M441316 五、新型說明： 【新型所屬之技術領域】 本創作孫有關於一楂電磁波屏蔽結構，更詳而言之， 係有關於一種用於軟性印刷電路板具有遮蔽佈線功能及電 磁干擾遮蔽之膜層。 【先前技術】 為因應電子及通訊產品多功能的市場需求，軟性印刷 電路板（Flexible Printed Circuit，FPC)的構裝需要更 鲁輕、薄、短、小’而在功能上則需要高密度且多功之訊號 傳輸。此外，由於軟性載板訊號傳輸線路之間距離越來越 近，加上工作頻率朝向南寬頻化，使得來自外部電磁輻射 或是内部雜訊（noise)相互之間的電磁干擾 (Electromagnetic Interference; EMI)情形日益嚴重。因 此，在不斷向高功能化及高速度化發展下的同時須制定了 各種電磁波干擾的對策。 鲁以往為了解決軟板的電磁波干擾問題，除了藉由整套 完整的佈線路徑設計外，更推出適用於薄膜型FPC的導電 性電磁波屏蔽膜（EMI Shielding Film)，廣泛應用於智慧 型手機、平板電腦、數位照相機、數位攝影機等小型電子 產品中。 近幾年為避免FPC電路佈局圖案被同業抄襲，常使用 導電黏著層或使用導電黏著層配合金屬膜作為電磁波屏蔽 膜。如，第200227981號日本專利揭露一種將具有電磁波 屏蔽層之黑色絕緣膜貼於軟板接地走線處之軟板電磁波屏 3 1 料 41316 蔽膜結構’其中，該電磁波屏蔽層係以蒸鍵金屬薄膜搭配 導電黏著膜所構成。而該導電黏著膜係以具導電性之導電 粉體、具阻燃性之粉體與熱硬化樹脂組成物所構成。惟’ 此法雖可製得具電磁波屏蔽且具難燃特性之軟性印刷電路 板’然而’在高溫回焊（solder ref low)製程下使用熱可塑 性工業塑膠（如，聚次苯基硫化物、聚脂等）並無難熱特性， 故此.法製得之軟性印刷電路板無法兼具軟板絕緣保護膜之 難熱特性。 又’於第200495566號日本專利揭示一種電磁波屏蔽 材料’係由環氧樹脂之絕緣層結合導電黏著層，導電黏著 係由熱硬化環氧樹脂、導電金屬粉、阻燃劑所組成，為達 到軟性印刷電路板對於難燃性及電磁波屏蔽等特性之需 求，於熱硬化樹脂中加入阻燃劑。雖可提高電磁波屏敝膜 的阻燃性，然而卻衍伸出屏蔽膜與軟性印刷電路板間接著 性之問題。此外，為達到較好的屏蔽能力往往得填充更多 的導電粉體，惟導電性粉體含量越高該屏蔽膜與軟性印刷 電路板間之接著性相對越差。 故，開發一種具有良好之電磁波屏蔽效果且兼具耐 熱、難燃又能保有與軟性印刷電路板間之密著性甚為困難。 【新型内容】 為此，本創作提供一種用於軟性印刷電路板之電磁波 屏蔽結構，包括：導電複合膜，其中，該導電複合膜包括 依序相疊合之絕緣接著層及導電膠黏層；以及黑色聚醯亞 胺膜，係开>成於该導電複合膜上，其中，該絕緣接著層係 M441316 夾置於該黑色聚酿亞㈣與導電㈣層之&卜於較佳態樣 中，本創作電磁波屏蔽結構之厚度介於29至58微米。 本創作減供-種具有電魏屏蔽.結構之軟性印刷 電路板，包括：本體層，其表面上形成有接地線路；以及 本創作之㈣波屏蔽結構，係藉㈣電磁波屏蔽結構之導 電膠黏層貼合於該本體層之形成有接地線路的表面上，俾 與該接地線路導通。 相較於-般熱可塑性工業塑膠而言，本創作之琴色聚 醯亞胺膜除了具有熱穩定性高、優異的絕緣性、機械強度' 及抗化學腐錄特點，更具有霧㈣紐能有效保護電 路圖案不被同業抄襲^ 不僅如此纟創作之導電複合膜具有絕緣接著層及$ 電膠黏層，且該絕緣接著層含有阻_，無需在導電㈣ 廣加入阻燃劑，即可達到最佳的_的 雨-0難燃祕祕要求縣，缺補叙具有電約 屏蔽結構之雖印刷電路板具有更佳的阻燃性。 【實施方式】 以下係藉由特定的具體實例說明本創作之實施方 式，熟悉此㈣之人士可由本說明書所揭示之内容輕易地 瞭解本創作之優點及功效。補作村以其它不同的方式 予以實施’即，在不_本創作所揭示之範_下，能予不 同之修飾與改變。 第1圖係顯示本創作之電磁波屏蔽結構1〇〇，包括： 導電複合膜12G，包括依序相疊合之絕緣接著層121及導 5 M441316 * 電，122’其中，該絕緣接著層121及導電膠黏層i22 使該導電複合膜120具有相對之絕緣接著面哪及導電膠 黏面120b;以及與該導電複合们2〇之絕緣接著面服 結合之^色㈣亞賴⑽。於本創作之具體實施例中， 絕緣接著層包括環氧樹脂及阻燃劑。 第2圖係顯示本創作之具有電磁波屏蔽結構之軟性印 刷電路板2〇〇，包括：本體層咖及電磁波屏蔽結構24〇。 該電磁波屏蔽結構24Q包括導電複合膜咖及黑 酿亞胺膜210，其中，1¾導電複合膜22{)包括依序相疊合 之絕緣接著層221及導電膠㈣您，俾使該導電複合膜 220具有相對之絕緣接著面22Qa及導電膠黏面2施該里 色聚酿亞胺膜210 _合於該導電複合膜22()之絕緣接著 面220a。該本體層230係與該導電膠㈣屢緊密妹人， 具體而言’係藉由該電磁波屏蔽結構24〇之導電膠黏層怨 貼合於該本體層230之形成有接地線略·的表面上俾 與該接地線路230a導通，使該具有電磁波屏蔽結構24〇 之軟性印刷電路板2⑽具有不透光之外表面⑽&本創作 之電磁波屏蔽結構之厚度係介於29至58微米之間。 度為5 賴屏賴射，黑色料亞胺膜之厚 !/至33^ 較佳為12微米，·導電複合膜之厚度為 U至33微未，較佳為^至烈微 黏層之厚度為！2至2 J各該導電膠 絕緣接著層之厚度丨2至18微米;各該 太鐘+ * 5至8微水’較隹為5至7微米。 之黑色聚醯亞胺膜，含有聚醯亞胺及色粉。其 M441316 中，聚醯亞胺較佳是使用不含鹵素的聚醯亞胺材料。色粉 係包括，但不限於碳黑、二氧化鈦、黑色顏料或其混合‘ 之粉體，俾使本創作之黑色聚醯亞胺膜具有較佳之遮蔽效 果。 "、 由於本創作電磁波屏蔽結構之黑色聚醯亞胺膜具黑 色之色澤及較低之折射率，故本創作之具有電磁磁: 構之軟性印刷電路板之外表面具衫透光特性，特別適: 應用於有遮蔽電路圖案需求之軟性印刷電路板。 本創作之絕緣接著層’含有接著劑及阻燃劑，其中， 以接著劑及阻燃劑之總重計，該阻燃劑之含量為2〇〃至Η 較佳為3G至50重量％。於較佳具體實施例中，本 創作所使狀接㈣衫含时之接著劑，更佳為且有自 不含自素的接著劑。於較佳具體實施例中，本創作 二邑緣接者層所使用之阻燃劑，包括， 呂、氫氧化鎂、鋁酸鈣水合物、碟李 ' 更佳為含俩⑽。 w難難粉體或其混合， 本創作電磁波屏蔽結構之導 化環氧樹脂及導電粉體所組成 ^層主要係由熱硬 銅粉、_、銀包贿核包_ H電㈣為銀粉、 遮蔽性電氣雜下，較料鈒^在考1成本與電磁波 粒徑為:至,微米更:為銀 波屏蔽離::佳具體實施例中’本創作之電磁 於較佳具體實施例中，本創作之電场波屏蔽結構係以 7 M441316 如下所述之方法製造，將導電粉體與熱硬化環氧樹脂均勻 混合為導電塗料（conductive paste)並塗佈於離型層之 上，並使其乾燥以形成導電黏著層，接著將由阻燃劑與環 氧樹脂均勻混合之絕緣接著劑塗佈於黑色聚亞醯胺膜I， 並乾燥形成絕緣接著層，最後，將具有導電黏著層之離型 層與具有鱗接著層之㈣亞賴減貼合，該貼合方式 係以絕緣接著層與導電黏著層相互貼合俾形成本創作之 電磁波屏蔽結構。 本創作之具有電磁波屏蔽結構之軟性印刷電路板，係 將上述之電魏屏蔽結構之導電黏著層與軟性印刷電路板 之接地線路以減貼合，且該導電黏著層與接地線路形成 導通。 