M436827 五、新型說明： 【新型所屬之技術領域】 本創作係有關於劈裂晶圓的晶圓劈裂機，尤其是有 關於晶圓劈裂機的劈裂取像結構》 【先前技術】 [0002] 請參閱「圖！」與「圖所示，晶圓劈裂機1用於將 曰曰圓2劈裂為一粒粒的晶粒，以進行後續的封裝作業，晶 圓2在進行劈裂之前，會先用雷射切割出橫向與縱向的預 9 切線3，接著將晶圓2貼附一藍膜4加以固定後，藉一固定 夾具5送入一晶圓劈裂機1進行劈裂作業。 晶圓劈裂機1包含一晶圓固定座6、一懸臂桿7、一劈 刀8、一影像擷取元件9、一壓制元件1 〇與一照明光源^ ^ ，該晶圓固定座6夾置該固定夾具5，並可作平面方向的 移動與轉動，該劈刀8固定於該懸臂桿7上且設於該晶圓2 的上方，以進行劈裂作業，且在進行料作#時，為利 用該壓制元件10抵壓該晶圓2，以避免晶圓2勉曲而該 照明光源11則可一體連接設置於該壓制元件1〇上其用 於產生成像光源（圖未示）照射該晶圓2，以穿透晶圓2， 而該影像操取元件9則設於該晶圓2的下方，為用於操取 該晶圓2的影像，以得知該晶圓2的位置。 [0004] 10120872## 編號 據而該晶圓2可藉該晶圓固定座6的位移與該影像操 取元件9對該晶圓2的取像而進行定位，而在定位完成之 後，即可藉該劈刀8的上下位移與該晶圓固定座6的定量 位移，對多個預切線3連續進行劈裂，而該影像操取元件 9則在連續劈裂過程中，持續監控該㈣線3的定位是否 0101 第3頁/共15頁 1012028278-0 [0005]M436827 [0006] [0007] [0008] 偏移，以視偏移的程度補償定位，而當橫向與縱向的預 切線3皆被劈裂之後即完成劈裂作業。 業界為了增加發光二極體的亮度，而改變晶圓製程 ，如在晶圓2利用雷射切割出橫向與縱向的預切線3之前 ，背鍍反射金屬（圖未示），以利用反射金屬具反射光的 特性，使發光二極體所產生的光朝同一方向射出，因而 可增加光取出效率，提高發光二極體的亮度。 然而在晶圓2背鍍反射金屬之後，其利用影像擷取元 件9擷取影像時，此時由於晶圓2不透光，因此設於晶圓2 上方的照明光源，所產生的成像光源入射該晶圓2之後， 無法穿透反射金屬，被設於晶圓2下方的影像擷取元件9 取像，換句話說，對於背鍍金屬的晶圓2來說，無法利用 影像擷取元件9在連續劈裂過程中監控該預切線3的定位 是否偏移，因而大大的減少晶圓2劈裂的良率。 【新型内容】 爰此，本創作之主要目的在於提供一種不透光晶圓 的劈裂取像結構，以應用於不透光晶圓的劈裂作業。 本創作為一種不透光晶圓的劈裂取像結構，安裝於 一晶圓劈裂機上，用於對經過背鍍處理而不透光的一晶 圓進行取像*該晶圓劈裂機具有固定該晶圓的·一晶圓固 定座、一懸臂桿與固定於該懸臂桿上的一劈刀，該劈裂 取像結構包含一上影像擷取元件、一壓制元件與一發光 元件，其中該上影像擷取元件固定於該懸臂桿上，該壓 制元件抵壓該晶圓，該發光元件設置於該晶圓的一側上 方，且該上影像擷取元件位於該晶圓的另一側上方，並 10120872产單编號 A0101 第4頁/共15頁 1012028278-0 M436827 該發光元件產生一成像光源入射該晶圓，並反射至該上 影像擷取元件，又該壓制元件具有供該成像光源通過的 至少一開槽。 [0009] 據此，該上影像擷取元件與該發光元件皆設置於該 晶圓的上方，並該發光元件所產生的成像光源在入射該 晶圓後，會反射至該上影像擷取元件，因此該上影像擷 取元件可對該晶圓取像，亦即可以掌握該晶圓的位置， 在連續劈裂過程中監控該晶圓的定位是否偏移，因而大 大的增加晶圓劈裂的良率。 【實施方式】 [0010] 為俾使貴委員對本創作之特徵、目的及功效，有著 更加深入之瞭解與認同，茲列舉較佳實施例並配合圖式 說明如后： .請參閱「圖3」、「圖4A」與「圖4B」所示，本創 作為一種劈裂取像結構，安裝於一晶圓劈裂機20上，用 於對經過背鍍處理而不透光的一晶圓30進行取像，該晶 圓劈裂機20具有固定該晶圓30的一晶圓固定座21、一懸 臂桿22與固定於該懸臂桿22上的一劈刀23。 本創作包含一上影像擷取元件40、一壓制元件50與 一發光元件60，其中該上影像擷取元件40固定於該懸臂 桿22上，該壓制元件50抵壓該晶圓30，該發光元件60設 置於該晶圓30的一側上方，該發光元件60可以為設置於 該壓制元件50上，且該上影像擷取元件40位於該晶圓30 的另一側上方，並該發光元件60產生一成像光源61入射 該晶圓30，並反射至該上影像擷取元件40。 10120872# 單編號 A〇101 第5頁/共15頁 1012028278-0 M436827 又該壓制元件50具有供該成像光源61通過的至少一 開槽51，且該壓制元件50具有供該劈刀23通過的一劈裂 槽52，並該至少一開槽51可以為二個，並一體成型設於 該劈裂槽52的兩侧，又該二開槽51可以分為上寬下窄而 各形成供該成像光源61掠過的一斜面53。 此外，該發光元件60包令—發光二極體燈條62、一 載板63與一散熱片64，該發光二極體燈條62與該散熱片 64分設於該載板63的兩側，且該散熱片64連接該壓制元 件50。並本創作亦可包含一下影像擷取元件70，該下影 像擷取元件70設於該晶圓30的正下方，其適用於可透光 的晶圓30，並輔助校正本創作的上影像擷取元件40。 如上所述，本創作透過讓該上影像擷取元件與該發 光元件設置於該晶圓的上方，並讓該壓制元件具有供成 像光源通過的至少一開槽，因此該發光元件產生的成像 光源在入射該晶圓後，可以反射至該上影像擷取元件， 因此就算該晶圓不透光，該上影像擷取元件亦可對該晶 圓取像，換句話說可以透過該上影像擷取元件掌握該晶 圓的位置，故在進行劈裂作業時，可以在連續劈裂過程 中監控該晶圓的定位是否偏移，因而可以大大的增加晶 圓劈裂的良率，滿足使用上的需求。 綜上所述僅為本創作的較佳實施例而已，並非用來 限定本創作之實施範圍，即凡依本創作申請專利範圍之 内容所為的等效變化與修飾，皆應為本創作之技術範疇 【圖式簡單說明】 1012028278-0 [0011] 圖1，係習知晶圓之結構圖。 1()12()872f單编號A0101 第6頁/共15頁 M436827 [0012] 圖2，係習知晶圓劈裂機結構圖。 [0013] 圖3，係本創作晶圓劈裂機立體結構圖。 [0014] 圖4A，係本創作晶圓劈裂機局部剖視圖。 [0015] 圖4B，係本創作圖4A局部放大圖。 【主要元件符號說明】 [0016] 習知 [0017] 1:晶圓劈裂機 [0018] 2 :晶圓 [0019] 3 :預切線 [0020] 4 :藍膜 [0021] 5:固定夾具 [0022] 6 :晶圓固定座 [0023] 7 :懸臂桿 [0024] 8 :劈刀 [0025] 9 :影像擷取元件 [0026] 10 :壓制元件 [0027] 11 :照明光源 [0028] 本創作 [0029] 20:晶圓劈裂機 [0030] 21 :晶圓固定座 10120872#單編號 A〇101 第7頁/共15頁 1012028278-0 M436827 [0031] 22 :懸臂桿 [0032] 23 :劈刀 [0033] 3 0 ·晶圓 [0034] 40 :上影像擷取元件 [0035] 50 :壓制元件 [0036] 51 :開槽 [0037] 52 :劈裂槽 [0038] 53 :斜面 [0039] 60 :發光元件 [0040] 61 :成像光源 [0041] 62 :發光二極體燈條 [0042] 63 :載板 [0043] 64 :散熱片 [0044] 70 :下影像擷取元件 仙靈产單編號A0101 第8頁/共15頁 1012028278-0M436827 V. New Description: [New