TWM465965U - Treatment equipment having quantitative loading device - Google Patents

Treatment equipment having quantitative loading device Download PDF

Info

Publication number
TWM465965U
TWM465965U TW101222555U TW101222555U TWM465965U TW M465965 U TWM465965 U TW M465965U TW 101222555 U TW101222555 U TW 101222555U TW 101222555 U TW101222555 U TW 101222555U TW M465965 U TWM465965 U TW M465965U
Authority
TW
Taiwan
Prior art keywords
outlet
accumulator
treatment
dosing device
dosing
Prior art date
Application number
TW101222555U
Other languages
Chinese (zh)
Inventor
Tanja Wittmann
Matthias Niese
Juergen Schweckendiek
Original Assignee
Rena Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena Gmbh filed Critical Rena Gmbh
Publication of TWM465965U publication Critical patent/TWM465965U/en

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00Control of flow
    • G05D7/06Control of flow characterised by the use of electric means
    • G05D7/0617Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0635Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means
    • G05D7/0641Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means
    • G05D7/0647Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on throttling means using a plurality of throttling means the plurality of throttling means being arranged in series
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052Wet cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels

Abstract

Dosing device (1) comprises: an accumulator (2) with an inlet (3) and an outlet (4); at least one supply line (5) opening into the accumulator; a weighing device for the accumulator; a flow measuring unit arranged downstream of the outlet; at least one controllable outlet valve; and a discharge line. The accumulator comprises an inlet for pressurized gas and the outlet is arranged in a bottom portion of the accumulator. Independent claims are also included for: (1) a treatment station for wet chemical treatment of workpieces using a treatment medium having at least one liquid component, comprising a treatment tank, a medium supply line, which terminates in the treatment tank, and at least one dosing device with at least one supply line and a discharge line, where the supply line is fed using a corresponding component supply line, and the discharge line opens in the medium supply line; (2) a treatment plant for wet-chemical treatment of workpieces, comprising at least one treatment station; and (3) providing the liquid component within the framework for the wet-chemical treatment of workpieces to be used, using the above dosing device, comprising (a) supplying the component into the accumulator using the supply line, (b) at least partially filling the accumulator with the component, (c) supplying a stationary gas above the component at the residual volume of the accumulator, under pressure, (d) degassing and soothing the component present in the accumulator, (e) determining the amount of the component present in the accumulator, (f) opening an outlet valve and detecting the amount of component flowing under pressure from the accumulator via the outlet valve and the subsequent discharge passage using flow measuring device, (g) closing the outlet valve, when the amount has flowed equal to a preset target amount, (h) determining the quantity of the component present in the accumulator, calculating the difference of the amount present in the accumulator before opening of the outlet valve, and comparing the difference with the preset target amount, where a deviation between the calculated difference and the target amount generates an error signal.

Description

具有定量加料裝置的處理設備Processing device with dosing device

本創作關於處理設備的領域。尤其地,本創作關於在使用定量加料裝置的情況下借助於液態成分對工件進行濕法化學處理的處理設備領域。This creation is about the field of processing equipment. In particular, the present invention relates to the field of processing equipment for wet chemical treatment of workpieces by means of liquid components in the case of using a dosing device.

例如製造太陽能電池或半導體元件等物品通常會使用到關於對襯底進行剝離(例如刻蝕)、表面改性(例如摻雜)、覆層(例如金屬化)或清洗(例如沖洗)等一個或多個濕法化學的處理步驟,所述襯底通常含有矽、玻璃、陶瓷、環氧樹脂或塑料或是由其組成。因為在大多數情況下,多個這種濕法化學的處理步驟是連續的,因此市場上提供的相關設備具有至少一個、但大多是具有多個連續的濕法化學的處理站,以下也簡稱為“站”。待處理的物品是以成批(批量)或連續(一列式)的方式從一個站輸送到下一個站。出於經濟的原因,當今站已經在其尺寸方面盡可能地被標準化,以便當站故障或要組建新的流程時能夠以簡單的方式進行替換。濕法化學的處理通常是在分配給站的一個處理池中進行。申請人也以“NIAK”為名銷售這種處理設備。For example, the manufacture of articles such as solar cells or semiconductor components typically involves the use of stripping (eg, etching), surface modification (eg, doping), cladding (eg, metallization), or cleaning (eg, rinsing) of the substrate. A plurality of wet chemical processing steps, the substrate typically comprising or consisting of tantalum, glass, ceramic, epoxy or plastic. Since in most cases, a plurality of such wet chemical processing steps are continuous, the related equipment provided on the market has at least one, but mostly a plurality of continuous wet chemical processing stations, hereinafter also referred to as For "station". The items to be processed are transported from one station to the next in a batch (batch) or continuous (in-line) manner. For economic reasons, today's stations have been standardized as much as possible in terms of their size so that they can be replaced in a simple manner when a station fails or a new process is to be built. Wet chemical treatment is usually carried out in a treatment tank assigned to the station. The applicant also sells such processing equipment under the name "NIAK".