實施例 實施例1 將30質量份之熱硬化環氧樹脂混合物、μ. 5質量份 之二乙基磷酸錄（柯萊恩公5Ί)|^ 1G f量份&氧化铭粉 的阻燃劑’加入丙二醇曱醚與甲乙酮混合溶劑（pGME/MEK= 1/2)，使上述添加物稀釋、分散均勾混合並形成總固體 /辰度為30重里比之絕緣接著劑，待真空靜置脫泡後，以精 岔塗佈方式塗佈在黑色聚醯亞胺臈（達邁公司），並乾燥使 之形成絕緣接著層。 另外，將30 f量份之熱硬化環氧樹脂混合物、7〇質 量份之銀包銅導電粉體與含有丙二醇曱醚與曱乙酮 (PGME/MEK= 1 /2)之混合溶劑均句混合稀釋為總固體濃度 M441316 為50重量比之導電膠黏劑，並將其塗佈於聚苯二曱酸乙二 酯（PET)材質之離型層的可離型表面上，並乾燥形成導電膠 黏層。 將上述所製備含絕緣接著層之黑色聚醯亞胺與含導 電膠黏層之可離型PET膜，使用熱壓滾輪貼合俾獲得可單 面離型本創作之電磁波屏蔽結構。將製得的電磁波屏蔽結 構與軟性印刷電路板壓合，並測量其電磁波屏蔽性、與軟 硬印刷電路板間之接著力及難燃性測試結果記錄於表1。 ®實施例2至5 與實施例1同樣的執行相同步驟製作，差別在於絕緣 接著層中使用表一所示之阻燃劑含量與表一所示各層厚 度。將製得的電磁波屏蔽結構與軟性印刷電路板壓合，並 測量其電磁波屏蔽性、與軟硬印刷電路板間之接著力及難 燃性測試結果記錄於表1。 比較例1 Φ 使用與實施例1相同方式執行相同步驟製作，差別僅 在於比較例1之絕緣接著層中不加入阻燃劑。將製得的電 磁波屏蔽結構與軟性印刷電路板壓合，並測量其電磁波屏 蔽性、與軟硬印刷電路板間之接著力及難燃性測試結果記 錄於表1。 比較例2 使用與實施例1相同之方法製備，差別僅在於比較例 2於絕緣接著劑中加入10%重量的阻燃劑。將製得的電磁波 屏蔽結構與軟性印刷電路板壓合，並測量其電磁波屏蔽 9 削41316 眭、與軟硬印刷電路板間之接著力及難燃性測試結果記錄 於表1。 比較例3 使用與實施例1相同之方法製備，差別僅在於比較例 3於導電膠黏劑中加入35%阻燃劑。將製得的電磁波屏蔽結 構與軟性印刷電路板壓合’並測量其電磁波屏蔽性、與軟 硬印刷電路板間之接著力及難燃性測試結果記錄於表1。 測試例 分別將上述實施例1至5及比較例1至3所製得之具 有電磁波屏蔽結構之軟性印刷電路板裁取成合適大小之測 試樣片，進行電磁波屏蔽性、與軟硬印刷電路板間之接著 力、難燃性測試（UL 94垂直燃燒試驗）。 (1) 電磁波屏蔽性： 準備13cm圓型電磁波屏蔽結構，依據ASTM4935法進 行電磁波遮蔽效率測定。 (2) 與軟硬印刷電路板間之接著力： 將電磁波屏蔽結構與軟性印刷電路板之接地線路側 熱壓滾輪貼合，然後以100 kg/cm2壓力下於180 °C熱壓1 分鐘，接著於17(TC熟化一小時，使用萬能拉力機以50 麵/min速度、剝離角度90度下進行測試電磁波屏蔽結構 與軟性印刷電路板之接地線路侧之間接著力。 (3) 難燃性（UL-94垂直燃燒試驗）: 將電磁波屏蔽結構裁切為長4 cm、寬50cm且經Π0 °C熟化1小時後，進行UL-94 V0垂直難燃性測試。 M441316M441316 V. New description: [New technical field] This creation Sun has a structure about electromagnetic shielding. More specifically, it relates to a film for shielding flexible wiring and electromagnetic interference shielding for flexible printed circuit boards. Floor. [Prior Art] In order to meet the versatile market demand for electronic and communication products, the flexible printed circuit (FPC) needs to be more light, thin, short, and small, and functionally requires high density. Multi-signal transmission. In addition, due to the closer distance between the flexible carrier signal transmission lines and the widening of the operating frequency toward the south, electromagnetic interference from external electromagnetic radiation or internal noise (Electromagnetic Interference; EMI) The situation is getting worse. Therefore, various electromagnetic wave interference countermeasures must be developed at the same time as the development of high functionality and high speed. In order to solve the electromagnetic wave interference problem of the soft board, in addition to the complete set of wiring path design, the conductive electromagnetic shielding film (EMI Shielding Film) suitable for the film type FPC has been introduced, which is widely used in smart phones and tablets. , small digital cameras, digital cameras and other small electronic products. In recent years, in order to avoid the plagiarism of the FPC circuit layout pattern, a conductive adhesive layer or a conductive adhesive layer is used as a electromagnetic wave shielding film. For example, Japanese Patent No. 200227981 discloses a soft-plate electromagnetic shielding screen with a black insulating film having an electromagnetic wave shielding layer attached to a grounding trace of a soft board, wherein the electromagnetic shielding layer is made of a steamed metal. The film is composed of a conductive adhesive film. The conductive adhesive film is composed of a conductive conductive powder, a flame retardant powder, and a thermosetting resin composition. However, this method can produce flexible printed circuit boards with electromagnetic shielding and flame retardant characteristics. However, thermoplastic plastics (such as polyphenylene sulfide) are used in the solder ref low process. Polyester, etc.) has no difficult thermal properties. Therefore, the flexible printed circuit board produced by the method cannot have the hard heat characteristics of the soft insulating film. Japanese Patent No. 200405566 discloses an electromagnetic wave shielding material which is composed of an insulating layer of an epoxy resin combined with a conductive adhesive layer, and the conductive adhesive is composed of a thermosetting epoxy resin, a conductive metal powder and a flame retardant, in order to achieve softness. The printed circuit board adds a flame retardant to the thermosetting resin for the requirements of characteristics such as flame retardancy and electromagnetic wave shielding. Although the flame retardancy of the electromagnetic wave screen can be improved, the problem of adhesion between the shielding film and the flexible printed circuit board is extended. In addition, in order to achieve better shielding ability, it is often necessary to fill more conductive powder, but the higher the content of the conductive powder, the worse the adhesion between the shielding film and the flexible printed circuit board. Therefore, it is difficult to develop a coating having a good electromagnetic wave shielding effect and having heat resistance, flame resistance, and adhesion to a flexible printed circuit board. [New content] To this end, the present invention provides an electromagnetic wave shielding structure for a flexible printed circuit board, comprising: a conductive composite film, wherein the conductive composite film comprises an insulating adhesive layer and a conductive adhesive layer which are sequentially laminated; And a black polyimine film, which is formed on the conductive composite film, wherein the insulating adhesive layer M441316 is sandwiched between the black poly (a) and the conductive (four) layer & The thickness of the electromagnetic wave shielding structure of the present invention is between 29 and 58 microns. The creation of the reduced supply-type flexible printed circuit board with electric Wei shielding. The structure includes: a body layer, a grounding line is formed on the surface thereof; and the (four) wave shielding structure of the present invention is a conductive adhesive of the electromagnetic wave shielding structure. The layer is attached to the surface of the body layer on which the ground line is formed, and is electrically connected to the ground line. Compared with the general thermoplastic plastic industrial plastics, the piano color polyimide film of this creation has the characteristics