TWM455330U - Porous ceramics heat sink - Google Patents

Porous ceramics heat sink Download PDF

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Publication number
TWM455330U
TWM455330U TW101225389U TW101225389U TWM455330U TW M455330 U TWM455330 U TW M455330U TW 101225389 U TW101225389 U TW 101225389U TW 101225389 U TW101225389 U TW 101225389U TW M455330 U TWM455330 U TW M455330U
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Taiwan
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agent
heat sink
porous ceramic
ceramic heat
combination
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TW101225389U
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Chinese (zh)
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you-jia Chen
Ye Yang
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Wha Yueb Technology Co Ltd
Xiamen Zf Co Ltd
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Priority to TW101225389U priority Critical patent/TWM455330U/en
Publication of TWM455330U publication Critical patent/TWM455330U/en

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Description

多孔陶瓷散熱片Porous ceramic heat sink

本創作係有關一種多孔陶瓷散熱片,尤指一種藉由通孔孔道裡的冷熱空氣所形成之熱對流進而快速散熱之設計者。This creation relates to a porous ceramic heat sink, especially a designer who uses the heat convection formed by the hot and cold air in the through-hole to quickly dissipate heat.

按,目前市場上主要是以銅、鋁散熱器作為3C產品和LED產品的散熱基體,而欲利用銅、鋁的高熱導率達到快速散熱的功效;然而,銅、鋁本身為導體,通常必須再利用一絕緣層避免短路,但絕緣層熱導率僅0.2~0.5W/mK,嚴重影響銅、鋁散熱器的導熱和散熱效果,且有耐熱方面的問題。According to the current market, copper and aluminum heat sinks are mainly used as heat dissipation substrates for 3C products and LED products, and the high thermal conductivity of copper and aluminum is required to achieve rapid heat dissipation; however, copper and aluminum themselves are conductors, which usually must An insulating layer is used to avoid short circuit, but the thermal conductivity of the insulating layer is only 0.2~0.5W/mK, which seriously affects the heat conduction and heat dissipation effects of the copper and aluminum heat sinks, and has heat resistance problems.

次按,雖然已有一些陶瓷散熱片進入市場,如氮化鋁陶瓷散熱片、碳化矽陶瓷散熱片和普通型95%氧化鋁陶瓷…等;其中,儘管氮化鋁導熱係數非常高,可是價格昂貴,且吸潮後容易水解生成Al﹙OH﹚3,致使氮化鋁陶瓷散熱片導熱率偏低,導熱性能得不到發揮;碳化矽陶瓷散熱片由於燒結困難,散熱性能無法滿足需求;普通型95%氧化鋁陶瓷可能因結構緻密致使散熱面積太低,或因微觀結構不合理而降低了散熱性能,抑或是因為對微觀結構和對流機制不甚瞭解,造成散熱效果無法達到要求。After pressing, although some ceramic heat sinks have entered the market, such as aluminum nitride ceramic heat sinks, tantalum carbide ceramic heat sinks and ordinary 95% alumina ceramics, etc., although the thermal conductivity of aluminum nitride is very high, but the price It is expensive and easily hydrolyzed to form Al(OH)3 after moisture absorption, which causes the thermal conductivity of the aluminum nitride ceramic heat sink to be low, and the thermal conductivity is not exerted. The heat dissipation performance of the silicon carbide ceramic heat sink cannot meet the demand due to sintering difficulty; The type 95% alumina ceramic may cause the heat dissipation area to be too low due to the dense structure, or the heat dissipation performance may be lowered due to the unreasonable microstructure, or the heat dissipation effect may not be met because the microstructure and convection mechanism are not well understood.

本創作之主要目的,係欲提供一種多孔陶瓷散熱片,而具有提升散熱性能及低成本之功效。The main purpose of this creation is to provide a porous ceramic heat sink with improved heat dissipation and low cost.

為達上述功效,本創作之結構特徵,係將粒徑在20~100μm之間具有高導熱性與高絕緣性的金屬化合物至少混合有造孔劑與黏結劑所製備而成,該造孔劑於製備過程中被耗減消失而致使該多孔陶瓷散熱片為層狀結構之型態且形成有微小孔道,而該微小孔道為交錯連通之通孔孔道者。In order to achieve the above-mentioned effects, the structural features of the present invention are prepared by mixing at least a pore-forming agent and a binder with a metal compound having a high thermal conductivity and a high insulating property with a particle diameter of 20 to 100 μm. During the preparation process, the depletion disappears and the porous ceramic fin is in the form of a layered structure and is formed with minute holes, and the micro holes are staggered through holes.

此外,該多孔陶瓷散熱片的厚度在0.5~2mm之間,該微小孔道的半徑在600~8000nm之間。又,該多孔陶瓷散熱片進一步附著有導熱層,該導熱層的厚度在0.02~0.08mm之間。另,該多孔陶瓷散熱片進一步混合有助熔劑、改性劑、增強劑、分散劑、脫模劑、絮凝劑,軟化劑、消泡劑或可塑劑等化學助劑。再者,該金屬化合物選自氧化鋁、氮化鋁、二氧化矽或前述金屬化合物之組合;該造孔劑選自麵粉、米粉、石油焦、澱粉、竹炭、木炭、糊精、鋸末、聚乙二醇、PMMA、PS、炭黑、小麥粉、酚醛樹脂、可發泡樹脂、已發泡的發泡樹脂、聚甲基丙烯酸甲酯、聚對苯二甲酸乙二醇酯或前述造孔劑之組合;該黏結劑選自羥甲基纖維素鈉、羥甲基纖維素、聚乙烯醇、矽酸鈉或前述黏結劑之組合;該助熔劑選自鈦酸四丁酯、正矽酸乙酯、氧化鈦或前述助熔劑之組合;該改性劑為聚乙烯醇;該增強劑為甲基纖維素;該分散劑選自聚乙烯醇、酚醛樹脂、發泡樹脂或前述分散劑之組合;該脫模劑為油酸;該絮凝劑選自硫酸鎂、硫酸銅或前述絮凝劑之組合;該消泡劑選自天然油脂、矽脂或前述消泡劑之組合;該可塑劑為鄰苯二甲酸鹽。Further, the porous ceramic fin has a thickness of between 0.5 and 2 mm, and the microchannel has a radius of between 600 and 8000 nm. Further, the porous ceramic fin further has a heat conductive layer having a thickness of between 0.02 and 0.08 mm. In addition, the porous ceramic heat sink is further mixed with a chemical agent such as a flux, a modifier, a reinforcing agent, a dispersing agent, a releasing agent, a flocculating agent, a softening agent, an antifoaming agent or a plasticizer. Furthermore, the metal compound is selected from the group consisting of alumina, aluminum nitride, cerium oxide or a combination of the foregoing metal compounds; the pore forming agent is selected from the group consisting of flour, rice flour, petroleum coke, starch, bamboo charcoal, charcoal, dextrin, sawdust, and poly Ethylene glycol, PMMA, PS, carbon black, wheat flour, phenolic resin, foamable resin, foamed foamed resin, polymethyl methacrylate, polyethylene terephthalate or the aforementioned pores a combination of agents; the binder is selected from the group consisting of sodium carboxymethylcellulose, hydroxymethylcellulose, polyvinyl alcohol, sodium citrate or a combination of the foregoing; the flux is selected from the group consisting of tetrabutyl titanate and n-decanoic acid. Ethyl ester, titanium oxide or a combination of the foregoing flux; the modifier is polyvinyl alcohol; the reinforcing agent is methyl cellulose; the dispersing agent is selected from the group consisting of polyvinyl alcohol, phenolic resin, foaming resin or the aforementioned dispersing agent Combining; the mold release agent is oleic acid; the flocculating agent is selected from the group consisting of magnesium sulfate, copper sulfate or a combination of the foregoing flocculating agents; the antifoaming agent is selected from the group consisting of natural oils, fats or combinations of the aforementioned antifoaming agents; Phthalates.

首先,請參閱「圖1」、「圖2」所示,本創作之多孔陶瓷散熱片10,係將具有高導熱性與高絕緣性且粒徑在20~100μm之間的金屬化合物至少混合有造孔劑與黏結劑,再經由模製成生坯、乾燥與燒製成型等工序所製備而成,所製備之多孔陶瓷散熱片10的厚度較佳在0.5~2mm之間,該造孔劑乃於製備過程中被耗減消失而致使該多孔陶瓷散熱片10形成有半徑在600~8000nm之間的微小孔道11,進而增大了該多孔陶瓷散熱片10與空氣之間的接觸散熱面積;其中,所形成之微小孔道11超過95%為通孔孔道,使得通孔孔道裡的冷熱空氣能夠形成熱對流,即時將熱量傳送至該多孔陶瓷散熱片10外面,讓該多孔陶瓷散熱片10維持在一個較低的溫度下;另,因金屬化合物間係呈頸向(點狀)燒結之態樣,故該多孔陶瓷散熱片10為層狀結構之型態且該微小孔道11為錯流結構;又,該多孔陶瓷散熱片10進一步附著有導熱層12,該導熱層12的厚度較佳在0.02~0.08mm之間者。First, please refer to "Fig. 1" and "Fig. 2". The porous ceramic heat sink 10 of the present invention is a mixture of a metal compound having a high thermal conductivity and a high insulating property and having a particle diameter of 20 to 100 μm. The pore-forming agent and the binder are prepared by molding into a green body, drying and firing, and the prepared porous ceramic heat sink 10 preferably has a thickness of 0.5 to 2 mm. During the preparation process, the porous ceramic heat sink 10 is formed with a micro-channel 11 having a radius of between 600 and 8000 nm, thereby increasing the contact heat-dissipating area between the porous ceramic heat sink 10 and the air; Wherein, more than 95% of the formed micro-channels 11 are through-hole channels, so that the hot and cold air in the through-holes can form heat convection, and heat is immediately transferred to the outside of the porous ceramic heat sink 10 to maintain the porous ceramic heat sink 10 At a lower temperature; in addition, since the intermetallic compound is in a neck-like (point-like) sintering state, the porous ceramic fin 10 is in the form of a layered structure and the micro-channel 11 is a cross-flow structure. Again, the porous pottery The porcelain fin 10 further adheres to the heat conductive layer 12, and the thickness of the heat conductive layer 12 is preferably between 0.02 and 0.08 mm.

此外,該金屬化合物選自具有高導熱性與高絕緣性之氧化鋁、氮化鋁、二氧化矽或前述金屬化合物之組合。又,為了控制該多孔陶瓷散熱片10形成的微小孔道11的孔隙率和孔道大小,該造孔劑選自麵粉、米粉、石油焦、澱粉、竹炭、木炭、糊精、鋸末、聚乙二醇、PMMA、PS、炭黑、小麥粉、酚醛樹脂、可發泡樹脂、已發泡的發泡樹脂、聚甲基丙烯酸甲酯、聚對苯二甲酸乙二醇酯或前述造孔劑之組合。另,為了使原料顆粒之混合具有更好地結合性、降低燒製溫度、提高結構強度以及更易於脫模,乃可適當地進一步混合有助熔劑、改性劑、增強劑、分散劑、脫模劑、絮凝劑,軟化劑、消泡劑或可塑劑等化學助劑;該黏結劑選自羥甲基纖維素鈉、羥甲基纖維素、聚乙烯醇、矽酸鈉或前述黏結劑之組合;該助熔劑選自鈦酸四丁酯、正矽酸乙酯、氧化鈦或前述助熔劑之組合;該改性劑為聚乙烯醇;該增強劑為甲基纖維素;該分散劑選自聚乙烯醇、酚醛樹脂、發泡樹脂或前述分散劑之組合;該脫模劑為油酸;該絮凝劑選自硫酸鎂、硫酸銅或前述絮凝劑之組合;該消泡劑選自天然油脂、矽脂或前述消泡劑之組合;該可塑劑為鄰苯二甲酸鹽。Further, the metal compound is selected from the group consisting of alumina having high thermal conductivity and high insulation, aluminum nitride, cerium oxide or a combination of the foregoing metal compounds. Further, in order to control the porosity and the pore size of the micropores 11 formed by the porous ceramic fins 10, the pore former is selected from the group consisting of flour, rice flour, petroleum coke, starch, bamboo charcoal, charcoal, dextrin, sawdust, and polyethylene glycol. , PMMA, PS, carbon black, wheat flour, phenolic resin, foamable resin, foamed foamed resin, polymethyl methacrylate, polyethylene terephthalate or a combination of the foregoing pore formers . In addition, in order to make the mixing of the raw material particles have better bonding, lower the firing temperature, increase the structural strength, and more easily release the mold, the flux, the modifier, the reinforcing agent, the dispersing agent, and the deodorizer may be appropriately further mixed. a chemical agent such as a molding agent, a flocculating agent, a softening agent, an antifoaming agent or a plasticizer; the bonding agent is selected from the group consisting of sodium hydroxymethylcellulose, hydroxymethylcellulose, polyvinyl alcohol, sodium citrate or the aforementioned binder a combination; the flux is selected from the group consisting of tetrabutyl titanate, ethyl orthosilicate, titanium oxide or a combination of the foregoing flux; the modifier is polyvinyl alcohol; the reinforcing agent is methyl cellulose; the dispersant is selected From a combination of polyvinyl alcohol, phenolic resin, foamed resin or the aforementioned dispersing agent; the releasing agent is oleic acid; the flocculating agent is selected from the group consisting of magnesium sulfate, copper sulfate or a combination of the foregoing flocculating agents; the antifoaming agent is selected from natural a combination of grease, rouge or the aforementioned antifoaming agent; the plasticizer is a phthalate.

基於如是之構成,本創作之成型方式沒有一定的限制,可以根據現有條件選擇最佳成型方式;例如,混合氧化鋁原料100質量份、造孔劑8~24質量份、黏結劑3.2~10.5質量份、助溶劑2~8.4質量份、改性劑1.5~6.4質量份、增強劑2.1~5.6質量份、分散劑2.1~3.3質量份、絮凝劑0.8~2.4質量份、消泡劑0.3~0.5質量份以及可塑劑0.7~1.3質量份後,採用等靜壓或流延成型工藝製造生坯。而在生坯燒製工序中,坯體中心溫度是由造孔劑的添加量來決定的,因為燒製氣氛溫度升高時,並不能夠很快地將熱量傳導至坯體中心,當溫度足夠高時,能夠使得造孔劑燃燒釋放熱量,加快坯體中心溫度的上升,減少中心溫度與燒製氣氛溫度的差值;然而,當造孔劑的量太少時,一方面導致孔隙率不夠,另一方面導致坯體中心溫度遠低於燒製氣氛溫度,導致坯體開裂;但當造孔劑的量太多時,則可能發生燒製時坯體坍塌,或者是由於坯體中心溫度遠高於燒製氣氛溫度引起燒成收縮不一致導致坯體開裂。是以,本創作之多孔陶瓷散熱片所形成之微小孔道為通孔孔道,遂故可藉由通孔孔道裡的冷熱空氣所形成之熱對流,進而快速散熱,且材料及加工成本皆低,而具有提升散熱性能及低成本之功效。【00010】 綜上所述,本創作所揭示之構造,為昔所無,且確能達到功效之增進,並具可供產業利用性,完全符合新型專利要件,祈請 鈞局核賜專利,以勵創新,無任德感。【00011】 惟,上述所揭露之圖式、說明,僅為本創作之較佳實施例,大凡熟悉此項技藝人士,依本案精神範疇所作之修飾或等效變化,仍應包括在本案申請專利範圍內。Based on the composition of the present invention, there is no limitation on the molding method of the present invention, and the optimum molding method can be selected according to the existing conditions; for example, 100 parts by mass of the mixed alumina raw material, 8 to 24 parts by mass of the pore forming agent, and 3.2 to 10.5 of the bonding agent. 2 parts by weight to 8.4 parts by mass of the cosolvent, 1.5 to 6.4 parts by mass of the modifier, 2.1 to 5.6 parts by mass of the reinforcing agent, 2.1 to 3.3 parts by mass of the dispersing agent, 0.8 to 2.4 parts by mass of the flocculating agent, and 0.3 to 0.5 mass of the antifoaming agent. After the portion and the plasticizer are 0.7 to 1.3 parts by mass, the green body is produced by an isostatic pressing or a tape casting process. In the green firing process, the center temperature of the blank is determined by the amount of pore former added. Because the temperature of the firing atmosphere increases, heat cannot be quickly transferred to the center of the body. When it is high enough, the pore former can be burned to release heat, accelerate the rise of the center temperature of the body, and reduce the difference between the center temperature and the temperature of the firing atmosphere; however, when the amount of the pore former is too small, the porosity is caused on the one hand. Not enough, on the other hand, the center temperature of the blank is much lower than the temperature of the firing atmosphere, causing the body to crack; but when the amount of the pore-forming agent is too large, the body may collapse during firing, or due to the center of the body The temperature is much higher than the temperature of the firing atmosphere, causing the inconsistent firing shrinkage to cause cracking of the green body. Therefore, the micro-cavity formed by the porous ceramic heat sink of the present invention is a through-hole hole, so that the heat convection formed by the hot and cold air in the through-hole hole can be quickly dissipated, and the material and processing cost are low. It has the effect of improving heat dissipation and low cost. [00010] In summary, the structure revealed by this creation is unprecedented, and it can achieve the improvement of efficacy, and it can be used for industrial utilization, fully complying with the new patent requirements, and praying for the patents issued by the bureau. Inspire innovation, no sense of morality. [00011] However, the above-mentioned drawings and descriptions are only preferred embodiments of the present invention. Those skilled in the art who are familiar with the art, the modifications or equivalent changes made in the spirit of the case should still include the patent application in this case. Within the scope.

【00013】
10‧‧‧多孔陶瓷散熱片
11‧‧‧微小孔道
12‧‧‧導熱層
【00013】
10‧‧‧Porous ceramic heat sink
11‧‧‧ tiny holes
12‧‧‧thermal layer

【00012】 圖1係本創作之多孔陶瓷散熱片之結構示意圖。圖2係本創作之多孔陶瓷散熱片之掃描式電子顯微鏡圖。[00012] FIG. 1 is a schematic structural view of a porous ceramic heat sink of the present invention. Figure 2 is a scanning electron micrograph of the porous ceramic heat sink of the present invention.

10‧‧‧多孔陶瓷散熱片 10‧‧‧Porous ceramic heat sink

11‧‧‧微小孔道 11‧‧‧ tiny holes

12‧‧‧導熱層 12‧‧‧thermal layer

Claims (5)

一種多孔陶瓷散熱片,係將粒徑在20~100μm之間具有高導熱性與高絕緣性的金屬化合物至少混合有造孔劑與黏結劑所製備而成,該造孔劑於製備過程中被耗減消失而致使該多孔陶瓷散熱片為層狀結構之型態且形成有微小孔道,而該微小孔道為交錯連通之通孔孔道者。A porous ceramic heat sink prepared by mixing at least a metal compound having a high thermal conductivity and a high insulating property with a pore-forming agent and a binder at a particle diameter of 20 to 100 μm, and the pore-forming agent is prepared in the preparation process. The depletion disappears, causing the porous ceramic heat sink to be in the form of a layered structure and formed with minute pores, and the minute pores are via holes that are alternately connected. 如請求項1之多孔陶瓷散熱片,其中,該多孔陶瓷散熱片的厚度在0.5~2mm之間,該微小孔道的半徑在600~8000nm之間。The porous ceramic heat sink of claim 1, wherein the porous ceramic heat sink has a thickness of between 0.5 and 2 mm, and the microchannel has a radius of between 600 and 8000 nm. 如請求項1或2之多孔陶瓷散熱片,其中,該多孔陶瓷散熱片進一步附著有導熱層,該導熱層的厚度在0.02~0.08mm之間。The porous ceramic heat sink of claim 1 or 2, wherein the porous ceramic heat sink further adheres to a heat conductive layer having a thickness of between 0.02 and 0.08 mm. 如請求項3之多孔陶瓷散熱片,其中,該多孔陶瓷散熱片進一步混合有助熔劑、改性劑、增強劑、分散劑、脫模劑、絮凝劑,軟化劑、消泡劑或可塑劑等化學助劑。The porous ceramic heat sink of claim 3, wherein the porous ceramic heat sink is further mixed with a flux, a modifier, a reinforcing agent, a dispersing agent, a releasing agent, a flocculating agent, a softening agent, an antifoaming agent or a plasticizer, etc. Chemical additives. 如請求項4之多孔陶瓷散熱片,其中,該金屬化合物選自氧化鋁、氮化鋁、二氧化矽或前述金屬化合物之組合;該造孔劑選自麵粉、米粉、石油焦、澱粉、竹炭、木炭、糊精、鋸末、聚乙二醇、PMMA、PS、炭黑、小麥粉、酚醛樹脂、可發泡樹脂、已發泡的發泡樹脂、聚甲基丙烯酸甲酯、聚對苯二甲酸乙二醇酯或前述造孔劑之組合;該黏結劑選自羥甲基纖維素鈉、羥甲基纖維素、聚乙烯醇、矽酸鈉或前述黏結劑之組合;該助熔劑選自鈦酸四丁酯、正矽酸乙酯、氧化鈦或前述助熔劑之組合;該改性劑為聚乙烯醇;該增強劑為甲基纖維素;該分散劑選自聚乙烯醇、酚醛樹脂、發泡樹脂或前述分散劑之組合;該脫模劑為油酸;該絮凝劑選自硫酸鎂、硫酸銅或前述絮凝劑之組合;該消泡劑選自天然油脂、矽脂或前述消泡劑之組合;該可塑劑為鄰苯二甲酸鹽。The porous ceramic heat sink of claim 4, wherein the metal compound is selected from the group consisting of alumina, aluminum nitride, cerium oxide or a combination of the foregoing metal compounds; the pore forming agent is selected from the group consisting of flour, rice flour, petroleum coke, starch, and bamboo charcoal. , charcoal, dextrin, sawdust, polyethylene glycol, PMMA, PS, carbon black, wheat flour, phenolic resin, foamable resin, foamed foamed resin, polymethyl methacrylate, poly-p-phenylene a combination of ethylene glycol formate or the aforementioned pore former; the binder is selected from the group consisting of sodium carboxymethylcellulose, hydroxymethylcellulose, polyvinyl alcohol, sodium citrate or a combination of the foregoing; the flux is selected from the group consisting of a combination of tetrabutyl titanate, ethyl orthosilicate, titanium oxide or the aforementioned flux; the modifier is polyvinyl alcohol; the reinforcing agent is methyl cellulose; the dispersant is selected from the group consisting of polyvinyl alcohol and phenolic resin a foaming resin or a combination of the foregoing dispersing agents; the releasing agent is oleic acid; the flocculating agent is selected from the group consisting of magnesium sulfate, copper sulfate or a combination of the foregoing flocculating agents; the antifoaming agent is selected from the group consisting of natural oils, fats, or the aforementioned a combination of foaming agents; the plasticizer is a phthalate.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487688B (en) * 2012-12-28 2015-06-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI487688B (en) * 2012-12-28 2015-06-11

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