TWM445269U - LED lead frame structure - Google Patents

Abstract

A LED lead frame structure is disclosed, in which the LED lead frame structure includes a metal base and insulating casings. The metal base has a plurality of lead areas, and two holes are formed on two opposing sides of each lead area. The insulating casings are formed on the lead areas respectively.

Description

Light-emitting diode lead frame structure

The present invention relates to a leadframe structure, and more particularly to a light-emitting diode leadframe structure.

In recent years, due to the development of industrial and commercial development and social progress, the products provided are mainly aimed at convenience, reliability, and economic benefits. Therefore, the products currently being developed are more advanced than before and can contribute to society.

Light-Emitting Diode (LED) [1] is a semiconductor electronic component capable of emitting light. This kind of electronic component appeared as early as 1962. In the early days, it only emitted low-light red light. Later, it developed other versions of monochromatic light. The light that has been emitted so far has spread all over visible light, infrared light and ultraviolet light, and the luminosity has increased to equivalent. The luminosity. The use is also used as an indicator light, a display panel, etc. at the beginning; as the white light emitting diode appears, it is gradually developed to be used as illumination.

The LED can only be turned on in one direction (energized), called forward bias (forward bias). When current flows, the electron and the hole overlap in it to emit monochromatic light. This is called electroluminescence. The wavelength and color of the light are related to the type of semiconductor material used and the elemental impurities that are intentionally infiltrated. It has the advantages of high efficiency, long life, not easy to break, fast response, high reliability and other traditional light sources.

However, in the manufacturing process of the conventional LED lead frame, as shown in Fig. 1, when the finished product is unloaded, the colloid 110 is liable to have a crack 112 (i.e., at a diagonal line). This has caused a drop in yield and difficulty in increasing production capacity.

It can be seen that the above existing manufacturing methods obviously have inconveniences and defects, and need to be further improved. In order to solve the above problems, the relevant fields have not exhausted their efforts to seek solutions, but the methods that have not been applied for a long time have been developed. Therefore, how to prevent the occurrence of colloidal rupture is one of the current important research and development topics, and it has become an urgent need for improvement in related fields.

Therefore, one aspect of the present invention is to provide a light-emitting diode leadframe structure to prevent colloid rupture.

According to an embodiment of the invention, a light-emitting diode lead frame structure comprises a metal substrate and a plurality of insulating colloids. The metal substrate has a plurality of wire regions, and two opposite holes are formed on opposite sides of each wire region. A plurality of insulating colloids are formed on the wire regions.

In the structure of the light-emitting diode lead frame, the above-mentioned insulating colloid is a thermoplastic colloid or a thermosetting colloid.

In the structure of the light-emitting diode lead frame, the above-mentioned insulating rubber system is formed on each of the wire regions by injection molding.

In the light-emitting diode lead frame structure, two opposite first sides of each of the wire regions form two stealing holes, and two opposite sides of each wire region form two openings, each wire The length of the first side of the region is greater than the length of the second side.

In the structure of the light-emitting diode lead frame, each of the above-mentioned stealing holes is a long-shaped stealing hole, and the length of the long-shaped stealing hole is greater than or equal to the length of the first side of each wire area.

In summary, the technical solution of the present invention has obvious advantages and beneficial effects compared with the prior art. With the above technical solution, considerable technological progress can be achieved, and the industrial use value is widely used, which has at least the following advantages: 1. When punching the wire region, the hole is cut from the opposite sides of the wire region to both sides. Pushing to prevent the insulation colloid from rupturing, and naturally detaching each wire area from the metal substrate to obtain a plurality of finished products (ie, light-emitting diode lead frames); and 2. increasing yield and increasing productivity.

The above description will be described in detail in the following embodiments, and further explanation of the technical solutions of the present invention will be provided.

In order to make the description of the present invention more complete and complete, reference is made to the accompanying drawings and the accompanying drawings. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessarily limiting the present invention.

In the scope of the embodiments and patent applications, unless the context specifically dictates the articles, "a" and "the" may mean a single or plural.

As used herein, "about," "about," or "substantially" is used to modify the amount of any slight change, but such minor changes do not alter the nature. In the embodiment, unless otherwise stated, the error range represented by "about", "about" or "substantially" is generally allowed to be within 20%, preferably 10%. Within, and better yet Within five percent.

The technical aspect of the present invention is a method for manufacturing a light-emitting diode lead frame, which can be applied in industrial manufacturing or widely used in related technical aspects. It is worth mentioning that the manufacturing method of the technical aspect can prevent the colloid from rupturing. Specific embodiments of the manufacturing method will be described below with reference to Figs. 2 to 4 .

2 is a flow chart of a method 200 of fabricating a light-emitting diode lead frame in accordance with an embodiment of the present invention. As shown in FIG. 2, the manufacturing method 200 includes steps 210-240 (it should be understood that the steps mentioned in the embodiment can be adjusted according to actual needs, except for the order in which the sequence is specifically described. It can even be executed simultaneously or partially).

