五、新型說明： 【新型所屬之技術領域】 本創作是有種電鍍裝置，且制是有關於一種 通於對基板進行電鍍製程的電鍍裝置。 【先前技術】 電鑛技術是-種發展已久的成膜技術，自其問世以 ’即廣泛的應用在各種不同用途與不同領域上。從早期 的ί:為主的裝飾用途’如於容器表面上形成-具有光澤 發展到現今翻於高科技產業，如半導體的 、王中’疋現今科技產業巾不可或缺的-項技術。 在電錢製程中’為防止印刷電路板於傳送過程中搖 板^拄ί仙滾輪裝置來鱗印刷電路板，使印刷電路 月b、，隹持在兩陽極的中間。然而，利用滾輪 碰撞印刷電路板’而對印刷電路板造成到 喷灑至印齡’在印㈣路板的電鍍餘巾’當電錢液 滚輪阻擋住蔽=角度範圍的電鍍液會被 滾輪經過的路=知的滾輪之間行進時， 程中，這此深板上形減跡，在電鍍製 圖形。⑽痕跡’可能會破壞印刷電路板上的電路 f新型内容】 本創作提供一種電鍍裝置， 及電鍍的良率。 γ直其可提高電鍍的均勻度以 本創作提出一種電鍍裝置， 程。電錢裝置包括-電錢槽、對—基板進行電鐘製 片。電鑛槽具有一第一陽^及動=元以及多個導向薄 之相對兩電鍍面。移叙留…h乐一％極，分別面對基板 入或進出電鑛槽。導向薄:成對;3雷用以移動基板進 片之軸向平行於第-陽極及鍍槽内且導向薄 時，導向薄片分別承靠於基板之兩電=基板進入電鍵槽 在本創作之一實施例中，μ、+、A Λ & 犋。 、 上述之各導向薄片為一薄 在本創作之一實施例中，f_ 狀接觸面，適於接觸基板。、之各導向⑽具有一刷 物。在本創作之-實施例中，上述之各導向薄片為一刷狀 縣創作之-實施例中，上述之各導向薄片的厚度介 ;〇’5耄米（mm)至1毫米（mm)之間。 取在本創作之一實施例中，上述之各導向薄片的材質包 括聚丙烯（polypropylene ’ PP)、尼龍（nyl〇n)、氟樹脂 (fluorine resin)、聚乙烯樹脂（polyethylene resin，PE resin ) 或氯乙稀樹脂（polyvinyl chloride resin，PVC resin )。 在本創作之一實施例中，上述之各導向薄片之一夾持 方向垂直於基板之接觸面。 M439061 在本創作之一實施例中，上述之各導向薄片之一失持 方向不垂直於基板之接觸面。 、 在本創作之-實施例中，上述之電錢裝置更包括多個 喷嘴’設置於電㈣内’用⑽基板倾電鑛液。 在本創作之一實施例中，上述之移動單元包括一爽持 件’夾持基板之一上緣並適於移動基板。 基於上述，本創作之電鍍裝置以導向薄片夾持基板， 鲁使基板在被移動單元傳送的過程中，其位置能保持在兩陽 極之間。由於導向薄片的厚度較薄，故可避免導向薄片样 動電鑛液及擾動正電荷的電鍍金屬離子之電流線流向，^ 可減少電鍍液被導向薄片播住而導致基板電鍍不均勻的产 ^，因此可提升電翻品f及電鍵良率。此外，由於導^ 薄片輕薄且具有彈性，故當基板於傳送過程中搖晃時 向薄片不致彳i擊基板的表面，㈣對基板造成化學到傷戍 損毀。因此，本創作確實可提升電鍍良率以及電鍍的匄 度’更可減少基板的損傷。 ~ ► —為讓本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 、 【實施方式】 立圖1是依照本創作之-實施例之一種電鑛農置的俯視 示意圖。圖2是圖1之電鍍裝置的側視示意圖。請同時彔 照圖1及圖2，在本實施例中，電鍍裝置1〇〇適於對二又 板200進行電鍍製程。基板2〇〇例如為印刷電路板或半^ 5 M439061V. New description: [New technical field] This creation is a kind of electroplating device, and the system is related to a plating device for electroplating the substrate. [Prior Art] Electro-mineralization technology is a long-established film-forming technology that has been widely used in various applications and fields. From the early ί: the main decorative use 'as formed on the surface of the container - the luster developed to the current high-tech industry, such as semiconductor, Wang Zhong, nowadays technology industry towel is indispensable - the technology. In the electric money manufacturing process, in order to prevent the printed circuit board from being shaken during the transfer process, the scroll wheel device is used to squash the printed circuit board so that the printed circuit is held in the middle of the two anodes. However, the use of a roller to collide with the printed circuit board' causes the printed circuit board to be sprayed to the printing age of the "plated surface of the printing (four) road board." When the electro-hydraulic liquid roller blocks the cover = the angle range of the plating solution will be passed by the roller The road = knowing when the roller travels between, in the process, this deep plate is reduced in shape, in the plating pattern. (10) Traces 'may break the circuit on the printed circuit board f New content】 This creation provides a plating device and the yield of plating. γ straightness can improve the uniformity of electroplating. The present invention proposes a plating apparatus. The electric money device comprises an electric money slot and a pair of substrates for making an electric clock. The electric ore tank has a first positive electrode and a movable element and a plurality of opposite thin plating faces. The rehearsal stays...H-100% pole, facing the substrate into or out of the electric ore tank. Guide thin: paired; 3 mines are used to move the substrate into the sheet parallel to the