五 、新型說明： 【新型所屬之技術領域】 回溫箱樞 本創作侧於-種可存放騎的箱子，尤其關於—種使用 鎖控件與計時單元之錫扣溫财具有多個此齡回溫箱的 【先前技術】 現今报多電路板已採用表面黏著技術（gee施邮 =〇hn〇logy，SMT)來連接電子元件，而此電子元件例如是被 或絲元件。詳細而言，表面黏著技術是—種使用錫膏 工二子7G件桿接在電路板上的技術，其帽f的品質會左右電 子耕與電路板之_電性連接品f，_受到重視。 。為了維持錫膏的品質，錫膏通常保存在溫度介於代至 卢H低'皿=中。當要使用錫膏時，會先對錫膏進行回溫 地心而5 ’工作人員在從低溫環境_取出齡之後，會 纽常溫環境（溫度例如是2代）下，並且讓錫膏 、、® t裒兄下Γ過士又回溫時間，以使錫膏自然回溫。 等到回 過之後’此時的錫膏才適合上線U，關綠軒 疋件知·接在電路板上。 办ώ '、果哪心低酿知“兄取出的錫膏沒有經過完整的回溫時間 二U皿的4，此時錫膏會回溫不完全科適合上線使用。 員誤用這種回溫不完全的錫膏來焊接電子元件，則 a ^ - 70件與A路板之間的電性連接品質造成不良影響。 【新型内容】 有4a於此本創作提供—種錫膏回溫箱，其能降低使用上 3/16 述回溫不完全的錫膏的機會。 Μ本創作提供—觀膏回溫紐，其包括上述多個錫膏回溫 箱0 本，丨作提麵膏回溫箱，包括：紐、門板、鎖控件 二十=單元。箱體具有開口及容置空間，開口連通容置空間， 奋置空間用以存放至少一錫膏。門板樞接於箱體，以使門板遮 4開口例如使門板封合開口，此外門板更可暴露開口。鎖 控件配置於|目體鄰近開σ側。計時單元，於預設—回溫時 間内使鎖控件對應鎖固該箱體與該門板。 在本創作另k出一種錫貧回溫箱櫃，包括多個錫膏回溫箱 ，由多個錫膏回溫箱彼此堆疊組成錫膏回溫箱櫃，其中每一錫 膏回溫知包括：碰、門板、雜件與計時單元。箱體具有開 口及容置空間，開口連通容置空間，容置空間用以存放至少一 錫膏。門板樞接於箱體，以使門板遮住開口，例如使門板封 合開口，此外門板更可暴露開口。鎖控件配置於箱體鄰近開 口側。計時單元於預設一回溫時間内使鎖控件對應鎖固 箱體與門板。 基於上述’本辦之錫膏回溫箱櫃及翻溫箱是利用鎖控 件與計時單元，並依擄回溫時間來鎖住或解鎖門板，從而降低 使用回溫不完全的錫膏的機會。 為讓本創作之上述和其他目的、概和優點能更明顯易懂 ’下文特舉本創作之較佳貫施例，並配合所附圖式，作詳細緣 明如下。 、° 【實施方式】 為了充分暸解本創作，於下文將例舉較佳實施例並配合附 4/16 M434202 圖作詳細說明，且其並非用以限定本創作。 圖1為根據本創作—實施例之錫膏回溫箱之立體示意圖 ’而圖2為圖1之錫膏回溫箱被開啟時之立體示意圖。請^ 圖1與圖2 ’―種錫膏回溫箱1可供錫膏8所放置，並且包括 ··二箱體10、-門板12、一鎖控件14、一狀態指示元件π 、一計時單元18、-外表φ 20與一操作介面22，其令箱體 1〇具有開口 Hi及容置空間S1。開口 H1連通容置空間幻， 而容置空間S1用以存放至少一錫膏8。 相體10包括樞接壁板102、承載底板1〇4、頂板1〇6以及 側壁板108 ’其中樞接壁板1〇2、承載底板1〇4、頂板1〇6以 及側壁板103相連並圍繞容置空間SI與開口 H1。樞接壁板 102相對於側壁板]〇8，並樞接門板ι2，且鎖控件14配置於 側壁板108 ’而承載底板1〇4相對於頂板1〇6，並具有承載面 110 ’其中承載面u〇用於放置至少一錫膏8。 ,樞接壁板配置在承載底板與頂板1〇6之間，而承 載底板104配置在樞接壁板1〇2與側壁板1〇8之間。頂板1〇6 配置在樞接壁板1〇2與側壁板1〇8之間，而側壁板1〇8連接承 =底板104與頂板1〇6。以圖】為例，承載底板1〇4可位於箱 體ίο之下側，而頂板106可相對於承载底板1〇4並位於箱體 ίο之上側。樞接壁板102可位於箱體1〇之右側，而側壁板1〇8 可相對於樞接壁板〗〇2並位於箱體1〇之左側。值得注意的是 ，圖1所不的樞接壁板102、承载底板1〇4、頂板1〇6及侧壁 板108四者之間的配置不限於本創作。 門板12樞接於箱體1〇，例如門板12可利用絞鏈來樞接 知體10 ’以使門板12能相對於箱體10而樞轉。如此，門 板12可以遮住開口 H1 ’例如使門板12封合開口 H1，此外 5/16 M434202 門板12更可暴露開口 H1。此外’根據使用需求’可以在門板 12上安裝把手24，讓工作人員可以方便地打開錫膏回溫箱1 〇 鎖控件14配置於箱體10鄰近開口 H1側，並且配置 於側壁板108，其中鎖控件14能鎖固門板12以及對門板 12解鎖。詳細而言’鎖控件14具有門栓142，而門板12 具有對應門栓142的栓孔144。當鎖控件14鎖固門板12時 ，門栓142會伸進栓孔144，以固定住門板12。所以，此時 門板12會遮住開口 H1，例如使門板12封合開口 H1。當鎖 控件14解鎖門板12時，門栓142會從栓孔144縮回。此 時，門板12可相對於箱體1〇而枢轉，因此工作人員能打開 門板12，並從開口 H1取出錫膏8或放置錫膏8。 門板12具有一對應鎖控件14之限位開關122，於 門板12封合時，觸發鎖控件14對應鎖固箱體1〇與門 板12，並啟動計時單元18。詳細而言，限位開關122例 如為直動式限位開關、滾輪式限位開關或微動開關式限位 開關。當門板12封合時’限位開關122觸發門栓142伸進 栓孔144 ’並重新啟動計時單元18計時，當計時單元18計 算完成回溫時間後’計時單元18停止計時，其中限位開關 122觸發門栓142自栓孔144縮回，門板12可被開啟。所以 限位開關122用來限制門板12封合箱體1〇的位置，使門 板12按一定位置被鎖控件14鎖固。值得一提的是，限位 開關122的配置位置不僅限於圖丨與圖2所示。 在本貫施例中，在預設一回溫時間内，鎖控件14合鎖固 門板12 ’而在經過回溫時間後，鎖控件14會解鎖門板12，其 巾k裡所賴回—間是指錫膏8進行自然回溫時所需要的 6/16 M434202 時間。 狀態相示元件16電性連接計時單 20。能> _ _ | κ ，並裸硌於外表面 〇 日不凡件16可以包括至少_個發光二極體（ ^-EmmingDicKle ’ LED)，域態如元件 16 可 ，讓使Γ可以從狀態指示元件16得知鍚膏8是否 16 m’而这些發光二極體分別為 發光二極體。當紅光發光 極肢與綠光 行回溫中。當綠光發光二極體 的回溫時間。 ^衣錫用8經過完整 電子!例如為計時器、石英鐘錶計時器或數位 回溫時π?%欠十异錫膏8的回溫時間’並能顯示剩餘 ^胸相_在下午幾點幾 餘回溫時間 時單元18上所顯示的剩 是錫膏，需要 當計時^接狀'_元件16 ’ 元18之時間仲tr，'麵示7"件16依計時單 。當計時單元18=二域表錫膏8還在進行回溫中。 時單元18之乂 溫時間後，狀態指示元件π依計 溫時間。 號顯示綠光，這代表錫膏8經過完整的回 電性外表面 。操作介面22 具有：表面2°。操作介面22可更 介面與顯示信號給:人:、认t面(未標不），用以提供輸入 〜D 貝，且操作介面22電性連接鎖控件 7/16 M434202 工作人員可透過操作介面22控制鎖 動’而狀態相示元件16根據計時單 14與計時單元π，所以，工十 控件14與計時單元18作動， 元18作動。 當工作人員使用操作介面22來操作錫膏回溫箱i時，工 介面22設定回溫時間’而鎖控件14會根據 此口酿時間來控制門栓142的作動。因此，在回溫時間内 控件14會對應鎖關板12，以減少卫作人員誤用回溫不完全 的錫膏8的機會。在經過回溫時間後，錫膏8 &回溫^全7^ 鎖控件14會解鎖門板12，讓工作人員可以取出錫吏用 〇 基於上述，錫膏回溫箱1可減少工作人員誤用回溫不完全 的錫膏8的齡’制轉電子元件前路板之_電性連接 品質。舉例而t：，當工作人員將錫膏8存放於錫膏回溫箱i時 ，工作人員·操作介® 22來設定回溫時間，例如回溫 設定為12小時。 』 在設定好回溫時間之後，鎖控件14控制門栓142作動， 讓門检U2伸進栓孔m，以使門板^在回溫時間内被鎖控 件Μ鎖固，例如門板12在回溫時間設定後的12小時之内是 不能被開啟。