TWM447595U - Light-emitting diode packaging module - Google Patents

Description

LED package module

The present invention relates to a light-emitting diode package module, and more particularly to a pattern combined light-emitting diode package module for improving light intensity and illumination range.

Since the 1960s, the advantages of low power consumption and long-lasting illumination of Light Emitting Diodes (LEDs) have gradually replaced the use of indicators or light sources for lighting or various electrical appliances in daily life. . What's more, the development of multi-color and high-brightness LEDs has been applied to large outdoor display billboards or traffic signs, indicating that they can be applied in a wide range of fields.

In recent years, as the luminous efficiency of the light-emitting diode has been greatly improved, the light-emitting diode has been gradually used as a standard lighting device instead of the incandescent lamp. However, the conventional light-emitting diode is not like an incandescent lamp, and has a 360-degree light-emitting angle, and the light-emitting intensity of the light-emitting diode gradually decreases with the light-emitting angle. In order to overcome the problem that the light intensity varies with the light exit angle, the light-emitting diodes commonly used in displays generally adjust the light of the light-emitting diodes uniformly toward the light-emitting surface by a technique such as a reflective layer. On the other hand, when the light-emitting diode is used in a lighting device, it is desirable that the light-emitting angle can be expanded as much as possible to increase the illumination range. However, as described above, the light-emitting intensity of the conventional light-emitting diode has a problem of decreasing the light-emitting angle. Therefore, many techniques have been attempted to improve the illumination range of light-emitting diodes by arranging a plurality of light-emitting diode chips. Wai. However, due to the limitation of the wire connection between the LEDs, the encapsulating resin used usually has to be packaged once to avoid the encapsulation resin from damaging the wires between the LEDs. . However, the light-emitting intensity and the light-emitting angle of the light-emitting diode are also related to the structure of the encapsulating resin. When the structure of the encapsulating resin is flat, it is not conducive to improving the illumination range of the light-emitting diode, thereby developing a light-emitting diode package. The module, which can effectively improve the illumination range of the light-emitting diode, is necessary.

The main purpose of the present invention is to provide a light-emitting diode package module in which each light-emitting diode chip is separately packaged, thereby optimizing the luminous efficiency and illumination range of the light-emitting diode package module.

In order to achieve the above object, the present invention provides a light emitting diode package module comprising: a circuit carrier board; a plurality of light emitting diode chips disposed on the circuit carrier board; and a plurality of package resins, The LEDs are disposed on the LED chips, and each of the LED chips is individually packaged on the circuit carrier by each package resin.

In the above-mentioned light-emitting diode package module, the circuit carrier can include an insulating layer and a circuit substrate, wherein the material of the circuit substrate is not particularly limited, for example, one of the creations In the aspect, the material is a metal plate, a ceramic plate or a substrate; likewise, the material of the insulating layer is not particularly limited, as long as the insulation effect can be achieved, for example, in the present In one aspect of creation, it is selected from diamond-like carbon, At least one of the group of alumina, ceramic, and diamond-containing epoxy.

As described above, the conventional light-emitting diode package module often has to be used for one-time packaging of all the light-emitting diode chips by connecting the wires between the light-emitting diode chips included in the light-emitting diode package. The illumination range of the polar package module is limited by the fact that the package resin structure is too flat. However, in the light-emitting diode package module of the present invention, since the light-emitting diode chips are connected to each other by a wire, and the wire is embedded in the circuit carrier, the light-emitting diode of the present invention is The body package module can separately package each of the light emitting diode chips on the circuit carrier board, thereby optimizing the illumination range of the light emitting diode package module.

In the above-mentioned light-emitting diode package module, the types and functions of the light-emitting diode chips are not particularly limited. For example, the emission wavelength may be between 200 nm and 800 nm. Light. Furthermore, the light emitted by the light-emitting diode chips may also be in the same or different wavelength ranges. In one embodiment of the present invention, the light-emitting diode chips emit at least one wavelength selected from the group consisting of blue light having a wavelength between 450 nm and 470 nm, and wavelengths ranging from 550 nm to 570 nm. Green light, red light with a wavelength between 650 nm and 700 nm, and a group of yellow light with a wavelength between 580 nm and 590 nm.

