TWM448108U - Circuit-board height adjusting and shock-absorbing structure and server having the circuit-board height adjusting and shock-absorbing structure - Google Patents
Circuit-board height adjusting and shock-absorbing structure and server having the circuit-board height adjusting and shock-absorbing structure Download PDFInfo
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- TWM448108U TWM448108U TW101217561U TW101217561U TWM448108U TW M448108 U TWM448108 U TW M448108U TW 101217561 U TW101217561 U TW 101217561U TW 101217561 U TW101217561 U TW 101217561U TW M448108 U TWM448108 U TW M448108U
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- height adjustment
- adjustment structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H5/00—Feeding articles separated from piles; Feeding articles to machines
- B65H5/22—Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device
- B65H5/222—Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device by suction devices
- B65H5/224—Feeding articles separated from piles; Feeding articles to machines by air-blast or suction device by suction devices by suction belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H1/00—Supports or magazines for piles from which articles are to be separated
- B65H1/08—Supports or magazines for piles from which articles are to be separated with means for advancing the articles to present the articles to the separating device
- B65H1/14—Supports or magazines for piles from which articles are to be separated with means for advancing the articles to present the articles to the separating device comprising positively-acting mechanical devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H1/00—Supports or magazines for piles from which articles are to be separated
- B65H1/28—Supports or magazines for piles from which articles are to be separated compartmented to receive piles side-by-side
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/26—Delivering or advancing articles from machines; Advancing articles to or into piles by dropping the articles
- B65H29/32—Delivering or advancing articles from machines; Advancing articles to or into piles by dropping the articles from pneumatic, e.g. suction, carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/58—Article switches or diverters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H3/00—Separating articles from piles
- B65H3/08—Separating articles from piles using pneumatic force
- B65H3/12—Suction bands, belts, or tables moving relatively to the pile
- B65H3/124—Suction bands or belts
- B65H3/128—Suction bands or belts separating from the top of pile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H31/00—Pile receivers
- B65H31/30—Arrangements for removing completed piles
- B65H31/3054—Arrangements for removing completed piles by moving the surface supporting the lowermost article of the pile, e.g. by using belts or rollers
- B65H31/3063—Arrangements for removing completed piles by moving the surface supporting the lowermost article of the pile, e.g. by using belts or rollers by special supports like carriages, containers, trays, compartments, plates or bars, e.g. moved in a closed loop
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D11/00—Devices accepting coins; Devices accepting, dispensing, sorting or counting valuable papers
- G07D11/10—Mechanical details
- G07D11/16—Handling of valuable papers
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D11/00—Devices accepting coins; Devices accepting, dispensing, sorting or counting valuable papers
- G07D11/10—Mechanical details
- G07D11/16—Handling of valuable papers
- G07D11/165—Picking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2405/00—Parts for holding the handled material
- B65H2405/30—Other features of supports for sheets
- B65H2405/33—Compartmented support
- B65H2405/331—Juxtaposed compartments
- B65H2405/3311—Juxtaposed compartments for storing articles horizontally or slightly inclined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2406/00—Means using fluid
- B65H2406/30—Suction means
- B65H2406/32—Suction belts
- B65H2406/322—Suction distributing means
- B65H2406/3223—Suction distributing means details of the openings in the belt, e.g. shape, distribution
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1912—Banknotes, bills and cheques or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
本創作係關於一種高度調整及減震結構,特別是關於一種電路板之高度調整及減震結構。 This creation is about a height adjustment and shock absorbing structure, especially regarding a height adjustment and shock absorbing structure of a circuit board.
隨著時代巨輪之轉動,科技突飛猛進,電子產品已成為不可缺之生活必須品,在電子產品中(例如:電腦、伺服器等),絕大多數均配置有電路板,電路板基本上置有諸如積體電路晶片、電阻器、電容器及其它各種電子元件,同時前述之電子元件亦會與其他裝置相互連接。而習知之電子產品之內部結構,有4個待解決之問題: With the revolution of the era of giant wheels, technology has advanced by leaps and bounds, electronic products have become an indispensable necessity for life. In electronic products (such as computers, servers, etc.), most of them are equipped with circuit boards, and the circuit boards are basically placed. Such as integrated circuit chips, resistors, capacitors and other various electronic components, while the aforementioned electronic components are also connected to other devices. There are four problems to be solved in the internal structure of the known electronic products:
1.習知之電路板為剛性支撐,但隨著電子產品趨向短小輕薄,為維持電子產品之可靠度,電路板之高度須具可調整性或提升組裝後之電路板之水平度,若利用剛性支撐來達成目的,則電路板之製造費用將大幅提高。(如第二圖揭示,習知之電路板為剛性支撐,無法調整電路板之高度或水平度,因電路板與支撐台之距離H1為固定距離。) 1. The conventional circuit board is rigidly supported, but as the electronic product tends to be short and light, in order to maintain the reliability of the electronic product, the height of the circuit board must be adjustable or the level of the assembled circuit board can be improved. Support to achieve the goal, the manufacturing cost of the board will be greatly increased. (As shown in the second figure, the conventional circuit board is rigidly supported, and the height or level of the circuit board cannot be adjusted because the distance H1 between the circuit board and the support table is a fixed distance.)
2.電子產品內之磁碟機、光碟機、冷卻風扇等之機械運動會產生外力或震動,該等外力或震動會至電路板上,使電路板上之電子元件產生不可預期之應力、移位或疲勞等,使電路板 上之電路失效。(如第三圖揭示,習知之電路板為剛性支撐,因此不能吸收震動源A14傳至電路板上之外力或吸收傳至電路板上之震動。) 2. The mechanical movement of the disk drive, CD player, cooling fan, etc. in the electronic product generates external force or vibration, and the external force or vibration will come to the circuit board, causing unpredictable stress and displacement of the electronic components on the circuit board. Or fatigue, etc., make the board The circuit on the circuit is invalid. (As shown in the third figure, the conventional circuit board is rigidly supported, and therefore cannot absorb the external force transmitted from the vibration source A14 to the circuit board or absorb the vibration transmitted to the circuit board.)
3.於伺服器中,常發生冷卻風扇藉由電路板傳送外力或震動至硬碟上,硬碟因外力或震動之衝擊而引致失效。 3. In the server, the cooling fan often transmits external force or vibration to the hard disk through the circuit board, and the hard disk is ineffective due to the impact of external force or vibration.
4.當達成電路板高度調整、減震之功效時,如何確保電路板於狹小空間內,可對外電性連接。 4. When the board height adjustment and damping effect are achieved, how to ensure that the circuit board is connected to the outside in a narrow space.
有鑑於前述原因,本創作之目的是要提供: For the foregoing reasons, the purpose of this creation is to provide:
●一種電路板高度調整結構,其可調整電路板之高度或水平度。 A circuit board height adjustment structure that adjusts the height or level of the board.
●一種電路板減震結構,降低電路板承受外力或震動之衝擊。 ● A circuit board shock absorbing structure reduces the impact of the board on external forces or vibrations.
●一種電路板減震結構,降低由震動源藉由電路板傳送外力或震動至硬碟上之衝擊。 ● A circuit board shock absorbing structure that reduces the impact of external forces or vibrations transmitted from the vibration source to the hard disk by the circuit board.
●一種電路板導電結構,如何達成電路板高度調整、減震之功效時,可確保電路板於狹小空間內,可對外電性連接。 ● A circuit board conductive structure, how to achieve the board height adjustment, shock absorption effect, can ensure that the circuit board in a small space, can be externally connected.
為達成前述目的,本創作提供一種電路板高度調整結構,係用以調整電路板之高度或調整電路板之水平度,該電路板高度調整結構包括:一種電路板高度調整結構,係用以調整電路板之高度或調整電路板之水平度,該電路板高度調整結構包括:一支撐台,該支撐台上設有複數個支撐柱,每個支撐柱套設一彈性緩衝元件,每個支撐柱分別貫穿一電路板之貫穿孔,且該電路板為該複數個彈性緩衝元件所支撐,每個支撐柱之上部分別與一結合部結合;藉此達成,該結合部下壓該電路板,該電路板下壓該複數個彈性緩衝元件,該複數個彈性緩衝元件為該支撐台支撐,該電路板便為該彈性緩衝元件所支撐。前述之電路板高度調整結構,可利用下述步驟達成高度調整之目的: In order to achieve the foregoing objectives, the present invention provides a circuit board height adjustment structure for adjusting the height of a circuit board or adjusting the level of the circuit board. The circuit board height adjustment structure includes: a circuit board height adjustment structure for adjusting The height of the circuit board or the level of the adjustment of the circuit board, the height adjustment structure of the circuit board comprises: a support table, the support table is provided with a plurality of support columns, each support column is provided with an elastic buffer component, and each support column Passing through a through hole of a circuit board, and the circuit board is supported by the plurality of elastic buffering elements, and each of the upper portions of the support columns is respectively coupled with a joint portion; thereby achieving that the joint portion presses the circuit board, The circuit board presses the plurality of elastic buffer elements, and the plurality of elastic buffer elements are supported by the support table, and the circuit board is supported by the elastic buffer elements. The aforementioned circuit board height adjustment structure can achieve the purpose of height adjustment by the following steps:
1.每個支撐柱分別置入一彈性緩衝元件。 1. Each of the support columns is respectively provided with an elastic buffering member.
2.每個支撐柱分別貫穿一電路板之貫穿孔後,該電路板置於該彈性緩衝元件上。 2. After each support column runs through a through hole of a circuit board, the circuit board is placed on the elastic buffer member.
3.每個支撐柱之上部分別與一結合部結合,藉由,該結合部下壓該電路板,該電路板下壓該複數個彈性緩衝元件,該電路板便為該彈性緩衝元件所支撐。 3. The upper part of each support column is respectively combined with a joint portion, wherein the joint portion presses the circuit board, and the circuit board presses the plurality of elastic buffer members, and the circuit board is supported by the elastic buffer member .
4.由於該電路板為該彈性緩衝元件所支撐,因此選取不同長度之彈性緩衝元件、彈性系數之彈性緩衝元件或/及更換不同下壓深度之結合部,便可調整電路板之高度或調整電路板之水平度。 4. Since the circuit board is supported by the elastic buffering component, the height or adjustment of the circuit board can be adjusted by selecting elastic buffering elements of different lengths, elastic buffering elements of elastic coefficients or/and replacing the joints of different pressing depths. The level of the board.
另本創作中,該支撐柱之上部與該結合部為緊配結合。藉由,緊配結合,該結合部固結於該支撐柱之上部。 In another creation, the upper portion of the support column and the joint portion are tightly coupled. The joint is affixed to the upper portion of the support column by a tight fit.
另本創作中,該支撐柱之上部與該結合部為螺旋結合。藉由,螺旋結合,該結合部螺固於該支撐柱之上部。 In another creation, the upper portion of the support column and the joint portion are spirally coupled. The joint is screwed to the upper portion of the support column by a spiral joint.
另本創作中,該支撐柱之上部設有螺紋,該結合部上設有螺孔,藉以,利用該支撐柱之上部之螺紋與該結合部之螺孔達成螺旋結合。藉由,螺旋結合,該結合部螺固於該支撐柱之上部。 In the creation, the upper part of the support column is provided with a thread, and the joint portion is provided with a screw hole, so that the screw on the upper part of the support column and the screw hole of the joint portion are screwed. The joint is screwed to the upper portion of the support column by a spiral joint.
另本創作中,該支撐柱之上部設有螺孔,該結合部為一螺栓,藉此,利用該螺孔與該螺栓螺旋結合。藉由,螺旋結合,該螺栓螺固於該支撐柱之上部。 In another creation, a screw hole is arranged on the upper part of the support column, and the joint portion is a bolt, whereby the screw hole is screwed into the bolt. The bolt is screwed to the upper portion of the support column by a spiral joint.
另本創作中,該彈性緩衝元件為一彈簧。 In another creation, the elastic cushioning element is a spring.