此時，狀態指示元件16顯示為紅光。如此，$ 回溫時間内，工作人員無法打開錫膏回溫箱j而取得錫膏8。 在經過回溫時間後，鎖控件14再次控制門栓142 ^動， 讓門栓142從栓孔144縮回，以使門板12被鎖控件14解鎖。 此時，狀態指示元件16顯示為綠光，而工作人員才能打開門 板12而取得錫膏8。由此可知，錫膏回溫箱1能利用鎖控件 14與計時單元18來管制工作人員取用錫膏8，以防止工作人 員s吳用回溫不完全的錫膏8，避免電子元件與電路板之間的電 8/16 M434202 性連接品質被回溫不完全的錫膏8所影響。 圖3為根據本創作另一實施例之錫膏回溫箱櫃之立體示 意圖。請參閱圖3，錫膏回溫箱櫃2包括多個錫膏回溫箱】 ’因此錫f回溫箱櫃2可以存放很多錫膏8。這些錫膏回溫箱 1彼此堆疊，其中一箱體1〇的承載底板1〇4可疊放在另一箱 體10的頂板1〇6上。也就是說，其中一錫膏回溫箱】之承載 底板104連接另一錫膏回溫箱1之頂板106,而其中一錫膏回 溫箱1位於另一錫膏回溫箱櫃2之上方。 籲在本實_巾，這麵控件14可以纽在齡回溫_ 2的同一侧，例如所有鎖控件Η位在錫膏回溫箱櫃2之左側 ，如圖3所示。然而，在其他實施例中，這些鎖控件μ也 ‘· 可以位在錫膏回溫箱櫃2之右側，或者是這些鎖控件14可 以分別位在錫貧回溫箱櫃2的左右兩側。因此，錫膏回溫箱 櫃2的鎖控件14配置不僅限於圖3所示。 。由於錫膏回溫箱櫃2包括多個錫膏回溫箱】，因此工作人 員可根據不同X作時段來取用不_ f回溫箱丨⑽錫膏8。 • 舉例而言，錫膏回溫箱櫃2的二個錫膏回溫箱1可存放二批回 f時間不是同時結束的錫膏8，射第—鴻f8的回溫時間 =在下午16 k結束，^第二批錫f 8的回溫時間是在晚上 時結，。因此，下午班的工作人員可於下午16時後取用第一 8 ’而晚班的工作人員可於下午2〇時後取用第二批锡 月^在匕玉作人員可根據工作時段，並配合回溫時間，從 錫貧回溫箱櫃2的多個錫膏回溫箱i中取用合適的錫膏卜 圖；4為根據本創作另—實施例之錫膏回溫箱植之 電路方 ίΙΙΛ 圖3與圖4。操作介面22電性連接鎖控件 。柄料18 ’而計時料18電性連接狀態指示元件16 9/16 M434202 ，其中限位開關122電性連接鎖控件14愈叶時 二詳細而言，錫膏回溫箱櫃2更包括多個外表面2g以^ 細作介面22，如圖3所示。這些操作介面22 對應的計時單元18以及相對應的鎖控件14，而這 22裸露於相對應的外表面2〇。 一、hi面 在其他實施例中，錫膏回溫箱櫃2只有一外表面2 -操作介面22，操作介面22電性連接計時單幻8以 件14，且操作介面22裸露於外表面。換句話說，一個操; 介面22裸露於-面外表面2〇,並可分別控制多個計時單元 與多個鎖控件Μ。當1作人S使用錫f回溫紐2，並透過一 個操作介面22輸人纽回溫時間，之後，各計料元18控 相對應的鎖控件14鎖固門板]2 〇 · 工 值付注意的是，多個狀態指示元件16分別電性連接 應的計時單7G 18，並裸露於這些外表面2Q。不過，在其 施例中’這些狀H指示元件16裸露於_面外表面2G，並分 電性連接減應輯時單元18，詳纟_言，狀態指示元 件16受控於相對應的計時單元18作動。 士，外’工作人員除了使用操作介面22來控制鎖控件Μ與 6十呀單元18作動外，工作人員可切換以限位開關122來控制 鎖控件Μ與計時單元18作動。當門板12封合時，限位開關 122觸發鎖控件14對應鎖固箱體1〇與門板12，並啟動 計時單元18，當計時單元18計算完成回溫時間後，計時單 兀18停止計時，其中限位開關122觸發鎖控件14對應解 鎖箱體10與門板12,門板12可被開啟。 “ 圖5為根據本創作另一實施例之錫膏回溫箱櫃之立體示 意圖。請同時參閱圖5與圖3，本實施例提供另一種錫膏回溫 10/16 M4J4202 f櫃=::5:锡膏回溫箱櫃4與圖3中的錫膏回溫箱櫃 2二者結構相似，而以下將對二者所包括的綱树以相阶 :==相：2、4二者的差異在於：錫膏回溫箱櫃 制鎖控件與計時單元18 作介面22來控 件14料時單元18丨動，僅由限位開關122控制鎖控 件14。物早兀18作動，當門板12封合時，限位 :^8控二應鎖固箱體1〇與門板12，並啟動計時 早兀18 4物早兀18計算完成回溫時間後，計 =止計時，其中限位開關122觸發鎖 8 體H)與产1板12,門板12可被開啟。十應解鎖相 换岡圖6為也X據本創作另—實施例之錫膏回溫箱櫃之電路方 閱圖6與圖4,本實施例提供另—種錫 =榧4之㊄路箱，其中圖6的錫膏回溫箱樞 =權2之電路架構二者架構相似，而以下將對二= ， /、；錫丹回溫箱櫃4之電路架構不具操作介 22:，立開關122電性連_^ 示元件16，詳細而言，限位開關： 概據料锌元18作動’且狀態指示元件16 需要二Tt錫膏回溫箱櫃及其回溫箱可用於存放 膏回溫π日^t他需要回溫的化學藥劑，其中本創作的锡 ^ 5 創你而此有效地管制工作人員取用錫膏。如此，木 機合、锡1回溫箱能降低1作人員誤用回溫不完全的锡膏的 从會，促使锡膏能經過完整的回溫時間來回溫，以避免回= 11/16V. New type description: [New technical field] The regenerative box pivot is created on the side of the box that can be stored, especially with regard to the use of the lock control and the timing unit. [Previous Technology] Today's multi-boards have been connected to electronic components using surface adhesion technology (GEE), which is, for example, a wire or wire component. In detail, the surface adhesion technique is a technique in which a solder paste 2G 7G rod is attached to a circuit board, and the quality of the cap f is related to the electronic connection of the electronic ploughing and the circuit board. . In order to maintain the quality of the solder paste, the solder paste is usually stored at a temperature ranging from the low to the low H. When the solder paste is to be used, the solder paste will be warmed first and the 5' staff will take the temperature from the low temperature environment, and then the temperature will be normal (the temperature is, for example, 2 generations), and the solder paste, ® t裒 brother squats and returns to the warm time, so that the solder paste naturally returns to temperature. After the return, the solder paste at this time is suitable for the on-line U, and the off-gate is known to be connected to the circuit board. ώ 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 A complete solder paste to solder electronic components, the quality of the electrical connection between a ^ - 70 and the A board is adversely affected. [New content] There are 4a in this creation to provide a solder paste return box, It can reduce the chance of using the incomplete solder paste on 3/16. The creation of this book provides - the cream back to Wennu, which includes the above-mentioned multiple solder paste return box 0, which is used as a noodle cream back to the oven. , including: button, door panel, lock control 20 = unit. The box has an opening and a receiving space, the opening communicates with the accommodating space, and the space is used to store at least one solder paste. The door panel is pivotally connected to the box to make the door panel The cover 4 is, for example, such that the door panel is sealed, and the door panel is further exposed to the opening. The lock control is disposed adjacent to the σ side of the body, and the timing unit locks the lock correspondingly with the lock control during the preset-recovery time. The door panel. In this creation, a tin-reducing thermostat cabinet is included, including a plurality of solder pastes. The returning temperature box is composed of a plurality of solder paste returning boxes stacked on each other to form a solder paste returning temperature cabinet, wherein each solder paste back temperature includes: a bump, a door panel, a miscellaneous piece and a timing unit. The box body has an opening and an accommodating space. The opening is connected to the accommodating space, and the accommodating space is used for storing at least one solder paste. The door panel is pivotally connected to the box body so that the door panel covers the opening, for example, the door panel is sealed with the opening, and the door panel is further exposed to the opening. The box body is adjacent to the open side. The timing unit makes the lock control corresponding to the lock box and the door panel in a preset temperature-refening time. Based on the above-mentioned solder paste back cabinet and the tilting box, the lock control and the timing unit are utilized. And depending on the temperature recovery time to lock or unlock the door panel, thereby reducing the chance of using the incomplete temperature solder paste. To make the above and other purposes, advantages and advantages of this creation more obvious and easy to understand' The preferred embodiment of the creation and the accompanying drawings are described in detail below. [°] In order to fully understand the present creation, the preferred embodiment will be exemplified below and the attached 4/16 M434202 diagram. For detailed explanation, It is not intended to limit the creation. Fig. 1 is a perspective view of a solder paste returning box according to the present creation and embodiment, and Fig. 2 is a perspective view of the solder paste returning box of Fig. 1 when it is opened. And the solder paste 1 of FIG. 2 can be placed in the solder paste 8, and includes two housings 10, a door panel 12, a lock control 14, a state indicating component π, a timing unit 18, - The outer surface φ 20 and an operation interface 22 have an opening Hi and an accommodating space S1. The opening H1 communicates with the accommodating space, and the accommodating space S1 is used for storing at least one solder paste 8. The phase body 10 includes The pivoting wall plate 102, the bearing bottom plate 1〇4, the top plate 1〇6, and the side wall plate 108′, wherein the pivoting wall plate 1〇2, the bearing bottom plate 1〇4, the top plate 1〇6, and the side wall plate 103 are connected and surround the accommodating space SI and opening H1. The pivoting wall panel 102 is opposite to the side wall panel 〇8, and pivots the door panel ι2, and the lock control 14 is disposed on the side wall panel 108' and carries the bottom panel 〇4 relative to the top panel 〇6, and has a bearing surface 110' The surface u is used to place at least one solder paste 8. The pivoting wall plate is disposed between the carrying bottom plate and the top plate 1〇6, and the bearing bottom plate 104 is disposed between the pivoting wall plate 1〇2 and the side wall plate 1〇8. The top plate 1〇6 is disposed between the pivoting wall panel 1〇2 and the side wall panel 1〇8, and the side wall panel 1〇8 is connected to the bottom plate 104 and the top plate 1〇6. For example, the carrier substrate 1〇4 may be located on the lower side of the casing ίο, and the top plate 106 may be located on the upper side of the casing ίο with respect to the carrier substrate 1〇4. The pivoting wall panel 102 can be located on the right side of the casing 1 ,, and the side wall panel 1 〇 8 can be located on the left side of the casing 1 相对 relative to the pivoting wall panel 〇 2 . It should be noted that the configuration between the pivoting wall panel 102, the carrying substrate 1〇4, the top panel 1〇6, and the side wall panel 108, which are not shown in FIG. 1, is not limited to the present invention. The door panel 12 is pivotally connected to the casing 1 . For example, the door panel 12 can be pivoted to the body 10 ′ with a hinge to enable the door panel 12 to pivot relative to the casing 10 . Thus, the door panel 12 can cover the opening H1' such that the door panel 12 closes the opening H1, and the 5/16 M434202 door panel 12 can more expose the opening H1. In addition, the handle 24 can be installed on the door panel 12 according to the use requirement, so that the worker can conveniently open the solder paste returning box. The shackle control 14 is disposed on the side of the box 10 adjacent to the opening H1, and is disposed on the side wall panel 108, wherein The lock control 14 can lock the door panel 12 and unlock the door panel 12. In detail, the lock control 14 has a door latch 142, and the door panel 12 has a bolt hole 144 corresponding to the door latch 142. When the lock control 14 locks the door panel 12, the bolt 142 will extend into the bolt hole 144 to secure the door panel 12. Therefore, at this time, the door panel 12 covers the opening H1, for example, the door panel 12 is sealed with the opening H1. When the lock control 14 unlocks the door panel 12, the door latch 142 is retracted from the bolt hole 144. At this time, the door panel 12 is pivotable relative to the casing 1 so that the worker can open the door panel 12 and take out the solder paste 8 or place the solder paste 8 from the opening H1. The door panel 12 has a limit switch 122 corresponding to the lock control 14. When the door panel 12 is closed, the trigger lock control 14 corresponds to the lock box 1 and the door panel 12, and the timing unit 18 is activated. In detail, the limit switch 122 is, for example, a direct-acting limit switch, a roller type limit switch or a micro-switch type limit switch. When the door