TWM445244U - Inductance element - Google Patents

Description

Inductive component

The present invention relates to a passive electronic component, and in particular to an inductor.

Some inductive components today include a magnetic core and a plurality of windings that are wound onto the magnetic core, wherein the windings are mostly manually wound on the magnetic core to form a coil loop. (coil circuit). However, this manual method is not only time consuming, but also it is easy to make a wrong winding, for example, the number of turns of the winding is insufficient or excessive, or the winding direction of the winding is wrong, thereby producing a defective inductance element. In addition, for a small inductive component, since a small inductive component has a small-volume magnetic core, it is difficult to manually wind a plurality of windings on the magnetic core.

The present invention provides an inductive component in which a coil loop is formed by connecting a plurality of connection pads to a plurality of wires.

The present invention proposes an inductive component comprising a plurality of first wires, a plurality of second wires, a magnetic sensing member and a first molding member. The connection pads are located around the magnetic sensitive component, wherein the connection pads and the magnetic sensitive component are located between the first wires and the second wires. Each of the first wires connects the two connection pads across the magnetic sensitive component, and each of the second wires connects the two connection pads across the magnetic sensitive component to form a coil loop wound around the magnetic sensitive component. The first mold cover covers the magnetic sensing member, the first wires, and the connection pads. each The connection pads have a plane that is not covered by the first mold member and that connects the second wires.

Based on the above, in the inventive inductive component, the coil circuit is formed by connecting the connection pads, the first wires and the second wires, wherein the coil circuit is wound around the magnetic sensing component to enable the inductive component to generate an induced electromotive force It is operated by (induced electromotive force).

In order to make the above features and advantages of the present invention more comprehensible, the following detailed description of the embodiments and the accompanying drawings will be described below.

1A is a top plan view of an inductor element according to an embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line I-I of FIG. 1A. Referring to FIG. 1A and FIG. 1B , the inductance component 100 includes a magnetic sensing component 110 , a plurality of connection pads 120 , a plurality of first wires 130 a and a plurality of second wires 130 b . The connection pads 120 connect the first wires 130a and the second wires 130b to form a coil loop wound around the magnetic sensor 110. When a current flows into the coil circuit described above, the inductor element 100 generates an induced electromotive force to operate.

The magnetic sensing component 110 can be an annular block (as shown in FIG. 1A) or an elongated block, and the magnetic sensing component 110 is made of a ferromagnetic material or a ferrimagnetic material. . When the magnetic sensing member 110 is made of a ferromagnetic material, the magnetic sensing member 110 may be a metal block, and the material thereof is, for example, a ferromagnetic metal such as iron, cobalt, nickel or nickel-iron alloy. When the magnetic sensing member 110 is made of a ferrite material, the magnetic sensing member 110 may be a ceramic block containing, for example, a ferromagnetic material such as iron oxide.

These connection pads 120 are located around the magnetic sensitive component 110. In detail, in the embodiment shown in FIG. 1A and FIG. 1B, the magnetic sensing component 110 is an annular block, so the magnetic sensing component 110 will surround a ring opening H1, and some of the connecting pads 120 are located in the ring mouth H1. The other connecting pads 120 are located outside the ring mouth H1. In other words, some of the connection pads 120 are located on the inner side of the magnetic sensitive component 110, while other connection pads 120 are located on the outer side of the magnetic sensitive component 110. Moreover, the connection pads 120 can be arranged in a two concentric circles along the magnetic sensing member 110, as shown in FIG. 1A.

The first wires 130a are disposed above the magnetic sensing device 110, and the second wires 130b are disposed under the magnetic sensing device 110. The first conductive wires 130a and the second conductive wires 130b are each a metal film layer. The formation method may include deposition, photolithography, and etching, wherein the deposition may be electroplating, electroless plating, or sputtering.

The connecting pads 120 and the sensing component 110 are located between the first wires 130a and the second wires 130b, and the at least one connecting pad 120 is connected between one of the first wires 130a and one of the second wires 130b. Each of the first wires 130a connects the two connection pads 120 across the magnetic sensing member 110, and each of the second wires 130b connects the two connection pads 120 across the magnetic sensing member 110 to form a coil loop.