In the above-mentioned light-emitting diode package module, in order to optimize the illumination range of the light-emitting diode package module, in one aspect of the present invention, the light-emitting diode chips can be arranged in a ring. a pattern in which the ring pattern can be arranged as a single layer concentric from 3 to 20 LED chips It consists of a ring or a multi-layer concentric ring, but this creation should not be limited to this. For example, in one embodiment of the present invention, the circular pattern can be composed of eight light-emitting diode wafers arranged in two concentric rings, wherein a light-emitting diode chip is disposed at the center. And the other seven LED chips are arranged in a ring pattern along the periphery thereof. In another embodiment of the present invention, the circular pattern may be composed of six LED chips and arranged in two concentric rings, wherein a light-emitting diode wafer is disposed at the center, and The other five light-emitting diode wafers are arranged in a ring pattern along the periphery thereof. In addition, in another aspect of the present invention, the annular pattern may also be formed by arranging the light-emitting diode wafers at the same or different pitches, for example, in one embodiment of the present creation. The inner concentric ring of the annular pattern is formed by arranging the light emitting diode wafers at equal intervals, and the outer concentric rings are arranged by arranging the light emitting diode wafers at different pitches; or, in the present invention In one embodiment, the inner concentric ring and the outer concentric ring of the annular pattern are formed by arranging the LED chips at different pitches. However, it should be understood that the arrangement of the various LED chips and the same or different spacing can be used as long as they can optimize the illumination range and luminous efficiency of the LED package module. Not limited to this.

In the above-mentioned light-emitting diode package module, the material of the package resin is not particularly limited as long as it can completely encapsulate the light-emitting diode wafers, for example, a heat curing resin, A light curing resin, or a combination thereof. Specifically, in one embodiment of the present invention, the encapsulating resin is an epoxy resin; in another embodiment of the present invention, A silicone resin is selected as the encapsulating resin; in another embodiment of the present invention, an acrylic resin is selected as the encapsulating resin. Furthermore, the encapsulating resin may further comprise a phosphor powder, wherein the phosphor powder may be at least one selected from the group consisting of red phosphor powder, green phosphor powder, blue phosphor powder, yellow phosphor powder, or Combining the groups, so that the LED package module can emit various kinds of phosphor powder contained in the encapsulating resin by emitting light emitted by the LED chip, thereby making the LED The body package module can emit a mixed color light. For example, in one embodiment of the present invention, the light emitting diode package module emits a white light for illumination purposes, or the creation can be arbitrarily changed as needed. The present invention is not limited to the combination of a light-emitting diode wafer and a phosphor powder in each of the encapsulating resins to produce light of the same or different wavelengths. However, it should be understood that various methods of setting the phosphor powder in the encapsulating resin can be used, for example, mixing the phosphor powder with the encapsulating resin and then packaging it on the LED chip; The light powder and the encapsulating resin are stacked and stacked, and this creation is not limited to this.

Accordingly, the light-emitting diode package module of the present invention can optimize the illumination range and the luminous efficiency of the light-emitting diode package module, for example, in one aspect of the present invention, The light-emitting diode package module has a brightness intensity of 40% to 60% when the light angle is 150 degrees. In another aspect of the creation, the light-emitting diode package module is at an optical angle of 180. The brightness intensity is about 15% to 25%, which is obviously superior to the illumination range and light output intensity of the conventional LED package.