panel 12 is sealed, the limit switch 122 triggers the bolt 142 to extend into the bolt hole 144' and restarts the timing unit 18 to count. When the timing unit 18 calculates the completion of the warm-up time, the timing unit 18 stops counting, wherein the limit switch The trigger door latch 142 is retracted from the bolt hole 144 and the door panel 12 can be opened. Therefore, the limit switch 122 is used to limit the position of the door panel 12 to seal the casing 1 , so that the door panel 12 is locked by the lock control 14 at a certain position. It is worth mentioning that the configuration position of the limit switch 122 is not limited to the figure shown in Fig. 2. In the present embodiment, during a preset warm-up time, the lock control 14 locks the door panel 12', and after the warm-up time, the lock control 14 unlocks the door panel 12, and the towel k is returned to the room. It refers to the 6/16 M434202 time required for the solder paste 8 to naturally return to temperature. The state display component 16 is electrically connected to the timesheet 20. Can > _ _ | κ , and barely on the outer surface of the next day, 16 can include at least _ light-emitting diode ( ^-EmmingDicKle 'LED), the domain state as component 16 can be, so that Γ can be indicated from the state Element 16 knows whether or not paste 8 is 16 m' and these light-emitting diodes are respectively light-emitting diodes. When the red light is shining, the limbs and the green light are warmed up. When the green light emitting diode returns to the temperature. ^ clothing tin with 8 through the complete electronics! For example, the timer, quartz watch timer or digital temperature π?% owe ten different solder paste 8 rewarming time 'and can show the remaining ^ chest phase _ in the afternoon The remaining time displayed on the unit 18 is the solder paste. When it is timed, the time is 'connected' to the '16' element 18, and the time is 7'. When the timing unit 18=two-domain solder paste 8 is still undergoing warm-up. After the temperature time of the unit 18, the state indicating element π depends on the temperature time. The number shows green light, which means that the solder paste 8 passes through the complete returning outer surface. The operation interface 22 has a surface of 2°. The operation interface 22 can be more interface and display signals to: human:, recognize t-face (not marked), to provide input ~D shell, and operate interface 22 electrical connection lock control 7/16 M434202 staff can operate through the interface 22 controls the lock' and the state indicator element 16 is actuated according to the chronograph 14 and the chronograph unit π. Therefore, the operative control 14 and the chronograph unit 18 actuate, and the element 18 is actuated. When the worker uses the operating interface 22 to operate the solder paste return tank i, the interface 22 sets the warm-up time ' and the lock control 14 controls the actuation of the latch 142 based on the brewing time. Therefore, the control 14 will correspond to the lock plate 12 during the warm-up time to reduce the chance for the guardian to misuse the solder paste 8 which is not completely warm. After the warm-up time, the solder paste 8 & temperature back ^ 7 lock control 14 will unlock the door panel 12, so that the staff can remove the tin enamel based on the above, the solder paste back to the thermostat 1 can reduce the staff misuse The temperature