Taking the embodiment shown in FIG. 1A and FIG. 1B as an example, each of the first wires 130a will connect one of the connection pads 120 located in the ring mouth H1 across the magnetic sensing member 110 and one of the positions is outside the ring mouth H1. Connection pad 120, and Each of the second wires 130b may connect one of the connection pads 120 located in the ring mouth H1 and one of the connection pads 120 located outside the ring mouth H1 across the magnetic sensing member 110, thereby forming a winding around the magnetic sensing member 110. The coil loop.

In addition, the inductive component 100 further includes a first molding member 140a covering the magnetic sensing member 110, the first conductive wires 130a and the connecting pads 120, and the first molding member 140a can protect the magnetic sensing member 110 and the first conductive line 130a. And the connection pad 120 is protected from being damaged by foreign objects. In addition, the first mold member 140a has electrical insulation and is not electrically connected to the first wire 130a, so current is not transferred between the first wires 130a via the first mold member 140a.

Although the first mold member 140a covers the connection pads 120, the first mold member 140a does not completely cover all surfaces of the connection pads 120. In detail, each of the connection pads 120 has a flat surface 122, and as seen from FIG. 1B, the flat surface 122 is a lower surface of the connection pad 120. The first mold member 140a covers the surface of the connection pad 120, for example, covering the upper surface and the side surfaee of the connection pad 120, but the first mold member 140a does not cover the bottom surface of the connection pad 120, that is, there is no Cover plane 122. Further, the second wire 130b is connected to the plane 122 of the connection pad 120.

Additionally, the planes 122 are flush with each other and are all in the same plane, so the connection pads 120 will be coplanar with each other. Taking FIG. 1B as an example, these connection pads 120 are all at the same level. Moreover, in the embodiment of FIG. 1B, the planes 122 may be more aligned with the bottom surface 142a of the first mold member 140a.

It should be noted that the above-mentioned so-called tangent and coplanar means substantially tangential and substantially coplanar. In detail, without deliberately making the connection pads 120 not coplanar, the plane 122 and the bottom surface 142a are not aligned, the connection pads 120 are inevitably affected by the inevitable errors in the normal manufacturing process, resulting in these planes 122. Some of the connection pads 120 may be somewhat non-planar, the plane 122 and the bottom surface 142a may be slightly misaligned, and the so-called substantially aligned and substantially coplanar covers such unintentional Not aligned and not coplanar. In addition, the coplanarity and aligning referred to below also cover such unintentional inconsistencies and non-coplanarities.

It is worth mentioning that when the magnetic sensing component 110 is a ceramic block, the magnetic sensing component 110 can be electrically insulated, and the connection pad 120, the first wire 130a and the second wire 130b can contact the magnetic sensing component 110, and It is electrically connected to the magnetic sensitive component 110. As such, when the current is transmitted through the connection pad 120, the first wire 130a, and the second wire 130b, the magnetic sensing component 110 is not electrically connected to the first wire 130a and the second wire 130b, that is, the first wire 130a and the second wire. There is no short circuit between the two of the 130b and the magnetic sensitive component 110. However, when the magnetic sensing component 110 is a metal block, the connection pad 120, the first wire 130a and the second wire 130b do not contact the magnetic sensing component 110 to avoid a short circuit.

In this embodiment, the inductive component 100 can further include a first insulating layer 160 and an insulating bonding layer 150 connecting the magnetic sensing component 110. The insulating bonding layer 150 is located between the magnetic sensing component 110 and the second conductive wires 130b, and can separate the magnetic sensing component 110 from the second conductive wire 130b so that the magnetic sensing component 110 does not contact the second conductive wire 130b. Similarly, the first insulating layer 160 is located at these first leads The first wire 130a is separated from the magnetic sensitive component 110 between the wire 130a and the magnetic sensitive component 110, so that the magnetic sensitive component 110 does not contact the first conductive wire 130a.

It can be seen that even if the magnetic sensing component 110 is a metal block, the insulating bonding layer 150 and the first insulating layer 160 can separate the magnetic sensing component 110, the first conductive line 130a and the second conductive line 130b from each other, so that the magnetic sensing component 110, The first wire 130a and the second wire 130b are not in electrical contact with each other. As such, the insulating bonding layer 150 and the first insulating layer 160 can help the magnetic sensitive component 110, the first conductive line 130a, and the second conductive line 130b to be electrically insulated from each other.