As described above, since the conventional LED package module is limited to the wires connected between the included LED chips, all the LED chips must be packaged at one time, so that The illumination range of the LED package module is often limited. Therefore, the main purpose of the present invention is to provide a light emitting diode package module that optimizes the light emitting efficiency and illumination range of the light emitting diode package module by separately packaging each light emitting diode chip. . Hereinafter, the light-emitting diode package module of the present invention will be described in detail by way of embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of a light-emitting diode package module 1 according to the first embodiment of the present invention, which includes eight LED chips 12 disposed on a circuit carrier 11 , and the light-emitting diodes The body wafer 12 is arranged on the circuit carrier 11 as a circular pattern having two concentric rings and is independently packaged on the circuit carrier 11 by eight encapsulating resins 13, wherein the LEDs are respectively mounted on the circuit carrier 11 The wafers 12 are connected to each other by a wire 14 embedded in the circuit carrier 11. In the first embodiment, the light emitting diode chips 12 are blue light having an emission wavelength of 450 nm to 470 nm; the encapsulating resin 13 is a heat curing epoxy resin and contains a yellow fluorescent powder. According to this, the LED package module 1 prepared in this embodiment can emit a white light for use as an illumination.

Please refer to FIG. 2A and FIG. 2B , which show the measurement results of the luminous intensity and the optical angle of the light-emitting diode package module 1 of the first embodiment at different light-emitting angle positions. FIG. 2A is a perspective vector diagram of the LED package module 1 of the first embodiment, showing the LED package module 1 of the first embodiment. The light exiting angle is 0°, the light exiting angle is 10°, and the light exiting angle is 90°. The three positions have stable brightness intensity and light angle. Please refer to FIG. 2B together with the light emitting diode package of Embodiment 1. The two-dimensional coordinate map of the group 1 angle vector diagram. As shown in FIG. 2B, the LED package module 1 has substantially the same performance at the above three light exit angles, and further, the light intensity is compared at different light angles (light intensity compared to the light angle of 0°). The measurement of the light intensity measured at a light angle of 100° is about 82%, and the light intensity measured at a light angle of 180° is about 20%; in addition, at different light intensities The measurement of the optical angle, wherein when the luminous intensity is 50%, the optical angle can reach about 150°.

Next, in order to compare the difference between the illumination range and the light intensity of the light-emitting diode package module 1 of the first embodiment and the conventional light-emitting diode package module, the comparative example of the present invention has the same configuration in the conventional technology package. Light-emitting diode chip. Please refer to FIG. 3 , which is a schematic structural diagram of the LED package module 2 of the comparative example. As described above, the comparative example is substantially the same as that of the first embodiment. The eight LED chips 22 of the comparative example are also arranged on the circuit carrier 21 as a ring pattern having two concentric rings (ie, and the embodiment 1). The LED array 22 is connected to each other by a wire 24 embedded in the circuit carrier 21, and the LED chip 22 also emits a wavelength of 450 nm. The blue to 470 nm blue light, the encapsulating resin 23 used is also a thermosetting epoxy resin containing yellow fluorescent powder. The difference from the first embodiment is that the light-emitting diode chips 22 of this comparative example are packaged together with the package resin 23 on the circuit carrier board 21. Accordingly, in this comparative example, the LED package module 2 packaged only in different manners can be prepared.

Please refer to FIG. 4A and FIG. 4B , which show the measurement results of the luminous intensity and the optical angle of the light-emitting diode package module 2 of the comparative example at different light-emitting angle positions. As shown in FIG. 4A , it is a corner vector diagram of the LED package module 2 of the comparative example, and shows the light-emitting diode package module 2 of the comparative example at an exit angle of 0°, an exit angle of 10°, and an exit angle of 90. °, the three positions have a stable luminous intensity and optical angle; please refer to FIG. 4B together, which is a two-dimensional coordinate diagram of the angular vector diagram of the LED package module of the comparative example. As shown in FIG. 4B, the LED package module 2 has substantially the same performance at the above three light exit angles, and further, the light intensity is compared at different light angles (light intensity compared to the light angle of 0°). The measurement of the light intensity measured at a light angle of 100° is about 62%, and the light intensity measured at a light angle of 180° is about 6%; in addition, at different light intensities The measurement of the optical angle, wherein when the luminous intensity is 50%, the optical angle can reach about 125°.