of high thermal stability, excellent insulation, mechanical strength and chemical resistance, and is more foggy. Effectively protect the circuit pattern from being copied by the same industry^ Not only that, the conductive composite film created has an insulating adhesive layer and an electric adhesive layer, and the insulating adhesive layer contains a resistance _, which can be achieved without adding a flame retardant in the conductive (four) The best _ rain-0 flammable secrets require the county, the lack of supplements have an electrical shield structure, although the printed circuit board has better flame retardancy. [Embodiment] The following describes the implementation of the present invention by a specific specific example, and those skilled in the art (4) can easily understand the advantages and effects of the present invention by the contents disclosed in the present specification. Completion villages are implemented in different ways. That is, different modifications and changes can be made without the disclosure of this creation. FIG. 1 is a view showing an electromagnetic wave shielding structure of the present invention, comprising: a conductive composite film 12G comprising an insulating interlayer 121 and a conductive layer M110316 which are sequentially laminated, and wherein the insulating interlayer 121 and The conductive adhesive layer i22 has the conductive composite film 120 having a relatively insulating insulating surface and a conductive adhesive surface 120b; and a color (four) ya (10) combined with the insulating composite of the conductive composite. In a specific embodiment of the present invention, the insulating backing layer comprises an epoxy resin and a flame retardant. Fig. 2 is a view showing a soft printed circuit board 2 of the present invention having an electromagnetic wave shielding structure, comprising: a body layer and an electromagnetic wave shielding structure 24A. The electromagnetic wave shielding structure 24Q comprises a conductive composite film coffee and a black-shelled imine film 210, wherein the 13⁄4 conductive composite film 22{) comprises an insulating bonding layer 221 and a conductive adhesive (4) which are sequentially laminated, and the conductive composite film is laminated. 220 has a relatively insulating insulating surface 22Qa and a conductive adhesive surface 2 to apply the lithographic polyimide film 210 to the insulating bonding surface 220a of the conductive composite film 22 (). The body layer 230 is closely attached to the conductive adhesive (four), and specifically, the conductive adhesive layer of the electromagnetic wave shielding structure 24 is adhered to the surface of the body layer 230 formed with a grounding line. The upper cymbal is electrically connected to the grounding line 230a, so that the flexible printed circuit board 2 (10) having the electromagnetic wave shielding structure 24 has an opaque outer surface (10). The thickness of the electromagnetic wave shielding structure of the present invention is between 29 and 58 micrometers. The degree is 5 ray