TWM461282U - Printed circuit board shaping apparatus - Google Patents

Abstract

A printed circuit board shaping apparatus includes a support table, a transmission device, a positioning device, a moving device, and a cutter. The transmission device is used to convey a printed circuit board in a first direction. The positioning device includes a positioning pin, a first fixing bar, a second fixing bar, and a pressing board to position the printed circuit board. The positioning pin is used to move in a second direction toward the support table. The first fixing bar is used to move in the first direction. The second fixing bar is used to move in a third direction. The first, second, and third directions are perpendicular with each other. The pressing board is used to move in the second direction to press the printed circuit board. The moving device is located under the transmission device, and the moving device is used to move in the directions that are parallel to the first, second, and third directions. The cutter is fixed on the moving device. When the cutter is moved by the moving device to contact the printed circuit board, a bevel is formed on a plurality of conductive terminals of the printed circuit board by an oblique surface of the cutter.

Description

Circuit board forming equipment

The present invention relates to a circuit board forming apparatus.

The gold fingers of the board are easy to form and leave the metal wires. When the excess metal wires touch the gold fingers, the circuit board is short-circuited. Therefore, in general, the board manufacturer will make a lead angle at the end of the gold finger, and remove the excess wire first to solve the short circuit problem described above. In addition, when the user inserts and pulls the circuit board with the lead angle into the interface card slot, the lead angle of the gold finger can save the user when inserting and removing.

At present, the lead angle of the circuit board is mostly made by a beveling machine. The conventional beveling machine has a moving device for milling cutters and fixed milling cutters. The top end of the conventional milling cutter is flat and has no angle. Therefore, the moving device needs to first tilt the milling cutter relative to the circuit board, and then the guiding angle can be formed when the milling cutter contacts the circuit board. The beveling machine can generally be divided into two working modes, one can form a lead angle on the upper surface of the circuit board, and the other can form a lead angle on the lower surface of the circuit board. However, limited by the design of the beveling machine, the moving device can only drive the milling cutter to move unidirectionally along the edge of the gold finger, so that only the guide angle of the straight shape can be made. That is to say, when it is desired to make the guide angle into a circular arc shape or other shapes, it is known The beveling machine cannot be made.

In addition, the mobile device of the conventional blind fishing machine can only form a cross section by contacting the milling cutter with the circuit board in the direction of the vertical circuit board. Since the conventional blind fishing machine cannot tilt the milling cutter relative to the circuit board, it is impossible to make a lead angle on the gold finger of the circuit board.

One of the technical aspects of the present invention is a circuit board forming apparatus.

According to an embodiment of the present invention, a circuit board forming apparatus includes a carrier, a transmission device, a positioning device, a moving device, and a cutter. The transport device is located on the carrier for transporting the circuit board in a first direction. The positioning device is located on the carrier for positioning the circuit board on the transmission device. The positioning device comprises a positioning pin, a first fixing rod, a second fixing rod and a pressure plate. The locating pin is located above the transport device for movement in a second direction of the carrier. The first fixing rod is adjacent to the first side of the conveying device opposite to the positioning pin for moving in the first direction to position the circuit board between the positioning pin and the first fixing rod. The second fixing rod is adjacent to the second side of the conveying device adjacent to the first side for moving in the third direction against the circuit board. Wherein the first, second and third directions are perpendicular to each other. The pressure plate is located above the transport device for moving in the second direction to apply pressure to the circuit board. The mobile device is located below the transport device for movement in parallel with the first, second and third directions. The tool is fixed to the mobile device and moves with the mobile device. The end of the tool near the conveyor has a bevel. The bevel causes the plurality of conductive terminals of the board to form a lead angle as the tool contacts the board by movement of the moving device.

In an embodiment of the present invention, the moving device includes a first moving portion, a second moving portion, and a third moving portion. The first moving portion is configured to move in a direction parallel to the first direction. The second moving portion is configured to move in a direction parallel to the second direction. The third moving portion is coupled between the first and second moving portions for moving in a direction parallel to the third direction.

In an embodiment of the present invention, the cutter is fixed to the second moving portion.

In an embodiment of the present invention, the inclined surface of the cutter is at an angle of 20 to 70 degrees from the longitudinal direction of the cutter.

In an embodiment of the present invention, the circuit board forming apparatus further includes a circuit board feed port. The circuit board feed port is located on the carrier to accommodate the circuit board on which the lead angle is to be formed.

In an embodiment of the present invention, the first fixing rod is located between the transmission device and the circuit board feed port.

In an embodiment of the present invention, the circuit board forming apparatus further includes a circuit board suction device. The board pick-up device is movably located above the board feed cassette and above the transport device for picking up the board in the board feed cassette to the transport device.

In an embodiment of the present invention, the circuit board forming apparatus further includes a circuit board receiving pocket. The circuit board receiving magazine is located on the carrier and is connected to the transmission device for receiving the circuit board that the transmission device transmits in the first direction.

In an embodiment of the invention, the transport device comprises a conveyor belt or a roller.

In an embodiment of the present invention, the first fixing rod and the second solid The rod includes a push rod, a tie rod or a clamp.

Another technical aspect of the present invention is a circuit board forming apparatus.

According to an embodiment of the present invention, a circuit board forming apparatus includes a moving platform, one or more moving devices, a depth measuring component, a tool, a length measuring component, a pressing component, and a photosensitive component. The mobile platform is used to move in the first direction. The mobile platform includes a plurality of suction cups for pumping the circuit board to position the circuit board on the mobile platform. The mobile device is located above the mobile platform for clamping or carrying the component in a direction parallel to the first, second and third directions. The first, second and third directions are perpendicular to each other. The depth measuring component is on the mobile device and moves with the mobile device to measure the distance between the surface of the circuit board facing away from the mobile platform and the mobile platform. The tool is clamped to the mobile device and moves with the mobile device. The tool has a bevel at one end of the moving platform. The bevel causes the plurality of conductive terminals of the board to form a lead angle as the tool contacts the board by movement of the moving device. The length measuring component is on the mobile device and moves with the mobile device to measure the length of the tool. The pressing member is on the moving device and moves with the moving device to apply pressure to the circuit board in the third direction. The photosensitive element is located below the transmission device for detecting the position of the conductive terminals of the circuit board.

Another aspect of the present invention is a method of forming a lead angle at a conductive terminal of a circuit board.

In accordance with an embodiment of the present invention, a method of forming a lead angle at a conductive terminal of a circuit board includes the steps of: placing a transfer device of the circuit board on the carrier, wherein the transfer device is configured to transfer the circuit board in a first direction. The positioning pin is used to move in the second direction of the carrier. Use the first fixed rod towards the first The direction is moved to position the circuit board between the positioning pin and the first fixing rod. The second fixing rod is moved in a third direction to abut against the circuit board, wherein the first, second and third directions are perpendicular to each other. The platen is moved in the second direction to apply pressure to the circuit board. The moving device under the transport device is used to drive the cutter in the direction parallel to the first, second and third directions. When the tool contacts the board, the bevel of the tool near one end of the transfer device causes the plurality of conductive terminals of the board to form a lead.

In an embodiment of the present invention, the method for forming a lead angle on a conductive terminal of a circuit board, wherein the step (f) further comprises: moving the tool in a direction parallel to the first direction by using the first moving portion of the moving device. The second moving portion of the moving device is used to drive the cutter to move in a direction parallel to the second direction. The third moving portion of the moving device is used to drive the tool to move in a direction parallel to the third direction.

In an embodiment of the present invention, the inclined surface of the cutter is at an angle of 20 to 70 degrees from the longitudinal direction of the cutter.