first anode and the plating tank and the guide is thin, the guide sheets respectively bear against the two substrates of the substrate = the substrate enters the keyway in the present creation In one embodiment, μ, +, A Λ & Each of the above-mentioned guide sheets is thin. In one embodiment of the present invention, an f-shaped contact surface is adapted to contact the substrate. Each of the guides (10) has a brush. In the present invention, the above-mentioned guide sheets are created by a brush-like county - in the embodiment, the thickness of each of the above-mentioned guide sheets is 〇'5 耄m (mm) to 1 mm (mm) between. In an embodiment of the present invention, the material of each of the guiding sheets comprises polypropylene (PP), nylon (nyl〇n), fluororesin, polyethylene resin (PE resin). Or polyvinyl chloride resin (PVC resin). In one embodiment of the present invention, one of the above-mentioned respective guide sheets is oriented perpendicular to the contact surface of the substrate. M439061 In one embodiment of the present invention, one of the above-mentioned guide sheets has a misalignment direction that is not perpendicular to the contact surface of the substrate. In the present invention, the above-described money-making device further includes a plurality of nozzles ' disposed in the electric (four)' (10) substrate pouring ore. In one embodiment of the present invention, the moving unit includes a holding member that holds an upper edge of the substrate and is adapted to move the substrate. Based on the above, the electroplating apparatus of the present invention holds the substrate with the guide sheets, so that the position of the substrate can be maintained between the two anodes during the conveyance by the moving unit. Since the thickness of the guiding sheet is thin, the current flow direction of the sheet-like electrokinetic ore and the electroplating metal ion disturbing the positive electric charge can be avoided, and the electroplating liquid can be prevented from being guided by the sheet to cause uneven plating of the substrate. Therefore, it can improve the yield of electric products and the yield of electric keys. In addition, since the guide sheet is light and flexible, when the substrate is shaken during transport, the sheet is not hit by the surface of the substrate, and (4) chemical damage to the substrate is caused. Therefore, this creation can indeed improve the plating yield and the degree of plating' to reduce the damage of the substrate. In order to make the above features and advantages of the present invention more comprehensible, the following embodiments are described in detail with reference to the accompanying drawings. [Embodiment] Fig. 1 is a schematic plan view of an electric ore farm according to an embodiment of the present invention. Figure 2 is a side elevational view of the plating apparatus of Figure 1. Referring to FIG. 1 and FIG. 2 simultaneously, in the present embodiment, the plating apparatus 1 is adapted to perform an electroplating process on the second and second plates 200. The substrate 2 is, for example, a printed circuit board or a half ^ 5 M439061
八有一第一陽極112及一第二陽極114，分別面對基板 200之相對兩電鍍面210、220。詳細而言，電鍍的劁二办 。電鍍裝置100包括—電 個導向薄片130。電鍍槽There is a first anode 112 and a second anode 114 facing the opposite plating surfaces 210, 220 of the substrate 200, respectively. In detail, the electroplating of the second is done. The plating apparatus 100 includes an electric guide sheet 130. Plating tank