of the incomplete solder paste 8 is the electrical connection quality of the front panel of the electronic component. For example, t: When the worker deposits the solder paste 8 in the solder paste return tank i, the worker/operation panel 22 sets the temperature recovery time, for example, the temperature is set to 12 hours. After the warm-up time is set, the lock control 14 controls the door latch 142 to move, so that the door check U2 extends into the bolt hole m, so that the door panel ^ is locked by the lock control during the warm-up time, for example, the door panel 12 is warmed up. It cannot be turned on within 12 hours after the time is set. At this time, the status indicating element 16 is displayed in red light. Thus, during the rewarming time, the staff could not open the solder paste back to the thermostat j and obtain the solder paste 8. After the warm-up time has elapsed, the lock control 14 again controls the latch 142 to retract the latch 142 from the latch hole 144 to unlock the door panel 12 by the lock control 14. At this time, the state indicating element 16 is displayed in green light, and the worker can open the door panel 12 to obtain the solder paste 8. It can be seen that the solder paste reheating box 1 can use the lock control 14 and the timing unit 18 to control the staff to use the solder paste 8 to prevent the worker from using the solder paste 8 which is not completely warm, and avoids the electronic components and the circuit. The electrical 8/16 M434202 connection quality between the boards is affected by the incomplete solder paste 8. Figure 3 is a perspective view of a solder paste return cabinet according to another embodiment of the present invention. Referring to FIG. 3, the solder paste return cabinet 2 includes a plurality of solder paste return tanks. ‘ Therefore, the tin f reheat cabinet 2 can store a lot of solder paste 8 . These solder paste reheating tanks 1 are stacked on each other, and a carrier substrate 1 〇 4 of one case 1 可 can be stacked on the top plate 1 〇 6 of the other case 10. That is to say, one of the solder paste returning ovens 104 is connected to the top plate 106 of the other solder paste returning thermostat 1 , and one of the solder paste returning thermostats 1 is located above the other solder paste returning thermostat 2 . In the actual _ towel, this control 14 can be on the same side of the temperature _ 2, for example, all the lock controls are placed on the left side of the solder paste return cabinet 2, as shown in FIG. However, in other embodiments, these lock controls μ may also be located on the right side of the solder paste return cabinet 2, or these lock controls 14 may be located on the left and right sides of the tin-reduced cabinet 2, respectively. Therefore, the configuration of the lock control 14 of the solder paste reheating cabinet 2 is not limited to that shown in FIG. . Since the solder paste return cabinet 2 includes a plurality of solder paste return tanks, the staff can use the _f return tank 10 (10) solder paste 8 according to different X periods. • For example, the two solder paste return tanks of the solder paste return cabinet 2 can store two batches of solder paste 8 that are not at the same time, and the temperature of the first time is the 16k in the afternoon. End, ^ The second batch of tin f 8's warming time is at night. Therefore, the staff of the afternoon class can pick up the first 