First, in step 210, a metal substrate is provided; in step 220, a plurality of wire regions are formed on the metal substrate, and two stealing holes are formed on opposite sides of each wire region; and in step 230, in each wire region Forming an insulating colloid thereon; in step 240, when punching each wire region, pushing from the opposite sides of each wire region to the two stealing holes to prevent the insulating colloid from being broken, and each wire region is self-metal The substrate is detached to obtain a plurality of finished products (ie, a light-emitting diode lead frame).

In order to further illustrate the above steps 210-230, please refer to FIG. 3, which is a schematic plan view of a light-emitting diode lead frame structure 300 prior to blanking according to an embodiment of the present invention. As shown in FIG. 3, the light emitting diode leadframe structure 300 includes a metal substrate 310 and a plurality of insulating colloids 320. Structurally, the metal substrate 310 has a plurality of wire regions 312, and opposite sides of each of the wire regions 312 form two stealing holes 330. A plurality of insulating colloids 320 are formed on the wire regions 312.

Specifically, two opposite sides 313 of the wire region 312 form two stealing holes 330, and two opposite sides 314 of each of the wire regions 312 form two openings 340, wherein the length of the first side 313 The length is greater than the length of the second side 314.

In FIG. 3, each of the stealing holes 330 is a long strip-shaped hole, and the length of the long-shaped stealing hole is greater than or equal to the length of the first side of each wire region. Thereby, during the blanking, the long-shaped stealing hole can be sufficiently spatially deformed to prevent the insulating colloid 320 from being broken.

In practice, the insulating colloid 320 is formed on each of the wire regions 312 by injection molding. In one embodiment, the insulating colloid 320 may be a thermoplastic colloid, and the thermoplastic colloid may be repeatedly cured by heating and melting. For example, the thermoplastic colloid may be, for example, polyethylene (PE), polypropylene (PP), polystyrene (PS), ABS resin, polyvinyl chloride (PVC), acrylic resin, polycarbonate (PC), A fluororesin, or other suitable material, or a derivative thereof, or a combination thereof.

Alternatively, in another embodiment, the insulating colloid 320 may be a thermosetting colloid, and the thermosetting colloid becomes a solidified state after being heated to a certain temperature, and the state cannot be changed even if heating is continued. For example, the thermosetting colloid can be, for example, a phenol formaldehyde resin, a urea resin, an epoxy resin, a blush, a melamine, or other suitable material, or a derivative thereof, or a combination thereof.

On the other hand, in order to further illustrate the above step 240, please refer to FIG. 4, which is a plan view of a light-emitting diode lead frame structure 300 after blanking according to an embodiment of the present invention. As shown in FIG. 4, when the wire area (shown in FIG. 3) is punched, the opposite sides 313 of the wire area are pushed toward the two stealing holes 330, by stealing the hole 330. The force is deformed to prevent the insulating colloid 320 from being broken, thereby increasing the yield and increasing the productivity. Moreover, the wire region, together with the non-ruptured insulating colloid, is detached from the metal substrate 310, and can serve as a plurality of light-emitting diode lead frames. Light-emitting diode lead frames can be used to carry light-emitting diodes and make electrical connections, which are well known to those skilled in the art and are beyond the scope of the present invention and will not be described in detail herein.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any one skilled in the art can make various changes and retouchings without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

110‧‧‧colloid

112‧‧‧breaking

200‧‧‧Manufacture method

210‧‧‧Steps

220‧‧‧Steps

230‧‧‧Steps

240‧‧‧ steps

300‧‧‧Lighting diode lead frame structure

310‧‧‧Metal substrate

312‧‧‧Wire area

313‧‧‧ first side

314‧‧‧ second side

320‧‧‧Insulating colloid

330‧‧‧Stealing holes

340‧‧‧Opening

The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. The description of the drawings is as follows: Figure 1 shows the colloidal rupture of a conventional LED lead frame; A flow chart of a method for manufacturing a light-emitting diode lead frame according to an embodiment of the present invention; and FIG. 3 is a plan view of a light-emitting diode lead frame structure before blanking according to an embodiment of the present invention; and The figure is a schematic plan view of a light-emitting diode lead frame structure after blanking according to another embodiment of the present invention.

300‧‧‧Lighting diode lead frame structure

310‧‧‧Metal substrate

312‧‧‧Wire area

313‧‧‧ first side

314‧‧‧ second side

320‧‧‧Insulating colloid

330‧‧‧Stealing holes

340‧‧‧Opening

Claims (5)

A light-emitting diode lead frame structure comprises: a metal substrate having a plurality of wire regions, and two opposite holes are formed on opposite sides of each wire region; and a plurality of insulating gels are formed on the wire regions. The light-emitting diode lead frame structure of claim 1, wherein the insulating colloid is a thermoplastic colloid or a thermosetting colloid. The light-emitting diode lead frame structure of claim 1, wherein the insulating glue system is formed on each of the wire regions in an injection molding manner. The light-emitting diode lead frame structure of claim 1, wherein two opposite first sides of each of the wire regions form the two stealing holes, and two opposite second sides of each of the wire regions are formed. Two openings, the length of the first side of each of the wire regions being greater than the length of the second side. The light-emitting diode lead frame structure according to claim 4, wherein each of the stealing holes is a long-shaped stealing hole, and the length of the long-shaped stealing hole is greater than or equal to each of the wire areas. The length of the first side.