另本創作中,該電路板下方設有一導電層;該導電層下方組設一導電部,該複數個彈性緩衝元件中之一個彈性緩衝元件組設於該導電部下方,且該個彈性緩衝元件可導電;該個彈性緩衝元件為該支撐台支撐,且該支撐台可導電;藉此達成,該結合部下 壓該電路板,該電路板之導電層下壓該導電部,該導電部下壓該個可導電之彈性緩衝元件,該個可導電之彈性緩衝元件為該可導電之支撐台支撐,藉此,該電路板之電流經由該導電層、該導電部、該個可導電之彈性緩衝元件,最後被傳至該可導電之支撐台。 In another creation, a conductive layer is disposed under the circuit board; a conductive portion is disposed under the conductive layer, and one of the plurality of elastic buffer members is disposed under the conductive portion, and the elastic buffer member Conductive; the elastic cushioning member is supported by the support table, and the support table is electrically conductive; thereby achieving Pressing the circuit board, the conductive layer of the circuit board presses the conductive portion, the conductive portion presses the conductive elastic buffering member, and the conductive elastic buffering member is supported by the conductive supporting platform, thereby The current of the circuit board is finally transmitted to the conductive support table via the conductive layer, the conductive portion, the conductive elastic buffering member.
另本創作中,該導電部為一中空結構,且該個可導電之彈性緩衝元件係套入該中空結構內。此中空結構可方便組裝及確保該中空結構與該個可導電之彈性緩衝元件接觸。 In another creation, the conductive portion is a hollow structure, and the electrically conductive elastic buffering member is nested in the hollow structure. The hollow structure facilitates assembly and ensures that the hollow structure is in contact with the electrically conductive elastic cushioning element.
另本創作中,一伺服器,該伺服器上設有該電路板高度調整結構,該伺服器上設有該支撐台,該伺服器上具有一震動源,該電路板設於該震動源旁,該等彈性緩衝元件具有阻尼;藉由,該等阻尼,吸收從該震動源直接或間接傳送至該電路板上之外力或震動。 In another creation, a server is provided with the height adjustment structure of the circuit board. The server is provided with the support table, and the server has a vibration source, and the circuit board is disposed beside the vibration source. The elastic cushioning members have damping; by means of the damping, the external force or vibration transmitted from the vibration source directly or indirectly to the circuit board.
另,間接傳送至該電路板上之外力或震動,係指該震動源與該電路板非直接接觸,以間接方式傳送外力或震動至該電路板上(例如:第十二至十六圖所揭示,該震動源透過支撐台傳送外力或震動至該電路板上)。 In addition, an external force or vibration transmitted indirectly to the circuit board means that the vibration source is not in direct contact with the circuit board, and an external force or vibration is transmitted to the circuit board in an indirect manner (for example, the twelfth to sixteenth drawings It is revealed that the vibration source transmits an external force or vibration to the circuit board through the support table.
另,直接傳送至該電路板上之外力或震動,係指該震動源與該電路板直接接觸,該震動源直接傳送外力或震動至該電路板上(例如:第十七至二十一圖所揭示,該震動源直接傳送傳送外力或震動至該電路板上)。 In addition, direct force or vibration transmitted directly to the circuit board means that the vibration source is in direct contact with the circuit board, and the vibration source directly transmits an external force or vibration to the circuit board (for example, the seventeenth to twenty-first figures) It is disclosed that the vibration source directly transmits an external force or vibration to the circuit board).
另本創作中,該伺服器中之震動源為一散熱風扇。(各圖中皆未揭示)。 In addition, in this creation, the vibration source in the server is a cooling fan. (Not shown in each figure).
另本創作中,該伺服器中之震動源為一硬碟。(各圖中皆未揭示) In addition, in this creation, the vibration source in the server is a hard disk. (not shown in each figure)
另本創作中,該伺服器中之震動源為一散熱風扇,且該電路板上連接一硬碟;藉此,降低由震動源藉由該電路板傳送外力或震動至該硬碟上。 In the present invention, the vibration source in the server is a cooling fan, and a hard disk is connected to the circuit board; thereby, the external source or vibration is transmitted by the vibration source to the hard disk by the vibration source.
另本創作中,該硬碟係設於該電路板上。 In the present creation, the hard disk is provided on the circuit board.
第一圖係為習知之電路板支撐結構之爆炸圖。 The first figure is an exploded view of a conventional circuit board support structure.
第二圖係為第一圖之組合示意圖,圖中揭示支撐台A13上設有複數支撐柱A10,複數支撐柱A10對電路板A11係為剛性支撐,故當支撐柱A10之上部分別與結合部A12結合後,電路板A11與支撐台之距離H1為固定距離,因此無法調整電路板A11距離支撐台A13之高度或水平度。 The second figure is a combination diagram of the first figure. The figure shows that the support table A13 is provided with a plurality of support columns A10, and the plurality of support columns A10 are rigidly supported to the circuit board A11, so when the upper part of the support column A10 is respectively combined with After the portion A12 is combined, the distance H1 between the circuit board A11 and the support table is a fixed distance, so that the height or level of the circuit board A11 from the support table A13 cannot be adjusted.
第三圖係為習知之電路板支撐結構旁具有震動源之組合示意圖,圖中揭示電路板A11為剛性支撐,因此不能吸收震動源A14傳至電路板A11上之外力或吸收傳至電路板A11上之震動。 The third figure is a combination diagram of a vibration source adjacent to the conventional circuit board support structure. The figure shows that the circuit board A11 is rigidly supported, so that the vibration source A14 cannot be absorbed to the circuit board A11 and the external force or absorption is transmitted to the circuit board A11. The vibration on the top.
第四圖係為本創作之電路板支撐結構之爆炸圖。 The fourth picture is an exploded view of the circuit board support structure of the creation.