8' after 16:00 pm and the staff of the evening class can take the second batch of tin months after 2 pm in the afternoon. And in conjunction with the temperature recovery time, a suitable solder paste is taken from a plurality of solder paste reheating boxes i of the tin-returning thermostat cabinet 2; 4 is a solder paste reheating box according to another embodiment of the present invention. Circuit diagram ΙΙΛ Figure 3 and Figure 4. The operation interface 22 is electrically connected to the lock control. The handle material 18' and the timing material 18 are electrically connected to the state indicating component 16 9/16 M434202, wherein the limit switch 122 is electrically connected to the lock control 14 when the leaf is turned over. In detail, the solder paste return cabinet 2 further comprises a plurality of The outer surface 2g is finely interfaced as shown in Fig. 3. These operating interfaces 22 correspond to the timing unit 18 and the corresponding lock control 14, and these 22 are exposed to the corresponding outer surface 2〇. 1. Hi face In other embodiments, the solder paste retro cabinet 2 has only one outer surface 2 - the operation interface 22, the operation interface 22 is electrically connected to the timing module 8 and the operation interface 22 is exposed on the outer surface. In other words, one interface; the interface 22 is exposed to the outer surface 2〇, and the plurality of timing units and the plurality of lock controls can be separately controlled. When 1 is used as the person S, the tin f is used to return to the temperature 2, and the operation time is input through an operation interface 22, after which the respective meter elements 18 control the corresponding lock control 14 to lock the door panel] 2 〇· It is noted that the plurality of status indicating elements 16 are electrically connected to the timing sheets 7G 18, respectively, and are exposed to the outer surfaces 2Q. However, in its embodiment, 'these H indicating elements 16 are exposed to the outer surface 2G and are electrically connected to the subtractive unit 18, and the status indicating element 16 is controlled by the corresponding timing. Unit 18 is actuated. In addition to using the operating interface 22 to control the lock control and the unit 18, the worker can switch the limit switch 122 to control the lock control and the timing unit 18. When the door panel 12 is sealed, the limit switch 122 triggers the lock control 14 to lock the lock box 1 and the door panel 12, and starts the timing unit 18. When the timing unit 18 calculates the completion of the warm-up time, the timer unit 18 stops counting. The limit switch 122 triggers the lock control 14 corresponding to the unlocking box 10 and the door panel 12, and the door panel 12 can be opened. 5 is a perspective view of a solder paste return cabinet according to another embodiment of the present invention. Referring to FIG. 5 and FIG. 3 simultaneously, this embodiment provides another solder paste temperature 10/16 M4J4202 f cabinet =:: 5: The solder paste return cabinet 4 is similar in structure to the solder paste return cabinet 2 in FIG. 3, and the following will be in the order of the two trees included: == phase: 2, 4 The difference is that: the solder paste return cabinet lock control and the timing unit 18 act as the interface 22 to control the unit 18 when the unit 18 is tilted, and only the limit switch 122 controls the lock