TWM460403U - Carrier package structure with sensing device - Google Patents

Description

Carrier package structure with sensing device

The present invention relates to a carrier package structure having an inductive device, and more particularly to a package structure in which a light emitting element and a light sensing element are disposed on the same carrier.

Configuring a light-emitting element and a light-sensing element on the same carrier plate can form a widely used light-sensing device. When an object intercepts the light path between the light-emitting element and the light-sensing element, the light-sensing element The presence of the object can be determined. Conversely, if the light sensing element can smoothly receive the light emitted by the light emitting element, the light sensing element can determine that the object does not exist. The reflective light sensing device is configured such that the light emitting element and the light sensing element are disposed on the same side, and whether the object reflects the light of the light emitting element back to the light sensing element to determine whether the object exists.

In order to ensure the accuracy of the light sensing device, in the conventional art, it is desirable that the light sensing component only receives the light reflected by the object, so how to avoid the additional influence of the light sensing component, especially avoiding It is very important that the light-emitting element is directly irradiated from the inside of the light-sensing device to the light-sensing element.

As described above, the light sensing devices used in the prior art are as follows. First, please refer to FIG. 1A, which is a schematic diagram of a package structure of a light sensing device disclosed in US Pat. No. 8,232,541. As shown in FIG. 1A, the carrier 90 has a light-emitting element 92 and a light-sensing element 94, which are packaged in a transparent material on the carrier to form a package cover 98. A trench 96 is cut in the package cover 98. The 96 is filled with an opaque material to form a photoresist barrier 91.

Please refer to FIG. 1B , which is a schematic diagram of a package structure of a light sensing device disclosed in Taiwan Patent No. M363080. As shown in FIG. 1B, the carrier 90 has a light-emitting element 92 and a light-sensing element 94, which are packaged in a transparent material on the carrier to form a package cover 98, and a trench 96 is cut in the package cover 98. 96 and the surface of the package lid 98 are coated with an opaque coating 95.

FIG. 1C is a schematic diagram of a package structure of a light sensing device disclosed in US Pat. No. 20100327164. As shown in FIG. 1C, the carrier 90 has a light-emitting element 92 and a light-sensing element 94. Three light-blocking barriers 91 are placed in the middle and on both sides of the two components, and the entire carrier 90 is covered by a transparent cover 93.

FIG. 1D is a schematic diagram of a package structure of a light sensing device disclosed in US Pat. No. 7,652,244. As shown in FIG. 1D, the lead frame 97 is mounted on a lower cover 99 of a plastic material, and the light-emitting element 92 and the light sensing element 94 are placed on the lead frame 97, and finally the light-emitting element 92 and the light-sensing element are mounted. The space of 94 is filled with a transparent material 990.

The package structure of the above devices has some disadvantages. First, the process is troublesome. The above-mentioned components are mostly calculated in millimeters, and each of the processes performed under such a size causes a large increase in cost; The number is large, and the thickness of the light sensing device cannot be reduced, and the size of the product using the light sensing device cannot be further reduced.

Therefore, the present invention proposes a carrier package structure having an inductive device, which can be used for packaging of a light sensing device, and improves the manufacturing process of the light sensing device by relatively improving the packaging structure, thereby reducing the manufacturing cost. It is also possible to further produce a light-sized device of a smaller size.

In order to solve the above related problems, one of the main purposes of the present invention is to provide a carrier package structure having an inductive device, which can be applied to a package of a light sensor. Through a carrier board having a blocking element itself, it is not necessary to add too many components to the carrier board when manufacturing the light sensing device, and a smaller-sized light sensing device can be produced.

According to the above items, the present invention provides a carrier package structure having an inductive device, comprising a carrier plate having an upper surface and a lower surface, and configured with a plurality of carrier through holes extending through the upper surface to the lower surface, wherein The upper surface has a partition wall and a side wall parallel to each other, and divides the upper surface into two planes, wherein the partition wall and the side wall are the first plane, and one side of the partition wall is the second plane, and the second plane At least one carrier wire is disposed in the through hole of the plane carrier, and a plurality of carrier wires are disposed in the through hole of the first plane; a light emitting component is disposed on the second plane, wherein the light emitting component transmits at least one first The outer wire is electrically connected to the carrier wire in the second plane; a light sensing component is disposed on the first plane, wherein the light sensing component transmits the plurality of second outer wires and the carrier wire in the first plane The plurality of wire pins are disposed on the lower surface and electrically connected to the carrier wires; a first transparent sealing layer is coated on the second plane to cover the second plane, the light emitting component and the first External guidance ; And a second transparent encapsulant layer, coated on the first plane, to cover the first plane, the light sensing element and a second outer conductor.

The present invention further provides a carrier package structure having an inductive device, comprising a carrier plate having an upper surface and a lower surface, and configured with a plurality of carrier through holes extending through the upper surface to the lower surface, wherein the upper surfaces are parallel to each other A partition wall and a side wall, the partition wall and the side wall have a plurality of retaining wall through holes corresponding to the through holes of the carrier, and the upper surface is divided into two planes, wherein the partition wall and the side wall are first a plane, the other side of the wall is a second plane, and a plurality of inner conductors are disposed in the through hole of the partition wall and the corresponding carrier in the partition wall and the side wall; and a light emitting component is disposed in the second plane, wherein The light-emitting element is electrically connected to the inner wall of the corresponding carrier through-hole through a first outer lead and the retaining wall through-hole of the partition wall; a light sensing component is disposed on the first plane, wherein the light sensing component The plurality of second outer conductors and the plurality of third outer conductors are respectively electrically connected to the through holes of the partition wall and the side wall and the inner conductors of the corresponding carrier through holes; the plurality of conductor pins are disposed under Surface and electrical properties of inner conductor And a transparent encapsulation layer covering the surface of the carrier board and covering the first plane, the second plane, the partition wall, the side wall, and the light-emitting elements, the light sensing components and the first plane and the second plane wire.

The carrier package structure with the sensing device proposed by the present invention can produce a smaller size light sensing device with less steps and less manufacturing cost, and can further reduce the size of the product using the light sensing device.

Since the present invention mainly discloses a carrier package structure having an inductive device, the current process is modified by providing a carrier plate having a barrier element, thereby reducing the manufacturing cost and producing a smaller-sized light sensing device product. Further, the semiconductor package technology related to the present invention has been known to those skilled in the relevant art, and therefore, the description of the carrier package structure having the sensing device will be described in detail below. In addition, the drawings in the following texts are not completely drawn according to the actual relevant dimensions, and their functions are only to express the schematic diagrams related to the present creative features.

First, please refer to FIG. 2, which is a cross-sectional view of a carrier board according to a first embodiment of the present invention. As shown in FIG. 2, the carrier 12 is made of a polymer material such as a PI or a PCB, and has a thickness of 0.1 to 1.5 mm; and a preferred thickness of the embodiment is 0.3 to 1.3 mm. The carrier 12 has an upper surface 12a and a lower surface 12b opposite to the upper surface 12a, and the carrier 12 is provided with a plurality of carrier through holes (not shown) extending through the upper surface 12a to the lower surface 12b; the upper surface 12a The utility model has a partition wall 127 and a side wall 121, and divides the upper surface 12a into a first plane 124 and a second plane 122. The first plane 124 is located between the partition wall 127 and the side wall 121, and the second plane 122 is located in the isolation. The other side of the wall 127; a carrier through-hole (not shown) in the second plane 122 is provided with a carrier trace 123 and a carrier via in the first plane 124 (not shown) a plurality of carrier wires 123 are disposed; the carrier wires 123 are electrically connected to the plurality of wire pins 125 disposed on the lower surface 12b of the carrier 12, and the wire pins 125 are used as the external connection of the carrier 12 point.

Next, please refer to FIG. 3, which is a cross-sectional view of a carrier package structure with an inductive device according to a first embodiment of the present invention. As shown in FIG. 3, in the carrier 12 of FIG. 2, a light-emitting element 14 is disposed on the second plane 122 of the carrier 12, and is passed through an external wire 18a and the carrier of the second plane 122. The carrier wires 123 in the holes (not shown) are electrically connected; in addition, a light sensing component 16 is disposed on the first plane 124 of the carrier 12 and passes through the plurality of outer wires 18b and the first plane. The carrier wires 123 of the carrier holes (not shown in the drawings) of 124 are electrically connected; wherein the wires 18a, 18b are formed by wire bonding.

After the light-emitting element 14 and the light-sensing element 16 are disposed, the transparent epoxy resin is applied to the second plane 122 and the first plane 124, respectively, and the first transparent sealing layer 1220 and the second transparent sealing layer are formed. 1240; the first transparent sealant layer 1220 simultaneously covers the second plane 122, the light-emitting element 14 and the outer lead 18a on the second plane 122; and the second transparent sealant layer 1240 simultaneously sets the first plane 124, light The sensing element 16 and the outer lead 18b on the first plane 124 are covered, and the thickness of the first transparent encapsulant layer 1220 and the second transparent encapsulant layer 1240 may be lower than, equal to, or higher than the height of the partition wall 127. When the height of the transparent sealing layer 1220, 1240 is lower than or equal to the height of the partition wall 127, the thickness of the carrier package structure 1 having the sensing device is the thickness of the carrier 12 (0.1 to 1.5 mm).

In addition, before mounting the light-emitting element 14 and the light-sensing element 16 on the carrier 12, a first metal plate 1224 and a second metal plate may be respectively installed at positions where the light-emitting element 14 and the light-sensing element 16 are to be mounted. 1244 is used as a slot for mounting the light-emitting element 14 and the light-sensing element 16.

Next, please refer to FIG. 4, which is a top view of a carrier package structure with an inductive device according to a first embodiment of the present invention. As shown in FIG. 4, the first transparent sealant layer 1220 on the second plane 122 is coated with an opaque paint 126 made of black epoxy resin, and an illumination hole 1222 is left at a corresponding position of the light-emitting element 14 to The light from the light-emitting element 14 is pierced; in addition, an opaque paint 126 made of black epoxy resin is applied over the second transparent sealant layer 1240 on the first plane 124, and is disposed at a corresponding position of the light-sensing element 16. A receiving aperture 1242 is left for the light sensing element 16 to sense the source of light outside.

Next, please refer to FIG. 3 and FIG. 5 at the same time. FIG. 5 is a cross-sectional view showing the use of other light-emitting elements in the carrier package structure with the sensing device according to the first embodiment of the present invention. As shown in FIG. 3, the carrier package structure 1 having the sensing device of the present invention uses the light-emitting element 14; in the embodiment, the light-emitting element 14 is an infrared light-emitting diode (IR-LED); - The LED is the upper and lower electrodes, so the light-emitting element 14 only needs to be connected to one of the carrier wires 123 through an outer wire 18a. If the light-emitting component 14 is changed to an LED of the same side electrode (for example, a green LED or a blue LED), As shown in FIG. 5, at this time, the light-emitting element 14' of the carrier package structure 1' having the sensing device is connected to the carrier through-hole (not shown) of the second plane 122 by a plurality of outer wires 18a. A plurality of carrier wires 123 are provided, and the remaining components are arranged in the same manner as in FIG. 3, and will not be described again.

In the above embodiment, only the partition wall 127 and the side wall 121 are additionally disposed on the carrier 12, and the creation may also be performed on the carrier 12 by processing, for example, etching, stamping or digging. The plane 124 and the second plane 122 integrally form the carrier 12 with the partition wall 127 and the side wall 121.

Please refer to FIG. 6, which is a cross-sectional view of a carrier board according to a second embodiment of the present invention. As shown in FIG. 6, the carrier 22 is made of a polymer material such as a PI or a PCB, and has a thickness of 0.1 to 1.5 mm. The carrier 22 has an upper surface 22a and a lower surface 22b opposite to the upper surface 22a, and the carrier 22 is provided with a plurality of carrier through holes (not shown) extending through the upper surface 22a to the lower surface 22b; the upper surface 22a There is a partition wall 227, a side wall 221, and the upper surface 22a is divided into a first plane 224 and a second plane 222, wherein the first plane 224 is located between the partition wall 227 and the side wall 121, and the second plane 222 is located in the isolation The other side of the wall 227; in addition, the partition wall 227 and the side wall 221 have a plurality of retaining wall through holes corresponding to the carrier through holes (not shown in the drawings) (not shown in the drawings), and in the partition wall 227 and the retaining wall through hole of the side wall 221 (not shown in the drawing) and the corresponding carrier through hole (not shown in the drawing) are arranged with a plurality of inner wires 229; the inner wires 229 are all provided with the carrier 22 The plurality of wire pins 225 disposed on the lower surface 22b are electrically connected, and the wire pins 225 serve as connection points for the carrier 22 to the outside.

Next, please refer to FIG. 7, which is a cross-sectional view of a carrier package structure having an inductive device according to a second embodiment of the present invention. As shown in FIG. 7, in the carrier 22 of FIG. 6, a light-emitting element 24 is disposed on the second plane 222, and is transmitted through an outer lead 28a and a through-wall through hole adjacent to the second plane 222 (not shown in the figure). The inner conductor 229 of the corresponding carrier through hole (not shown) is electrically connected; in addition, a light sensing element 26 is disposed on the first plane 224, and the light sensing element 26 is transmitted through the plurality of strips. The outer lead 28b is electrically connected to a plurality of inner conductors 229 of the partition wall through hole (not shown) of the partition wall 227 adjacent to the first plane 224 and the corresponding carrier through hole (not shown). The light sensing component 26 further has a plurality of inner conductors 229 passing through the plurality of outer conductors 28c and the sidewall of the side wall 221 (not shown) and the corresponding carrier through holes (not shown). The electrical connection; wherein the outer leads 28a, 28b, 28c are formed by wire bonding.

After the light-emitting element 24 and the light-sensing element 26 are disposed, the surface of the carrier 22 is covered by a transparent encapsulating layer 228 made of a transparent epoxy resin, including: a second plane 222, a first plane 224, a partition wall 227, The sidewall 221 and the light-emitting element 24, the light sensing element 26, and the outer leads 28a, 28b, 28c on the second plane 222, the first plane.

In addition, before the light-emitting element 24 and the light-sensing element 26 are mounted on the carrier 22, a first metal plate 2224 and a second metal plate may be respectively installed at positions where the light-emitting element 24 and the light-sensing element 26 are to be mounted. 2244 is used as a slot for mounting the light-emitting element 24 and the light-sensing element 26.

Next, please refer to FIG. 8, which is a top view of a carrier package structure having an inductive device according to a second embodiment of the present invention. As shown in FIG. 8 , an opaque coating 226 made of black epoxy resin is applied over the transparent encapsulation layer 228 , and an illumination hole 2222 is left at a corresponding position of the illuminating element 24 for the light of the illuminating element 24 to pass through; Additionally, a receiving aperture 2242 is left in the corresponding location of the light sensing component 26 for the light sensing component 26 to sense the source of light outside.

Next, please refer to FIG. 7 and FIG. 9 at the same time. FIG. 9 is a cross-sectional view showing the use of other light-emitting elements in the carrier package structure with the sensing device according to the first embodiment of the present invention. As shown in FIG. 7, the carrier package structure 2 having the sensing device of the present invention uses the light-emitting element 24; in the embodiment, the light-emitting element 24 is an IR-LED; since the IR-LED is an upper and lower electrode, the light-emitting element 24 only needs to be connected to an inner lead 229 through an outer lead 28a. If the light-emitting element 24 is changed to an LED of the same side electrode (for example, a green LED or a blue LED), as shown in FIG. 9, at this time, there is an induction. The light-emitting element 24' of the carrier-package structure 2' of the device requires a through-hole (not shown in the figure) and a corresponding carrier through-hole (not shown in the figure) of an outer lead 28a and the partition wall 227. The inner conductors 229 are electrically connected to each other, and at least one further outer conductor 28d is required to be connected to the plurality of carrier conductors 223 in the second plane 222. The rest of the components are arranged in the same manner as in FIG. 7, and will not be described again.

In the above embodiment, only the partition wall 227 and the side wall 221 are separately disposed on the carrier 22, and the creation may also be performed on the carrier 22 by processing, for example, etching, stamping or excavating. The plane 224 and the second plane 222 form the carrier 22 integrally with the partition wall 227 and the side wall 221 .

The carrier package structure 1, 1', 2, 2' with the sensing device proposed by the present invention can produce a smaller size light sensing device with less process and less manufacturing cost, and also enables light to be used. The product size of the sensing device can be further reduced.

Although the present invention has been described above with reference to the preferred embodiments thereof, it is not intended to limit the present invention, and anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of patent protection of the creation shall be subject to the definition of the scope of the patent application attached to this specification.

1‧‧‧ Carrier package structure with sensing device
222‧‧‧ second plane

1'‧‧‧ Carrier package structure with sensing device
2222‧‧‧ illuminated holes

12‧‧‧ Carrier Board
223‧‧‧ Carrier wire

12a‧‧‧Upper surface
224‧‧‧ first plane

12b‧‧‧ lower surface
2242‧‧‧ receiving hole

121‧‧‧Side wall
2244‧‧‧Second metal plate

122‧‧‧ second plane
225‧‧‧Wire pins

1220‧‧‧First transparent sealant
226‧‧‧ opaque paint

1222‧‧‧ illuminated holes
227‧‧‧The wall

1224‧‧‧First metal plate
228‧‧‧Transparent encapsulation layer

123‧‧‧ Carrier wire
229‧‧‧ inner conductor

124‧‧‧ first plane
24‧‧‧Lighting elements

1240‧‧‧Second transparent sealant
24'‧‧‧Lighting elements

1242‧‧‧ receiving hole
26‧‧‧Light sensing components

1244‧‧‧Second metal plate
28a‧‧‧External conductor

125‧‧‧Wire pins
28b‧‧‧External wire

126‧‧‧Opacity coating
28c‧‧‧External conductor

127‧‧‧The wall
28d‧‧‧External wire

14‧‧‧Lighting elements
90‧‧‧ Carrier Board

14'‧‧‧Lighting elements
91‧‧‧Light barrier

16‧‧‧Light sensing components
92‧‧‧Lighting elements

18a‧‧‧External conductor
93‧‧‧ Transparent cover

18b‧‧‧External wire
94‧‧‧Light sensing components

2‧‧‧ Carrier board package structure with sensing device
95‧‧‧Opacity coating

2'‧‧‧ Carrier package structure with sensing device
96‧‧‧ trench

22‧‧‧ Carrier Board
97‧‧‧ lead frame

22a‧‧‧Upper surface
98‧‧‧Package cover

22b‧‧‧lower surface
99‧‧‧Undercover

221‧‧‧ Side wall
990‧‧‧Transparent material

1A is a schematic view showing a package structure of a conventional light sensing device;

1B is a schematic view showing a package structure of a conventional light sensing device;

1C is a schematic view showing a package structure of a conventional light sensing device;

1D is a schematic view showing a package structure of a conventional light sensing device;

Figure 2 is a cross-sectional view of the carrier of the first embodiment of the present invention;

Figure 3 is a cross-sectional view showing a carrier package structure having an inductive device according to a first embodiment of the present invention;

4 is a top view of a carrier package structure having an inductive device according to a first embodiment of the present invention;

Figure 5 is a cross-sectional view showing a carrier package structure having an inductive device according to a first embodiment of the present invention using other light-emitting elements;

Figure 6 is a cross-sectional view of a carrier plate of a second embodiment of the present invention;

Figure 7 is a cross-sectional view showing a carrier package structure having an inductive device according to a second embodiment of the present invention;

Figure 8 is a top plan view of a carrier package structure having an inductive device according to a second embodiment of the present invention;

Figure 9 is a cross-sectional view showing the use of other light-emitting elements in a carrier package structure having an inductive device according to a second embodiment of the present invention.

12‧‧‧ Carrier Board

12a‧‧‧Upper surface

12b‧‧‧ lower surface

121‧‧‧Side wall

122‧‧‧ first plane

123‧‧‧ Carrier wire

124‧‧‧ second plane

125‧‧‧Wire pins

127‧‧‧The wall

Claims (18)

A carrier board package structure having an inductive device, comprising:
a carrier board having an upper surface and a lower surface, and configured with a plurality of carrier through-holes extending through the upper surface to the lower surface, wherein the upper surface has a partition wall and a side wall parallel to each other, and the The upper surface is divided into two planes, wherein the partition wall and the side wall are a first plane, the other side of the partition wall is a second plane, and at least one of the carrier through holes is disposed in the second plane a carrier wire, wherein a plurality of carrier wires are disposed in the carrier through holes of the first plane;
An illuminating element is disposed on the second plane, wherein the illuminating element is electrically connected to the carrier wire in the second plane through the at least one first outer lead;
a light sensing component is disposed on the first plane, wherein the light sensing component is electrically connected to the carrier wires in the first plane through the plurality of second outer wires;
a plurality of wire pins disposed on the lower surface and electrically connected to the carrier wires;
a first transparent encapsulant layer coated on the second plane to cover the second plane, the light emitting element and the first outer lead; and a second transparent sealant layer coated on the first plane Upper to cover the first plane, the light sensing element and the second outer leads. The carrier package structure with an inductive device according to claim 1, wherein the two transparent sealant layers are coated with an opaque paint, and respectively have a corresponding position on the light-emitting element and the light-sensing element. An illumination hole and a receiving hole. The carrier package structure with an inductive device according to claim 1, wherein the first transparent encapsulant layer and the second transparent encapsulant layer are transparent epoxy resins. A carrier package structure having an inductive device according to claim 2, wherein the opaque coating is a black epoxy resin. A carrier package structure having an inductive device according to claim 1, wherein a first metal plate is further disposed between the light emitting element and the carrier. The carrier package structure with an inductive device according to claim 1, wherein a second metal plate is further disposed between the light sensing element and the carrier. The carrier package structure having the sensing device according to claim 1, wherein the carrier material is a polymer material. According to the carrier package structure with the sensing device described in claim 1, the carrier package structure having the sensing device has a thickness of 0.1 to 1.5 mm. The carrier board package structure with an inductive device according to claim 1, wherein the carrier board is integrally formed with the partition wall and the side wall. A carrier board package structure having an inductive device, comprising:
a carrier plate having an upper surface and a lower surface, and configured with a plurality of carrier through-holes extending through the upper surface to the lower surface, wherein the upper surface has a partition wall and a side wall parallel to each other, the partition wall And the side wall has a plurality of retaining wall through holes corresponding to the through holes of the carrier plates, and the upper surface is divided into two planes, wherein the partition wall and the side wall are a first plane, the partition wall The other side is a second plane, and a plurality of inner conductors are disposed in the partition wall through holes of the partition wall and the side wall and the corresponding carrier through holes;
a light-emitting element is disposed on the second plane, wherein the light-emitting element is electrically connected to the inner wall of the corresponding through-hole of the carrier through a first outer wire and the through-wall hole of the partition wall;
a light sensing component is disposed on the first plane, wherein the light sensing component passes through the plurality of second outer wires and the plurality of third outer wires respectively, and the partition walls and the sidewalls of the sidewalls Electrically connecting to the inner conductors of the corresponding carrier through holes;
a plurality of wire pins disposed on the lower surface and electrically connected to the inner wires; and a transparent encapsulation layer covering the surface of the carrier plate and covering the first plane and the second plane together a wall, the side wall, and the light-emitting element, the light sensing element, and the outer wires in the first plane and the second plane. The carrier package structure with an inductive device according to claim 10, wherein the light emitting element is further electrically connected to at least one of the carrier through holes of the second plane by at least one fourth outer wire. Carrier wire. The carrier package structure with an inductive device according to claim 10, wherein the transparent encapsulation layer is coated with an opaque coating, and an illumination hole is left at a corresponding position of the light-emitting element and the photo-sensing element, respectively. And a receiving hole. A carrier package structure having an inductive device according to claim 10, wherein the transparent encapsulation layer is a transparent epoxy resin. A carrier package structure having an inductive device according to claim 12, wherein the opaque coating is a black epoxy resin. A carrier package structure having an inductive device according to claim 10, wherein a first metal plate is further disposed between the light emitting element and the carrier. A carrier package structure having an inductive device according to claim 10, wherein a second metal plate is further disposed between the photo sensing element and the carrier. A carrier package structure having an inductive device according to claim 10, wherein the carrier is made of a polymer material. A carrier board package structure having an inductive device according to claim 10, wherein the carrier board is integrally formed with the partition wall and the side wall.