In the present embodiment, the first wires 130a cover the first insulating layer 160. However, each of the first wires 130a partially covers the first insulating layer 160 instead of covering the first insulating layer 160 in a comprehensive manner. Therefore, after the first molding 140a is removed, the first wires 130a and a portion of the first insulating layer 160 are exposed.

In addition, since the first conductive line 130a and the second conductive line 130b are metal film layers formed by deposition such as electroplating, electroless plating, or sputtering, the first conductive line 130a conformally covers the first insulating layer 160, The second wire 130b conformally adheres to the plane 122 and the bottom surface 142a. Because the plane 122 is aligned with the bottom surface 142a, the current path length of each of the first wires 130a is greater than the current path length of each of the second wires 130b, wherein the current path length of the first wire 130a is approximately equal to the length L11 plus two times. The sum of the lengths L12, and the current path length of the second wire 130b is approximately equal to the length L21, as shown in Fig. 1B.

In particular, the inductive component 100 can also include a protective layer 170, and the protective layer 170 covers the bottom surface 142a of the first mold member 140a and the second wires 130b to protect the second wires 130b, wherein the protective layer 170 is, for example, a solder mask. However, it should be noted that even if the inductive component 100 does not include the protective layer 170, the overall function of the inductive component 100 is not affected, so in other embodiments, the inductive component 100 may not include any protective layer 170.

1C is a schematic cross-sectional view taken along line II-II of FIG. 1A. Referring to FIG. 1A and FIG. 1C , the inductor component 100 further includes two external pads 181p and 182p and at least two wires 181t and 182t. The wire 181t connects the external pads 181p and one of the connection pads 120, and is connected. The 182t connects the external pads 182p to the other connection pads 120.

The protective layer 170 exposes the external pads 181p, 182p so that the external pads 181p, 182p can be electrically connected to the circuit board (not shown) via solder bumps (not shown) such as solder balls. . Thus, an electrical signal from the board can be input to the inductive component 100, allowing the inductive component 100 to operate.

In addition, in the embodiment, when the protective layer 170 is a solder resist layer, the protective layer 170 may partially cover the external pads 182p to form pads of the Solder Mask Defined (SMD) type, and the protective layer The 170 may also not cover the external pads 181p and completely expose the external pads 181p to form a non-solder mask defined (NSMD) type of pads. However, in other embodiments, the external pads 182p may also be changed to pads of a non-solderproof layer definition type, and the external pads 181p may also be To change the pad to the type defined by the solder mask.

The wires 181t and 182t and the external pads 181p and 182p may each be a metal film layer, wherein the wires 182t and the external pads 182p may be a single layer film, and both have an upper plane S1, and the wires 181t are connected to the outside. The pad 181p may be a two-layer film, that is, both the external pad 181p and the wire 181t include the first metal layer M1 and the second metal layer M2 stacked on each other.

An interface F1 exists between the first metal layer M1 and the second metal layer M2, wherein the first metal layer M1 is buried in the first molding member 140a, and the second metal layer M2 is protruded from the first molding member 140a. The bottom surface 142a. The outer pads 182p, the wires 182t, and the second wires 130b may be coplanar with each other, that is, the upper plane S1 is aligned with the upper plane 132b of the second wire 130b, and the interface F1 may be aligned with the upper plane S1 and the bottom surface 142a.

1D is a perspective view of the magnetic sensing component of the inductive component of FIG. 1A. Referring to FIG. 1D, the shape of the magnetic sensing component 110 is an annular body, which may be a toroid. That is, the shape of the magnetic sensing member 110 may be like a donut shape. In the magnetic sensing member 110 shown in FIG. 1D, the cross-sectional shape of the magnetic sensing member 110 may be a rectangle as shown in FIG. 1B. However, in other embodiments, the cross-sectional shape of the magnetic sensing member 110 may also be other shapes than rectangular.

Please refer to FIG. 2A, which illustrates the magnetic sensing component 210 in another embodiment. Specifically, in the inductive component 100 shown in FIG. 1A and FIG. 1B, the magnetic sensing component 110 shown in FIG. 1A and FIG. 1B can be replaced with the magnetic sensing component 210, wherein the shape of the magnetic sensing component 210 is also a ring body. However, the cross-sectional shape of the magnetic sensing member 210 is circular or elliptical (as shown in Fig. 2A). So, with the feeling in Figure 1D Compared to the magnetic member 110, the shape of the magnetic sensing member 210 is more like a donut shape.