當然,這種設備的每一個濕法化學的處理站都必須獲得一種或多種例如為(去離子)水、刻蝕液(酸或堿)、電解液等介質的供應。為此需要將完成混合的處理介質或 成分本身以正確的量配送到池中。因此很高的配方精確性對穩定良好的處理結果而言是不可缺少的。Of course, each wet chemical processing station of such equipment must obtain a supply of one or more media such as (deionized) water, etching solution (acid or hydrazine), electrolyte, and the like. For this purpose it is necessary to complete the mixing of the treatment medium or The ingredients themselves are delivered to the pool in the correct amount. Therefore, high formulation accuracy is indispensable for stable and good processing results.

對此,引導液態成分(以下也稱為“液體”)的成分供應管道與所謂的定量加料裝置連接。通常是借助於單獨的控制裝置來測定要輸出的液體量。To this end, the component supply conduit guiding the liquid component (hereinafter also referred to as "liquid") is connected to a so-called dosing device. The amount of liquid to be output is usually determined by means of a separate control device.

典型地,每個處理站也具有用於介質或所述介質的成分的特殊的定量加料裝置、控制裝置等。其結果為,這種站包含大量連同流體管道的定量加料裝置,所述流體管道典型地分別“根據需要”來鋪設和連接。為了連接到中央成分供應裝置上,在站的下側、後側及/或上側會空出未明確定義的區域。相應地,在組裝由各個站組成的設備時,必須單獨地考慮每個站的連接情況,這不僅很耗費時間,而且也可能成為連接誤差的來源。Typically, each processing station also has a special dosing device, control device or the like for the medium or components of the medium. As a result, such stations contain a plurality of dosing devices along with fluid conduits that are typically laid and joined "as needed", respectively. In order to be connected to the central component supply, an undefined area is vacated on the lower, rear and/or upper side of the station. Accordingly, when assembling devices consisting of individual stations, the connection of each station must be considered separately, which is not only time consuming, but also a source of connection errors.

通常,例如為了維修的目的,必須更換站的一些或者全部的配料或操縱元件。有時為了更換介質也需要清潔或甚至更換介質的流體管道、閥等。這意味著,至少整個站、甚至可能是整個設備必須停止運轉一段長時間,因為通常大量存在的流體元件必須全部單獨拆卸並且分開維護。同樣的,這也適用於例如傳感器或指示儀錶的電子元件。Typically, some or all of the ingredients or handling elements of the station must be replaced, for example for maintenance purposes. Sometimes it is necessary to clean or even change the fluid piping, valves, etc. of the medium in order to change the medium. This means that at least the entire station, and possibly even the entire equipment, must be shut down for a long time, since usually the fluid components that are present in large quantities must all be dismantled separately and maintained separately. Again, this also applies to electronic components such as sensors or indicator meters.

因此,本創作的目的是提供一種避免先前技術的缺點的設備。Accordingly, it is an object of the present invention to provide an apparatus that avoids the disadvantages of the prior art.

尤其地,本創作應提供一種處理設備,所述處理設備減少了用於以不同的液體進行濕法化學處理所必需的定量加料裝置的數量。In particular, the present creation should provide a processing apparatus that reduces the number of dosing devices necessary for wet chemical treatment with different liquids.

採用申請專利範圍第1或第2項所述的處理設備即可達到本創作的目的。其他的有利的實施態樣可以從說明書以及附圖中得出。The purpose of this creation can be achieved by using the processing equipment described in claim 1 or 2. Further advantageous embodiments can be derived from the description and the figures.

本創作揭示一種處理設備,所述處理設備具有可經由介質供應管道供料的處理池,以借助處理介質對工件進行濕法化學處理。處理介質具有至少一種、但通常是具有多種液態成分。處理設備也包括至少一個具有單獨的導出管道的定量加料裝置。The present disclosure discloses a processing apparatus having a processing tank that can be fed via a media supply conduit for wet chemical processing of the workpiece by means of a processing medium. The treatment medium has at least one, but usually has a plurality of liquid components. The processing apparatus also includes at least one dosing device having a separate outlet conduit.

根據本創作,在整個設備的範圍內進行處理所必需的每種液態成分都有分配到一個單獨的定量加料裝置。這意味著,這種設備不再具有優選存在的、分配給各個處理站的定量加料裝置,而是借助單獨的定量加料裝置對要在設備範圍內使用的每一種液態成分進行配料。這與前面描述的設備相比,尤其在大量的池需獲得供應的液態成分的數量是明確的情況下,能夠顯著地減少必需的定量加料裝置的數量。According to the present creation, each liquid component necessary for processing within the entire apparatus is assigned to a separate dosing device. This means that such a device no longer has a preferred dosing device assigned to the individual treatment stations, but instead dispenses each liquid component to be used within the device by means of a separate dosing device. This makes it possible to significantly reduce the number of necessary dosing devices, in particular in the case where the number of liquid components to be supplied in a large number of cells is clear, compared to the previously described devices.

因此,儘管如此,經由分配給設備(而不是分配給各個處理站)的定量加料裝置仍能夠將適當類型和量的成分配送到到各個處理池中,根據本創作的第一實施態樣,每個定量加料裝置的每個導出管道都經由可控制的切換閥與處理池的介質供應管道連接。因此,能夠單獨地控制應將 何種成分以什麽樣的量配送到設備的哪個處理池中。Thus, nevertheless, the appropriate type and amount of ingredients can be dispensed into the various processing pools via the dosing device assigned to the device (rather than to the individual processing stations), according to a first embodiment of the present invention, Each of the outlet conduits of the dosing device is connected to the media supply conduit of the treatment tank via a controllable switching valve. Therefore, it is possible to control separately Which component is dispensed into which processing pool of the device.

根據一個替選的實施態樣,設備不具有切換閥,而是每個導出管道通到每個處理池中,並具有一個選擇閥,所述選擇閥是可控制的,並且只有在一種成分應被送入處理池中時,才會打開選擇閥。在此,成分的配送量是由屬於該成分的定量加料裝置來確定,並且經由相應的選擇閥來確定位置。According to an alternative embodiment, the device does not have a switching valve, but each outlet conduit leads to each treatment tank and has a selector valve that is controllable and only in one component The selector valve is only opened when it is sent to the processing cell. Here, the dispensing amount of the ingredients is determined by a dosing device belonging to the ingredient, and the position is determined via a corresponding selection valve.

尤其優選地,這種處理設備的(多個)成分和介質供應管道終止在(多個)定量加料裝置的通到快速接口的導入和導出管道的容納部中。換言之,處理設備能夠借助相應的、已經在上面提及的快速接口與一個或多個定量加料裝置連接。Particularly preferably, the component(s) and the medium supply line of such a processing device are terminated in the receptacle of the inlet and outlet conduits of the dosing device that leads to the quick interface. In other words, the processing device can be connected to one or more dosing devices by means of a corresponding quick interface already mentioned above.

同樣尤其優選地,處理設備具有至少一個凹槽,所述凹槽用於至少一個構造為配料模組的定量加料裝置,所述定量加料裝置可插入到所述凹槽中。這意味著,處理設備適合於容納標準化的、構造成可插入到設備中的配料模組,因此,尤其當設有上述快速接口時,能夠以極其節省時間的方式來更換所述配料模組。這種標準除幾何形狀之外,尤其也能夠關於用於流體的、電的或其他的接口的連接點。It is also particularly preferred for the processing device to have at least one recess for at least one dosing device which is embodied as a dosing module, into which the dosing device can be inserted. This means that the processing device is suitable for accommodating a standardized ingredient module that can be inserted into the device, so that in particular when the quick interface described above is provided, the ingredient module can be replaced in an extremely time-saving manner. In addition to the geometry, such a standard can also relate in particular to connection points for fluid, electrical or other interfaces.

優選地,處理設備劃分成一個或多個處理站。這種處理站借助處理介質對工件進行濕法化學處理,所述處理介質具有至少一種液態成分。這種站包括容納處理介質的處理池、終止在處理池中的介質供應管道和至少一個定量加 料裝置。優選地,定量加料裝置具有至少一個導入管道和導出管道。定量加料裝置的至少一個導入管道能夠借助於相應的成分供應管道來供料,並且定量加料裝置的導出管道通入到介質供應管道中。因為處理站僅包括一個處理池,所述處理站用於執行處理步驟(例如工件的刻蝕或清洗)。Preferably, the processing device is divided into one or more processing stations. Such a processing station performs a wet chemical treatment of the workpiece by means of a treatment medium having at least one liquid component. Such a station includes a processing tank containing a processing medium, a medium supply conduit terminating in the processing pool, and at least one quantitative addition Material device. Preferably, the dosing device has at least one inlet conduit and outlet conduit. At least one inlet conduit of the dosing device can be fed by means of a respective component supply line, and the outlet line of the dosing device is passed into the medium supply line. Because the processing station includes only one processing cell, the processing station is used to perform processing steps (eg, etching or cleaning of the workpiece).

成分供應管道用於提供液態成分,所述液態成分應借助於定量加料裝置輸入到處理站的處理池中。The ingredient supply line is used to provide a liquid component which should be fed into the treatment tank of the treatment station by means of a dosing device.

因為定量加料裝置的導出管道通到介質供應管道中,所以一種或(當存在多個定量加料裝置時)多種成分以配方精確的方式混合到處理池中,其中所述介質供應管道本身終止於處理池中。替選地,配料(進而混合)到與所有定量加料裝置連接的共同的混合管道中也是可行的,所述混合管道本身終止於池中。最後也可行的是,每個定量加料裝置都具有多個導出管道,而且分別通到不同的池中。在此,每個定量加料裝置都具有相應數量的排出閥,及/或具有直接設置在池出口之前的附加的閥。Since the outlet conduit of the dosing device is passed into the medium supply conduit, one or (when a plurality of dosing devices are present) the various components are mixed into the treatment tank in a formulation-accurate manner, wherein the media supply conduit itself terminates in the treatment In the pool. Alternatively, it is also possible to mix (and thus mix) into a common mixing line connected to all dosing devices, which itself terminates in the tank. Finally, it is also possible for each dosing device to have a plurality of outlet pipes and to pass to separate pools. Here, each dosing device has a corresponding number of discharge valves and/or has additional valves placed directly before the outlet of the tank.

此外尤其優選的是,將定量加料裝置構造成配料模組,由於能夠設置多個所述配料模組,因此能夠在不會花很多時間的情況下更換配料模組。另一優點是,這種優化模組的小的結構尺寸和更緊湊的結構形狀。這對於存在於濕法化學設備中的排氣問題有正面的影響,因為更緊湊且優選為封裝的(封閉的)的模組為會冷凝存在於設備中且通常具有蝕刻性的氣體提供較小的作用面。Furthermore, it is particularly preferred to configure the dosing device as a dosing module, since a plurality of the dosing modules can be provided, so that the dosing module can be replaced without taking a lot of time. Another advantage is that this optimized module has a small structural size and a more compact structural shape. This has a positive impact on the exhaust problem present in wet chemical equipment, as the more compact and preferably encapsulated (closed) modules provide less gas that would condense in the equipment and typically have etchability. The role of the face.

根據一個優選的實施態樣,處理設備具有下面詳細描述的定量加料裝置。According to a preferred embodiment, the treatment device has a dosing device as described in detail below.

這種定量加料裝置包括具有(至少一個)入口和(至少一個)出口的儲存器、至少一個用於介質或所述介質的成分的通到儲存器中的導入管道、用於儲存器內含物的稱重裝置、設置在出口下游的流量測量裝置、至少一個可控制的排出閥、以及導出管道。此外,儲存器具有用於優選惰性壓縮氣體的入流口,並且出口設置在儲存器的下部區域中。Such a dosing device comprises a reservoir having (at least one) inlet and (at least one) outlet, at least one introduction conduit for the medium or a component of the medium, into the reservoir, for storage contents The weighing device, the flow measuring device disposed downstream of the outlet, the at least one controllable discharge valve, and the outlet conduit. Furthermore, the reservoir has an inflow opening for a preferably inert compressed gas, and the outlet is arranged in a lower region of the reservoir.

儲存器是作為液態成分的中間儲存器,所述液態成分能夠從外部儲備容器經由導入管道流入到儲存器中。優選地,主截止閥位於入口的區域。此外,儲存器的另一個作用是使流入到其中的液態成分平靜下來。The reservoir is an intermediate reservoir as a liquid component that can flow from the external storage container into the reservoir via the introduction conduit. Preferably, the main stop valve is located in the region of the inlet. In addition, another function of the reservoir is to calm the liquid components flowing into it.

稱重裝置用於確定裝在儲存器中的成分的量。稱重裝置會將儲存器的淨重從其測得的重量中減去。所得到的差就是裝在儲存器中的成分的重量。A weighing device is used to determine the amount of ingredients contained in the reservoir. The weighing device subtracts the net weight of the reservoir from its measured weight. The resulting difference is the weight of the ingredients contained in the reservoir.

流量測量裝置能夠測出離開儲存器的成分的量。優選地,所述裝置具有密度和溫度補償器,以便這樣實現盡可能準確的測量結果。The flow measuring device is capable of measuring the amount of ingredients leaving the reservoir. Preferably, the device has a density and temperature compensator to achieve as accurate an measurement as possible.

至少一個排出閥的作用是控制排出儲存器內一部分的內含物。所述排出閥設置在儲存器的下游,因此是位於設置在流量測量裝置之前或優選地設置在流量測量裝置之後。The function of the at least one discharge valve is to control the contents of a portion of the discharge reservoir. The discharge valve is arranged downstream of the reservoir and is therefore located before or preferably after the flow measuring device.

這種定量加料裝置具有以下優點:所述定量加料裝置 能夠以簡單的方式控制流量測量裝置測出的量值,其方式在於在取出液體之後重新確定在其中包含的量。如果所述值不一致,表示存在測量誤差,在最簡單的情況下會經由警告燈顯示測量誤差,使得能夠啟動對應措施。只要不充分的處理結果是源自配料測量誤差,就無需費時查找誤差。實際上,在不充分的處理結果出現之前的很久就已經是可以看出這誤差,這不僅可以節省時間,且有助於避免產生高成本的廢品。This dosing device has the following advantages: the dosing device The magnitude measured by the flow measuring device can be controlled in a simple manner by redetermining the amount contained therein after the liquid is withdrawn. If the values are inconsistent, it means that there is a measurement error, and in the simplest case, the measurement error is displayed via the warning light, so that the corresponding measure can be activated. As long as the insufficient processing results are derived from the ingredient measurement error, there is no need for time-consuming lookup errors. In fact, this error can be seen long before the incomplete processing results appear, which not only saves time, but also helps to avoid the costly waste.

如前面所述,尤其在大量的池需獲得供應的液態成分的數量是明確的情況下,本創作的處理設備能夠降低以不同的液體進行濕法化學處理所需要的定量加料裝置的數量。As described above, the processing apparatus of the present invention is capable of reducing the number of dosing devices required for wet chemical treatment with different liquids, particularly in the case where the number of liquid components to be supplied in a large number of pools is clear.

圖1示意地示出處理設備14,所述處理設備包括一排處理池15。此外,所述處理設備具有兩個定量加料裝置1,1’。處理池15能夠經由介質供應管道16獲得處理介質B的供應。所述處理介質是由保留在獨立的罐16中的多種成分F組成。每個罐經由成分供應管道19與設置用於相應的液態成分F的定量加料裝置1,1’流體地連接。因此,在整個設備14的範圍中進行處理所必需的每種液態成分F都分配到一個單獨的定量加料裝置1,1’。Figure 1 shows schematically a processing device 14, which comprises a row of processing cells 15. Furthermore, the treatment device has two dosing devices 1, 1'. The processing tank 15 is capable of obtaining a supply of the processing medium B via the medium supply conduit 16. The treatment medium consists of a plurality of ingredients F that remain in separate tanks 16. Each tank is fluidly connected via a component supply line 19 to a metering device 1, 1 ' provided for a corresponding liquid component F. Therefore, each liquid component F necessary for processing in the entire range of the apparatus 14 is distributed to a single dosing device 1, 1'.

每個定量加料裝置1,1’都具有單獨的導出管道10,10’。此外,每個定量加料裝置1,1’的每個導出管道10, 10’都經由可控制的切換閥17與處理池的介質供應管道連接。這允許單獨地控制在設備的特定的處理池中的特定成分的量。設備14的中央控制器未在圖式示出的,所述中央控制器必須與可控制的切換閥17連接,並且所述中央控制器控制定量加料裝置1,1’的局部評估和控制裝置(沒有示出),使得所述定量加料裝置能夠將期望量的期望的液態成分F配送到導出管道10,10’。Each dosing device 1, 1' has a separate outlet conduit 10, 10'. Furthermore, each of the dosing devices 1, 1' derives a conduit 10, 10' is connected to the medium supply conduit of the treatment tank via a controllable switching valve 17. This allows the amount of specific components in a particular processing pool of the device to be individually controlled. The central controller of the device 14 is not shown, the central controller must be connected to a controllable switching valve 17, and the central controller controls the local evaluation and control device of the dosing device 1, 1 ' ( Not shown), enabling the dosing device to dispense a desired amount of the desired liquid component F to the outlet conduit 10, 10'.

在圖2中示出上述處理設備14的替選的實施態樣。出於可視性的原因,此處不再對已經描述的特徵進行說明。和上述實施態樣相反的是,在此示出的設備14不具有可控制的切換閥,而是每個導出管道10、10’都通到每個處理池15,並且具有一個選擇閥9’(僅在圖中左側設有附圖標記)。所述選擇閥是可控制的,並且只有在一種成分F”應被送入處理池15中時,才會打開選擇閥。在此,經由屬於成分F的定量加料裝置1,1’來確定量,並且經由相應的選擇閥9’來確定位置(進而確定池)。同樣未示出的是上一級的控制器和控制管道,所述控制管道在該情況下也必須到達選擇閥9’處。一種可能的方式是,棄用定量加料裝置1,1’的排出閥(沒有示出),因為所述排出閥的功能由選擇閥9’來承擔。An alternative embodiment of the processing device 14 described above is shown in FIG. For the sake of visibility, the features already described are not described here. In contrast to the above-described embodiment, the device 14 shown here does not have a controllable switching valve, but each of the outlet ducts 10, 10' leads to each treatment tank 15 and has a selector valve 9' (Only the left side of the figure is provided with reference numerals). The selector valve is controllable and the selector valve is only opened when a component F" should be fed into the treatment tank 15. Here, the amount is determined via the dosing device 1, 1 ' belonging to component F. And the position (and thus the pool) is determined via the respective selector valve 9'. Also not shown is the controller of the upper stage and the control line, which in this case must also reach the selector valve 9'. One possible way is to dispense with the discharge valve (not shown) of the dosing device 1, 1 ', since the function of the discharge valve is borne by the selector valve 9'.

根據圖3示出優選的定量加料裝置1,其儲存器2具有入口3和出口4。待配送的液態成分F能夠經由導入管道5穿過入口3流入到儲存器2中。對此設有必須打開以用於進入的(主)截止閥6。A preferred dosing device 1 is shown in accordance with FIG. 3, the reservoir 2 having an inlet 3 and an outlet 4. The liquid component F to be dispensed can flow into the reservoir 2 through the inlet 3 via the inlet duct 5. For this purpose, a (main) shut-off valve 6 must be opened for access.

儲存器2連接到稱重裝置7上,所述稱重裝置能夠測出儲存器1裝在儲存器中的液態成分F’的重量。所述裝置在圖1中是一個彈簧秤。The reservoir 2 is connected to a weighing device 7 which is capable of measuring the weight of the liquid component F' of the reservoir 1 contained in the reservoir. The device is a spring balance in Figure 1.

存在於液體F’中的氣泡(沒有附圖標記)能夠上升(小箭頭)並且積聚在儲存器2的上部區域2’中。因此,所述氣泡會自動遠離出口4,所述出口設置在儲存器2的盡可能沒有氣泡的下部區域2”中。The bubbles (without reference numerals) present in the liquid F' can rise (small arrows) and accumulate in the upper region 2' of the reservoir 2. Thus, the bubbles are automatically remote from the outlet 4, which is arranged in the lower region 2" of the reservoir 2 which is as free of air bubbles as possible.