Table 1 is a comparison of the luminous intensity and the optical angle of the above-described Example 1 and Comparative Example. By comparison, in the same optical angle position (for example, the optical angle is 100° or 180°), the luminous intensity of the LED package module 1 of the first embodiment is greater than that of the comparative example. The light intensity of the light-emitting diode package module 1 of the present invention example 1 is greater than that of the comparative example when the brightness intensity of the module 2 is reached (for example, the light intensity is 50%). The optical angle of the polar package module 2. Moreover, please refer to FIG. 2B again. When the optical angle is 180°, the LED package of Embodiment 1 still has a brightness intensity of about 20%, and the LED of Embodiment 1 is obviously The package angle of the body package module can reach a light angle of 200° or more, which makes it have a wider illumination range.

Therefore, by separately packaging each of the light-emitting diode chips, the LED package module 1 of the present invention has stable brightness intensity and light angle at different light exit angles, compared with the conventional light-emitting diodes. The polar package module 2 obviously has a wider light angle and a better brightness.

In addition, the present invention further provides a light-emitting diode package module prepared by arranging a plurality of light-emitting diode chips into different ring patterns. Please refer to FIG. 5A to FIG. 5B , which are schematic diagrams of the structure of the LED package of the present inventions 2 to 4 .

Please refer to FIG. 5A , which is a schematic structural diagram of the LED package module 3 of the second embodiment. The second embodiment of the present invention is substantially the same as the first embodiment except that the light-emitting diode chips (not shown) are arranged in a ring pattern having two concentric rings, wherein the inner layer concentric rings are five. The light-emitting diode chips are arranged at equal intervals and emit red light having a wavelength of 650 nm to 700 nm; the outer concentric rings are arranged at equal intervals of 7 light-emitting diode chips, and the emission wavelength is 550 nm to 570 nm green light. In addition, the LED chips (not shown) of Embodiment 2 are individually packaged on the circuit carrier 31 by a plurality of encapsulating resins 33, wherein the encapsulating resin 33 used is photocured. An acrylic resin, and the encapsulating resins 33 comprise a blue phosphor. Accordingly, the LED package module 3 of the second embodiment can emit a white light for illumination.

Please refer to FIG. 5B , which is a schematic structural diagram of the LED package module 4 of the third embodiment. The present embodiment 3 is substantially the same as the first embodiment except that the light-emitting diode chips (not shown) are arranged in a ring pattern having two concentric rings, wherein the inner layer concentric rings are six The light-emitting diode wafers are arranged at equal intervals and emit blue light having a wavelength of 450 nm to 470 nm; the outer concentric rings are arranged at different pitches with 9 light-emitting diode chips, and the emission wavelength is 580. Nano to 590 nm yellow light. In addition, the LED chips (not shown) of Embodiment 3 are individually packaged on the circuit carrier 41 by a plurality of encapsulation resins 43. However, the encapsulation resin 43 used in this embodiment 3 is It is a heat-curing silicone and does not have a phosphor. Accordingly, the fabricated LED package module 4 can be provided as a multi-color optical module.

Please refer to FIG. 5C , which is a schematic structural diagram of the LED package module 5 of the fourth embodiment. The present embodiment 4 is substantially the same as the first embodiment except that the light-emitting diode chips (not shown) are arranged on the circuit carrier 51 in a ring pattern of three layers of concentric rings, wherein the innermost The layer concentric ring system is provided with one light emitting diode chip at the center of the circular pattern, which emits red light having a wavelength of 650 nm to 700 nm; the second layer of concentric ring is made of 6 light emitting diode chips Arranged at different pitches with an emission wavelength of 450 The blue light of nanometer to 470 nm; and the outermost concentric ring system are arranged at different pitches by 9 light-emitting diode chips, and emit yellow light having a wavelength of 580 nm to 590 nm. Further, the encapsulating resin 53 used in the embodiment 4 is also a photocurable acrylic resin, and the encapsulating resin 53 of this embodiment 4 does not contain the phosphor powder. Accordingly, the fabricated LED package module 5 can be provided as a multi-color optical module.