2B is a perspective view of a magnetic sensitive component of an inductive component of another embodiment of the present invention. Referring to FIG. 2B, in addition to the magnetic sensitive component 210 shaped as a ring body, the magnetic sensing component 110 of FIGS. 1A and 1B can also be replaced with a magnetic sensitive component 310 shaped as a square. Therefore, the inductive component 100 does not necessarily have to use the magnetic sensing member 110 or 210 in the shape of a ring. Further, the cross-sectional shape of the magnetic sensing member 310 may be a rectangle (as shown in FIG. 2B), a circular shape, or an elliptical shape.

There are various manufacturing methods of the inductance element 100, and a method of manufacturing the inductance element 100 will be exemplified below with reference to FIGS. 3A to 3G.

3A to 3G are schematic cross-sectional views showing the manufacture of the inductance element of Fig. 1B. Referring to FIG. 3A, first, a metal film layer 12a is provided, wherein the metal film layer 12a is disposed above a carrier plate 12c, and a connection layer 12b is connected between the metal film layer 12a and the carrier plate 12c to form a metal film layer. 12a can be fixed above the carrier plate 12c.

The metal film layer 12a may be a metal foil, which is, for example, a copper foil, an aluminum foil, a silver foil or a tin foil. The connecting layer 12b can be connected to the metal film layer 12a and the carrier plate 12c by means of a sticking, and the connecting layer 12b can be a polymer material layer, such as polyimide (PI) or poly(p-phenylene). Polyethylene Terephthalate (PET). The carrier plate 12c functions in the present embodiment to carry the metal film layer 12a, and the carrier plate 12c can be a rigid plate material such as a metal plate, a glass plate or a ceramic plate.

It is worth mentioning that in other embodiments, the metal film layer 12a can be bonded on the carrier board 12c and contact and connect the carrier board 12c. Therefore, even if the connection layer 12b is not provided, the metal film layer 12a can be directly attached to the carrier plate 12c. Therefore, the connection layer 12b in FIG. 3A is for illustrative purposes only and is not intended to limit the creation.

Referring to FIG. 3A and FIG. 3B, a portion of the metal film layer 12a is removed to form the connection pads 120 and the metal underlayer 124a, and the connection pads 120 are disposed on the metal underlayer 124a. In detail, the method of forming the connection pad 120 and the metal underlayer 124a may be a patterning process of the metal film layer 12a, wherein the patterning process may be lithography and etching, or laser ablation, and the above The etching is, for example, wet etching or dry etching.

Referring to FIG. 3C, the magnetic sensitive component 110 is then fixed over the metal base layer 124a, wherein the magnetic sensing component 110 can be fixed over the metal base layer 124a via the insulating bonding layer 150. The insulating bonding layer 150 may bond the magnetic sensing component 110 and the metal underlayer 124a, wherein the insulating bonding layer 150 may be a polymer material layer, such as polyimide or polyethylene terephthalate. Therefore, the materials constituting both the insulating bonding layer 150 and the connecting layer 12b may be the same or similar.

Referring to FIG. 3D, the first insulating layer 160 and the first conductive lines 130a are sequentially formed on the magnetic sensing member 110. The first conductive lines 130a may be formed by sequential deposition, lithography, and etching, wherein deposition is performed. For example, electroplating, electroless plating or sputtering. Further, the first insulating layer 160 may be a photoresist left after the lithography for forming the first conductive line 130a described above.

Referring to FIG. 3E, a first molding member 140a is formed, which covers the magnetic sensing member 110, the first conductive wires 130a, the connection pads 120, and the first insulating layer 160, wherein the first molding member 140a can utilize a mold form, The main component of the first mold member 140a may be a resin, an epoxy or other polymer material.

Referring to FIG. 3F, after the first molding 140a is formed, the connecting layer 12b and the carrier 12c are removed to make the insulating bonding layer 150, the first insulating layer 160, the plane 122 of the bonding pad 120, and the first molding. The bottom surface 142a of the 140a is exposed, wherein the carrier plate 12c can be removed by peeling or etching, and the etching is, for example, wet etching. Since the connection layer 12b may be a polymer material layer, the connection layer 12b may be dissolved by a chemical liquid such as an organic solvent to be removed.