出口4通到流量測量裝置8,所述流量測量裝置能夠確定液態成分流出的量(或者與此關聯的值,例如流速)。這樣配送的成分F”就會經由排出閥9、經由導出管道10離開定量加料裝置1。The outlet 4 leads to a flow measuring device 8 which is capable of determining the amount of liquid component flow (or a value associated therewith, such as a flow rate). The component F" thus dispensed leaves the dosing device 1 via the discharge valve 9 via the outlet conduit 10.

此外,儲存器2在其上部區域2’具有壓縮氣體G的入流口11。優選地經由均壓段12提供所述壓縮氣體G,所述均壓段用於調整壓縮氣體G。基於可視性的原因,並未示出所述儲存器的元件,尤其是入流閥。Furthermore, the reservoir 2 has an inflow opening 11 for the compressed gas G in its upper region 2'. The compressed gas G is preferably supplied via a pressure equalization section 12 for adjusting the compressed gas G. The components of the reservoir, in particular the inflow valve, are not shown for reasons of visibility.

經由評估和控制單元13控制定量加料裝置1的元件,所述評估和控制單元經由控制管道(虛線,沒有附圖標記)與截止閥6、稱重裝置7、流量測量裝置8和排出閥9連接。評估和控制單元13優選地能夠通過上一級的、配屬於處理設備的控制單元(總是沒有示出)來操控。The elements of the dosing device 1 are controlled via an evaluation and control unit 13, which is connected to the shut-off valve 6, the weighing device 7, the flow measuring device 8 and the discharge valve 9 via a control line (dashed line, without reference numerals) . The evaluation and control unit 13 is preferably controllable by a control unit (always not shown) assigned to the processing device of the previous stage.

1,1’‧‧‧定量加料裝置1,1'‧‧‧Quantum feeding device

2‧‧‧儲存器2‧‧‧Storage

2’‧‧‧上部區域2’‧‧‧ upper area

2”‧‧‧下部區域2"‧‧‧ Lower area

3‧‧‧入口3‧‧‧ entrance

4‧‧‧出口4‧‧‧Export

5‧‧‧導入管道5‧‧‧Introduction of pipeline

6‧‧‧截止閥6‧‧‧Shutdown valve

7‧‧‧稱重裝置7‧‧‧Weighing device

8‧‧‧流量測量裝置8‧‧‧Flow measuring device

9‧‧‧排出閥9‧‧‧ discharge valve

9’‧‧‧選擇閥9’‧‧‧Selection valve

10,10’‧‧‧導出管道10,10’‧‧‧Export pipeline

11‧‧‧入流口11‧‧‧Inlet

12‧‧‧均壓段12‧‧‧pressure section

13‧‧‧評估和控制單元13‧‧‧Evaluation and Control Unit

14‧‧‧處理設備、設備14‧‧‧Processing equipment, equipment

15‧‧‧處理池15‧‧‧Processing pool

16‧‧‧罐16‧‧‧ cans

17‧‧‧可控制的切換閥17‧‧‧Controllable switching valve

18‧‧‧成分供應管道18‧‧‧Component supply pipeline

19‧‧‧介質供應管道19‧‧‧Media supply pipeline

F‧‧‧液態成分F‧‧‧liquid components

F’‧‧‧包含在儲存器中的/剩餘的成分、儲存器內含物F’‧‧‧ contained in the reservoir / remaining components, storage contents

F”‧‧‧已配送的成分、流出的量F"‧‧‧Distributed ingredients, outflows

G‧‧‧壓縮氣體、氣體G‧‧‧Compressed gas, gas

B‧‧‧處理介質B‧‧‧Processing media

圖1示出具有多個配料模組的處理設備。Figure 1 shows a processing apparatus having a plurality of batching modules.

圖2示出具有多個配料模組的替選的處理設備。Figure 2 shows an alternative processing device having multiple batching modules.

圖3示出定量加料裝置的一個尤其優選的實施態樣。Figure 3 shows a particularly preferred embodiment of the dosing device.

1,1’‧‧‧定量加料裝置1,1'‧‧‧Quantum feeding device

10,10’‧‧‧導出管道10,10’‧‧‧Export pipeline

14‧‧‧處理設備、設備14‧‧‧Processing equipment, equipment

15‧‧‧處理池15‧‧‧Processing pool

16‧‧‧罐16‧‧‧ cans

17‧‧‧可控制的切換閥17‧‧‧Controllable switching valve

18‧‧‧成分供應管道18‧‧‧Component supply pipeline

19‧‧‧介質供應管道19‧‧‧Media supply pipeline

F‧‧‧液態成分F‧‧‧liquid components

B‧‧‧處理介質B‧‧‧Processing media

Claims (8)