screen, the thickness of the black imine film! / to 33 ^ is preferably 12 microns, · the thickness of the conductive composite film is U to 33 micro, preferably ^ to the thickness of the micro-adhesive layer for! 2 to 2 J each of the conductive adhesive insulating layers has a thickness of 丨2 to 18 μm; each of the terabytes + 5 to 8 μm of water is 5 to 7 μm. The black polyimine film contains polyimine and toner. In the M441316, the polyimine is preferably a halogen-free polyimine material. The toner system includes, but is not limited to, carbon black, titanium dioxide, black pigment or a mixture thereof, and the black polyimide film of the present invention has a better shielding effect. ", Because the black polyimine film of the electromagnetic wave shielding structure of the present invention has a black color and a low refractive index, the present invention has electromagnetic magnetic: the outer surface of the soft printed circuit board has a light transmissive characteristic, especially Applicable: Applicable to flexible printed circuit boards with mask circuit pattern requirements. The insulating backing layer of the present invention contains an adhesive and a flame retardant, wherein the flame retardant is contained in an amount of 2 Torr to Η, preferably 3 to 50% by weight based on the total weight of the adhesive and the flame retardant. In a preferred embodiment, the present invention provides a bonding agent that is time-dependent, and is preferably a self-inhibiting adhesive. In a preferred embodiment, the flame retardant used in the layer of the second layer of the present invention includes, for example, luminum, magnesium hydroxide, calcium aluminate hydrate, and dish Li's preferably containing two (10). w difficult powder or its mixture, the composition of the electromagnetic shielding structure of the conductive epoxy resin and conductive powder consists of the main layer consists of hot hard copper powder, _, silver bribery nuclear package _ H electricity (four) for silver powder, Concealed electrical miscellaneous, compared to the cost of the test and the electromagnetic wave particle size: to, micron: for the silver wave shielding away:: In the specific embodiment, the electromagnetic of the present invention is in a preferred embodiment, The created electric field wave shielding structure is manufactured by the method described below as 7 M441316, and the conductive powder and the thermosetting epoxy resin are uniformly mixed into a conductive paste and coated on the release layer, and Drying to form a conductive adhesive layer, then applying an insulating adhesive uniformly mixed with a flame retardant and an epoxy resin to the black polyimide film I, and drying to form an insulating adhesive layer, and finally, releasing the conductive adhesive layer The layer is bonded to the (four) sub- ing with the scaled back layer, and the bonding method is such that the insulating adhesive layer and the conductive adhesive layer are bonded to each other to form the electromagnetic wave shielding structure of the present