In the above embodiment of the present invention, since the circuit board can be positioned on the transmission device by the positioning pin of the positioning device, the first fixing rod, the second fixing rod and the pressing plate, and the first, second and third directions are perpendicular to each other, Therefore, the positioning device has the effect of three-axis positioning of X, Y, and Z. In addition, the moving device below the transport device can move in parallel with the first, second and third directions, so that the tool fixed on the mobile device can move along the X, Y and Z axes with the mobile device. Since the tool has a bevel at one end of the transfer device, the bevel can form a plurality of conductive terminals of the circuit board to form a lead angle when the tool contacts the circuit board by the moving device. The movement of this board molding equipment The moving device can form a lead angle on the circuit board without tilting the tool relative to the circuit board, and the beveled tool can move along the X, Y, and Z axes with the moving device, thereby forming a linear shape on the circuit board, The arc of a circular shape or other shape.

Yet another technical aspect of the present invention is a method of forming a lead angle at a conductive terminal of a circuit board.

In accordance with an embodiment of the present invention, a method of forming a lead angle at a conductive terminal of a circuit board includes the steps of placing a circuit board on a mobile platform, wherein the mobile platform is configured to move in a first direction. The board is pumped using a plurality of suction cups of the mobile platform to position the board on the mobile platform. Using a depth measuring component on the mobile device to measure the distance between the surface of the mobile platform facing the mobile platform and the mobile platform, wherein the mobile device is located above the mobile platform for moving toward the second and third directions toward the carrier And the first, second, and third directions are perpendicular to each other. The tool with the bevel is clamped using a clamping element located on the moving device, wherein the bevel is located at the end of the tool near the moving platform. The length of the tool is measured using a length measuring component located on the mobile device. A pressing element located on the mobile device is pressed against the circuit board in a third direction. The position of the plurality of conductive terminals of the circuit board is detected using a photosensitive element located on the mobile device. The moving device is used to drive the cutter clamped to the clamping member to move in the second direction and the third direction. When the cutter contacts the circuit board, the slope of the cutter causes the conductive terminals of the circuit board to form a lead angle.

In an embodiment of the present invention, the inclined surface of the cutter is at an angle of 20 to 70 degrees from the longitudinal direction of the cutter.

In an embodiment of the present invention, the depth measuring component comprises a deep Control the measuring ruler.

In an embodiment of the invention, the length measuring component comprises an optical scale.

In an embodiment of the present invention, the pressing member includes a pressure foot or a pressure brush.

In the above embodiment of the present invention, the depth measuring component can first measure the position of the surface of the circuit board. The clamping element can then grip the tool with the bevel and measure the length of the tool by the length measuring component, thereby obtaining the position of the tool near one end of the moving platform. Thereafter, the pressing member can be pressed against the circuit board in a third direction, so that the photosensitive member detects the position of the plurality of conductive terminals of the circuit board. Finally, when the moving device drives the cutter held by the clamping member to move in the second direction and the third direction, the inclined surface of the cutter can form a conductive angle of the conductive terminals of the circuit board. The moving platform can move toward the X axis, and the beveled tool can move along the Y and Z axes with the moving device, so that a straight line shape, a circular arc shape or other shape of the lead angle can be formed on the circuit board.

100‧‧‧Circuit board forming equipment

110‧‧‧ bearing seat

120‧‧‧Transportation device

122‧‧‧ first side

124‧‧‧ second side

130‧‧‧ Positioning device

132‧‧‧Locating pin

134‧‧‧First fixed rod

136‧‧‧Second fixed rod

138‧‧‧ pressure plate

140‧‧‧Mobile devices

142‧‧‧First Moving Department

144‧‧‧Second Mobile Department

146‧‧ Third Mobile Department

150‧‧‧Tools

152‧‧‧Bevel

160‧‧‧Circuit Feed 匣

170‧‧‧Circuit suction device

180‧‧‧Board Receiver匣

200‧‧‧ boards

210‧‧‧Electrical terminals

212‧‧‧ empty slots

214‧‧‧ lead angle

214’‧‧‧ lead angle

300‧‧‧Circuit board forming equipment

310‧‧‧Mobile platform

312‧‧‧ sucker

314‧‧‧Slide rails

320‧‧‧Mobile devices

322‧‧‧rails

330‧‧‧Deep measurement components

340‧‧‧Clamping elements

350‧‧‧Tools

352‧‧‧Bevel

360‧‧‧ Length measuring components

370‧‧‧ Pressing elements

380‧‧‧Photosensitive elements

6-6‧‧‧ segments

D1‧‧ Direction

D1’‧‧‧ Direction

D2‧‧ Direction

D2’‧‧‧ Direction

D3‧‧ Direction

D3’‧‧‧ Direction

D4‧‧ Direction

D5‧‧ Direction

D6‧‧ Direction

H‧‧‧ distance

L1‧‧‧ length direction

L2‧‧‧ length direction

P‧‧‧Location

S1‧‧‧ steps

S2‧‧‧ steps

S3‧‧‧ steps

S4‧‧‧ steps

S5‧‧ steps

S6‧‧ steps

S7‧‧ steps

S8‧‧‧ steps

θ 1‧‧‧ angle

θ 2‧‧‧ angle

1 is a perspective view of a circuit board forming apparatus according to an embodiment of the present invention.

Fig. 2 is a partially enlarged plan view showing the circuit board forming apparatus of Fig. 1.

Figure 3 is a perspective view of the mobile device of Figure 1 located below the transmission device.

Fig. 4 is a partially enlarged view showing the cutter of Fig. 3.

Fig. 5 is a partially enlarged view showing the circuit board of Fig. 2.

Figure 6 is a cross-sectional view along line 6-6 of Figure 2.

FIG. 7 is a cross-sectional view showing the conductive terminals of the circuit board of FIG. 6 forming a lead angle.

Fig. 8 is a perspective view showing a circuit board produced by using the circuit board forming apparatus of Fig. 1.

FIG. 9 is a flow chart showing a method of forming a lead angle on a conductive terminal of a circuit board according to an embodiment of the present invention.

FIG. 10 is a perspective view of a circuit board forming apparatus according to an embodiment of the present invention.

Fig. 11 is a partially enlarged view showing the cutter of Fig. 10.

FIG. 12 is a flow chart showing a method of forming a lead angle on a conductive terminal of a circuit board according to an embodiment of the present invention.

The embodiments of the present invention are disclosed in the following drawings, and for the sake of clarity, the details of the invention are described in the following description. However, it should be understood that these practical details are not intended to limit the novel. That is to say, in some embodiments of the present invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

FIG. 1 is a perspective view of a circuit board forming apparatus 100 according to an embodiment of the present invention. 2 is a circuit board forming apparatus of FIG. A partially enlarged top view of 100. Referring also to FIGS. 1 and 2, the circuit board forming apparatus 100 includes a carrier 110, a transport device 120, a positioning device 130, a mobile device 140 (see FIG. 3), a cutter 150 (see FIG. 3), and a circuit board. The magazine 160, the circuit board pick-up device 170 and the circuit board receiving magazine 180. Since the moving device 140 and the cutter 150 of Fig. 3 are located in the carrier 110 of Fig. 1, the first drawing is not shown.

The circuit board feed port 160 is located on the carrier 110 and can accommodate the circuit board 200 to be formed with a lead angle. The board pick-up device 170 is movably disposed above the board feed cassette 160 and above the transport unit 120 to draw the board 200 in the board feed cassette 160 onto the transport unit 120. The transport device 120 is located on the carrier 110 and may include a conveyor belt or roller, but is not intended to limit the present invention. The circuit board receiving magazine 180 is located on the carrier 110 and is connected to the transmission device 120. In use, the transport device 120 can transmit the circuit board 200 located thereon to the circuit board receiving pocket 180 in a first direction D1, that is, the circuit board receiving cassette 180 can receive the circuit that the transmitting device 120 transmits in the first direction D1. Board 200.

The positioning device 130 is located on the carrier 110 and can position the circuit board 200 on the transmission device 120 so that the circuit board 200 can be stably processed at the transmission device 120 to form a lead angle. The positioning device 130 includes a positioning pin 132, a first fixing rod 134, a second fixing rod 136 and a pressure plate 138. The positioning pin 132 is located above the transmission device 120. The first fixed rod 134 is in close proximity to the first side 122 of the transport device 120 relative to the locating pin 132 and between the transport device 120 and the circuit board feed raft 160. The second fixed rod 136 abuts the second side 124 of the first side 122 of the transport device 120. In addition, the pressure plate 138 is located at the transmission device Above 120.

After the board pick-up device 170 places the circuit board 200 on the transport device 120, the positioning pin 132 can move toward the second direction D2 of the carrier 110 to contact the carrier 110. Next, the first fixing rod 134 is movable in the first direction D1 to position the circuit board 200 between the positioning pin 132 and the first fixing rod 134. Thereafter, the second fixing rod 136 is movable toward the third direction D3 to abut against the circuit board 200. Next, the pressure plate 138 is movable in the second direction D2 to apply pressure to the circuit board 200. The first direction D1, the second direction D2, and the third direction D3 are perpendicular to each other, so that the positioning device 130 has the effect of three-axis positioning of X, Y, and Z. That is to say, the circuit board 200 achieves the X-axis positioning effect by the first fixing rod 134, the Y-axis positioning effect is achieved by the second fixing rod 136, and the Z-axis positioning effect is achieved by the pressing plate 138.

FIG. 3 is a perspective view of the mobile device 140 located below the transmission device 120 in FIG. 1. Fig. 4 is a partial enlarged view of the cutter 150 of Fig. 3. Referring also to Figures 3 and 4, the mobile device 140 is located below the transport device 120. The cutter 150 is fixed to the mobile device 140 and moves with the mobile device 140. In addition, the tool 150 has a slope 152 near one end of the transmission device 120, and the slope 152 of the cutter 150 and the longitudinal direction L1 of the cutter 150 can be sandwiched by an angle θ 1 of 20 to 70 degrees, but the range of the angle θ 1 does not limit the present invention. .

In the present embodiment, the mobile device 140 includes a first moving unit 142, a second moving unit 144, and a third moving unit 146. The third moving portion 146 is connected between the first moving portion 142 and the second moving portion 144 , and the cutter 150 is fixed to the second moving portion 144 . The first moving portion 142 can be parallel to the first The direction of direction D1 moves, for example, direction D4. The second moving portion 144 is movable in a direction parallel to the second direction D2, for example, the direction D5. The third moving portion 146 is movable in a direction parallel to the third direction D3, for example, the direction D6. That is, the mobile device 140 has the ability to move X, Y, and Z three axes.

Fig. 5 is a partial enlarged view of the circuit board 200 of Fig. 2. Figure 6 is a cross-sectional view along line 6-6 of Figure 2. Referring to FIG. 5 and FIG. 6 , in the embodiment, the circuit board 200 has a plurality of conductive terminals 210 and a plurality of hollow slots 212 , and the conductive terminals 210 are adjacent to the hollow slots 212 . The conductive terminal 210 can be disposed on one side or both sides, and does not limit the present invention.

Referring to FIGS. 3 and 6, when the circuit board 200 is positioned by the positioning device 130 (see FIG. 2), the mobile device 140 located below the transmission device 120 can be in directions D1, D2, D3, D4, D5, D6. The movement causes the cutter 150 fixed to the mobile device 140 to move along the X, Y, and Z axes with the mobile device 140. Since the tool 150 has a ramp 152, the ramp 152 can cause the conductive terminals 210 of the circuit board 200 to form a lead angle as the tool 150 contacts the circuit board 200 by movement of the mobile device 140.

FIG. 7 is a cross-sectional view showing the conductive terminal 210 of the circuit board 200 of FIG. 6 forming a lead angle 214. Referring to FIGS. 6 and 7, when the conductive terminal 210 of the circuit board 200 forms the lead angle 214, the cutter 150 can move away from the circuit board 200 in the direction D2 with the mobile device 140 (see FIG. 3), and then the positioning device 130 (see Figure 2) can also be detached from the circuit board 200. In this way, the transmission device 120 (see FIG. 2) can transport the circuit board 200 in the first direction D1, so that one of the hollow slots 212 of the circuit board 200 is located at the cutter 150. Above, and repeating the above steps of positioning and guiding the angle to the circuit board 200. When all of the conductive terminals 210 adjacent to the hollow slot 212 form a lead angle 214, the transport device 120 can transport the circuit board 200 to the circuit board receiving pocket 180 in a first direction D1 (see FIG. 1).

Referring also to FIGS. 1 and 3, the moving device 140 of the board forming apparatus 100 can form the lead angle 214 on the circuit board 200 without tilting the tool 150 relative to the circuit board 200 (see FIG. 7). The tool having the inclined surface 152 (see FIG. 7) can be moved along the X, Y, and Z axes with the moving device 140, so that a lead shape of a linear shape, a circular arc shape, or the like can be formed on the circuit board 200.

Fig. 8 is a perspective view showing a circuit board 200 fabricated using the circuit board molding apparatus 100 of Fig. 1. Referring to FIGS. 1 and 8 together, the circuit board forming apparatus 100 can form a linear guide angle 214 ′ for a portion of the circuit board 200 and the right fourth conductive terminal 210 in the above manner, and can also be used for another portion of the circuit board 200 and the left side. The conductive terminals 210 form a circular arc-shaped lead angle 214. Therefore, the lead angle shape of the circuit board 200 and the conductive terminal 210 fabricated by the board forming apparatus 100 is more versatile than that of the conventional lead angle apparatus.

FIG. 9 is a flow chart showing a method of forming a lead angle on a conductive terminal of a circuit board according to an embodiment of the present invention. First, in step S1, a transfer device for the circuit board on the carrier is placed, wherein the transfer device is used to transfer the circuit board in the first direction. Next, in step S2, the positioning pin is used to move in the second direction of the carrier. Then in step S3, the first fixing rod is moved in the first direction to position the circuit board between the positioning pin and the first fixing rod. Next, in step S4, the second fixing rod is moved in the third direction to abut against the circuit board, wherein the first, second and third directions are perpendicular to each other. Thereafter, in step S5, the pressure plate is moved in the second direction to apply pressure to the circuit board. Finally, in step S6, the moving device under the transport device is used to drive the cutter in the direction parallel to the first, second and third directions. When the tool contacts the board, the bevel of the tool near one end of the transfer device causes the plurality of conductive terminals of the board to form a lead. Wherein the bevel of the tool is at an angle of 20 to 70 degrees with the length of the tool.

Furthermore, the step of moving the tool in the direction parallel to the first, second and third directions using the moving device below the transport device may further comprise: using the first moving portion of the moving device to move the tool in a direction parallel to the first direction. The second moving portion of the moving device is used to drive the cutter to move in a direction parallel to the second direction. The third moving portion of the moving device is used to drive the tool to move in a direction parallel to the third direction.

FIG. 10 is a perspective view of a circuit board forming apparatus 300 according to an embodiment of the present invention. Fig. 11 is a partially enlarged view showing the cutter 350 of Fig. 10. Referring also to FIGS. 10 and 11, the circuit board forming apparatus 300 includes a moving platform 310, a moving device 320, a depth measuring component 330, a clamping component 340, a cutter 350, a length measuring component 360, a pressing component 370, and a photosensitive component. 380. The mobile platform 310 has a plurality of suction cups 312. The chuck 312 can be evacuated to position the circuit board 200 on the mobile platform 310. The mobile platform 310 is movable along the slide rail 314 in a first direction D1'. The mobile device 320 is positioned above the mobile platform 310 for clamping or carrying the components in the direction parallel to the first, second and third directions D1', D2', D3'. Mobile device 320 It is movable along the slide rail 322 in the second direction D2' and can be elongated in the third direction D3'. The first, second and third directions D1', D2', D3' are perpendicular to each other. That is, the mobile platform 310 can move along the X axis, and the mobile device 320 can move along the Y and Z axes.

Depth measuring element 330, clamping element 340, length measuring element 360, pressing element 370 and photosensitive element 380 are all disposed on mobile device 320. In use, the depth measuring element 330 can be elongated toward the third direction D3', which can be measured when the depth measuring element 330 contacts the surface of the circuit board 200 facing away from the moving platform 310 (eg, the position point P on the surface) The circuit board 200 faces away from the distance H between the surface of the mobile platform 310 and the mobile platform 310, thereby obtaining the position of each point on the surface of the circuit board 200 as the depth control parameter of the tool 350 contacting the circuit board 200. The clamping element 340 can grip the tool 350 having a ramp 352. The slope 352 is located at one end of the cutter 350 near the moving platform 310. The length measuring component 360 can measure the length of the tool 350 to obtain a position of the tool 350 near one end of the moving platform 310 for depth compensation and correction of the height of the tool 350 at the Z-axis.

When the mobile device 320 is positioned above the circuit board 200, the pressing member 370 can be pressed against the circuit board 200 in the third direction D3' such that the surface of the circuit board 200 facing away from the mobile platform 310 does not slide. The photosensitive element 380 is caused to detect the position of the conductive terminal 210 of the circuit board 200 to control the position at which the tool 350 contacts the starting point of the circuit board 200. At this time, the moving device 320 can drive the cutter 350 clamped on the clamping member 340 to move in the second direction D2 ′ and the third direction D3 ′, and the moving platform 310 can move toward the first direction D1 ′, so the slope of the cutter 350 352 can cause the conductive terminal 210 of the circuit board 200 Form a guide angle. Since the moving platform 310 can be moved along the X axis, the tool 350 having the inclined surface 352 can move along the Y and Z axes with the moving device 320, so the tool 350 can form a straight line shape, a circular arc shape or a lead shape of other shapes on the circuit board 200. .

In the present embodiment, the inclined surface 352 and the longitudinal direction L2 of the cutter 350 may be sandwiched by an angle θ 2 of 20 to 70 degrees, but the range of the included angle θ 2 is not intended to limit the present invention. Additionally, depth measuring component 330 can include a depth control tap. The length measuring component 360 can include an optical scale. Photosensitive element 380 can include a charge-coupled device camera. The pressing member 370 can include a pressure foot or a pressure brush, wherein the pressure brush can be used to clean the powder layer produced when the circuit board 200 forms a lead angle.

FIG. 12 is a flow chart showing a method of forming a lead angle on a conductive terminal of a circuit board according to an embodiment of the present invention. First, in step S1, the circuit board is placed on the mobile platform, wherein the mobile platform is used to move in the first direction. Next, in step S2, the circuit board is evacuated using a plurality of suction cups of the mobile platform to position the circuit board on the mobile platform. Then in step S3, the distance between the surface of the mobile platform and the mobile platform is measured by the depth measuring component on the mobile device, wherein the mobile device is located above the mobile platform for carrying the second and the facing The third direction of the seat moves and the first, second and third directions are perpendicular to each other. Next in step S4, the tool with the bevel is clamped using a clamping element located on the moving device, wherein the bevel is located at the end of the tool near the moving platform. Then in step S5, the length of the tool is measured using a length measuring component located on the mobile device. Next, in step S6, the pressing force on the moving device is used to apply pressure in the third direction. On the board. Then in step S7, the position of the plurality of conductive terminals of the circuit board is detected using the photosensitive element located on the mobile device. Finally, in step S8, the moving device is used to drive the cutter clamped to the clamping member to move in the second direction and the third direction. When the cutter contacts the circuit board, the slope of the cutter causes the conductive terminals of the circuit board to form a lead angle.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Circuit board forming equipment

110‧‧‧ bearing seat

120‧‧‧Transportation device

130‧‧‧ Positioning device

160‧‧‧Circuit Feed 匣

170‧‧‧Circuit suction device

180‧‧‧Board Receiver匣

200‧‧‧ boards

D1‧‧‧ first direction

D2‧‧‧ second direction

Claims (16)

A circuit board forming apparatus comprising: a carrier; a transmission device located on the carrier for transmitting a circuit board in a first direction; and a positioning device located on the carrier for positioning the transmission device The positioning device includes: a positioning pin located above the transmission device for moving in a second direction of the carrier; a first fixing rod adjacent to the transmission device opposite to the positioning pin a side for moving in the first direction to position the circuit board between the positioning pin and the first fixing rod; a second fixing rod adjacent to a second side of the transmitting device adjacent to the first side For moving in a third direction against the circuit board, wherein the first, the second and the third direction are perpendicular to each other; and a pressure plate located above the transmission device for moving in the second direction And applying a pressure to the circuit board; a moving device located below the transmission device for moving in parallel with the first, second, and third directions; and a cutter fixed to the mobile device, and With Means for moving the tool near one end of the transmission device has an inclined plane, when the tool by means of the movement of the mobile contact of the circuit board, so that the inclined surface a plurality of conductive terminals of the circuit board forms a lead angle. The circuit board forming apparatus of claim 1, wherein the moving device comprises: a first moving portion for moving in a direction parallel to the first direction; and a second moving portion for facing the second direction Moving in a direction; and a third moving portion connected between the first and the second moving portion for moving in a direction parallel to the third direction. The circuit board forming apparatus of claim 2, wherein the tool is fixed to the second moving portion. The circuit board forming apparatus of claim 1, wherein the slope of the tool is at an angle of 20 to 70 degrees from the length direction of the tool. The circuit board forming apparatus of claim 1, further comprising: a circuit board feed port located on the carrier for receiving the circuit board to be formed. The circuit board forming apparatus of claim 5, wherein the first fixing rod is located between the transmission device and the circuit board feed port. The circuit board forming apparatus of claim 5, further comprising: a circuit board suction device movable to be located on the circuit board feed port Above the transmission device, the circuit board in the feeding port of the circuit board is sucked onto the transmission device. The circuit board forming apparatus of claim 1, further comprising: a circuit board receiving magazine located on the carrying base and connected to the transmitting device for receiving the circuit board that the transmitting device transmits in the first direction . The circuit board forming apparatus of claim 1, wherein the transporting device comprises a conveyor belt or a roller. The circuit board forming apparatus of claim 1, wherein the first fixing rod and the second fixing rod comprise a push rod, a pull rod or a clamp. A circuit board forming apparatus comprising: a mobile platform for moving in a first direction, the mobile platform comprising: a plurality of suction cups for pumping a circuit board to position the circuit board on the mobile platform; Or a plurality of mobile devices located above the mobile platform for moving or holding the carrier member in a direction parallel to the first, second and third directions, the first, the second and the third direction being mutually Vertically; a depth measuring component on the mobile device and moving with the mobile device to measure a distance between the surface of the circuit board facing the mobile platform and the mobile platform; a cutter clamped to the moving device, and as the moving device moves, the tool has a slope near an end of the moving platform, and the slope causes the tool to contact the circuit board when the moving device moves The plurality of conductive terminals of the circuit board form a lead angle; a length measuring component is mounted on the moving device and moves with the moving device to measure the length of the tool; and a pressing component is disposed on the mobile device And moving with the mobile device for pressing the circuit board in the third direction; and a photosensitive element located below the transmission device for detecting the positions of the conductive terminals of the circuit board. The circuit board forming apparatus of claim 11, wherein the slope of the tool is at an angle of 20 to 70 degrees from the length of the tool. The circuit board forming apparatus of claim 11, wherein the depth measuring component comprises a deep gauge. The circuit board forming apparatus of claim 11, wherein the length measuring component comprises an optical scale. The circuit board forming apparatus of claim 11, wherein the pressing member comprises a pressure foot or a pressure brush. The circuit board forming apparatus of claim 11, wherein the photosensitive The component contains an automatic registration exposure machine.