五、新型說明： 【新型所屬之技術領域】 本創作係與散熱有關，更詳而言之，尤指係以延伸架 接受來自散熱n之鱗，增加散絲分熱_，並散叙 器前後皆為簍空狀態，使其通風良好，熱氣流自然對流供 L E D晶片電路板迅速散熱，提高散熱效率的—種散熱器 之延伸架。 【先前技術】 按’先行所知’習知L E D燈需要有良好的散熱器作 政熱，否則有光衰退問題產生，L ED燈係當今節能省電 的趨勢，LED燈產品已具有節能、省電、高效率、反應 時間快、壽命週期長、且不含汞，具有環保效益…等等優 點； 但是’ L E D燈高功率產品輸入功率約為2 〇%能轉 換成光’剩下8 〇%的電能均轉換為熱能，LED燈發光 時所產生的熱能若無法散熱，將會使L ED燈溫度過高， 影響產品生命週期、發光效率、穩定性，L E D燈溫度、 發光效率及壽命之間的關係，據統計，當L eD燈結面溫 度由2 5°C上昇至1 〇 〇。〇時，其發光效率將會衰退2 〇 %到7 5%不等，此外，當l ed燈的環境溫度愈高，其 產哥命亦愈低’當操作溫度由6 3。(：昇到7 4°C時，L E D燈平均哥命將會減少3/4 ; 因此’要提昇L ED燈的發光效率’ L ED燈裝置的 熱散與設計便非常重要，習知L E d燈在散熱器方面，通 常以多片體作延伸散熱面積，然而，考慮到散熱器的體積 不能過於魔大，所以習知L E D燈散熱效果有限，所以目 刖LED燈雖是省電，u不了多久，即有光衰退問題產 生’其使用壽命降低； 有鑑於此，本案創作人乃基於上述弊端，仍積極努力 開發、研究改良’並累積多年製造、生產經驗，而終於有 一足以解決上述弊端之創作產生。 【新型内容】 即，本創作一種散熱器之延伸架，其主要目的係以延 伸架接文來自散熱器之熱源，增加散熱器之散熱面積。 本創作一種散熱器之延伸架，其次一目的係提供散熱 器則後皆為簍空狀態，使其通風良好，熱氣流自然對流供 L E D晶片電路板迅速散熱，提高散熱效率。 緣是’本創作一種散熱器之延伸架，其係包含有： 一延伸架，為一框體，延伸架内有一平板，平板内至 少設有一嵌入孔，嵌入孔内置入一散熱器； 一散熱器，設有至少一容置槽、數個散熱片及一卡止 件，容置槽供L E D晶片電路棱組入，容置槽另面為散熱 片’散熱片相平行’以卡止件作架設及貼觸散熱器於延伸 架上; 據此，以延伸架接受來自散熱器之熱源，增加散熱器 之散熱面積，供L ED晶片電路板迅速散熱，提高散熱效 率。 為使貴審查委員，對本創作之内容、轉徵及目的， 有著更進一步之瞭解與認同，茲舉一較佳實施例，並配合 圖式、圖號說明於后： 【實施方式】 首先’本創作一種散熱器之延伸架，第一實施例，如 第一、二、三、四、五、六圖所示，其係包含有一延伸架 10及一散熱器2 〇，延伸架10為一框體，組裝於輕鋼 架之天花板上，延伸架1〇内有一平板i i，平板i工内 至少没有一嵌入孔12(第六圖所示），嵌入孔12内置 入一散熱器2 0，延伸架1〇及平板1丄皆為金屬製品， 月欠熱2 0作結合一燈罩2 1及·—^止件2 2 (第二、三 、四、五圖所示.），散熱器2 〇設有兩個容置槽2 3、數 個散熱片24、-組左右對稱的上嵌槽2 5及—組左右對 稱的下絲2 6 ’容置槽2 3為斜向供L E D晶>1電路板 2 0 〇組人（第五圖所示），容置槽2 3另面為數個散熱 片2 4，數個散熱片2 4相平行，上紐2 5位於容置槽 2 3兩侧’下嵌槽2 6也位於容置槽2 3兩側，上錢2 5位於下嵌槽2 6上方’上織2 5提供-卡止件2 2作 結合； 一卡止件2 2 ’卡止件22兩邊設有凸緣22 1組入 於上嵌槽2 5内’燈罩21設有兩對稱之邊緣2 i丄，將 邊緣211組入於散熱器之下嵌槽2 6，使燈罩2丄定位 於散熱器2 0下方’卡止件2 2作卡止於延伸架i 〇之框 體上’以卡止件2 2作架設及貼觸散熱ϋ於延伸架1 ◦ 上’散熱器2 0前後、卡止件2 2前後及燈罩21前後皆 為簍空狀態，不作封閉，使其通風良好，熱氣流自然對流， 卡止件2 2前後設有凸出部位2 2 2，凸出部位2 2 2作 卡止於延伸架1〇之上； 藉由上述之結構裝置，本創作一種散熱器之延伸架， 以卡止件2 2前後凸出部位2 2 2作架設及貼觸散熱器2 〇於延伸架1〇上，使散熱器2 〇架設於延伸架i 〇上， 將L ED晶片電路板2 〇 〇組入兩個容置槽2 3内，再將 卡止件2 2兩邊之凸緣2 21組人於上欲槽2 5内，燈罩 21之兩邊緣21 1組入於散熱器之下嵌槽2 6，使燈罩 2 1定位於散熱ϋ2 〇下方，而有關於電猶及變電器放 置於卡止件22内，以隱藏電源線及變電器，該卡止件2 2、容置槽2 3、數個散熱片2 4、上嵌槽2 5及下散槽 2 6皆為金屬製品’如此可仙金屬製品作有效散熱使 散熱器供L ED晶片電路板2 〇 〇散熱，以延伸架i 〇接 文來自散熱器2 Q之熱源，增加散熱器2 Q之散熱面積， 供E D “電路板2 〇 q迅速散熱，提高散熱效率上 述第一實施例的散熱器2 〇呈V型體； —第二實施例的散熱器3 Q呈平板型體，如第七圖所 示，也是架設於第-實施例之延伸架i 0上散熱器3 0 作結合—料3 1及—卡止件3 2，散熱H 3 0設有-個 容置槽3 3、數個散熱片3 4、左右對稱的上嵌槽3 5及-組左右對稱的下嵌槽3 6，容置槽3 3供l e d晶 片電路板組入，容置槽33另面為散熱片34，散轨片3 4相平行，上紐3 5位於容置槽3 3 _，下嵌槽3 6 也位於容置槽3 3兩側，上㈣3 5位於下嵌槽3 6上 方，上錢3 5提供-卡土件3 2作結合，卡止件3 2兩 邊設有凸緣3 21 Μ入於上絲3 5 θ，燈罩3丄設有兩 對稱之邊緣311，將邊緣3丄i組人於散熱器3 〇之下 嵌槽3 6 ’使燈罩31定位於散熱！！ 3 Q下方，卡止件3 2作卡止於延伸架丨〇之上，以卡止件3 2作架設及貼觸 散熱器3 Q於延伸架1〇上，散熱器3 Q前後卡止件^ 2前後及燈罩31前後皆為簍空狀態，不作封閉，使其通 風良好，熱氣流自崎&，卡止件3 2前後設有凸出部位 (圖未示），凸出部位作卡止於延伸架丄〇之上； 第二實施例同第-實施例的功效，以延伸架i 〇接受 來自散熱器20(3◦)之熱源，增加散熱器20(30) 之散熱面積，供LED晶片電路板2 〇 〇迅速散熱’提高 散熱效率； ° 第二實施例’如第八圖所示’延伸架1 〇為一框體， 組裝於輕鋼架之天花板上，延伸架1 Q内有一平板1 1， 將至少一組L E D晶片電路板2 0 0架設於平板1 1，L E D晶片電路板2 0 〇可以使用散熱膠或螺柱接設於平板 1 1，L E D晶片電路板2 〇 Q與平板1 1相貼觸，以平 板1 1當作散熱器之延伸，以延伸架1〇接受來自L ED 晶片電路板2 0 0之熱源，增加之散熱面積，供L ED晶 片電路板2 0 0迅速散熱，提高散熱效率； 綜上所述，本創作一種散熱器之延伸架，其新穎性、 實用性乃毋庸置疑，為此懇祈貴審查委員，一秉國人努 M439334 力創作初衷，賜准本案專利，則申請人是幸！ 【圖式簡單說明】 圖 示意圖 f _圖係本創作第—實施例之立體組合示意Θ 第二圖係本創作第—實施織熱器、燈罩ϋ止件之平面 ，圖係本創作第—實施例散熱器之平面示意圖。 ，四圖係本創作實施例卡止件之平面示意圖。 第五圖係本創作第·'實施纖熱H組紅ED晶片電路 板之平面示意圖。 第六圖係本創作第一實施例散熱器組裝於延伸架之平面 示意圖。 第七圖係本創作第二實施例散熱器之平面示意圖。 第八圖係本創作第三實施例之平面示意圖。 【主要元件符號說明】 1 0延伸架 2 0散熱器 1 1平板 1 2嵌入孔 2 1燈罩 2 2卡止件 2 3容置槽 2 4散熱# 2 5上嵌槽 2 6下嵌槽 3 1 1邊緣 2 2 1凸緣 2 1 1邊緣 2 2 2凸出部位 3 0散熱器 3 1燈罩 3 2卡牛 3 3容置槽 3 4散熱片 3 5上嵌槽 3 6下嵌槽 3 2 1凸緣 2 0 0 L ED晶片電路板V. New description: [New technology field] This creation department is related to heat dissipation. In more detail, especially the extension frame accepts the scale from the heat dissipation n, increases the heat dissipation of the loose wire _, and before and after the scatterer All of them are hollowed out, which makes them well ventilated, and the hot air flow naturally converges for the LED chip circuit board to quickly dissipate heat, improving the heat dissipation efficiency of the radiator extension. [Prior Art] According to the 'first known' LED lights need to have a good heat sink for heat, otherwise there will be light degradation problems, L ED lights are the trend of energy saving today, LED lights have energy saving, save Electricity, high efficiency, fast reaction time, long life cycle, no mercury, environmental benefits, etc.; but 'LED lamp high power product input power is about 2 〇% can be converted into light' remaining 8 〇% The electrical energy is converted into thermal energy. If the thermal energy generated by the LED light is not able to dissipate heat, the temperature of the L ED lamp will be too high, affecting the product life cycle, luminous efficiency, stability, LED lamp temperature, luminous efficiency and lifetime. According to statistics, when the L eD lamp junction temperature rises from 2 5 ° C to 1 〇〇. When 〇, its luminous efficiency will decline by 2 〇 % to 7 5%. In addition, the higher the ambient temperature of the ed lamp, the lower its production life is when the operating temperature is 6 3 . (: When the temperature rises to 7 4 °C, the average life of LED lights will be reduced by 3/4; therefore, 'to improve the luminous efficiency of L ED lamps' L ED lamp device heat dissipation and design is very important, the conventional LE d In terms of the heat sink, the heat dissipation area is usually extended by a plurality of sheets. However, considering that the volume of the heat sink cannot be too large, the conventional LED light has limited heat dissipation effect, so that the LED light is power saving, u can't. How long does it take, that is, the problem of light decay produces 'the service life is reduced; in view of this, the creators of this case are still actively working hard to develop, research and improve' and accumulate years of manufacturing and production experience based on the above drawbacks, and finally have a solution to the above drawbacks. The creation of the new content. [New content] That is, the creation of a heat sink extension frame, the main purpose of which is to extend the heat source from the heat