invention. The flexible printed circuit board having the electromagnetic wave shielding structure of the present invention is configured to reduce the adhesion of the conductive adhesive layer of the electrical shield structure and the grounding circuit of the flexible printed circuit board, and the conductive adhesive layer is electrically connected to the ground line. EXAMPLES Example 1 30 parts by mass of a thermosetting epoxy resin mixture, μ. 5 parts by mass of diethylphosphoric acid (Colaine 5 Ί)|^ 1G f parts & flame retardant of oxidized powder Add a mixture solvent of propylene glycol oxime ether and methyl ethyl ketone (pGME/MEK= 1/2), and dilute and disperse the above additives to form an insulating adhesive with a total solid/length of 30 liters. Thereafter, it was applied to a black polyimine oxime (Damai Co., Ltd.) by fine coating, and dried to form an insulating back layer. In addition, 30 μ parts of the thermosetting epoxy resin mixture, 7 parts by mass of the silver-coated copper conductive powder and a mixed solvent containing propylene glycol oxime ether and acetophenone (PGME/MEK=1 /2) are uniformly mixed. Diluted into a 50% by weight total conductive solids M441316 conductive adhesive, and coated on the release surface of the release layer of polyethylene terephthalate (PET) material, and dried to form conductive adhesive Sticky layer. The black polyimine containing the insulating adhesive layer prepared above and the peelable PET film containing the conductive adhesive layer were bonded together by a hot press roller to obtain an electromagnetic wave shielding structure capable of single-sided release. The electromagnetic wave shielding structure obtained was pressed against a flexible printed circuit board, and the electromagnetic wave shielding property, the adhesion between the hard and soft printed circuit boards, and the flame retardancy test results were recorded in Table 1. ® Examples 2 to 5 The same procedure as in Example 1 was carried out in the same procedure except that the insulating layer was used in the next layer and the thickness of each layer shown in Table 1 was used. The obtained electromagnetic wave shielding structure was pressed against a flexible printed circuit board, and the electromagnetic wave shielding property, the adhesion between the hard and soft printed circuit boards, and the flame retardancy test results were recorded in Table 1. Comparative Example 1 Φ The same procedure was carried out in the same manner as in Example 1, except that no flame retardant was added to the insulating adhesive layer of Comparative Example 1. The obtained electromagnetic wave shielding structure was pressed against a flexible printed circuit board, and the electromagnetic wave shielding property, the adhesion between the hard and soft printed circuit boards, and the flame retardancy test results were recorded in Table 1. Comparative Example 2 The same procedure as in Example 1 was carried out except that Comparative Example 2 was added with 10% by weight of a flame retardant to the insulating adhesive. The