Technology Field] This is a wafer splitting machine for splitting wafers, especially for the splitting and image-removing structure of wafer splitting machine. [Prior Art] [0002 Please refer to "Figure!" and "Figure, wafer splitting machine 1 is used to split the round 2 into a grain of grain for subsequent packaging operations, wafer 2 is undergoing splitting Previously, the horizontal and vertical pre-cut lines 3 are first cut by laser, and then the wafer 2 is attached with a blue film 4 to be fixed, and then sent to a wafer splitting machine 1 for chopping by a fixing jig 5. The wafer splitting machine 1 comprises a wafer holder 6, a cantilever rod 7, a file 8, an image capturing member 9, a pressing member 1 and an illumination source, and the wafer holder 6 affixing the fixing jig 5 and moving and rotating in a plane direction. The boring tool 8 is fixed on the cantilever rod 7 and disposed above the wafer 2 for performing a splitting operation, and is being processed. When the wafer 2 is pressed against the pressing member 10 to prevent the wafer 2 from being distorted, the illumination source 11 can be integrated. An imaging light source (not shown) is disposed on the pressing member 1 to illuminate the wafer 2 to penetrate the wafer 2, and the image capturing component 9 is disposed under the wafer 2, The image of the wafer 2 is used to learn the position of the wafer 2. [0004] 10120872## The wafer 2 can be displaced by the wafer holder 6 and the image manipulation component. 9 Locating the wafer 2, and after the positioning is completed, the plurality of pre-cut lines 3 can be chopped continuously by the up-and-down displacement of the boring tool 8 and the quantitative displacement of the wafer holder 6. And the image manipulation component 9 continuously monitors whether the positioning of the (4) line 3 is 0101 in the continuous cleaving process. 3101/3 pages 1012028278-0 [0005] M436827 [0006] [0007] [0008] Shifting, the positioning is compensated by the degree of visual offset, and the splitting operation is completed when both the lateral and longitudinal pre-cut lines 3 are cleaved. The industry changes the wafer process, such as in the crystal, in order to increase the brightness of the light-emitting diode. Before the circle 2 cuts the transverse and longitudinal pre-cut lines 3 by laser, the back is plated with reflective metal (not shown) to utilize The metal has the characteristic of reflecting light, so that the light generated by the light-emitting diode is emitted in the same direction, thereby increasing the light extraction efficiency and improving the brightness of the light-emitting diode. However, after the wafer 2 is back-plated with reflective metal, the use thereof When the image capturing component 9 captures an image, since the wafer 2 is opaque, the illumination source disposed above the wafer 2 may not penetrate the reflective metal after being incident on the wafer 2 The image capturing component 9 disposed under the wafer 2 is imaged. In other words, for the back metallized wafer 2, the image capturing component 9 cannot be used to monitor the positioning of the pre-cutting line 3 during the continuous cleaving process. Whether it is offset, thus greatly reducing the yield of wafer 