第五圖係為第四圖之組合示意圖,圖中揭示:每個支撐柱100之上部分別與一結合部120結合(該結合方式為:該支撐柱之上部設有一螺紋,該結合部上設有一螺孔,該支撐柱之上部貫穿電路板110之貫穿孔170,且該螺紋螺固於該螺孔內,藉此,利用該螺紋與該螺孔螺旋結合)(或該結合方式為:該支撐柱之上部貫穿電路板110之貫穿孔170後,該支撐柱之上部與該結合部為緊配結合),而電路板110為彈性緩衝元件150所支撐,由於該電路板110為該彈性緩衝元件150所支撐,因此藉選取不同長度之彈性緩衝元件150、彈性系數之彈性緩衝元件150或/及更換不同下壓深度之結合部120,便可調整電路板110距離支撐台130之高度或調整電路板110距離支撐台130之水平度。 The fifth figure is a combination diagram of the fourth figure. The figure shows that the upper part of each support column 100 is respectively combined with a joint portion 120 (the combination manner is: a thread is arranged on the upper portion of the support column, and the joint portion is provided on the joint portion A screw hole is disposed, the upper portion of the support column penetrating through the through hole 170 of the circuit board 110, and the thread is screwed into the screw hole, thereby using the thread to be screwed with the screw hole) (or the combination manner is: After the upper portion of the support column penetrates the through hole 170 of the circuit board 110, the upper portion of the support column and the joint portion are tightly coupled, and the circuit board 110 is supported by the elastic buffering member 150, because the circuit board 110 is elastic. The cushioning element 150 is supported. Therefore, by selecting the elastic buffering element 150 of different lengths, the elastic cushioning element 150 of the elastic coefficient or/and the joint 120 of different pressing depths, the height of the circuit board 110 from the support table 130 can be adjusted or The level of the circuit board 110 from the support table 130 is adjusted.
第六圖係為本創作之電路板支撐結構之爆炸圖。 The sixth picture is an exploded view of the circuit board support structure of the creation.
第七圖係為第六圖之組合示意圖,圖中揭示:每個支撐柱100之上部設有一螺孔210,一螺栓200貫穿電路板110之貫穿孔170,且該螺栓200螺固於該螺孔210內,使該電路板110為彈性緩衝元件150所支撐,由於該電路板110為該彈性緩衝元件150所支撐,因此藉選取不同長度之彈性緩衝元件150、彈性系數之彈性緩衝元件150或/及更換不同下壓深度之螺栓200,便可調整電路板110距離支撐台130之高度或調整電路板110距離支撐台130之水 平度。 The seventh figure is a combination diagram of the sixth figure. The figure shows that a screw hole 210 is arranged in the upper part of each support column 100. A bolt 200 penetrates the through hole 170 of the circuit board 110, and the bolt 200 is screwed to the screw. In the hole 210, the circuit board 110 is supported by the elastic buffering element 150. Since the circuit board 110 is supported by the elastic buffering element 150, the elastic cushioning element 150 of different lengths, the elastic cushioning element 150 of elastic modulus or / and replacing the bolts 200 of different depression depths, the height of the circuit board 110 from the support table 130 or the water of the adjustment board 110 from the support table 130 can be adjusted. Flatness.
第八圖係為本創作之另一種方式之電路板支撐結構之爆炸圖。 The eighth figure is an exploded view of the circuit board support structure of another mode of creation.
第九圖為第八圖之組合示意圖,圖中揭示:每個支撐柱100之上部分別與一結合部120結合(該結合方式為:該支撐柱之上部設有一螺紋,該結合部上設有一螺孔,該支撐柱之上部貫穿電路板110之貫穿孔170,且該螺紋螺固於該螺孔內,藉此,利用該螺紋與該螺孔螺旋結合)(或該結合方式為:該支撐柱之上部貫穿電路板110之貫穿孔170後,該支撐柱之上部與該結合部為緊配結合);該電路板110下方設有一導電層300;該導電層300下方組設一導電部310,該複數個彈性緩衝元件150中之一個彈性緩衝元件150組設於該導電部310下方,且該個彈性緩衝元件150可導電;該個彈性緩衝元件150為該支撐台130支撐,且該支撐台130可導電;藉此,該結合部120下壓該電路板110,該電路板110之導電層300下壓該導電部310,該導電部310下壓該個可導電之彈性緩衝元件150,該個可導電之彈性緩衝元件150為該可導電之支撐台130支撐,藉此,該電路板110之電流經由該導電層300、該導電部310、該個可導電之彈性緩衝元件150,最後被傳至該可導電之支撐台130。 The ninth figure is a combination diagram of the eighth figure. The figure shows that the upper part of each support column 100 is respectively combined with a joint portion 120 (the combination manner is: a thread is arranged on the upper part of the support column, and the joint portion is provided a threaded hole, the upper portion of the support column penetrates the through hole 170 of the circuit board 110, and the thread is screwed into the screw hole, thereby using the thread to be screwed with the screw hole) (or the combination manner is: After the upper portion of the support column penetrates the through hole 170 of the circuit board 110, the upper portion of the support column is tightly coupled with the joint portion; a conductive layer 300 is disposed under the circuit board 110; and a conductive portion is disposed under the conductive layer 300. 310, one of the plurality of elastic buffer elements 150 is disposed under the conductive portion 310, and the elastic buffer member 150 is electrically conductive; the elastic buffer member 150 is supported by the support table 130, and the The support table 130 can be electrically conductive; thereby, the bonding portion 120 presses the circuit board 110, the conductive layer 300 of the circuit board 110 presses the conductive portion 310, and the conductive portion 310 presses the conductive elastic buffer member 150. , the conductive elastic buffer The component 150 is supported by the electrically conductive support table 130. The current of the circuit board 110 is transmitted to the electrically conductive layer via the conductive layer 300, the conductive portion 310, and the electrically conductive elastic buffer member 150. Support table 130.
第十圖係為本創作之另一種方式之電路板支撐結構之爆炸圖。 The tenth figure is an exploded view of the circuit board support structure of another mode of creation.
第十一圖係為第十圖之組合示意圖,圖中揭示:每個支撐柱100 之上部設有一螺孔210,一螺栓200貫穿電路板110之貫穿孔170,且該螺栓200螺固於該螺孔210內;該電路板110下方設有一導電層300;該導電層300下方組設一導電部310,該複數個彈性緩衝元件150中之一個彈性緩衝元件150組設於該導電部310下方,且該個彈性緩衝元件150可導電;該個彈性緩衝元件150為該支撐台130支撐,且該支撐台130可導電;藉此,該螺栓200下壓該電路板110,該電路板110之導電層300下壓該導電部310,該導電部310下壓該個可導電之彈性緩衝元件150,該個可導電之彈性緩衝元件150為該可導電之支撐台130支撐,藉此,該電路板110之電流經由該導電層300、該導電部310、該個可導電之彈性緩衝元件150,最後被傳至該可導電之支撐台130。 The eleventh figure is a combination diagram of the tenth figure, the figure shows: each support column 100 The upper part of the circuit board 110 is provided with a through hole 170, and a bolt 200 is inserted into the through hole 170 of the circuit board 110, and the bolt 200 is screwed into the screw hole 210; a conductive layer 300 is disposed under the circuit board 110; A conductive portion 310 is disposed, and one of the plurality of elastic buffer members 150 is disposed under the conductive portion 310, and the elastic buffer member 150 is electrically conductive; the elastic buffer member 150 is the support table 130. Supporting, and the support table 130 can be electrically conductive; thereby, the bolt 200 presses the circuit board 110, the conductive layer 300 of the circuit board 110 presses the conductive portion 310, and the conductive portion 310 presses the conductive elastic The buffering element 150, the electrically conductive elastic buffering element 150 is supported by the electrically conductive support table 130, whereby the current of the circuit board 110 passes through the conductive layer 300, the conductive portion 310, and the electrically conductive elastic buffer Element 150 is finally passed to the electrically conductive support table 130.
第十二圖為本創作之伺服器內之電路板與振動源間接連接之示意圖。 The twelfth figure is a schematic diagram of the indirect connection of the circuit board and the vibration source in the server of the creation.
第十三圖係為第十二圖之電路板支撐結構與振動源間接連接之示意圖,圖中揭示該震動源與該電路板非直接接觸,該震動源係透過支撐台傳送外力或震動至該電路板上。 The thirteenth figure is a schematic diagram of the indirect connection between the support structure of the circuit board and the vibration source of the twelfth figure, wherein the vibration source is in direct contact with the circuit board, and the vibration source transmits an external force or vibration through the support table to the On the board.
第十四圖係為第十二圖之另一種方式之電路板支撐結構與振動源間接連接之示意圖,圖中揭示該震動源與該電路板非直接接觸,該震動源係透過支撐台傳送外力或震動至該電路板上。 Figure 14 is a schematic view showing the indirect connection of the support structure of the circuit board to the vibration source in another mode of the twelfth figure, wherein the vibration source is in direct contact with the circuit board, and the vibration source transmits the external force through the support table. Or shake to the board.
第十五圖係為第十二圖之另一種方式之電路板支撐結構與振動源 間接連接之示意圖,圖中揭示該震動源與該電路板非直接接觸,該震動源係透過支撐台傳送外力或震動至該電路板上。 The fifteenth figure is the circuit board support structure and vibration source of another mode of the twelfth figure. The schematic diagram of the indirect connection reveals that the vibration source is not in direct contact with the circuit board, and the vibration source transmits external force or vibration to the circuit board through the support table.
第十六圖係為第十二圖之另一種方式之電路板支撐結構與振動源間接連接之示意圖,圖中揭示該震動源與該電路板非直接接觸,該震動源係透過支撐台傳送外力或震動至該電路板上。 Figure 16 is a schematic view showing the indirect connection of the support structure of the circuit board to the vibration source in another mode of the twelfth figure, wherein the vibration source is in direct contact with the circuit board, and the vibration source transmits the external force through the support table. Or shake to the board.
第十七圖係為本創作之伺服器內之電路板與振動源直接連接之示意圖。 The seventeenth figure is a schematic diagram of the direct connection of the circuit board and the vibration source in the server of the creation.
第十八圖係為第十七圖之電路板與振動源直接連接之示意圖,圖中揭示該震動源與該電路板直接接觸,該震動源直接傳送外力或震動至該電路板上。 Figure 18 is a schematic view showing the direct connection of the circuit board of the seventeenth diagram to the vibration source. The vibration source is directly in contact with the circuit board, and the vibration source directly transmits an external force or vibration to the circuit board.
第十九圖係為第十七圖之另一種方式之電路板與振動源直接連接之示意圖,圖中揭示該震動源與該電路板直接接觸,該震動源直接傳送外力或震動至該電路板上。 The nineteenth figure is a schematic diagram of a circuit board directly connected to a vibration source according to another mode of the seventeenth figure. The vibration source is directly in contact with the circuit board, and the vibration source directly transmits an external force or vibration to the circuit board. on.
第二十圖係為第十七圖之另一種方式之電路板與振動源直接連接之示意圖,圖中揭示該震動源與該電路板直接接觸,該震動源直接傳送外力或震動至該電路板上。 Figure 20 is a schematic view showing a circuit board directly connected to a vibration source according to another mode of the seventeenth embodiment. The vibration source is directly in contact with the circuit board, and the vibration source directly transmits an external force or vibration to the circuit board. on.
第二十一圖係為第十七圖之另一種方式之電路板與振動源直接連接之示意圖,圖中揭示該震動源與該電路板直接接觸,該震動源直接傳送外力或震動至該電路板上。 The twenty-first figure is a schematic diagram of the circuit board directly connected to the vibration source in another mode of the seventeenth figure, wherein the vibration source is directly in contact with the circuit board, and the vibration source directly transmits an external force or vibration to the circuit. On the board.
第二十二圖揭示,震動源間接藉由電路板傳送外力或震動至硬碟上。 According to the twenty-second figure, the vibration source transmits an external force or vibration to the hard disk indirectly through the circuit board.
第二十三圖揭示,震動源直接藉由電路板傳送外力或震動至硬碟上。 The twenty-third figure reveals that the vibration source directly transmits external force or vibration to the hard disk by the circuit board.
本案將可由以下的實施例說明而得到充分瞭解,使得熟習本技藝之人士可以據以完成之,然本案之實施並非可由下列實施案例而被限制其實施型態。 The present invention will be fully understood by the following examples, so that those skilled in the art can do so. However, the implementation of the present invention may not be limited by the following embodiments.
參閱第四至二十一圖揭示。 See Figures 4 to 21 for disclosure.