electromagnetic wave shielding structure obtained was pressed against a flexible printed circuit board, and the electromagnetic wave shielding of the electrode shielded film was measured, and the adhesion between the hard and light printed circuit boards and the flame retardancy test results are shown in Table 1. Comparative Example 3 The same procedure as in Example 1 was carried out except that Comparative Example 3 was added with a 35% flame retardant to the conductive adhesive. The electromagnetic wave shielding structure obtained by pressing the obtained electromagnetic wave shielding structure with the flexible printed circuit board and measuring the electromagnetic wave shielding property, the adhesion between the hard and soft printed circuit board and the flame retardancy test results are shown in Table 1. In the test examples, the flexible printed circuit boards having the electromagnetic wave shielding structure prepared in the above Examples 1 to 5 and Comparative Examples 1 to 3 were respectively cut into test pieces of appropriate size to perform electromagnetic wave shielding and between the soft and hard printed circuit boards. Subsequent force, flame retardancy test (UL 94 vertical burning test). (1) Electromagnetic wave shielding: A 13 cm circular electromagnetic wave shielding structure is prepared, and the electromagnetic wave shielding efficiency is measured in accordance with the ASTM 4935 method. (2) Adhesion between the hard and soft printed circuit board: The electromagnetic wave shielding structure is bonded to the grounding line side hot pressing roller of the flexible printed circuit board, and then hot pressed at 180 °C for 1 minute under the pressure of 100 kg/cm2. Then, at 17 (TC), the adhesion between the electromagnetic wave shielding structure and the grounding line side of the flexible printed circuit board was tested at a speed of 50 faces/min and a peeling angle of 90 degrees using a universal tensile machine. (3) Flame retardancy ( UL-94 vertical burning test): The electromagnetic wave shielding structure was cut to a length of 4 cm, a width of 50 cm, and aged for 1 hour at 0 ° C, and subjected to UL-94 V0 vertical flame retardancy test.
實施例 4 實施例 5 比較例 1 比較例 2 比較例 3 實施例 實施例 2 實施例 3 黑色聚醯亞胺膜 12βϊη \2βτα \2βτη \2βχη 25μτη 12//m 12/zm 12/im 絕緣接著層 5//m 5μτη 6μπι Ί βτη Ί μτη 5μγη 6/zm 6/zm 阻燃劑含量 45% 38% 40% 35% 35% 0% 10% 35% 導電膠黏層 15/zm 17jczm 18//m 20βπι 15//m 18/zm 15^m 15/zm 電磁波屏蔽厚度 32βτη 34jcan 36/zm 39βπι 47/zm 35/zm 33/zm 33/zm 電磁波屏蔽性 49 dB 52 dB 53 dB 54 dB 50 dB 52 dB 49 dB 49 dB 接著力（kgftm) 0.87 0.90 0.95 1.10 0.87 0.93 0.88 0.26 kg^cm kg^cm kg^cm kg^cm kg^cm kgfcm kgFcm kgFcm mmAi (UL-94) PASS PASS PASS PASS PASS FAIL FAIL PASSExample 4 Example 5 Comparative Example 1 Comparative Example 2 Comparative Example 3 Example Example 2 Example 3 Black Polyimine Film 12βϊη \2βτα \2βτη \2βχη 25μτη 12//m 12/zm 12/im Insulation Adhesive Layer 5//m 5μτη 6μπι Ί βτη Ί μτη 5μγη 6/zm 6/zm Flame retardant content 45% 38% 40% 35% 35% 0% 10% 35% Conductive adhesive layer 15/zm 17jczm 18//m 20βπι 15//m 18/zm 15^m 15/zm Electromagnetic wave shielding thickness 32βτη 34jcan 36/zm 39βπι 47/zm 35/zm 33/zm 33/zm Electromagnetic shielding effectiveness 49 dB 52 dB 53 dB 54 dB 50 dB 52 dB 49 dB 49 dB Next force (kgftm) 0.87 0.90 0.95 1.10 0.87 0.93 0.88 0.26 kg^cm kg^cm kg^cm kg^cm kg^cm kgfcm kgFcm kgFcm mmAi (UL-94) PASS PASS PASS PASS PASS FAIL FAIL PASS