2 splitting. [New content] Therefore, the main purpose of this creation is to provide a cleaving and taking structure for opaque wafers for cracking of opaque wafers. The present invention is a cleaving and absorbing structure of an opaque wafer, which is mounted on a wafer splitting machine for taking a wafer which is subjected to back plating and is not transparent to light. a wafer holder fixed to the wafer, a cantilever rod and a trowel fixed to the cantilever rod, the cleavage image capturing structure comprising an upper image capturing element, a pressing element and a illuminating element, wherein The upper image capturing component is fixed on the cantilever beam, the pressing component is pressed against the wafer, the light emitting component is disposed on one side of the wafer, and the upper image capturing component is located on the other side of the wafer Above, and 10120872, order number A0101, page 4 / total 15 pages 1012028278-0 M436827 The light-emitting element generates an imaging light source incident on the wafer and is reflected to the upper image capturing element, and the pressing element has the image for the imaging At least one slot through which the light source passes. According to the above, the upper image capturing component and the light emitting component are disposed above the wafer, and the imaging light source generated by the light emitting component is reflected to the upper image capturing component after being incident on the wafer. Therefore, the upper image capturing component can image the wafer, that is, the position of the wafer can be grasped, and whether the positioning of the wafer is offset during the continuous cleaving process is greatly increased, thereby greatly increasing the wafer splitting. Yield. [Embodiment] [0010] In order to enable your members to have a deeper understanding and recognition of the features, purposes and effects of this creation, the preferred embodiment is illustrated with the following description: See "Figure 3" As shown in Fig. 4A and Fig. 4B, the present invention is a cleaving imaging structure mounted on a wafer splitting machine 20 for performing a wafer 30 which is subjected to a back plating process and is opaque to light. For example, the wafer splitting machine 20 has a wafer holder 21 for fixing the wafer 30, a cantilever rod 22 and a boring tool 23 fixed to the cantilever rod 22. The present invention comprises an upper image capturing component 40, a pressing component 50 and a light emitting component 60, wherein the upper image capturing component 40 is fixed on the cantilever beam 22, and the pressing component 50 presses the wafer 30, the light emitting The component 60 is disposed on one side of the wafer 30. The light emitting component 60 may be disposed on the pressing component 50, and the upper image capturing component 40 is located on the other side of the wafer 30, and the light emitting component An imaging light source 61 is incident on the wafer 30 and reflected to the upper image capturing element 40. 