sink of the heat sink to increase the heat dissipation area of the heat sink. One purpose is to provide a heat sink, which is then hollowed out, so that it is well ventilated, and the hot air flow naturally convects for the LED chip circuit board to quickly dissipate heat and improve heat dissipation efficiency. The present invention relates to an extension of a heat sink, which comprises: an extension frame, a frame body, a flat plate in the extension frame, at least one insertion hole in the plate, and a heat sink embedded in the insertion hole; The utility model is provided with at least one accommodating groove, a plurality of heat sinks and a latching member, and the accommodating groove is formed by arranging the LED chip circuit ribs, and the other side of the accommodating groove is a heat sink “the heat sink is parallel” to be erected by the locking component and The heat sink is attached to the extension frame; accordingly, the heat source from the heat sink is received by the extension frame, and the heat dissipation area of the heat sink is increased, so that the L ED chip circuit board can quickly dissipate heat and improve heat dissipation efficiency. The contents, the transfer and the purpose have a further understanding and recognition. A preferred embodiment is described with reference to the drawings and figure numbers: [Embodiment] Firstly, a heat sink extension is created. The first embodiment, as shown in the first, second, third, fourth, fifth, and sixth figures, includes an extension frame 10 and a heat sink 2, and the extension frame 10 is a frame body assembled in a light steel frame. Ceiling, extension 1 There is a flat plate ii in the cymbal, and at least one insertion hole 12 is not included in the flat i (the sixth figure is shown), the embedded hole 12 is built into a heat sink 20, and the extension frame 1 and the plate 1 are all metal products. The heat 20 is combined with a lampshade 2 1 and a ^ 2 stopper 2 2 (shown in the second, third, fourth, and fifth figures). The heat sink 2 is provided with two accommodating grooves 2 3 and a plurality of heat sinks. 24, - group symmetrical upper embedding groove 2 5 and - group symmetrical lower wire 2 6 ' accommodating groove 2 3 is oblique for LED crystal > 1 circuit board 2 0 〇 group (figure fifth The accommodating groove 2 3 is a plurality of fins 24, the plurality of fins 24 are parallel, and the upper button 2 5 is located on both sides of the accommodating groove 2 3 'the lower slot 2 6 is also located in the accommodating groove 2 3 On both sides, the upper money 2 5 is located above the lower molding groove 2 6 'the upper weave 2 5 provides the locking member 2 2 for the joint; one of the locking members 2 2 'the locking member 22 is provided with the flange 22 1 on both sides In the upper slot 2 5, the lamp cover 21 is provided with two symmetrical edges 2 i 丄, and the edge 211 is assembled under the heat sink under the slot 2 6 so that the lamp cover 2 丄 is positioned under the heat sink 20 0 'locking member 2 2 is locked on the frame of the extension frame i ' 'with the locking member 2 2 Set and contact heat dissipation on the extension frame 1 上 on the front and rear of the radiator 2 0, the front and rear of the locking member 2 2 and the front and rear of the lamp cover 21 are hollowed out, so that they are not closed, so that they are well ventilated, and the hot air flow is naturally convected. The front and back of the piece 2 2 are provided with a protruding portion 2 2 2 , and the protruding portion 2 2 2 is locked on the extension frame 1〇; by the above structural device, the extension frame of the heat sink is created with the locking piece 2 2 front and rear protruding parts 2 2 2 for erection and contact with the heat sink 2 〇 on the extension frame 1 ,, so that the heat sink 2 〇 is placed on the extension frame i 将, the L ED chip circuit board 2 〇〇 into two In the accommodating groove 2 3 , the flange 2 21 on both sides of the locking member 2 2 is placed in the upper groove 2 5 , and the two edges 21 1 of the lamp cover 21 are assembled in the lower surface of the heat sink 2 6 . The lampshade 2 1 is positioned under the heat sink 2 ,, and the electrical insulator is placed in the latch 22 to hide the power cord and the transformer, the latch 2 2, the receiving slot 2 3, and several The heat sink 2 4, the upper slot 2 5 and the lower slot 6 6 are all metal products, so that the heat sink can effectively dissipate the heat sink for the L ED chip circuit board 2 The heat is extended from the heat source of the heat sink 2 Q to increase the heat dissipation area of the heat sink 2 Q for the ED "circuit board 2 〇q to quickly dissipate heat and improve the heat dissipation efficiency. The heat sink 2 of the first embodiment described above" The heat sink 3 Q of the second embodiment is a flat plate body, as shown in the seventh figure, and is also mounted on the extension frame i 0 of the first embodiment for the heat sink 30 as a bonding material 3 1 And the locking member 3 2, the heat dissipation H 3 0 is provided with a receiving groove 3 3 , a plurality of heat sinks 34 , a left and right symmetrical upper fitting groove 3 5 and a group of left and right symmetrical lower fitting grooves 3 6 The slot 3 3 is for the LED chip circuit board to be assembled, the receiving slot 33 is the heat sink 34, the loose rail 34 is parallel, the upper button 35 is located in the receiving slot 3 3 _, and the lower slot 3 6 is also located. The two sides of the receiving groove 3 3 are located above the lower fitting groove 3 6 , and the upper part of the locking piece 3 5 is provided with a clamping member 3 2 , and the locking piece 3 2 is provided with a flange 3 21 on both sides. 3 5 θ, the lampshade 3丄 is provided with two symmetrical edges 311, and the edge 3丄i group is embedded in the radiator 3 〇 under the groove 3 6 ' to position the lamp cover 31 for heat dissipation! ! 