根據表1之測試結果可知，本創作使用電磁波屏蔽結 構作為軟性印刷電路板之EMI遮罩材料，可以在提高遮罩 效果同時’使軟性印刷電路板具有較佳的接著性與難燃 性。本創作之實施例1至5相較於比較例1至3，本創作 之電磁波屏蔽結構具有較佳的難燃性且並未減少與軟性印 刷電路板之接著特性。 綜上所述’本創作之電磁波屏蔽結構除了具有優異的 電磁波干擾屏蔽及難燃性外，仍保有與軟性印刷電路板之 良好的接著力，因此可取代一般電磁波遮罩膜中的電子 EMI屏蔽材料，且能廣泛適用於翻蓋或滑蓋手機、數位照 相機、數位攝影機、平版電腦、智慧型手機等。 上述實施例僅例示性說明本創作之原理及其功效，而 M441316 非用於限制本創作。任何熟習此項技藝之人士均可在不違 背本創作之精神及範疇下，對上述實施例進行修飾與改 變。因此，本創作之權利保護範圍，應如後述之申請專利 範圍所列。 【圖式簡單說明】 第1圖係本創作之電磁波屏敝結構之結構不意圖，以 及 第2圖係本創作之具有電磁波屏蔽結構之軟性印刷電 路板之結構不意圖。 【主要元件符號說明】 100 、 240 電磁波屏蔽結構 200 具有電磁波屏蔽結構之軟性印刷電路板 110 、 210 黑色聚醯亞胺膜 120 、 220 導電複合膜 121 ' 221 絕緣接著層 122 、 222 導電膠黏層 120a、220a 絕緣接著面 120b、220b 導電膠黏面 230 本體層 230a 接地線路 240a 外表面 12According to the test results of Table 1, the present invention uses an electromagnetic wave shielding structure as an EMI mask material for a flexible printed circuit board, which can improve the mask effect while making the flexible printed circuit board have better adhesion and flame retardancy. Embodiments 1 to 5 of the present invention Compared with Comparative Examples 1 to 3, the electromagnetic wave shielding structure of the present invention has better flame retardancy and does not reduce the subsequent characteristics with the flexible printed circuit board. In summary, the electromagnetic wave shielding structure of the present invention not only has excellent electromagnetic interference shielding and flame retardancy, but also maintains a good adhesion with the flexible printed circuit board, and thus can replace the electronic EMI shielding in the general electromagnetic wave shielding film. Materials, and can be widely used in flip or slide mobile phones, digital cameras, digital cameras, lithography computers, smart phones, etc. The above embodiments are merely illustrative of the principles of the present invention and their effects, and M441316 is not intended to limit the creation. Any person skilled in the art can modify and change the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this creation should be as listed in the scope of the patent application described later. [Simple description of the drawing] Fig. 1 is a schematic diagram of the structure of the electromagnetic wave screen structure of the present invention, and Fig. 2 is not intended to be a structure of a flexible printed circuit board having an electromagnetic wave shielding structure. [Main component symbol description] 100, 240 electromagnetic wave shielding structure 200 Flexible printed circuit board 110, 210 with electromagnetic wave shielding structure Black polyimide film 120, 220 conductive composite film 121 '221 insulating adhesive layer 122, 222 conductive adhesive layer 120a, 220a insulating bonding surface 120b, 220b conductive adhesive surface 230 body layer 230a grounding line 240a outer surface 12