In summary, the LED package of the present invention can directly package each of the LED chips, so that the LED package can obtain the best light angle and brightness. Although the above-mentioned creation does not have an embodiment in which different phosphors are mixed at the same time, those skilled in the art can make various modifications and different configurations, and the scope of the patent application attached is intended to cover these modifications and differences. Configuration. Therefore, when the details of the presently considered most practical and preferred embodiments have been disclosed above, those of ordinary skill in the art to which the present invention pertains may be based on the concepts and principles set forth herein. Modifications are made without limitation to a variety of dimensions, materials, shapes, shapes, functions, methods of operation, assembly, and use.

The above-described embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1,2,3,4,5‧‧‧Light Emitting Diode Module

11,21,31,41,51‧‧‧circuit carrier board

12,22‧‧‧Light Emitter Wafer

13,23,33,43,53‧‧‧Encapsulation resin

14,24‧‧‧Wire

FIG. 1 is a schematic structural view of a light emitting diode package module according to an embodiment of the present invention.

2A and 2B show the measurement results of the luminous intensity and the optical angle of the LED package of the present embodiment.

FIG. 3 is a schematic structural view of a light emitting diode package module according to a comparative example of the present invention.

4A and 4B show the measurement results of the luminous intensity and the optical angle of the light-emitting diode package module of the comparative example.

5A to 5C are schematic structural views of a light emitting diode package module according to the present embodiment.

1‧‧‧Light Emitting Diode Module

11‧‧‧Circuit carrier board

12‧‧‧Light Emitter Wafer

13‧‧‧Encapsulation resin

14‧‧‧Wire

Claims (18)

A light emitting diode package module includes: a circuit carrier board; a plurality of light emitting diode chips disposed on the circuit carrier board; and a plurality of package resins disposed on the light emitting diodes On the wafer, each of the light-emitting diode chips is individually packaged on the circuit carrier board by each package resin. The illuminating diode package module of claim 1, wherein the circuit carrier comprises an insulating layer and a circuit substrate, the material of the insulating layer is selected from the group consisting of diamond-like carbon, alumina, ceramics. And at least one of the groups of diamond-containing epoxy resins. The LED package module of claim 2, wherein the circuit substrate is a metal plate, a ceramic plate or a substrate. The light-emitting diode package of claim 1, wherein the light-emitting diode chips are connected to each other by a wire, and the wire is embedded in the circuit carrier. The light-emitting diode package module of claim 1, wherein the light-emitting diode chips have light having an emission wavelength of from 200 nm to 800 nm. The light-emitting diode package module of claim 1, wherein the light emitted by the light-emitting diode chips is of the same or different wavelength range. The light-emitting diode package module of claim 1, wherein the light-emitting diode chips are arranged in a ring pattern. The light-emitting diode package module of claim 7, wherein the annular pattern is a single-layer concentric ring or a multi-layer concentric ring. The light-emitting diode package module of claim 7, wherein the annular pattern comprises three to twenty light-emitting diode wafers arranged in an array. The light-emitting diode package module of claim 7, wherein the annular pattern is composed of six light-emitting diode chips, and arranged in two layers of concentric rings. The light-emitting diode package module of claim 7, wherein the circular pattern is composed of eight light-emitting diode chips, and arranged in two layers of concentric rings. The light-emitting diode package module of claim 7, wherein the annular pattern is formed by arranging the light-emitting diode wafers at the same or different pitches. The light-emitting diode package module of claim 1, wherein the package resin is a thermosetting resin, a photocurable resin, or a combination thereof. The light-emitting diode package module according to claim 13, wherein the package resin is epoxy resin, silicone rubber or acrylic resin. The light-emitting diode package module of claim 13, wherein the package resin further comprises a phosphor powder. The light-emitting diode package module of claim 15, wherein the fluorescent powder is at least one selected from the group consisting of red fluorescent powder, green fluorescent powder, blue fluorescent powder, yellow fluorescent powder, Or a group of combinations thereof. The light-emitting diode package module according to claim 1, wherein the light-emitting diode package module has a light intensity of 40% to 60% at an optical angle of 150 degrees. The light-emitting diode package module of claim 1, wherein the light-emitting diode package module has a light intensity of 180% at a light angle of 15% to 25%.