本例係一種電路板高度調整結構,係用以調整電路板110之高度或調整電路板110之水平度,該電路板高度調整結構包括:一支撐台130,該支撐台130上設有複數個支撐柱100,每個支撐柱100套設一彈性緩衝元件150,每個支撐柱100分別貫穿一電路板110之貫穿孔170,且該電路板110為該複數個彈性緩衝元件150所支撐,每個支撐柱100之上部分別與一結合部120結合;藉此達成,該結合部120下壓該電路板110,該電路板110下壓該複數個彈性緩衝元件150,該複數個彈性緩衝元件150為該支撐台130支撐。前述之電路板110高度調整結構,可利用下述步驟達成高度調整之目的: The present invention is a circuit board height adjustment structure for adjusting the height of the circuit board 110 or adjusting the level of the circuit board 110. The circuit board height adjustment structure includes: a support table 130, and the support table 130 is provided with a plurality of Each of the support columns 100 is provided with an elastic buffering element 150. Each of the supporting columns 100 extends through a through hole 170 of a circuit board 110, and the circuit board 110 is supported by the plurality of elastic buffering elements 150. The upper portions of the support columns 100 are respectively combined with a joint portion 120; thereby, the joint portion 120 presses the circuit board 110, and the circuit board 110 presses the plurality of elastic buffer members 150, the plurality of elastic buffer members 150 is supported by the support table 130. The aforementioned height adjustment structure of the circuit board 110 can achieve the purpose of height adjustment by the following steps:
1.每個支撐柱100分別置入一彈性緩衝元件150。 1. Each of the support columns 100 is respectively provided with an elastic cushioning member 150.
2.每個支撐柱100分別貫穿一電路板110之貫穿孔170後,該電路板110置於該彈性緩衝元件150上。 2. After each of the support columns 100 respectively penetrates through the through holes 170 of the circuit board 110, the circuit board 110 is placed on the elastic buffering member 150.
3.每個支撐柱100上部分別與一結合部120結合,藉由,該結 合部120下壓該電路板110,該電路板110下壓該複數個彈性緩衝元件150,該電路板110便為該彈性緩衝元件150所支撐。 3. The upper part of each support column 100 is respectively combined with a joint portion 120, by the knot The splicing portion 120 presses the circuit board 110, and the circuit board 110 presses the plurality of elastic absorbing members 150, and the circuit board 110 is supported by the elastic absorbing member 150.
4.由於該電路板110為該彈性緩衝元件150所支撐,因此選取不同長度之彈性緩衝元件150、彈性系數之彈性緩衝元件150或/及更換不同下壓深度之結合部120,便可調整電路板110之高度或調整電路板110之水平度。 4. Since the circuit board 110 is supported by the elastic buffering element 150, the circuit can be adjusted by selecting elastic buffering elements 150 of different lengths, elastic cushioning elements 150 of elastic coefficients or/and replacing the joints 120 of different pressing depths. The height of the board 110 or the level of the board 110 is adjusted.
另,如第五圖揭示,右邊電路板與支撐台之距離為H2,左邊電路板與支撐台之距離為H3,因此可單獨置換左邊或右邊不同長度之彈性緩衝元件150、彈性系數之彈性緩衝元件150或/及更換不同下壓深度之結合部120,便可調整電路板110之高度或調整電路板110之水平度。 In addition, as shown in the fifth figure, the distance between the right circuit board and the support table is H2, and the distance between the left circuit board and the support table is H3, so that the elastic buffer element 150 of different lengths on the left or the right side can be separately replaced, and the elastic buffer of the elastic coefficient can be separately replaced. The component 150 or/and the combination of different depression depths 120 can adjust the height of the circuit board 110 or adjust the level of the circuit board 110.
另,若電路板任一點之之高度或水平度不符規範,則只須單獨置換該點附件之彈性緩衝元件150之長度150或/及彈性系數,便可調整電路板110之高度或調整電路板110之水平度。(圖中未揭示) In addition, if the height or level of any point of the circuit board does not conform to the specification, the height of the circuit board 110 or the circuit board can be adjusted by simply replacing the length 150 or/and the spring constant of the elastic buffer element 150 of the attachment. The level of 110. (not shown in the figure)
另本例中,該支撐柱100之上部與該結合部120為緊配結合。藉由,緊配結合,該結合部120係固結於該支撐柱100之上部。 In this example, the upper portion of the support column 100 and the joint portion 120 are tightly coupled. The joint portion 120 is fixed to the upper portion of the support column 100 by a tight fit.
另本例中,該支撐柱100之上部與該結合部120為螺旋結合。 藉由,螺旋結合,該結合部120係螺固於該支撐柱100之上部。 In this example, the upper portion of the support column 100 and the joint portion 120 are spirally coupled. The joint portion 120 is screwed to the upper portion of the support column 100 by a spiral joint.
另本例中,該支撐柱100之上部設有一螺紋,該結合部120上設有一螺孔。藉由,該螺紋與該螺孔螺旋固結,該結合部120螺固於該支撐柱100之上部。 In another example, a thread is disposed on the upper portion of the support column 100, and a screw hole is disposed on the joint portion 120. The thread is screwed to the screw hole, and the joint portion 120 is screwed to the upper portion of the support column 100.
另本例中,該支撐柱100之上部設有一螺孔210,該結合部為一螺栓200。藉此,該螺孔210與該螺栓200螺旋結合,該結合部120螺固於該支撐柱100之上部。 In another example, a screw hole 210 is disposed on the upper portion of the support column 100, and the joint portion is a bolt 200. Thereby, the screw hole 210 is spirally coupled to the bolt 200, and the joint portion 120 is screwed to the upper portion of the support column 100.
另本例中,該彈性緩衝元件150為一彈簧。 In another example, the elastic cushioning member 150 is a spring.
另本例中,該電路板110下方設有一導電層300;該導電層300下方組設一導電部310,該複數個彈性緩衝元件150中之一個彈性緩衝元件150組設於該導電部310下方,且該個彈性緩衝元件150可導電;該個彈性緩衝元件150為該支撐台130支撐,且該支撐台130可導電;藉此達成,該結合部120下壓該電路板110,該電路板110之導電層300下壓該導電部310,該導電部310下壓該個可導電之彈性緩衝元件150,該個可導電之彈性緩衝元件150為該可導電之支撐台130支撐。藉由,該電路板110之電流經由該導電層300、該導電部310、該個可導電之彈性緩衝元件150,最後被傳至該可導電之支撐台130。 In another example, a conductive layer 300 is disposed under the circuit board 110. A conductive portion 310 is disposed under the conductive layer 300. One of the plurality of elastic buffer elements 150 is disposed under the conductive portion 310. And the elastic buffering element 150 is electrically conductive; the elastic buffering element 150 is supported by the supporting table 130, and the supporting platform 130 is electrically conductive; thereby achieving that the bonding part 120 presses the circuit board 110, the circuit board The conductive layer 310 of the 110 is pressed down by the conductive portion 310. The conductive portion 310 presses the conductive elastic buffer member 150. The conductive elastic buffer member 150 is supported by the conductive support table 130. The current of the circuit board 110 is finally transmitted to the conductive support table 130 via the conductive layer 300, the conductive portion 310, and the conductive elastic buffer member 150.