Referring to FIG. 3G, these second wires 130b are formed under the magnetic sensing member 110, and the method of forming the second wires 130b may be the same as the method of forming the first wires 130a. To this end, the connection pads 120 connect the first wires 130a and the second wires 130b to form a coil loop wound around the magnetic sensing member 110, and the inductance component 100 is substantially completed. Further, after the second wire 130b is formed, the protective layer 170 shown in FIG. 1B may be formed.

4A to 4B are schematic cross-sectional views showing the manufacture of an inductance element of another embodiment of the present invention. Referring to FIG. 4B , the inductance component 200 of the present embodiment is similar in structure to the inductance component 100 of the foregoing embodiment, so the same features are not repeated, and the difference between the two is mainly described below: the inductance component 200 It includes not only a first insulating layer 160a but also a second insulating layer 160b.

The first insulating layer 160a is different from the first insulating layer 160 in the foregoing embodiment. The structure, materials and manufacturing methods are the same. The material and manufacturing method of the second insulating layer 160b are also the same as those of the first insulating layer 160, and the second insulating layer 160b may also be a photoresist after lithography. However, the second insulating layer 160b is located between the second wires 230b and the magnetic sensing member 110, so that the magnetic sensing member 110 is covered by the first insulating layer 160a and the second insulating layer 160b, as shown in FIG. 4B. .

Since the first insulating layer 160a and the second insulating layer 160b cover the magnetic sensing member 110, when the magnetic sensing member 110 is a metal block, the first insulating layer 160a and the second insulating layer 160b can separate the magnetic sensing member 110 from these The first wire 130a, and the magnetic sensitive component 110 and the second wire 230b are separated. As such, the first insulating layer 160a and the second insulating layer 160b can further help the magnetic sensitive component 110, the first conductive line 130a, and the second conductive line 230b to be electrically insulated from each other.

In addition, it is worth mentioning that in the inductive component 200 shown in FIG. 4B, the magnetic sensing component 110 can be replaced with the magnetic sensing component 210 of FIG. 2A or the magnetic sensing component 310 of FIG. 2B. Therefore, the magnetic sensitive component 110 shown in FIG. 4B is for illustrative purposes only and is not intended to limit the creation.

Referring to FIG. 4A, the manufacturing method of the inductance element 200 is similar to the manufacturing method of the inductance element 100, except that the difference is that after the connection layer 12b and the carrier board 12c (as shown in FIG. 3A) are removed, these first forms are formed. The second insulating layer 160b, wherein the second insulating layer 160b is formed in the same manner as the first insulating layer 160.

Referring to FIG. 4B, after the second insulating layer 160b is formed, a plurality of second wires 230b connecting the connection pads 120 are formed. So far, the inductive component 200 has been substantially completed. The method of forming the second wire 230b can be the same A method of forming the first wire 130a. For example, the second wire 230b may be formed by sequential deposition, lithography, and etching, and the second insulating layer 160b may be the photoresist left after the lithography used to form the second wire 230b. Further, after the second wire 230b is formed, the protective layer 170 covering the second wires 230b may be formed as shown in FIG. 4B.

5A is a schematic perspective view of an inductor element according to another embodiment of the present invention, FIG. 5B is a top plan view of the inductor element of FIG. 5A, and FIG. 5C is a cross-sectional view taken along line III-III of FIG. 5B. Referring to FIG. 5A to FIG. 5C , the inductance component 500 of the present embodiment is similar in structure to the inductance component 100 of the foregoing embodiment, so the same features are not repeated, and the differences between the two are mainly described below.

In detail, the inductive component 500 includes a magnetic sensing component 510, two molding components, a plurality of connection pads 120, a plurality of first wires 530a and a plurality of second wires 530b, wherein the two moldings are respectively A mold seal 140a and a second mold member 140b. Unlike the inductive component 100 of FIG. 1B, except that the inductive component 500 includes two mold members, the first conductors 530a and the second conductors 530b are both bonding wires rather than metal film layers.

The second mold member 140b connects the first mold member 140a and covers the second wire 530b. As such, the second mold member 140b can protect the second wire 530b and the connection pad 120 from being damaged by foreign objects. Further, like the first mold member 140a, the second mold member 140b is also electrically insulating. However, unlike the first mold member 140a, the thickness of the second mold member 140b is different from the thickness of the first mold member 140a, wherein the thickness of the first mold member 140a is thick. The degree L51 is greater than the thickness L52 of the second mold member 140b.