一種處理設備(14),其具有:能夠經由介質供應管道(19)供料的處理池(15),以借助處理介質(B)對工件進行濕法化學處理,該處理介質(B)具有至少一種液態成分(F);至少一個具有單獨的導出管道(10,10’)的定量加料裝置(1,1’),其中在整個設備(14)的範圍內進行處理所需要的每種液態成分(F)都有分配到一個單獨的定量加料裝置(1,1’),並且其中每個導出管道(10,10’)經由可控制的切換閥(17)與該處理池(15)的該介質供應管道(19)連接。 A processing apparatus (14) having: a treatment tank (15) capable of being fed via a medium supply conduit (19) for wet chemical treatment of the workpiece by means of a treatment medium (B), the treatment medium (B) having at least a liquid component (F); at least one dosing device (1, 1 ') having a separate outlet conduit (10, 10'), wherein each liquid component required for processing is carried out over the entire range of equipment (14) (F) are assigned to a separate dosing device (1, 1 '), and wherein each of the outlet pipes (10, 10') is via the controllable switching valve (17) to the process cell (15) The medium supply pipe (19) is connected. 如申請專利範圍第1項所述的處理設備(14),其中該處理設備(14)的一個或多個成分和介質供應管道(18,19)終止在用於一個或多個該定量加料裝置(1,1’)的通到快速接口的導出管道(10,10’)的容納部中。 The processing apparatus (14) of claim 1, wherein the one or more components of the processing apparatus (14) and the medium supply conduit (18, 19) terminate in one or more of the dosing devices (1,1') leads to the receptacle of the export duct (10, 10') of the quick interface. 如申請專利範圍第1項所述的處理設備(14),其中該處理設備(14)具有至少一個凹槽,該凹槽用於至少一個構造為配料模組的定量加料裝置(1,1’),該定量加料裝置(1,1’)能夠插入到該凹槽中。 The processing device (14) of claim 1, wherein the processing device (14) has at least one groove for at least one dosing device (1, 1' configured as a batching module) The dosing device (1, 1 ') can be inserted into the recess. 如申請專利範圍第1至3項中任一項所述的處理設備(14),其中該處理設備(14)具有:定量加料裝置(1,1’),以用於提供要在對工件進行濕法化學處理的範圍內使用的液態成分(F),其中該 定量加料裝置(1,1’)包括具有入口(3)和出口(4)的儲存器(2);至少一個通到該儲存器(2)中的導入管道(5);用於儲存器內含物(F’)的稱重裝置(7);設置在該出口(4)下游的流量測量裝置(8);至少一個能夠控制的排出閥(9);以及導出管道(10,10’),其中該儲存器(2)具有用於壓縮氣體(G)的入流口(11),並且該出口(4)設置在該儲存器(2)的下部區域(2”)中。 The processing apparatus (14) according to any one of claims 1 to 3, wherein the processing apparatus (14) has: a dosing device (1, 1 ') for providing a workpiece to be a liquid component (F) used in the range of wet chemical treatment, wherein The dosing device (1, 1 ') comprises a reservoir (2) having an inlet (3) and an outlet (4); at least one introduction conduit (5) leading into the reservoir (2); for use in the reservoir a weighing device (7) containing a substance (F'); a flow measuring device (8) disposed downstream of the outlet (4); at least one discharge valve (9) capable of being controlled; and an outlet pipe (10, 10') Wherein the reservoir (2) has an inflow port (11) for compressing the gas (G), and the outlet (4) is disposed in a lower region (2") of the reservoir (2). 一種處理設備(14),其具有:能夠經由介質供應管道(19)供料的處理池(15),以借助處理介質(B)對工件進行濕法化學的處理,該處理介質(B)具有至少一種液態成分(F);至少一個具有單獨的導出管道(10,10’)的定量加料裝置(1,1’),其中在整個設備(14)的範圍內進行處理所需要的每種液態成分(F)都有分配到一個單獨的定量加料裝置(1,1’),其中每個導出管道(10,10’)通到每個處理池(15)中並且具有一個選擇閥(9’)。 A processing apparatus (14) having: a treatment tank (15) capable of being fed via a medium supply conduit (19) for wet chemical treatment of the workpiece by means of a treatment medium (B), the treatment medium (B) having At least one liquid component (F); at least one dosing device (1, 1 ') having a separate outlet conduit (10, 10'), wherein each liquid liquid required for processing within the entire device (14) The ingredients (F) are all assigned to a separate dosing device (1, 1 '), wherein each of the outlet pipes (10, 10') opens into each treatment tank (15) and has a selector valve (9' ). 如申請專利範圍第5項所述的處理設備(14),其中該處理設備(14)的一個或多個成分和介質供應管道(18,19)終止在用於一個或多個該定量加料裝置(1,1’)的通到快速接口的導出管道(10,10’)的容納部中。 The processing apparatus (14) of claim 5, wherein the one or more components of the processing apparatus (14) and the medium supply conduit (18, 19) terminate in one or more of the dosing devices (1,1') leads to the receptacle of the export duct (10, 10') of the quick interface. 如申請專利範圍第5項所述的處理設備(14),其 中該處理設備(14)具有至少一個凹槽,該凹槽用於至少一個構造為配料模組的定量加料裝置(1,1’),該定量加料裝置(1,1’)能夠插入到該凹槽中。 a processing device (14) according to claim 5, wherein The processing device (14) has at least one recess for at least one dosing device (1, 1 ') configured as a dosing module into which the dosing device (1, 1 ') can be inserted In the groove. 如申請專利範圍第5至7項中任一項所述的處理設備(14),其中該處理設備(14)具有:定量加料裝置(1,1’),以用於提供要在對工件進行濕法化學處理的範圍內使用的液態成分(F),其中該定量加料裝置(1,1’)包括具有入口(3)和出口(4)的儲存器(2);至少一個通到該儲存器(2)中的導入管道(5);用於儲存器內含物(F’)的稱重裝置(7);設置在該出口(4)下游的流量測量裝置(8);至少一個能夠控制的排出閥(9);以及導出管道(10,10’),其中該儲存器(2)具有用於壓縮氣體(G)的入流口(11),並且該出口(4)設置在該儲存器(2)的下部區域(2”)中。The processing apparatus (14) according to any one of claims 5 to 7, wherein the processing apparatus (14) has: a dosing device (1, 1 ') for providing a workpiece to be a liquid component (F) used in the range of wet chemical treatment, wherein the dosing device (1, 1 ') comprises a reservoir (2) having an inlet (3) and an outlet (4); at least one is connected to the storage a introducing pipe (5) in the device (2); a weighing device (7) for the storage contents (F'); a flow measuring device (8) disposed downstream of the outlet (4); at least one capable of a controlled discharge valve (9); and an outlet conduit (10, 10'), wherein the reservoir (2) has an inlet (11) for compressing the gas (G), and the outlet (4) is disposed in the storage In the lower area (2") of the device (2).
TW101222555U 2012-01-19 2012-11-21 Treatment equipment having quantitative loading device TWM465965U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012000899.6A DE102012000899B4 (en) 2012-01-19 2012-01-19 Dosing device, treatment station, treatment plant and dosing process