β -、-*/ 〜批、uy寸們竹。屬-她卞陰極盥 陽極，一外加電堡時’陽極112、114之電鏟金屬會析“ · 正電荷之電鍍金屬離子，而耦接陰極之基板2〇〇的表面則 會聚集帶負電荷之電子。此帶正電荷的電鍍金屬離子會被 電子所帶的負電荷所吸引，並以電鋪11G内之電鍵&做 為介質而流向基板200之表面。其中，正電荷的電鍍金屬 離子之電流線以虛線繪示於圖丨中。當電鍍金屬離子抵達 基板200的表面時，便會與電子結合而形成金屬原子，並 沉積於基板200的表面，形成電鍍金屬層。當電鍍金屬完 全析出或是停止施加外加電壓時，電鍍反應便停止。 鲁 承上述，電鍍裝置1〇〇之導向薄片13〇成對設置於電 鍍，no内，且導向薄片130之軸向平行於第一陽極112 及第二陽極114。在本實施例中，各導向薄片13〇為一薄 膜（thin film)。當基板200進入電鍍槽11〇時，導向薄 片130分別承靠於基板200之兩電鍍面21〇、22〇，以共同 夾持基板200，使基板200在被移動單元12〇傳送的過程 中，其位置能保持在第一陽極112及第二陽極114之間。 6 在本實施例中，電鍍裝置100更可包括多個喷嘴（未繪示） 喷嘴，其設置於電鍍槽110内，用以對基板200喷灑電鍍 液而移動單元120包括一夾持件，用以夾持基板2〇〇之 一上緣。 ，際而言，各導向薄片13〇的厚度介於〇 5毫米（mm) f 1军米（mm)之間，以避免導向薄片13〇擾動電鍍液， f響電鍍的品質，更可減少導向薄片130對基板200的遮 蔽作用。導向薄片130材質包括聚丙烯（polypropylene， ) 尼遽（nyl〇n)、氟樹脂（fluorine resin)、聚乙烯 樹脂（polyethylene resin，PE resin)或氯乙烯樹脂（p〇lyyinyl chloride resin ’ PVC resin)或其他耐酸鹼性之材質，本發 明並對導向薄片130的材質加以限制，只要其具有抗電鍍 液的酸鹼性之特質即可。任何所屬技術領域中具有通常知 識者，皆可依貫際設計需求而自行決定導向薄片13〇的材 質。 如上述之配置，電鍍裝置100以導向薄片130夾持基 板200，由於導向薄片13〇的厚度較薄，故可避免導向薄 ^ 130擾動電鍍液及擾動正電荷的電鍍金屬離子之電流線 视间’更1減少電鐘液被導向薄片i3〇擋住而導致基板2〇〇 電鍍不均勻的情形，因此可提升電鍍的品質及電鍍良率。 此外，由於導向薄片130輕薄且具有彈性，故當基板於傳 送過程中搖晃時’導向薄片13〇不致撞擊基板2〇〇的表面， 進而對基板200造成化學刮傷或損毀。 圖3是依照本創作之另一實施例之一種電鍍裝置的俯 M439061 視示意圖。圖4是圖3之電鍍裝置的側視示意圖。本實施 例沿用前述實施例的元件標號與部分内容，其中採用相同 的標號來表示相同或近似的元件，並且省略了相同技術内 容的說明。關於省略部分的說明可參照前述實施例，本實 施例不再重複贅述。 本實施例之電鍍裝置l〇〇a與前述實施例之電鍍裝置 100大致相似，惟在本實施例中，各導向薄片130a為一薄 膜，且具有刷狀接觸面，適於接觸基板2〇〇。刷狀接觸面 係由薄膜切割而形成。導向薄片13〇a的刷狀接觸面提供導 向薄片130a額外的彈性，使其更不易在與基板2〇〇碰撞時 刮傷基板200。此外’各導向薄片13〇a之一夾持方向ED 垂直於基板200之對應之電鍍面210/220，以共同夾持基 板200，使基板200在被移動單元12〇傳送的過程中，其 位置能保持在第一陽極112及第二陽極114之間。 圖5疋依照本創作之另一實施例之一種電鍍裝置的俯 視示意圖。圖6是圖5之電鍍裝置的側視示意圖。本實施 例沿用前述實施例的元件標號與部分内容，其中採用相同 的標號來表示相同或近似的元件，並且省略了相同技術内 容的說明。關於省略部分的說明可參照前述實施例，本實 施例不再重複贅述。 只 本實施例之電鍍裝置100b與前述實施例之電鐘裝置 100大致相似，惟在本實施例中，各導向薄片i3〇b為二 向刷，適於接觸基板200。導向刷提供導向薄片13〇b額外 的彈性，使其更不易在與基板2〇〇碰撞時到傷基板2〇〇。 8 M439061 此外，各導向薄片之一失持方向ED不垂直於基板 200之對應之電鏟面肩22〇，而與電鑛面肩22()夹一不 為直角的角度，以使基板200於運送過程中搖晃時，減小 導向薄片130b對基板200之電鑛面21〇、22〇的衝擊。 綜上所述，本創作之電鑛農置以導向薄片夾持基板， 使基板在鄉料元舰_財，私置祕持在兩陽 極之間。由於導向薄片的厚度較薄，故可避免導向薄片擾 動電鐘液及擾動正電荷的電鍍金屬離子之電流線流向 可減少電織被導向料齡而導致基板電鍍不均勾 形，因此可提升電_品質及電料率。此外，由於導向 薄片輕薄且具有彈性，故當基板於傳送過程中搖晃時 向薄片不致撞擊基板的表面，進而對基板造成化學刮傷 損毀。因此’本創作確實可提升電鑛良率以及電鍍 度’更可減少基板的損傷。 雖然本創作已以實施例揭露如上，然其並非用以 本創作’任何所屬技術領域中具有通常知識者，在不脫離 本創作之精神和範圍内，當可作些許之更動與潤飾，故 創作之保魏圍當視_之冑請專觸騎界定者為準。 【圖式簡單說明】 -圖1是依照本創作之一實施例之一種電鑛裝置的俯視 b意圖。 圖2是圖1之電鍍裝置的側視示意圖。 圖3是依照本創作之另—實施例之—種電鍵裝置的俯 9 M439061 視示意圖。 圖4是圖3之電鐘裝置的側視示意圖。 圖5是依照本創作之另一實施例之一種電鍍裝置的俯 視不意圖。 圖6是圖5之電嫂裝置的側視示意圖。 【主要元件符號說明】 100、100a、100b :電鍍裝置 110 電鍍槽 112 第 一陽極 114 第 二陽極 120 移動單元 130、130a、130b :導向薄片 200 :基板 210、220 :電鑛面 ED :夾持方向β -, -*/ ~ batch, uy inch bamboo. Dependent - she 卞 cathode 盥 anode, an external electric shovel 'anode 112, 114 shovel metal will analyze · · positive charge plating metal ions, and the surface of the substrate 2 耦 coupled to the cathode will accumulate negatively charged The positively charged electroplated metal ions are attracted by the negative charge carried by the electrons, and flow to the surface of the substrate 200 as a medium by the electric bonds & in the electric shop 11G. Among them, the positively charged electroplated metal ions The current lines are shown in broken lines in the figure. When the plating metal ions reach the surface of the substrate 200, they are combined with electrons to form metal atoms, and are deposited on the surface of the substrate 200 to form a plated metal layer. When the applied voltage is deposited or stopped, the plating reaction is stopped. As described above, the guiding