In addition, the inductive component 500 can further include an insulating bonding layer 150 and a supporting layer 590, wherein the magnetic sensing component 510 is disposed above the supporting layer 590, and the insulating bonding layer 150 is coupled between the magnetic sensing component 510 and the supporting layer 590. The material of the support layer 590 can be the same as the material of the connection pad 120, and both the support layer 590 and the connection pad 120 can be simultaneously formed in the same manufacturing process, so both the support layer 590 and the connection pad 120 can be a metal film layer. .

In the present embodiment, the support layer 590 can be coplanar with the connection pads 120. In detail, the support layer 590 has a lower plane 592, and the lower plane 592 and the plane 122 of the connection pads 120 are aligned with each other, and the lower planes 592 and the planes 122 are all in the same plane, so that the support layer 590 and The connection pads 120 are coplanar with each other. Further, the inductive element 500 may not include the first insulating layers 160, 160a and the second insulating layer 160b.

It is worth mentioning that in the present embodiment, the inductive component 500 may include the support layer 590, but in other embodiments, the inductive component 500 may not include any support layer 590. Therefore, it is emphasized herein that the support layer 590 shown in FIG. 5C is for illustrative purposes only and is not intended to limit the creation.

Figure 5D is a schematic cross-sectional view taken along line IV-IV of Figure 5B. Referring to FIG. 5B and FIG. 5D, the inductor component 500 further includes two external pads 580p and at least two wires, wherein the wires connect the external pads 580p and the connection pads 120, and the wires are respectively connected by 581t. Connect with 582t. Unlike the foregoing embodiment, the wire 581t is a bonding wire, and the wire 582t is a metal film layer. However, in other embodiments, even Lines 581t and 582t may both be metal film layers or bonding wires, i.e., the types of wires 581t and 582t may be identical to each other.

In addition, the second molding member 140b partially exposes the bottom surface 142a of the first molding member 140a, and the external bonding pads 580p are located on the bottom surface 142a exposed by the second molding member 140b, so the second molding member 140b also exposes the external portions. Pad 580p. Moreover, these external pads 580p and these connection pads 120 are coplanar with each other, as shown in Figure 5D.

In this embodiment, the inductive component 500 can further include two connectors 690, and the connectors 690 can be a plurality of metal cylinders, such as copper pins or silver posts. These connecting members 690 are respectively connected to the external pads 580p, wherein the height L53 of each of the connecting members 690 with respect to the first molding member 140a is greater than the thickness L52 of the second molding member 140b. As such, the connectors 690 can protrude from the bottom surface of the second molding 140b so that the inductive component 500 can be mounted on the wiring board by Surface Mounting Technology (SMT).

There are various manufacturing methods of the inductance element 500, and a method of manufacturing the inductance element 500 will be exemplified below with reference to FIGS. 6A to 6D. It should be noted that the manufacturing method of the inductance element 500 is similar to the manufacturing method of the inductance element 100, and the differences of the manufacturing methods of the inductance elements 100 and 500 are mainly described below. As for the same features of the manufacturing methods of the inductance elements 100 and 500, the description will not be repeated.

6A to 6D are schematic cross-sectional views showing the manufacture of the inductance element of Fig. 5C. Referring to FIG. 6A, first, these connection pads 120 and the support layer are formed. 590 is above the carrier plate 12c, wherein the connection layer 12b is connected between the connection pads 120 and the carrier plate 12c such that the connection pads 120 and the support layer 590 are fixed above the carrier plate 12c. However, in other embodiments, the connection pad 120 and the support layer 590 may also be directly bonded to the carrier plate 12c and contact the carrier plate 12c.

The connection pad 120 and the support layer 590 may be formed by removing a portion of the metal film layer, wherein the metal film layer may be the metal film layer 12a in FIG. 3A or a metal film layer having a thickness thinner than the metal film layer 12a. A method other than a portion of the metal film layer may be lithographically and etched, or laser ablated. Different from the method of removing a portion of the metal film layer 12a in FIGS. 3A to 3B, in the process of forming the connection pad 120 and the support layer 590 in FIG. 6A, when the metal film layer (for example, the metal film layer 12a) is removed Thereafter, the connection layer 12b is exposed, and the connection pads 120 and the support layer 590 are separated from each other and are not electrically connected.