Publications (1)

Publication Number Publication Date
TWM465965U true TWM465965U (en) 2013-11-21

Family

ID=48742096

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101222555U TWM465965U (en) 2012-01-19 2012-11-21 Treatment equipment having quantitative loading device
TW101222554U TWM475312U (en) 2012-01-19 2012-11-21 Quantification feeding device, processing station, and processing equipment

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101222554U TWM475312U (en) 2012-01-19 2012-11-21 Quantification feeding device, processing station, and processing equipment

Country Status (4)

Country Link
KR (2) KR20130004643U (en)
CN (2) CN203253420U (en)
DE (1) DE102012000899B4 (en)
TW (2) TWM465965U (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014106129A1 (en) 2014-04-30 2015-11-05 Thyssenkrupp Ag Method and apparatus for continuous precursor delivery
US11075218B2 (en) * 2019-05-22 2021-07-27 Sandisk Technologies Llc Method of making a three-dimensional memory device using silicon nitride etching end point detection
CN110935400B (en) * 2019-12-25 2021-01-01 唐虹 Intermittent automatic feeding device of liquid storage tank
DE102021109076A1 (en) 2021-04-12 2022-10-13 Bürkert Werke GmbH & Co. KG Metering device and method for metering liquid media

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH702769B1 (en) * 2010-02-22 2019-07-31 Reseachem Gmbh Metering device and method for metering a fluid into a reaction vessel.

Also Published As

Publication number Publication date
KR20130004644U (en) 2013-07-29
CN203134765U (en) 2013-08-14
DE102012000899B4 (en) 2014-01-16
CN203253420U (en) 2013-10-30
DE102012000899A1 (en) 2013-07-25
KR20130004643U (en) 2013-07-29
TWM475312U (en) 2014-04-01

Similar Documents

Publication Publication Date Title
JP6240252B2 (en) Dilution control of solid chemicals
JP2003062442A (en) System and method for accurately mixing fluids
TWM465965U (en) Treatment equipment having quantitative loading device
US6446644B1 (en) Chemical solutions system for processing semiconductor materials
CN105987745A (en) Automated solution dispenser
TW202138128A (en) On-demand in-line-blending and supply of chemicals
CN104359521A (en) Large-capacity storage tank volume detection system and calibration method
CN107029622A (en) Urethane raw high-precision measuring mixing equipment
US20090090164A1 (en) Method for volumetrically calibrating a liquid flow controller while maintaining the liquid in a closed system
CN103430116A (en) Metering unit
US20170189868A1 (en) Automated Liquid Blending System
CN206810192U (en) Urethane raw high-precision measuring mixing equipment
RU2682063C1 (en) Method for control of metrological characteristics of fixed or mobile metering installations and calibration unit for its implementation
CN102435266A (en) Constant water head water supply system for flow measurement device
CN207213649U (en) Solution feeding system
JP5021339B2 (en) Enzyme addition system
CN220672526U (en) Semiconductor cleaning equipment and liquid distribution device thereof
RU2393439C1 (en) Method of calibrating reservoirs
CN215428861U (en) Automatic preparation system of coating
CN219965798U (en) Automatic chemical adding equipment for cleaning silicon wafer
EA045286B1 (en) DOSING INSTALLATION FOR LIQUID COMPONENTS OF PLANT PROTECTION PRODUCTS
CN211612524U (en) Mixed acid system
CN208549791U (en) Peracetic acid soln preparation facilities
TWI807832B (en) Slurry Mixing and Supply System
US11377016B2 (en) Method of oil product receipt and metering

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees