TWM449346U - Die bonding device - Google Patents

Abstract

A die bonding device includes a glue needle and a rotating module. The glue needle provides a colloid. The rotating module has a spindle for rotating the glue needle and the colloid on the glue needle changes its viscosity by a horizontal rotating force from the stir of the glue needle.

Description

Solid crystal device

The present invention relates to a die bonding device, and more particularly to a die bonding device for reducing the thickness of a die bond.

As the name implies, the die bonding device is an automated device that holds the die on the substrate. The die bonding device comprises a crystal taking mechanism, a conveyor belt and a glue dispensing mechanism. The conveyor belt transports a substrate to the dispensing mechanism. The dispensing mechanism moves the die attach glue to the position on the substrate where the die is to be placed, and then the substrate is transported to the pick-up mechanism by the conveyor belt. The crystal pulling mechanism can transfer the crystal grains to the substrate and bond with the solid crystal glue.

However, the thickness of the solid crystal glue is affected by the downforce of the glue needle and the characteristics of the solid glue. The higher the viscosity (viscosity coefficient), the worse the fluidity; the viscosity (viscosity coefficient) The lower the colloid, the better the fluidity. If it is limited by the material properties of the solid crystal glue, if the colloid with higher viscous force is selected and the thickness cannot be reduced, the thermal resistance between the crystal grains and the substrate will be too high. If the related process of reducing the thickness of the solid crystal glue is required in order to reduce the thermal resistance, the production capacity per unit time is affected, resulting in an increase in the cycle time of the product.

This creation is about a die bonding device to reduce the thickness of the die bond.

According to one aspect of the present invention, a solid crystal device is proposed, including a glue The needle and a rotating module. The glue needle is used to provide a gel. The rotating module has a rotating shaft to drive the rubber needle to rotate, and the colloid is changed by the horizontal rotating force of the rubber needle to change its viscosity.

In order to better understand the above and other aspects of the present invention, the preferred embodiments are described below, and in conjunction with the drawings, the detailed description is as follows:

The die bonding device of this embodiment improves the dispensing mechanism responsible for transferring the colloid onto the substrate, so that the rubber needle has a rotating function. When the glue sticks the colloid or the glue needle to spray the gel to provide the colloid for the solid crystal, the needle controls the rotation speed by the rotation module, and the gel is agitated and then flows at a shear strain rate. When the shear strain rate of the colloid is higher, the viscosity (viscosity coefficient) of the colloid is reduced, thereby changing the viscosity of the colloid.

Please refer to Figures 1A and 1B, which respectively show the relationship between shear stress (τ) and shear strain rate (ν) and the relationship between colloidal viscosity (μ) and shear strain rate (ν). In Figure 1A, line 1 is represented as a Bingham-shaped fluid with a linear relationship between shear stress (τ) and shear strain rate (ν), while line 2 is represented as a shear-thinning fluid with a viscosity A curve in which the property (μ) is nonlinearly related to the shear strain rate (ν).

It can be seen from Fig. 1B that the viscosity is reduced as the shear strain rate is higher, whether it is a Bingham-shaped fluid or a shear-thinning fluid. Therefore, in this embodiment, the viscosity of the colloid can be changed by using the characteristic that the higher the shear strain rate is, the lower the viscosity is, and the fluidity of the colloid is increased, so that the thickness of the thermal conductive adhesive for the solid crystal is relatively thin to reduce heat. Resistance. In addition, when the glue needle stops rotating and the colloid is moved to the substrate, since the viscosity of the colloid has been changed, Even if a colloid having a higher viscous force is selected, the thickness of the colloid attached to the substrate can be controlled within a predetermined thickness range to achieve the desired effect.

The following is a detailed description of the embodiments, which are intended to be illustrative only and not to limit the scope of the invention.

FIG. 2 is a schematic view of the plastic needle 110 and the rotating module 120 according to an embodiment of the present invention. The glue needle 110 is fixed to the rotating shaft 130 of the rotating module 120. One end of the rotating shaft 130 has a collet 140 for holding the plastic needle 110. In one embodiment, the rotary module 120 includes a motor 150 that directly drives the rotary shaft 130 and controls the rotational speed of the rotary shaft 130. Further, the motor 150 can also drive the rotating shaft 130 and control the rotational speed of the rotating shaft 130 through a shifting mechanism such as a gear train.

In an embodiment, the collet 140 can adjust the tightness according to the size of the needle 110, and can replace the needle 110 of a suitable size to adjust the amount of glue of the needle 110. For example, the larger the size of the needle 110 or the surface area of the needle portion, the greater the amount of glue; conversely, the smaller the amount of glue.

The glue needle 110 of the embodiment is not limited to the glue needle 110 for adhering the glue, and may be the glue needle 110 for adsorbing the glue and ejecting the glue. When the glue needle 110 is used together with the rubber disk 160, the rubber disk 160 can hold the glue G to which the glue needle 110 is attached, as shown in FIG. 3A. When the glue needle 110 is used together with a needle tube (not shown), the needle tube can accommodate the gel for the glue needle 110 to be ejected.

Please refer to FIGS. 3A-3F for a schematic diagram of the dispensing step of the glue needle 110 used with the rubber disk 160. In the 3A-3C figure, the glue needle 110 is first moved laterally above the rubber disk 160, after which the glue needle 110 is moved down to the holding dish 162 of the plastic disk 160 to adhere to the colloid G, and then, the glue needle 110 Move up and the needle sticks to a part of the colloid G'. In the 3D~3E chart In the middle, the glue needle 110 moves above the substrate 111 and rotates the glue needle 110 to generate a horizontal rotational force F. The colloid G' is subjected to agitation by the horizontal rotational force F to generate shear stress. As the tangential velocity of the agitation increases, the shear strain rate of the colloid G' also relatively increases, thereby changing the viscosity of the colloid G'. Further, the colloid G' is also subjected to agitation by the horizontal rotational force F to generate centrifugal force. In the 3E~3F diagram, after the viscosity of the colloid G' is changed, the glue needle 110 is moved down to the substrate 111, so that the colloid G' is attached to the position on the substrate 111 where the crystal grain is to be placed, and then the glue needle 110 is moved toward Move up to continue with the next dispensing step.

In FIG. 3E, when the glue needle 110 stops rotating and is pressed down to move the colloid G' onto the substrate 111, at this time, the colloid G' is attached to the substrate 111 without the horizontal rotation force F until the shearing When the shear strain rate becomes zero, the colloid G' will no longer flow. Since the thickness of the colloid G' attached to the substrate 111 depends on the amount of colloid adhered to the needle 110 and the horizontal rotational force F added when the needle 110 is pressed, the horizontal rotational force F provided when the above dispensing step is passed. In order to change the viscosity of the colloid G', the thickness of the colloid G' attached to the substrate 111 can be effectively reduced.

The colloid of the embodiment is a thermal conductive adhesive for solid crystal, such as silver glue or silicone rubber, preferably a Bingham type fluid or a shear thinning type fluid, so that the viscosity of the colloid G' is agitated with horizontal rotation force. The tangential speed of F decreases and decreases, as shown in Figure 1B. Even if the selected colloid is a colloid having a higher viscous force, the viscosity of the colloid G' is lowered by the above-mentioned dispensing step, and the thickness of the colloid G' can be effectively changed to control the thickness of the colloid G' at a predetermined thickness. Within the range, the effect of reducing thermal resistance is achieved.

The above dispensing step can be completed by the die bonding device 100 of FIG. to make. Please refer to FIG. 4 , which illustrates a schematic diagram of a die bonding apparatus 100 in accordance with an embodiment. The die bonding apparatus 100 includes a workstation 101 and a conveyor belt 104. The conveyor belt 104 is used to carry an object (for example, the substrate 111), and sequentially transports the substrate 111 to the workstation 101 of the dispensing process. The workstation 101 includes a mobile platform 102, a plastic needle 110, and a rotating module 120. The mobile platform 102 is, for example, a horizontal mobile platform 102a and a vertical mobile platform 102b, or a robotic arm having a point-to-point moving function, which is not limited in this creation. The horizontal moving platform 102a is used to adjust the horizontal position of the plastic needle 110 relative to the substrate 111 or the plastic disk 160, and the vertical moving platform 102b is used to adjust the vertical position of the plastic needle 110 relative to the substrate 111 or the plastic disk 160. Through the movement of the mobile platform 102, the rotating module 120 and the plastic needle 110 can be moved back and forth between the rubber disc 160 and the substrate 111 to transfer the colloid G in the plastic disc 160 to the substrate 111 through the plastic needle 110, as described in 3A~3F shown in the figure. In the dispensing process, the glue needle 110 provides a horizontal rotational force F by the rotary shaft 130 of the rotary module 120, and the colloid G' changes its viscosity by the action of the horizontal rotational force F and the centrifugal force. Therefore, the colloid G' pressed down by the glue needle 110 and attached to the substrate 111 is thinner than the colloid which is not agitated by the horizontal rotational force F, and the effect of reducing the thermal resistance is achieved.