3 Q, the locking member 3 2 is locked on the extension frame ,, and the locking member 3 2 is used for erecting and contacting the heat sink 3 Q on the extension frame 1 , and the heat sink 3 Q front and rear locking members ^ 2 front and rear and the front and rear of the lampshade 31 are hollowed out, not closed, so that they are well ventilated, hot air flow from the Saki &, the locking part 3 2 is provided with a protruding part (not shown), the protruding part is used as a card The operation of the second embodiment is the same as that of the first embodiment. The heat source from the heat sink 20 (3◦) is received by the extension frame ,, and the heat dissipation area of the heat sink 20 (30) is increased. LED chip circuit board 2 〇〇 rapid heat dissipation 'improves heat dissipation efficiency; ° second embodiment' as shown in the eighth figure 'extend frame 1 〇 is a frame, assembled on the ceiling of light steel frame, extension frame 1 Q There is a flat plate 1 1, at least one set of LED chip circuit board 200 is mounted on the flat plate 1 1, LED chip circuit board 2 0 〇 can be connected to the flat plate 1 using a thermal adhesive or stud, 1 LED chip circuit board 2 〇Q It is in contact with the flat plate 1 1 , and the flat plate 1 1 is used as an extension of the heat sink, and the extension frame 1 is received from the L ED chip circuit board 2 0 0 The heat source, the increased heat dissipation area, for the L ED chip circuit board 200 heat dissipation quickly, improve the heat dissipation efficiency; In summary, the creation of a heat sink extension frame, its novelty and practicality is unquestionable恳 贵 贵 贵 贵 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a three-dimensional combination of the first embodiment of the present invention. The second figure is the plane of the first implementation of the weaving heat device and the lampshade, and the figure is the first implementation of the creation. A schematic plan view of a heat sink. The four figures are schematic plan views of the locking members of the present embodiment. The fifth picture is a schematic diagram of the implementation of the 'fibrew H group red ED chip circuit board. Fig. 6 is a plan view showing the plane in which the heat sink of the first embodiment of the present invention is assembled to the extension frame. The seventh figure is a schematic plan view of the heat sink of the second embodiment of the present invention. The eighth figure is a schematic plan view of the third embodiment of the present creation. [Main component symbol description] 1 0 extension frame 2 0 heat sink 1 1 plate 1 2 insertion hole 2 1 lamp cover 2 2 card holder 2 3 accommodating groove 2 4 heat dissipation # 2 5 upper groove 2 6 lower groove 3 1 1 edge 2 2 1 flange 2 1 1 edge 2 2 2 protrusion 3 0 heat sink 3 1 lamp cover 3 2 card cow 3 3 accommodating groove 3 4 heat sink 3 5 upper groove 3 6 lower groove 3 2 1 Flange 2 0 0 L ED chip board