control 14. The object is activated by 18, when the door panel 12 When sealing, the limit: ^8 control two should lock the box 1 〇 and the door panel 12, and start the timing early 兀 18 4 things early 兀 18 calculation after the completion of the warm-up time, count = stop timing, where the limit switch 122 Trigger lock 8 body H) and production 1 board 12, the door panel 12 can be opened. Ten should be unlocked and replaced with a map. Figure 6 is also a circuit diagram of the solder paste return cabinet according to the present invention. 4, this embodiment provides another five-way box of tin=榧4, wherein the circuit structure of the solder paste return box of FIG. 6 is similar to the structure of the two, and the following will be the second =, /,; Sidan returns to temperature The circuit structure of the cabinet 4 does not have the operation interface 22: the vertical switch 122 is electrically connected to the component 16 . In detail, the limit switch: the zinc element 18 is actuated and the state indicating component 16 needs two Tt solder paste back. The thermostat cabinet and its regenerator can be used to store the cream back to the temperature π day ^t he needs to return to the temperature of the chemical, which created the tin ^ 5 to create you and effectively control the staff to use the solder paste. So, wood The machine and tin 1 thermostat can reduce the accidental use of the solder paste with incomplete temperature. The solder paste can be warmed back and forth through the complete temperature recovery time to avoid back = 11/16
lVlH-J^-ZUZ lVlH-J^-ZUZ 質 不受限 雖缺響電子元件與電路板之間的電性連接品賀 、^ 1作之較佳實施例已揭露如上，然本創作並 於上述實施例，任何所屬技術領域中具有通常知識者，在不脫 離本創作所揭露之範圍内當可作些許之更動與調整，因此本 創作之保護範圍應當以後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為根據本創作一實施例之錫膏回溫箱之立體示意圖。 圖2為圖1之錫膏回溫箱被開啟時之立體示意圖。“ 圖3為根據本創作另一實施例之錫膏回溫箱櫃之立體示 意圖。 圖4為根據本創作另一實施例之錫膏回溫箱櫃之電路方 塊圖。 圖5為根據本創作另一實施例之錫膏回溫箱櫃之令卿一 意圖。 圖6為根據本創作另一實施例之錫膏回溫箱櫃之電路方 塊圖。 【主要元件符號說明】 1 :錫膏回溫箱 8 :錫膏 12 :門板 16 :狀態指示元件 20 :外表面 24 :把手 102 :枢接壁板 2、4 :錫膏回溫箱檣 ⑺：箱體 14 :鎖控件 18 :計時單元 22 :操作介面 104 :承載底板 12/16lVlH-J^-ZUZ lVlH-J^-ZUZ is not limited, although the electrical connection between the electronic components and the circuit board is not limited, the preferred embodiment has been disclosed above, but the creation is In the above-mentioned embodiments, those skilled in the art can make some changes and adjustments without departing from the scope of the present disclosure. Therefore, the scope of protection of the present invention should be defined by the scope of the patent application. quasi. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a solder paste reheating box according to an embodiment of the present invention. 2 is a schematic perspective view of the solder paste return tank of FIG. 1 when it is opened. 3 is a perspective view of a solder paste return cabinet according to another embodiment of the present invention. FIG. 4 is a circuit block diagram of a solder paste return cabinet according to another embodiment of the present invention. Fig. 6 is a block diagram of a solder paste return cabinet according to another embodiment of the present invention. [Main component symbol description] 1 : Solder paste back Thermostat 8: solder paste 12: door panel 16: status indicating element 20: outer surface 24: handle 102: pivoting wall 2, 4: solder paste return tank 樯 (7): box 14: lock control 18: timing unit 22 : Operation interface 104: Carrying the base plate 12/16