sheets 13 of the plating apparatus 1 are disposed in pairs, and the axial direction of the guiding sheets 130 is parallel to the first anode 112. And the second anode 114. In the embodiment, each of the guiding sheets 13 is a thin film. When the substrate 200 enters the plating tank 11 , the guiding sheets 130 respectively bear against the substrate 200 The plating surfaces 21〇, 22〇 are used to sandwich the substrate 200 together, and the substrate 200 can be held between the first anode 112 and the second anode 114 during the conveyance by the moving unit 12〇. 6 In this embodiment For example, the electroplating apparatus 100 further includes a plurality of nozzles (not shown) disposed in the plating tank 110 for spraying the plating solution on the substrate 200 and the moving unit 120 includes a clamping member for clamping The upper edge of one of the substrates 2 。. In other words, the thickness of each of the guide sheets 13 〇 is between 〇 5 mm (mm) f 1 mm (mm) to avoid the guide sheet 13 〇 disturbing the plating solution, f The quality of the plating plate can further reduce the shielding effect of the guiding sheet 130 on the substrate 200. The material of the guiding sheet 130 includes polypropylene, nyl〇n, fluorine resin, polyethylene resin. , PE resin) or vinyl chloride resin (PVC resin) or other acid and alkali resistant materials, the present invention and the material of the guide sheet 130 is limited as long as it has acid and alkali resistance to plating solution Traits can be. Any belonging In the field of general knowledge, the material of the guide sheet 13 can be determined according to the design requirements. As described above, the plating apparatus 100 holds the substrate 200 with the guide sheet 130, because the thickness of the guide sheet 13 is higher. Thin, so that the current line of the plating metal ion that disturbs the plating solution and disturbs the positive charge can be avoided, and the electric current is prevented from being unevenly plated by the guiding sheet i3. Therefore, the quality of plating and the plating yield can be improved. Further, since the guide sheet 130 is light and flexible, the guide sheet 13 does not hit the surface of the substrate 2 when the substrate is shaken during the transfer, thereby causing chemical scratching or damage to the substrate 200. Figure 3 is a schematic elevational view of a plating apparatus in accordance with another embodiment of the present invention. Figure 4 is a side elevational view of the plating apparatus of Figure 3. The same reference numerals are used to designate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the detailed description of the embodiments will not be repeated. The electroplating apparatus 10a of the present embodiment is substantially similar to the electroplating apparatus 100 of the foregoing embodiment. However, in the present embodiment, each of the guiding sheets 130a is a thin film and has a brush-like contact surface suitable for contacting the substrate 2〇〇. . The brush contact surface is formed by cutting a film. The brush-like contact surface of the guide sheet 13A provides additional elasticity to the guide sheet 130a, making it more difficult to scratch the substrate 200 when colliding with the substrate 2A. In addition, the holding direction ED of one of the guiding sheets 13A is perpendicular to the corresponding plating surface 210/220 of the substrate 200 to collectively