It can be seen from the above description that the die bonding apparatus 100 of the present embodiment reduces the thickness of the colloid G′ attached to the substrate 111 by using the material characteristics of the rubber needle 110 having the rotation function and the colloid itself, and the device is simple and easy to implement, so It may affect the capacity per unit time or increase the shipment time of the product due to the difficulty of the process or the difficulty in controlling the parameters of the process.

In summary, although the present invention has been disclosed above in the preferred embodiments, it is not intended to limit the present invention. Those who have ordinary knowledge in the technical field of the present invention can make various changes and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation is subject to the definition of the scope of the patent application.

100‧‧‧Solid crystal device

101‧‧‧Workstation

102‧‧‧Mobile platform

102a‧‧‧Horizontal mobile platform

102b‧‧‧Vertical mobile platform

110‧‧‧needle needle

111‧‧‧Substrate

120‧‧‧Rotary Module

130‧‧‧Rotary axis

140‧‧‧ chuck

150‧‧‧Motor

160‧‧‧MP

162‧‧‧Storage

G, G’‧‧‧ colloid

F‧‧‧ horizontal rotation force

Figures 1A and 1B show the relationship between shear stress (τ) and shear strain rate (ν), and the relationship between colloidal viscosity (μ) and shear strain rate (ν).

FIG. 2 is a schematic view of a die bonding apparatus according to an embodiment of the present invention.

Figures 3A to 3F show schematic views of the dispensing steps used with the glue needle and the rubber disk.

FIG. 4 is a schematic view of a die bonding apparatus according to an embodiment.

110‧‧‧needle needle

120‧‧‧Rotary Module

130‧‧‧Rotary axis

140‧‧‧ chuck

150‧‧‧Motor

F‧‧‧ horizontal rotation force

Claims (12)

A die bonding device comprising: a plastic needle for providing a colloid; and a rotating module having a rotating shaft for driving the plastic needle to rotate and causing the colloid to be agitated by a horizontal rotational force of the plastic needle And change its viscosity. The die bonding device of claim 1, wherein the rotating shaft comprises a collet for clamping the plastic needle. The die bonding device of claim 1, further comprising a rubber disk for holding the gel for the glue needle to adhere. The die bonding device of claim 1, further comprising a needle tube for receiving the gel for the glue needle to be ejected. The die bonding device of claim 1, further comprising a conveyor belt for carrying an object and changing the relative position of the object to the plastic needle by driving the conveyor belt, wherein the glue body is The needle is attached to the object when it is rotated and pressed down to the object. The die bonding device of claim 5, wherein the thickness of the gel attached to the article depends on the amount of the gel adhered to the needle and the horizontal rotational force added when the needle is depressed. The die bonding device of claim 5, further comprising a workstation, the workstation comprising a moving platform for moving the rotating module and the position of the needle relative to the object. The die bonding apparatus of claim 1, wherein the viscosity of the colloid decreases as the tangential speed of the horizontal rotational force increases. The die bonding device of claim 1, wherein the colloid is a Bingham type fluid or a shear thinning type fluid. The die bonding device of claim 1, wherein the colloid is a solid crystalline thermal conductive adhesive. The die bonding device of claim 1, wherein the colloid is subjected to a centrifugal force by agitation of the horizontal rotational force. The die bonding device of claim 1, wherein the rotating module comprises a motor.