10120872# Single No. A〇101 Page 5 of 15 1012028278-0 M436827 Further, the pressing member 50 has at least one slot 51 through which the imaging light source 61 passes, and the pressing member 50 has a pass for the file 23. a splitting groove 52, and the at least one groove 51 may be two, and integrally formed on both sides of the splitting groove 52, and the two grooves 51 may be divided into upper width and lower narrow and each formed for the A slope 53 that the imaging source 61 passes over. In addition, the light-emitting element 60 is provided with a light-emitting diode strip 62, a carrier 63 and a heat sink 64. The light-emitting diode strip 62 and the heat sink 64 are disposed on both sides of the carrier 63. And the heat sink 64 is connected to the pressing member 50. The creation may also include an image capturing component 70 disposed directly below the wafer 30, which is adapted for the light transmissive wafer 30 and assists in correcting the image of the creation. Take element 40. As described above, the present invention creates an imaging light source by causing the upper image capturing element and the light emitting element to be disposed above the wafer and having the pressing element have at least one slot for the imaging light source to pass therethrough. After the wafer is incident on the wafer, it can be reflected to the upper image capturing component, so that even if the wafer is opaque, the upper image capturing component can image the wafer, in other words, through the upper image. Taking the component to grasp the position of the wafer, when the cleaving operation is performed, the positioning of the wafer can be monitored during the continuous cleaving process, thereby greatly increasing the yield of the wafer and satisfying the use. Demand. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of implementation of the present invention, that is, the equivalent changes and modifications of the content of the patent application scope of the present invention should be the technology of the creation. [Simplified description of the drawings] 1012028278-0 [0011] FIG. 1 is a structural diagram of a conventional wafer. 1()12() 872f Single No. A0101 Page 6 of 15 M436827 [0012] FIG. 2 is a structural diagram of a conventional wafer splitting machine. [0013] FIG. 3 is a perspective structural view of the wafer splitting machine. [0014] FIG. 4A is a partial cross-sectional view of the wafer splitting machine of the present invention. [0015] FIG. 4B is a partially enlarged view of FIG. 4A. [Main Element Symbol Description] [0017] 1: Wafer Splitting Machine [0018] 2: Wafer [0019] 3: Pre-cutting line [0020] 4: Blue film [0021] 5: Fixing jig [ 0022] 6 : Wafer holder [0023] 7 : Cantilever rod [0024] 8 : File [0025] 9 : Image capture element [0026] 10 : Press element [0027] 11 : Illumination source [0028] This creation [0029] 20: Wafer Splitting Machine [0030] 21: Wafer Mounting 10120872# Single Number A〇101 Page 7/Total 15 Page 1012028278-0 M436827 [0031] 22: Cantilever Rod [0032] 23 : 劈Knife [0033] 3 0 · Wafer [0034] 40 : Upper image capturing element [0035] 50 : Pressing element [0036] 51 : Slotting [0037] 52 : Splitting groove [0038] 53 : Bevel [0039] 60: Light-emitting element [0040] 61: Imaging light source [0041] 62: Light-emitting diode light strip [0042] 63: Carrier board [0043] 64: Heat sink [0044] 70: Lower image capturing element Faerie production order No. A0101 Page 8 of 15 1012028278-0