clamp the substrate 200 so that the substrate 200 is in the process of being transported by the moving unit 12, its position. It can be held between the first anode 112 and the second anode 114. Figure 5 is a top plan view of a plating apparatus in accordance with another embodiment of the present invention. Figure 6 is a side elevational view of the plating apparatus of Figure 5. The same reference numerals are used to designate the same or similar elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the detailed description of the embodiments will not be repeated. Only the electroplating apparatus 100b of the present embodiment is substantially similar to the electric clock apparatus 100 of the foregoing embodiment, except that in the present embodiment, each of the guide sheets i3〇b is a two-way brush adapted to contact the substrate 200. The guide brush provides additional flexibility to the guide sheet 13b, making it less susceptible to damage to the substrate 2 when it collides with the substrate 2. 8 M439061 In addition, one of the guiding sheets has a misalignment direction ED that is not perpendicular to the corresponding shovel shoulder 22 of the substrate 200, and is not at a right angle to the electrode shoulder 22 () so that the substrate 200 is When the vehicle is shaken during transportation, the impact of the guide sheets 130b on the electric ore surfaces 21, 22 of the substrate 200 is reduced. In summary, the electric ore farmer of the present invention holds the substrate with a guide sheet, so that the substrate is held between the two anodes. Since the thickness of the guiding sheet is thin, the current flow of the electroplating metal ions that disturbs the electric bell liquid and disturbs the positive electric charge can be prevented, and the electroplating can be reduced to cause the uneven plating of the substrate, thereby improving the electric power. _Quality and electrical rate. Further, since the guide sheet is light and flexible, when the substrate is shaken during conveyance, the sheet does not hit the surface of the substrate, thereby causing chemical scratch damage to the substrate. Therefore, 'this creation can indeed improve the yield of electric ore and the degree of plating' can reduce the damage of the substrate. Although the present invention has been disclosed in the above embodiments, it is not intended to be used in the art of any of the art, and it is possible to make some changes and refinements without departing from the spirit and scope of the present invention. The protection of Wei Wei is regarded as the _ 胄 胄 胄 专 专 专 专 专 专 专 专 专BRIEF DESCRIPTION OF THE DRAWINGS - Fig. 1 is a plan view of an electric ore device according to an embodiment of the present invention. Figure 2 is a side elevational view of the plating apparatus of Figure 1. Figure 3 is a schematic elevational view of a type of key device in accordance with another embodiment of the present invention. 4 is a side elevational view of the electric clock device of FIG. 3. Figure 5 is a top view of a plating apparatus in accordance with another embodiment of the present invention. Figure 6 is a side elevational view of the electric device of Figure 5. [Main component symbol description] 100, 100a, 100b: plating apparatus 110 plating tank 112 first anode 114 second anode 120 moving unit 130, 130a, 130b: guide sheet 200: substrate 210, 220: electric ore surface ED: clamping direction