Next, the magnetic sensing member 510 is fixed above the carrier plate 12c, wherein the magnetic sensing member 510 can be fixed above the supporting layer 590 via the insulating bonding layer 150. Since in other embodiments, the inductive component 500 may not include any of the support layers 590, the magnetic sensing component 510 may be disposed directly on the connection layer 12b without the support layer 590 and the insulating bonding layer 150.

Referring to FIG. 6B, the first wires 530a and the first moldings 140a are sequentially formed, wherein the first wires 530a are connected to the connection pads 120, and the first wires 530a may be wire bonded. Formed by the way. The first mold member 140a covers the magnetic sensing member 510, the first wires 530a, the connection pads 120, and the support layer 590.

Referring to FIG. 6B and FIG. 6C, after the first mold member 140a is formed, the connection layer 12b and the carrier board 12c are removed to expose the support layer 590 and the connection pads 120, wherein the connection layer 12b and the carrier board are removed. The method of 12c has been described in detail in the foregoing embodiments, and thus the description thereof will not be repeated.

Referring to FIG. 6D, these second wires 530b are formed under the magnetic sensing member 510, and the method of forming the second wires 530b may be the same as the method of forming the first wires 530a. After the second wire 530b is formed, the second mold member 140b and the connection members 690 are sequentially formed under the first mold member 140a to form the inductance element 500 as shown in FIG. 5C. In addition, in order to enable the second mold member 140b to partially expose the bottom surface 142a of the first mold member 140a (as shown in FIG. 5D), the mold for forming the first mold member 140a and the second mold member 140b is not the same.

In summary, the coil circuit of the present inductive component is formed by connecting a plurality of connection pads and a plurality of wires (ie, the first wire and the second wire), wherein the connection pads can be lithographically and etched, or A patterning process such as laser ablation is performed, and the wire may be a metal film layer subjected to lithography and etching, or a bonding wire formed by wire bonding, so the coil circuit of the present inductive component is formed by the above pattern. Process, and can be made with wire bonding.

In view of the above, the inductive component of the present invention has a shorter manufacturing time and a higher yield than the conventional inductive component in which the coil circuit is manually fabricated, thereby facilitating mass production. In addition, the aforementioned patterning process and wire bonding are suitable for manufacturing small-sized electronic components (for example) Packaged wafers) are therefore also suitable for the fabrication of small inductive components. Therefore, the inventive inductive component can be applied to the design and manufacture of small inductor components.

The above description is only an embodiment of the present invention, and is not intended to limit the scope of patent protection of the present invention. Anyone who is familiar with the art of the artist, within the spirit and scope of the creation, the equivalent of the change and retouching is still within the scope of the patent protection of this creation.

12a‧‧‧metal film

12b‧‧‧Connection layer

12c‧‧‧carrier board

100, 200, 500‧‧‧Inductive components

110, 210, 310, 510‧ ‧ magnetic sensitive parts

120‧‧‧Connecting mat

122‧‧‧ plane

124a‧‧Metal bottom layer

130a, 530a‧‧‧ first wire

130b, 230b, 530b‧‧‧ second conductor

132b, S1‧‧‧ upper plane

140a‧‧‧First molded part

140b‧‧‧Second mould seal

142a‧‧‧ bottom

150‧‧‧Insulation joint

160, 160a‧‧‧ first insulation

160b‧‧‧Second insulation

170‧‧‧Protective layer

181p, 182p, 580p‧‧‧ external pads

181t, 182t, 581t, 582t‧‧‧ connection

590‧‧‧Support layer

592‧‧‧ Lower plane

690‧‧‧Connecting parts

F1‧‧‧ interface

H1‧‧‧ ring mouth

L11, L12, L21‧‧‧ length

L51, L52‧‧‧ thickness

L53‧‧‧ Height

M1, M2‧‧‧ first metal layer

1A is a top plan view of an inductive component of an embodiment of the present invention.

Figure 1B is a cross-sectional view taken along line I-I of Figure 1A.

1C is a schematic cross-sectional view taken along line II-II of FIG. 1A.

1D is a perspective view of the magnetic sensing component of the inductive component of FIG. 1A.

2A is a perspective view of a magnetic sensing component of an inductive component of another embodiment of the present invention.

2B is a perspective view of a magnetic sensitive component of an inductive component of another embodiment of the present invention.

3A to 3G are schematic cross-sectional views showing the manufacture of the inductance element of Fig. 1B.

