旋轉頭40使用時,基板保持環A的外側邊14於產生上下浮動(如箭號L1所示)過程中,能夠通過該導滑增益元件30的環形導滑面31與旋轉頭40所設環框41內壁42之間達到更加滑順無阻之導滑增益功能。With the above structural composition design, as shown in FIG. 6, when the substrate holding ring A is assembled to the rotary head 40 of the existing wafer grinding machine, the outer side edge 14 of the substrate holding ring A is floated up and down (eg, During the process of the arrow L1, a more smooth and unobstructed guide-slip gain function can be achieved between the annular guide surface 31 of the guide-sliding gain member 30 and the inner wall 42 of the ring frame 41 provided by the rotary head 40.
其中,該導滑增益元件30係可為陶瓷或鐵氟龍(Teflon)材料所構成者,以令環形導滑面31的摩擦係數能夠相對小於圓環狀框體10外周側14的摩擦係數。The guide gain element 30 may be made of ceramic or Teflon material so that the friction coefficient of the annular guide surface 31 can be relatively smaller than the friction coefficient of the outer peripheral side 14 of the annular frame 10.
如第3、4圖所示,其中該導滑增益元件30係可由至少二單元組件301、301相組合拼湊構成一圓環狀型態者。As shown in Figures 3 and 4, wherein the guide-slip gain element 30 can be assembled by at least two unit assemblies 301, 301 to form a ring-shaped pattern.
詳如第4、5圖所示,其中該導滑增益元件30的上下側係可相對凸設有嵌條32,以使圓環狀框體10外周側14所設環形凹槽17的上下側對應凹設有能夠與所述嵌條相嵌卡配合的嵌溝173。For example, as shown in FIGS. 4 and 5, the upper and lower sides of the guide-sliding gain member 30 are relatively convexly provided with the molding 32 so that the upper and lower sides of the annular groove 17 are provided on the outer peripheral side 14 of the annular frame 10. The corresponding recess is provided with a recess 173 which can be engaged with the insert.
其中,該圓環狀框體10的研磨面12係可設有間隔環列的溝槽18(如第1至4圖所示),各溝槽18係橫向貫穿圓環狀框體10的晶圓限位側13與外周側14。此所述溝槽18的功用主要係藉以排出晶圓研磨作業過程中,該圓環狀框體10內部所積累的研磨液。The polishing surface 12 of the annular frame 10 may be provided with a groove 18 of a spacer ring array (as shown in FIGS. 1 to 4), and each groove 18 is transversely penetrated through the crystal of the annular frame 10. The circular limit side 13 and the outer peripheral side 14 are provided. The function of the trench 18 is mainly to discharge the slurry accumulated inside the annular frame 10 during the wafer polishing operation.
又其中,該圓環狀框體10的組裝面11除了具有間隔環列的定位螺孔15之外,在組裝面11的四分點位置 處係更可設有四個用組裝導引孔19(僅標示於第1圖),所述組裝導引孔19的作用,主要係作為該基板保持環A組裝時的定向配合結構之用。In addition, the assembly surface 11 of the annular frame 10 is at the quarter point of the assembly surface 11 except for the positioning screw holes 15 of the spacer ring row. The assembly can be provided with four assembly guide holes 19 (only shown in FIG. 1), and the assembly guide holes 19 function mainly as an orientation matching structure when the substrate holding ring A is assembled.
本創作所揭「具導滑增益功能之基板保持環」主要藉由其圓環狀框體外周側的環形嵌凹溝上方間隔位置處更設有環形凹槽以嵌組定位所述導滑增益元件,且該導滑增益元件之環形導滑面摩擦係數相對小於圓環狀框體外周側摩擦係數之創新獨特結構型態與技術特徵,使本創作對照【先前技術】所提習知結構而言,當基板保持環組裝於既有晶圓研磨機之旋轉頭使用時,基板保持環的外側邊能夠通過該導滑增益元件的環形導滑面與旋轉頭所設環框內壁之間獲致更加滑順無阻之導滑增益功能,進而達到提昇晶圓研磨作業精度與品質之實用進步性與較佳產業利用效益。The "substrate retaining ring with a guide-sliding gain function" disclosed in the present invention mainly has an annular groove at an interval above the annular recessed groove on the outer peripheral side of the annular frame to define the guide-sliding gain. The innovative unique structural form and technical characteristics of the element, and the frictional coefficient of the annular sliding surface of the guiding and sliding gain element is relatively smaller than the outer peripheral side friction coefficient of the annular frame, so that the creation is compared with the conventional structure proposed by the prior art. When the substrate holding ring is assembled to the rotating head of the existing wafer grinding machine, the outer side of the substrate holding ring can pass between the annular sliding surface of the guiding and sliding gain element and the inner wall of the ring frame provided by the rotating head. A smoother and more unobstructed guide-slip gain function is achieved, thereby achieving practical advancement and better industrial utilization benefits for improving the accuracy and quality of wafer grinding operations.
上述實施例所揭示者係藉以具體說明本創作 ,且文中雖透過特定的術語進行說明,當不能以此限定本新型創作之專利範圍;熟悉此項技術領域之人士當可在瞭解本創作之精神與原則後對其進行變更與修改而達到等效目的,而此等變更與修改,皆應涵蓋於如后所述申請專利範圍所界定之範疇中。The person disclosed in the above embodiment is used to specify the creation However, although the text is explained by specific terms, it is not possible to limit the scope of patents of this new creation; those who are familiar with the technical field can change and modify them after understanding the spirit and principles of the creation. The purpose of this change, and such changes and modifications, should be covered in the scope defined by the scope of the patent application as described later.
A‧‧‧基板保持環A‧‧‧ substrate retention ring
10‧‧‧圓環狀框體10‧‧‧Ring-shaped frame
11‧‧‧組裝面11‧‧‧ Assembly surface
12‧‧‧研磨面12‧‧‧Grinding surface
13‧‧‧晶圓限位側13‧‧‧ Wafer Limit Side
14‧‧‧外周側14‧‧‧ peripheral side
16‧‧‧環形嵌凹溝16‧‧‧ring recessed groove
17‧‧‧環形凹槽17‧‧‧ annular groove
173‧‧‧嵌溝173‧‧‧ditch
18‧‧‧溝槽18‧‧‧ trench
20‧‧‧軟質膠圈20‧‧‧Soft rubber ring
21‧‧‧嵌組內緣21‧‧‧Inset inner edge
22‧‧‧凸伸外緣22‧‧‧ protruding outer edge
23‧‧‧曲摺段23‧‧‧Zigzag
30‧‧‧導滑增益元件30‧‧‧Sliding gain element
31‧‧‧環形導滑面31‧‧‧Circular guide surface
32‧‧‧嵌條32‧‧‧ Inserts
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Application Number | Title | Priority Date | Filing Date |
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TW102215091U TWM466754U (en) | 2013-08-12 | 2013-08-12 | Substrate retaining ring having slip-guiding gaining function |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM466754U (en) |
-
2013
- 2013-08-12 TW TW102215091U patent/TWM466754U/en not_active IP Right Cessation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |