TWM460405U - Carrier package structure with sensing device - Google Patents

Description

Carrier package structure with sensing device

The present invention relates to a carrier package structure having an inductive device, and more particularly to a package structure in which a light emitting element and a light sensing element are disposed on the same carrier.

Configuring a light-emitting element and a light-sensing element on the same carrier plate can form a widely used light-sensing device. When an object intercepts the light path between the light-emitting element and the light-sensing element, the light-sensing element The presence of the object can be determined. Conversely, if the light sensing element can smoothly receive the light emitted by the light emitting element, the light sensing element can determine that the object does not exist. The reflective light sensing device is configured such that the light emitting element and the light sensing element are disposed on the same side, and whether the object reflects the light of the light emitting element back to the light sensing element to determine whether the object exists.

In order to ensure the accuracy of the light sensing device, in the conventional art, it is desirable that the light sensing component only receives the light reflected by the object, so how to avoid the additional influence of the light sensing component, especially avoiding It is very important that the light-emitting element is directly irradiated from the inside of the light-sensing device to the light-sensing element.

As described above, the light-sensing device package structure used in the prior art is as follows. First, please refer to FIG. 1A, which is a schematic diagram of a package structure of a light-sensing device disclosed in US Pat. No. 8,232,541. As shown in FIG. 1A, the carrier 90 has a light-emitting element 92 and a light-sensing element 94, which are packaged in a transparent material on the carrier to form a package cover 98. A trench 96 is cut in the package cover 98. The 96 is filled with an opaque material to form a photoresist barrier 91.

Please refer to FIG. 1B , which is a schematic diagram of a package structure of a light sensing device disclosed in Taiwan Patent No. M363080. As shown in FIG. 1B, the carrier 90 has a light-emitting element 92 and a light-sensing element 94, which are packaged in a transparent material on the carrier to form a package cover 98, and a trench 96 is cut in the package cover 98. 96 and the surface of the package lid 98 are coated with an opaque coating 95.

FIG. 1C is a schematic diagram of a package structure of a light sensing device disclosed in US Pat. No. 20100327164. As shown in FIG. 1C, the carrier 90 has a light-emitting element 92 and a light-sensing element 94. Three light-blocking barriers 91 are placed in the middle and on both sides of the two components, and the entire carrier 90 is covered by a transparent cover 93.

FIG. 1D is a schematic diagram of a package structure of a light sensing device disclosed in US Pat. No. 7,652,244. As shown in FIG. 1D, the lead frame 97 is mounted on a lower cover 99 of a plastic material, and the light-emitting element 92 and the light sensing element 94 are placed on the lead frame 97, and finally the light-emitting element 92 and the light-sensing element are mounted. The space of 94 is filled with a transparent material 990.

The package structure of the above devices has some disadvantages. First, the process is troublesome. The above-mentioned components are mostly calculated in millimeters, and each of the processes performed under such a size causes a large increase in cost; The number is large, and the thickness of the light sensing device cannot be reduced, and the size of the product using the light sensing device cannot be further reduced.

Therefore, the present invention proposes a carrier package structure having an inductive device, which can be used for packaging of a light sensing device, and improves the manufacturing process of the light sensing device by relatively improving the packaging structure, thereby reducing the manufacturing cost. It is also possible to further produce a light-sized device of a smaller size.

In order to solve the above related problems, one of the main purposes of the present invention is to provide a carrier package structure having an inductive device, which can be applied to a package of a light sensor. Through a carrier board having a blocking element itself, it is not necessary to add too many components to the carrier board when manufacturing the light sensing device, and a smaller-sized light sensing device can be produced.

According to the above items, the present invention proposes a carrier package structure having an inductive device, comprising a carrier plate having an upper surface and a lower surface opposite to the upper surface, and configured with a plurality of loadings from the upper surface to the lower surface a through hole of the plate, wherein the upper surface has a rectangular wall, and the rectangular wall divides the upper surface into two planes, wherein the outer side of the rectangular wall is the first plane, and the inner side of the rectangular wall is the second plane, and is carried in the first plane At least one carrier wire is disposed in the through hole of the board, and a plurality of carrier wires are disposed in the through hole of the carrier plate in the second plane; a light emitting component is disposed on the first plane, wherein the light emitting component transmits through the at least one first outer wire The carrier wires in the first plane are electrically connected; a light sensing component is disposed in the second plane, wherein the light sensing component is electrically connected to the carrier wires in the second plane through the plurality of second outer wires a plurality of wire pins disposed on the lower surface and electrically connected to the carrier wires; a first transparent sealing layer applied to the first plane to cover the first plane, the light emitting component and the first outer conductor ; And a second transparent encapsulant layer, coated on the second plane, the second plane so as to cover the light sensing element and a second outer conductor.

The present invention further provides a carrier package structure having an inductive device, comprising a carrier plate having an upper surface and a lower surface opposite to the upper surface, and configured with a plurality of carrier through holes extending through the upper surface to the lower surface, wherein The upper surface has a rectangular wall, the rectangular wall has a plurality of retaining wall through holes corresponding to the through holes of the carrier plate, the rectangular wall divides the upper surface into two planes, wherein the outer side of the rectangular wall is the first plane, the rectangular shape The inner side of the wall is a second plane, and a plurality of inner wires are disposed in the through hole of the rectangular wall and the corresponding through hole of the carrier; a light emitting component is disposed on the first plane, wherein the light emitting component passes through the first outer wire The light sensing component is electrically connected to the inner wire; and the light sensing component is electrically connected to the inner wire through the plurality of second outer wires; the plurality of wire pins are disposed on the lower surface, and Electrically connecting with the inner conductor; and a transparent encapsulation layer disposed above the carrier board and covering the first plane and the second plane, and simultaneously illuminating the light-emitting component, the light sensing component, the rectangular wall and the outer conductor Coverage.

The carrier package structure with the sensing device proposed by the present invention can produce a smaller size light sensing device with less steps and less manufacturing cost, and can further reduce the size of the product using the light sensing device.

Since the present invention mainly discloses a carrier package structure having an inductive device, the current process is modified by providing a carrier plate having a barrier element, thereby reducing the manufacturing cost and producing a smaller-sized light sensing device product. Further, the semiconductor package technology related to the present invention has been known to those skilled in the relevant art, and therefore, the description of the carrier package structure having the sensing device will be described in detail below. In addition, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their functions are only to express the schematic diagrams related to the present creative features.

First, please refer to FIG. 2, which is a cross-sectional view of a carrier board according to a first embodiment of the present invention. As shown in FIG. 2, the carrier 12 is made of a polymer material, such as polyimide (PI) or a printed circuit board (PCB), and has a thickness of 0.1 to 1.5 mm; A preferred thickness of the embodiment is 0.3 to 1.3 mm. The carrier 12 has an upper surface 12a and a lower surface 12b opposite to the upper surface 12a, and is provided with a plurality of carrier through holes (not shown) extending through the upper surface 12a to the lower surface 12b; the upper surface 12a has a The rectangular wall 127 divides the upper surface 12a into two planes, the outer side of the rectangular wall 127 is a first plane 122, the inner side of the rectangular wall 127 is a second plane 124, and the rectangular wall 127 is located at the center of the upper surface 12a. For the wall 1271 of the wall, the rectangular wall 127 opposite to the wall 1271 of the wall is the wall side wall 1273; in addition, a carrier wire (not shown in the drawing) of the first plane 122 is provided with a carrier wire (trace) 123, a plurality of carrier wires 123 are disposed in the carrier through holes (not shown) of the second plane 124; the carrier wires 123 have a plurality of wire pins 125 disposed on the lower surface 12b of the carrier 12. Electrically connected, the wire pin 125 is used as a connection point for the carrier 12 to the outside.

Next, please refer to FIG. 3, which is a cross-sectional view of a carrier package structure with an inductive device according to a first embodiment of the present invention. As shown in FIG. 3, in the carrier 12 of FIG. 2, a light-emitting element 14 is disposed on the first plane 122 of the carrier 12 and communicates with the carrier of the first plane 122 through an outer wire 18a. The carrier wires 123 in the holes (not shown) are electrically connected; in addition, a light sensing component 16 is disposed on the second plane 124 of the carrier 12 and passes through the plurality of outer leads 18b and the second plane. The carrier wires 123 of the carrier holes (not shown in the drawings) of 124 are electrically connected; wherein the outer wires 18a, 18b are formed by wire bonding.

After the light-emitting element 14 and the light-sensing element 16 are disposed, the transparent epoxy resin is applied to the first plane 122 to form the first transparent sealant layer 1220, and the transparent epoxy resin is applied to the second plane 124. Forming a second transparent encapsulant layer 1240; the first transparent encapsulant layer 1220 simultaneously covers the first plane 122, the light-emitting element 14 and the outer lead 18a connecting the light-emitting elements 14; and the second transparent encapsulant layer 1240 simultaneously The two planes 124, the light sensing component 16 and the outer conductor 18b connecting the light sensing component 16 are covered, and the thickness of the first transparent sealing layer 1220 and the second transparent sealing layer 1240 may be lower than, equal to or higher than the moment. The depth of the type wall 127. When the height of the transparent sealing layer 1220, 1240 is lower than or equal to the depth of the rectangular wall 127, the thickness of the carrier package structure 1 having the sensing device is the thickness of the carrier 12 (0.1 to 1.5 mm).

In addition, before mounting the light-emitting element 14 and the light-sensing element 16 on the carrier 12, a first metal plate 1224 and a second metal plate may be respectively installed at positions where the light-emitting element 14 and the light-sensing element 16 are to be mounted. 1244 is used as a slot for mounting the light-emitting element 14 and the light-sensing element 16.

Next, please refer to FIG. 4, which is a top view of a carrier package structure with an inductive device according to a first embodiment of the present invention. As shown in FIG. 4, the first transparent sealant layer 1220 on the first plane 122 is coated with an opaque paint 126 made of black epoxy resin, and an illumination hole 1222 is left at a corresponding position of the light-emitting element 14 to The light from the light-emitting element 14 is pierced; in addition, an opaque paint 126 made of black epoxy resin is applied over the second transparent sealant layer 1240 on the second plane 124, and is disposed at a corresponding position of the light-sensing element 16. A receiving aperture 1242 is left for the light sensing element 16 to sense the source of light outside.

Next, please refer to FIG. 3 and FIG. 5 at the same time. FIG. 5 is a cross-sectional view showing the use of other light-emitting elements in the carrier package structure with the sensing device according to the first embodiment of the present invention. As shown in FIG. 3, the carrier package structure 1 having the sensing device of the present invention uses the light-emitting element 14; in the embodiment, the light-emitting element 14 is an infrared light-emitting diode (IR-LED); - the LED is the upper and lower electrodes, so the light-emitting element 14 only needs to be connected to one of the carrier wires 123 through an outer wire 18a; in addition, if the light-emitting element 14 is changed to the LED of the same side electrode (for example, a green LED or a blue LED), As shown in FIG. 5, the light-emitting element 14' of the carrier package structure 1' having the sensing device is connected to a plurality of strip-through holes (not shown in the drawing) of the first plane 122 by a plurality of outer leads 18a. The carrier wires 123 and the remaining components are arranged in the same manner as in FIG. 3 and will not be described again.

In the above embodiment, only the rectangular wall 127 is additionally disposed on the carrier 12, and the present invention can also form a first plane 122 and a first layer on the carrier 12 by processing, such as etching, stamping or digging. The two planes 124 form the carrier 12 and the rectangular wall 127 integrally.

Please refer to FIG. 6, which is a cross-sectional view of a carrier board according to a second embodiment of the present invention. As shown in FIG. 6, the carrier 22 is made of a polymer material such as a PI or a PCB, and has a thickness of 0.1 to 1.5 mm; and a preferred thickness of the embodiment is 0.3 to 1.3 mm. The carrier 22 has an upper surface 22a and a lower surface 22b opposite to the upper surface 22a, and is provided with a plurality of carrier through holes (not shown) extending through the upper surface 22a to the lower surface 22b; the upper surface 22a has a The rectangular wall 227 divides the upper surface 22a into two planes, the outer side of the rectangular wall 227 is a first plane 222, the inner side of the rectangular wall 227 is a second plane 224, and the rectangular wall 227 is located at the center of the upper surface 22a. For the wall 2271, the rectangular wall 227 opposite to the wall 2271 is the wall side wall 2273; in addition, the wall 2271 and the wall side wall 2273 have a plurality of through holes (not shown) Corresponding retaining wall through holes (not shown in the drawings), and through-wall through-holes (not shown in the figure) and corresponding carrier through-holes in the wall 2271 and the wall side wall 2273 (not shown) A plurality of inner wires 229 are disposed in the drawing; the inner wires 229 are electrically connected to the plurality of wire pins 225 disposed on the lower surface 22b of the carrier 22, and the wire pins 225 are used as the carrier 22 to the outside. Junction.

Next, please refer to FIG. 7, which is a cross-sectional view of a carrier package structure having an inductive device according to a second embodiment of the present invention. As shown in FIG. 7, in the carrier 22 of FIG. 6, a light-emitting element 24 is disposed on the first plane 222, and is passed through an outer lead 28a and a through-wall through hole of the wall 2271 adjacent to the first plane 222. The internal wires 229 (not shown in the drawings) and the corresponding carrier through holes (not shown in the drawings) are electrically connected; in addition, a light sensing element 26 is disposed on the second plane 224 and transmitted through the plurality The outer conductor 28b and the inner wall of the wall 2271 and the side wall 2273 of the second plane 224 are not shown in the drawing, and the corresponding inner conductor of the carrier through hole (not shown in the drawing) 229 is electrically connected; wherein the outer leads 28a, 28b are formed by wire bonding.

After the light-emitting component 24 and the light-sensing component 26 are disposed, the transparent encapsulation layer 228 made of a transparent epoxy resin covers the upper surface 22a of the carrier 22, including: a first plane 222, a second plane 224, and a rectangular wall. 227 and light-emitting elements 24, light-sensing elements 26, and outer leads 28a, 28b on first plane 222 and second plane 224.

In addition, before the light-emitting element 24 and the light-sensing element 26 are mounted on the carrier 22, a first metal plate 2224 and a second metal plate may be respectively installed at positions where the light-emitting element 24 and the light-sensing element 26 are to be mounted. 2244 is used as a slot for mounting the light-emitting element 24 and the light-sensing element 26.

Next, please refer to FIG. 8, which is a top view of a carrier package structure having an inductive device according to a second embodiment of the present invention. As shown in FIG. 8 , an opaque coating 226 made of black epoxy resin is applied over the transparent encapsulation layer 228 , and an illumination hole 2222 is left at a corresponding position of the illuminating element 24 for the light of the illuminating element 24 to pass through; Additionally, a receiving aperture 2242 is left in the corresponding location of the light sensing component 26 for the light sensing component 26 to sense the source of light outside.

Next, please refer to FIG. 7 and FIG. 9 at the same time; FIG. 9 is a cross-sectional view showing the use of other light-emitting elements in the carrier package structure with the sensing device according to the second embodiment of the present invention. As shown in FIG. 7, the carrier package structure 2 having the sensing device of the present invention uses the light-emitting element 24; in the embodiment, the light-emitting element 24 is an IR-LED; since the IR-LED is an upper and lower electrode, the light-emitting element 24 only needs to be connected to an inner wire 229 through a wire 28a; in addition, if the light-emitting element 24 is changed to an LED of the same side electrode (for example, a green LED or a blue LED), as shown in FIG. The light-emitting element 24' of the carrier-package structure 2' of the device needs to have an outer wire 28a and a through-wall through hole (not shown) of the wall 2271 adjacent to the first plane 222 and the corresponding carrier through hole. The inner wire 229 (not shown in the figure) is electrically connected, and is electrically connected to the carrier wire 223 of the carrier through hole (not shown in the drawing) of the first plane 222 of at least one outer wire 28c. The rest of the components are arranged in the same way as in Figure 7, and will not be described again.

In the above embodiment, only the rectangular wall 227 is additionally disposed on the carrier 22, and the present invention can also form a first plane 222 on the carrier 22 by processing, such as etching, stamping or digging. The second plane 224 is such that the carrier 22 and the rectangular wall 227 are integrally formed.

The carrier package structure 1 and 2 having the sensing device proposed by the present invention can produce a smaller-sized light sensing device with less steps and less manufacturing cost, and also enables the product size of the light sensing device to be used. Further narrowing down.

Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of patent protection of the creation shall be subject to the definition of the scope of the patent application attached to this specification.

1‧‧‧ Carrier package structure with sensing device
223‧‧‧ Carrier wire

1'‧‧‧ Carrier package structure with sensing device
224‧‧‧ second plane

12‧‧‧ Carrier Board
2242‧‧‧ receiving hole

122‧‧‧ first plane
2244‧‧‧Second metal plate

1220‧‧‧First transparent sealant
225‧‧‧Wire pins

1222‧‧‧ illuminated holes
226‧‧‧ opaque paint

1224‧‧‧First metal plate
227‧‧‧ rectangular wall

123‧‧‧ Carrier wire
2271‧‧‧Isolated wall

124‧‧‧ second plane
2273‧‧‧Isolated side wall

1240‧‧‧Second transparent sealant
228‧‧‧Transparent encapsulation layer

1242‧‧‧ receiving hole
24‧‧‧Lighting elements

1244‧‧‧Second metal plate
24'‧‧‧Lighting elements

125‧‧‧Wire pins
26‧‧‧Light sensing components

126‧‧‧Opacity coating
28a‧‧‧External conductor

127‧‧‧ rectangular wall
28b‧‧‧External wire

1271‧‧‧Isolated middle wall
28c‧‧‧External conductor

1273‧‧‧Isolated side wall
90‧‧‧ Carrier Board

14‧‧‧Lighting elements
91‧‧‧Light barrier

14'‧‧‧Lighting elements
92‧‧‧Lighting elements

16‧‧‧Light sensing components
93‧‧‧ Transparent cover

18a‧‧‧External conductor
94‧‧‧Light sensing components

18b‧‧‧External wire
95‧‧‧Opacity coating

2‧‧‧ Carrier board package structure with sensing device
96‧‧‧ trench

2'‧‧‧ Carrier package structure with sensing device
97‧‧‧ lead frame

22‧‧‧ Carrier Board
98‧‧‧Package cover

222‧‧‧ first plane
99‧‧‧Undercover

2222‧‧‧ illuminated holes
990‧‧‧Transparent material

2224‧‧‧First metal plate

1A is a schematic view showing a package structure of a conventional light sensing device;

1B is a schematic view showing a package structure of a conventional light sensing device;

1C is a schematic view showing a package structure of a conventional light sensing device;

1D is a schematic view showing a package structure of a conventional light sensing device;

Figure 2 is a cross-sectional view of the carrier of the first embodiment of the present invention;

Figure 3 is a cross-sectional view showing a carrier package structure having an inductive device according to a first embodiment of the present invention;

4 is a top view of a carrier package structure having an inductive device according to a first embodiment of the present invention;

Figure 5 is a cross-sectional view showing a carrier package structure having an inductive device according to a first embodiment of the present invention using other light-emitting elements;

Figure 6 is a cross-sectional view of a carrier plate of a second embodiment of the present invention;

Figure 7 is a cross-sectional view showing a carrier package structure having an inductive device according to a second embodiment of the present invention;

Figure 8 is a top plan view of a carrier package structure having an inductive device according to a second embodiment of the present invention;

Figure 9 is a cross-sectional view showing the use of other light-emitting elements in a carrier package structure having an inductive device according to a second embodiment of the present invention.

12‧‧‧ Carrier Board

12a‧‧‧Upper surface

12b‧‧‧ lower surface

122‧‧‧ first plane

123‧‧‧ Carrier wire

124‧‧‧ second plane

125‧‧‧Wire pins

127‧‧‧ rectangular wall

1271‧‧‧Wall wall

1273‧‧‧Wall wall

Claims (18)

A carrier board package structure having an inductive device, comprising:
a carrier plate having an upper surface and a lower surface opposite to the upper surface, and configured with a plurality of carrier through holes extending through the upper surface to the lower surface, wherein the upper surface has a rectangular wall, the rectangular shape The upper wall is divided into two planes, wherein the outer side of the rectangular wall is a first plane, the inner side of the rectangular wall is a second plane, and at least one carrier wire is disposed in the through hole of the carrier of the first plane Configuring a plurality of carrier wires in the carrier through holes of the second plane;
a light-emitting element is disposed on the first plane, wherein the light-emitting element is electrically connected to the carrier wire in the first plane through the at least one first outer wire;
a light sensing component is disposed in the second plane, wherein the light sensing component is electrically connected to the carrier wires in the second plane through the plurality of second outer wires;
a plurality of wire pins disposed on the lower surface and electrically connected to the carrier wires;
a first transparent encapsulant layer coated on the first plane to cover the first plane, the light emitting element and the first outer conductor; and a second transparent encapsulant layer coated on the second plane The second plane, the light sensing element and the second outer leads are covered. The carrier package structure with an inductive device according to claim 1, wherein the two transparent sealant layers are coated with an opaque paint, and respectively have a corresponding position on the light-emitting element and the light-sensing element. An illumination hole and a receiving hole. The carrier package structure with an inductive device according to claim 1, wherein the first and second transparent encapsulant layers are transparent epoxy resins. A carrier package structure having an inductive device according to claim 2, wherein the opaque coating is a black epoxy resin. A carrier package structure having an inductive device according to claim 1, wherein a first metal plate is further disposed between the light emitting element and the carrier. The carrier package structure with an inductive device according to claim 1, wherein a second metal plate is further disposed between the light sensing element and the carrier. The carrier package structure having the sensing device according to claim 1, wherein the material of the carrier is formed of a polymer material. According to the carrier package structure with the sensing device described in claim 1, the carrier package structure having the sensing device has a thickness of 0.1 to 1.5 mm. The carrier package structure having the sensing device according to claim 1, wherein the carrier and the rectangular wall are integrally formed. A carrier board package structure having an inductive device, comprising:
a carrier having an upper surface and a lower surface opposite to the upper surface, and configured with a plurality of carrier through holes extending through the upper surface to the lower surface, wherein the upper surface has a rectangular wall, the rectangular shape The wall has a plurality of retaining wall through holes corresponding to the through holes of the carrier plates, and the rectangular wall divides the upper surface into two planes, wherein the outer side of the rectangular wall is a first plane, and the inner side of the rectangular wall is a plurality of planes, wherein the plurality of inner conductors are disposed in the through hole of the retaining wall of the rectangular wall and the corresponding through holes of the carrier;
An illuminating element is disposed on the first plane, wherein the illuminating element is electrically connected to the inner lead through a first outer lead;
a light sensing component is disposed on the second plane, and the light sensing component is electrically connected to the inner wires through the plurality of second outer wires;
a plurality of wire pins disposed on the lower surface and electrically connected to the inner wires; and a transparent encapsulation layer disposed above the carrier plate and covering the first plane and the second plane, and At the same time, the light-emitting element, the light-sensing element, the rectangular wall and the outer wires are covered together. The carrier package structure with an inductive device according to claim 10, wherein the light emitting element is further electrically connected to at least one of the carrier through holes of the first plane by at least one third outer wire. Carrier wire. The carrier package structure with an inductive device according to claim 10, wherein the transparent encapsulation layer is coated with an opaque coating, and an illumination hole is left at a corresponding position of the light-emitting element and the photo-sensing element, respectively. And a receiving hole. A carrier package structure having an inductive device according to claim 10, wherein the transparent encapsulation layer is a transparent epoxy resin. A carrier package structure having an inductive device according to claim 12, wherein the opaque coating is a black epoxy resin. A carrier package structure having an inductive device according to claim 10, wherein a first metal plate is further disposed between the light emitting element and the carrier. A carrier package structure having an inductive device according to claim 10, wherein a second metal plate is further disposed between the photo sensing element and the carrier. A carrier package structure having an inductive device according to claim 10, wherein the carrier is made of a polymer material. A carrier package structure having an inductive device according to claim 10, wherein the carrier and the rectangular wall are integrally formed.