4A to 4B are schematic cross-sectional views showing the manufacture of an inductance element of another embodiment of the present invention.

FIG. 5A is a perspective view of an inductor element according to another embodiment of the present invention.

Figure 5B is a top plan view of the inductive component of Figure 5A.

Figure 5C is a schematic cross-sectional view taken along line III-III of Figure 5B.

Figure 5D is a schematic cross-sectional view taken along line IV-IV of Figure 5B.

6A to 6D are schematic cross-sectional views showing the manufacture of the inductance element of Fig. 5C.

100‧‧‧Inductive components

110‧‧‧Magnetic parts

120‧‧‧Connecting mat

122‧‧‧ plane

130a‧‧‧First wire

130b‧‧‧second wire

132b‧‧‧Upper plane

140a‧‧‧First molded part

142a‧‧‧ bottom

150‧‧‧Insulation joint

160‧‧‧First insulation

170‧‧‧Protective layer

L11, L12, L21‧‧‧ length

Claims (22)

An inductive component includes: a plurality of first wires; a plurality of second wires; a magnetic sensing member; a plurality of connecting pads located around the magnetic sensing member, wherein the connecting pads and the sensing member are located Between the first wires and the second wires, each of the first wires connects the two connection pads across the magnetic sensitive component, and each of the second wires crosses the magnetic sensitive component to connect two of the connections a pad to form a coil loop wound around the magnetic sensing member; and a first molding member covering the magnetic sensing member, the first conductive wires and the connecting pads, each of the connecting pads having a The first mold covers the plane, and the second wires are connected to the planes. The inductive component of claim 1, wherein the connection pads are coplanar with each other. The inductive component of claim 1, wherein at least one of the connection pads is connected between one of the first wires and one of the second wires. The inductive component of claim 1, wherein a current path length of each of the first wires is greater than a current path length of each of the second wires. The inductive component of claim 1, further comprising two external pads and at least two wires, wherein the wires are connected to the external connectors Pads with these connection pads. The inductive component of claim 5, wherein at least one of the wires is a metal film layer or a bonding wire. The inductive component of claim 1, further comprising an insulating bonding layer connecting the magnetic sensing component, wherein the insulating bonding layer is located between the magnetic sensing component and the second conductive wires. The inductive component of claim 7, further comprising a support layer disposed above the support layer, the insulating bonding layer being coupled between the magnetic sensitive component and the support layer. The inductive component of claim 8, wherein the support layer and the connection pads are coplanar with each other. The inductive component of claim 1, wherein the sensing component has an annular shape, and the sensing component surrounds a ring, some of which are located in the ring, and the other connecting pads Positioned outside the ring, each of the first wires spans the magnetic sensitive component to connect one of the connection pads located in the ring and one of the connection pads outside the ring, and each of the second wires spans The magnetic sensing member is connected to one of the connection pads located in the ring opening and one of the connection pads located outside the ring to form the coil circuit. The inductive component of claim 10, wherein the connecting pads are arranged in a double concentric shape along the magnetic sensitive component. The inductive component of claim 10, wherein the annular body is a box or a ring. The inductive component of claim 1, further comprising a first insulating layer covering the magnetic sensitive component and located between the first conductive wire and the magnetic sensitive component. The inductive component of claim 13, wherein each of the first wires is a metal film layer and partially covers the first insulating layer. The inductive component of claim 13, further comprising a second insulating layer disposed between the second wires and the magnetic sensing member. The inductive component of claim 1, further comprising a second molding member, the second molding member connecting the first molding member and covering the second guiding wires, wherein the second molding member The piece partially exposes the bottom surface of the first mold member. The inductive component of claim 16, wherein the first wires and the second wires are all bonding wires. The inductive component of claim 16, wherein the thickness of the first molding is greater than the thickness of the second molding. The inductive component of claim 16, further comprising two external pads and at least two wires, wherein the wires connect the external pads and the connection pads, and the second moldings are further Expose the external pads. The inductive component of claim 19, wherein the external pads and the connection pads are coplanar with each other. The inductive component according to claim 19, further comprising two connecting members, wherein the connecting members are respectively connected to the external pads, wherein each The height of the connector relative to the first mold member is greater than the thickness of the second mold member. The inductive component of claim 21, wherein the connectors are a plurality of metal cylinders.