另本例中,一伺服器,該伺服器上設有該電路板高度調整結 構,該伺服器上設有該支撐台130,該伺服器上具有一震動源140,該電路板110設於該震動源140旁,該等彈性緩衝元件150具有阻尼;藉由,該等阻尼,吸收從該震動源140直接或間接傳送至該電路板110上之外力或震動。 In this example, a server is provided with the board height adjustment knot on the server. The server is provided with the support table 130. The server has a vibration source 140. The circuit board 110 is disposed adjacent to the vibration source 140. The elastic buffer elements 150 have damping. By the damping Absorbing forces or vibrations transmitted directly or indirectly from the vibration source 140 to the circuit board 110.
另,間接傳送至該電路板110上之外力或震動,係指該震動源140與該電路板110非直接接觸,以間接方式傳送外力或震動至該電路板110上(例如:第十二至十六圖所揭示,該震動源140透過支撐台130傳送外力或震動至該電路板110上)。 In addition, the external force or vibration transmitted to the circuit board 110 indirectly means that the vibration source 140 is in non-direct contact with the circuit board 110, and indirectly transmits an external force or vibration to the circuit board 110 (for example: twelfth to As shown in the sixteenth figure, the vibration source 140 transmits an external force or vibration to the circuit board 110 through the support table 130.
另,直接傳送至該電路板110上之外力或震動,係指該震動源140與該電路板110直接接觸,該震動源140直接傳送外力或震動至該電路板110上(例如:第十七至二十一圖所揭示,該震動源直接傳送傳送外力或震動至該電路板上)。 In addition, the external force or vibration directly transmitted to the circuit board 110 means that the vibration source 140 is in direct contact with the circuit board 110, and the vibration source 140 directly transmits an external force or vibration to the circuit board 110 (for example: the seventeenth As disclosed in the twenty-first figure, the vibration source directly transmits an external force or vibration to the circuit board.
另本例中,該伺服器中之震動源140為一散熱風扇。 In another example, the vibration source 140 in the server is a cooling fan.
另本例中,該伺服器中之震動源140為一散熱風扇,且該電路板110上連接一硬碟145;藉此,降低由散熱風扇藉由該電路板110傳送外力或震動至該硬碟145上,以降低該硬碟145因外力或震動之衝擊而引致失效。 In this example, the vibration source 140 in the server is a heat dissipation fan, and a hard disk 145 is connected to the circuit board 110. Thereby, the external force or vibration transmitted by the heat dissipation fan by the circuit board 110 is reduced to the hard The dish 145 is used to reduce the failure of the hard disk 145 due to an external force or shock.
另本創作中,該硬碟145係設於該電路板110上。 In the present creation, the hard disk 145 is attached to the circuit board 110.
另本例中,該伺服器中之震動源140為一硬碟。 In another example, the vibration source 140 in the server is a hard disk.
本創作雖以較佳實施例揭露如上,然其並非用以限定本創作的範圍,任何熟習此項技藝者,在不脫離本創作之精神和範圍內,當可做些許的更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所界定。 The present invention is disclosed in the above preferred embodiments, and is not intended to limit the scope of the present invention. Anyone skilled in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of protection of this creation is defined by the scope of the patent application attached.
A10‧‧‧支撐柱 A10‧‧‧Support column
A11‧‧‧電路板 A11‧‧‧Circuit board
A12‧‧‧結合部 A12‧‧‧Combination Department
A13‧‧‧支撐台 A13‧‧‧ support table
A14‧‧‧震動源 A14‧‧‧Vibration source
H1‧‧‧電路板與支撐台之距離 H1‧‧‧The distance between the board and the support table
100‧‧‧支撐柱 100‧‧‧Support column
110‧‧‧電路板 110‧‧‧Circuit board
120‧‧‧結合部 120‧‧‧Combination Department
130‧‧‧支撐台 130‧‧‧Support table
140‧‧‧震動源 140‧‧‧Vibration source
145‧‧‧硬碟 145‧‧‧ Hard disk
150‧‧‧彈性緩衝元件 150‧‧‧elastic cushioning element
160‧‧‧伺服器 160‧‧‧Server
170‧‧‧貫穿孔 170‧‧‧through holes
200‧‧‧螺栓 200‧‧‧ bolt
210‧‧‧螺孔 210‧‧‧ screw holes
300‧‧‧導電層 300‧‧‧ Conductive layer
310‧‧‧導電部 310‧‧‧Electrical Department
H2‧‧‧電路板與支撐台之距離 H2‧‧‧The distance between the board and the support table
H3‧‧‧電路板與支撐台之距離 H3‧‧‧Distance between circuit board and support table
第一圖係為習知之電路板支撐結構之爆炸圖。 The first figure is an exploded view of a conventional circuit board support structure.
第二圖係為第一圖之組合示意圖。 The second figure is a combined schematic diagram of the first figure.
第三圖係為習知之電路板支撐結構旁具有震動源之組合示意圖。 The third figure is a combination diagram of a vibration source adjacent to the conventional circuit board support structure.
第四圖係為本創作之電路板支撐結構之爆炸圖。 The fourth picture is an exploded view of the circuit board support structure of the creation.
第五圖係為第四圖之組合示意圖。 The fifth figure is a combination diagram of the fourth figure.
第六圖係為本創作之另一種方式之電路板支撐結構之爆炸圖。 The sixth picture is an exploded view of the circuit board support structure of another way of creation.
第七圖係為第六圖之組合示意圖。 The seventh figure is a combination diagram of the sixth figure.
第八圖係為本創作之另一種方式之電路板支撐結構之爆炸圖。 The eighth figure is an exploded view of the circuit board support structure of another mode of creation.
第九圖係為第八圖之組合示意圖。 The ninth figure is a combination diagram of the eighth figure.
第十圖係為本創作之另一種方式之電路板支撐結構之爆炸圖。 The tenth figure is an exploded view of the circuit board support structure of another mode of creation.
第十一圖係為第十圖之組合示意圖。 The eleventh figure is a combination diagram of the tenth figure.
第十二圖係為本創作之伺服器內之電路板與振動源間接連接之示意圖。 The twelfth figure is a schematic diagram of the indirect connection between the circuit board and the vibration source in the server of the creation.
第十三圖係為第十二圖之電路板支撐結構與振動源間接連接之示意圖。 The thirteenth figure is a schematic diagram of the indirect connection of the support structure of the circuit board to the vibration source in the twelfth figure.
第十四圖係為第十二圖之另一種方式之電路板支撐結構與振動源間接連接之示意圖。 Figure 14 is a schematic view showing the indirect connection of the support structure of the circuit board to the vibration source in another mode of the twelfth figure.
第十五圖係為第十二圖之另一種方式之電路板支撐結構與振動源間接連接之示意圖。 The fifteenth figure is a schematic diagram of the indirect connection of the circuit board supporting structure and the vibration source of another mode of the twelfth figure.
第十六圖係為第十二圖之另一種方式之電路板支撐結構與振動源間接連接之示意圖。 Figure 16 is a schematic view showing the indirect connection of the support structure of the circuit board to the vibration source in another mode of the twelfth figure.
第十七圖係為本創作之伺服器內之電路板與振動源直接連接之示意圖。 The seventeenth figure is a schematic diagram of the direct connection of the circuit board and the vibration source in the server of the creation.
第十八圖係為第十七圖之電路板與振動源直接連接之示意圖。 The eighteenth figure is a schematic diagram of the direct connection of the circuit board of the seventeenth figure to the vibration source.
第十九圖係為第十七圖之另一種方式之電路板與振動源直接連接之示意圖。 The nineteenth figure is a schematic diagram of the circuit board directly connected to the vibration source in another mode of the seventeenth figure.
第二十圖係為第十七圖之另一種方式之電路板與振動源直接連接之示意圖。 Figure 20 is a schematic view showing the circuit board directly connected to the vibration source in another mode of the seventeenth embodiment.
第二十一圖係為第十七圖之另一種方式之電路板與振動源直接連接之示意圖。 The twenty-first figure is a schematic diagram of the circuit board directly connected to the vibration source in another mode of the seventeenth figure.
第二十二圖揭示,震動源間接藉由電路板傳送外力或震動至硬碟上。 According to the twenty-second figure, the vibration source transmits an external force or vibration to the hard disk indirectly through the circuit board.
第二十三圖揭示,震動源直接藉由電路板傳送外力或震動至硬碟上。 The twenty-third figure reveals that the vibration source directly transmits external force or vibration to the hard disk by the circuit board.
110‧‧‧電路板 110‧‧‧Circuit board
120‧‧‧結合部 120‧‧‧Combination Department
H2‧‧‧電路板與支撐台之距離 H2‧‧‧The distance between the board and the support table
H3‧‧‧電路板與支撐台之距離 H3‧‧‧Distance between circuit board and support table
Claims (23)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101217561U TWM448108U (en) | 2012-09-12 | 2012-09-12 | Circuit-board height adjusting and shock-absorbing structure and server having the circuit-board height adjusting and shock-absorbing structure |
US13/905,876 US20140070478A1 (en) | 2012-09-12 | 2013-05-30 | Banknotes withdraw and transfer unit structural improvement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101217561U TWM448108U (en) | 2012-09-12 | 2012-09-12 | Circuit-board height adjusting and shock-absorbing structure and server having the circuit-board height adjusting and shock-absorbing structure |
Publications (1)
Publication Number | Publication Date |
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TWM448108U true TWM448108U (en) | 2013-03-01 |
Family
ID=48471613
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW101217561U TWM448108U (en) | 2012-09-12 | 2012-09-12 | Circuit-board height adjusting and shock-absorbing structure and server having the circuit-board height adjusting and shock-absorbing structure |
Country Status (2)
Country | Link |
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US (1) | US20140070478A1 (en) |
TW (1) | TWM448108U (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6544067B2 (en) * | 2015-06-16 | 2019-07-17 | 沖電気工業株式会社 | Medium stacker and automatic transaction device |
JP7327112B2 (en) * | 2019-11-26 | 2023-08-16 | 沖電気工業株式会社 | Media processing equipment and automatic transaction equipment |
CN110978790B (en) * | 2019-12-24 | 2020-11-06 | 江西环境工程职业学院 | Code spraying equipment for computer manufacturing |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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GB2059391B (en) * | 1979-09-25 | 1983-06-22 | Laurel Bank Machine Co | Stacking paper sheets bank notes in dispensers |
US4980543A (en) * | 1983-01-26 | 1990-12-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Multiple denominator bank note depositor/dispenser with automatic loading to and from storage section |
DE3808669A1 (en) * | 1988-03-15 | 1989-09-28 | Nixdorf Computer Ag | DEVICE FOR DRAWING LEAVES FROM A PILE PACK |
GB9523378D0 (en) * | 1995-11-16 | 1996-01-17 | At & T Global Inf Solution | A cash dispensing apparatus |
JP2009067513A (en) * | 2007-09-12 | 2009-04-02 | Hitachi Omron Terminal Solutions Corp | Paper sheet storage device, and method and program for controlling the same |
JP5091628B2 (en) * | 2007-11-07 | 2012-12-05 | 日立オムロンターミナルソリューションズ株式会社 | Paper sheet handling equipment |
DE102010049376A1 (en) * | 2010-10-26 | 2012-04-26 | Heidelberger Druckmaschinen Ag | Apparatus and method for turning stacks of sheet material |
-
2012
- 2012-09-12 TW TW101217561U patent/TWM448108U/en not_active IP Right Cessation
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2013
- 2013-05-30 US US13/905,876 patent/US20140070478A1/en not_active Abandoned
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