M428363 第100223159號專利說明書修正 五、新型說明： 修正日期：101年3月13日 【新型所屬之技術領域】 本創作係關於-種賴機台，特別係關於—種用於測 試一晶片射頻頻率之測試機台。 【先前技術】 ^晶片製造完成後，需進行訊號測試。請參見第i 知技術中，測試治具1G通—上蓋u — 下盍13、一連桿15及一把手17。 — 侧邊相互樞接’連桿15連結於上”：:盖13猎由 中連桿15包括-減壓件，以支^蓋U、，H13之間’其 在使用時’使用者利用把手17掀起上關閉。 測試治具⑺當中。接著，使用者以手方晶片二 11與下蓋13 ’並輸人訊號對晶片進行測試、。^封上蓋 然而’上述測試治具1〇體積龐大、 喿作不易。當大量晶片欲進行測試時， 經濟考量。 導致 不符 且重量較重， 將耗時許久， 【新型内容】 有鐘於此，本創作之目的在於提供〜 片測試機台。 、種易於操作的機 為達上述目的本創作提供一種測試 片進行測試，該測試機台包括：° ’用以對-晶 、—支撐架、一可 M428363 ‘第100223159號專利說明書修正 修正日期：101年3月13日 ' 動平台、一屏蔽裝置及一台座單元。支撐架設置於基座上。 ； 可動平台透過支撐架位移。一屏蔽裝置包括：一第一殼體 以及一第二殼體。第一殼體設置於基座上，且第二殼體設 置於可動平台上。台座單元承接於屏蔽裝置中，用以承載 晶片。其中可動平台之位移可使得第一殼體與第二殼體處 於一開狀態或一闔狀態，且其中，根據開狀態或闔狀態， 測試機台提供晶片一測試環境。 在上述較佳實施例中，台座單元設於第一殼體中，且 攀 包括一第一承載座以及一面向第一承載座的第二承載座’ 其中第一承載座及第二承載座皆設置於第一殼體中，第二 承載座用於承載晶片於其上並移動於一測試位置以及一初 始位置之間。當可動平台位於一第二位置時，第一殼體與 第二殼體處於闔狀態，第二承載座位於測試位置，且第一 承載座電性連接晶片，並且當可動平台位於一第一位置 時，第一殼體與第二殼體處於開狀態，第二承載座位於初 φ 始位置，第二承載座與晶片電性分離。 在上述較佳實施例中，台座單元更包括至少一彈力元 件、一測試台座及一導柱。彈力元件設置於第一承載座與 第二承載座之間。導柱導柱貫穿第一承載座以及第二承載 座。台座單元包括一測試台座，設置於第二殼體之中且包 括至少一定位銷。當第一殼體與第二殼體處於闔狀態時， 測試台座的定位銷貫穿過第二承載座，且測試台座電性連 接晶片以對晶片進行測試。當第一殼體與第二殼體處於開 狀態時，測試台座電性分離晶片以停止測試晶片。 M428363 修正日期··⑼年3抑日 ★在上述較佳實施例中’測試機台更包括一訊號線、一 、—訊號收發模組及—顯示器。訊號線電性連接台 4 之賴台座。衰減^設於訊㈣之上。訊號收發模 生連接訊號線。顯㈣紐連結於訊號收發模組，其 中訊號收發模組電性連接第一承載座。 曰在上述較佳實施例令，支撐架更包括至少一導桿，導 =過可動平台，使可動平“導桿滑動，其 直線。 殼體 在上述較佳實施例中，第-殼體以及第二殼體為金屬 藉由本創作的晶片、3丨 — 片測忒機台，使用者利用簡單的步 驟，元成晶片測試的程庠 序另—方面，本創作的晶片測試 測試的效率。 的獲侍曰曰片測試結果，提昇晶片 【實施方式】 兹配合圖式說明較佳實施例。 請參閱第2、3圖。第？円@ 測試機台的示咅圖，^圖』不本創作之較佳實施例的 分元件的剖面示意圖圖顯示本創作之較佳實施例的部 本創作的測試機A〗 113、-可動平台12〇°_ ^括：一基座11卜一支樓架 一訊號收發模組15G、4屏敝f置i3G、—台座單元140、 -頁不态160、一影像輸送線〗71、 M428363 第1002細號翻翻難正 修正日期：ΚΠ年3月13日 一訊號線173、一衰減器175及一電源線175。 支撐架113 s史置於基座hi上，且包括一把手I”及 二個導桿117。二個導桿117垂直設立於基座lu上。把 手115包括一本體1151、一樞轉件1153及一延伸桿i】55。 福轉件1153連結於支撐架113 ±。把手1151也结於拖轉 件1153之一側，延伸桿1155連結於枢轉件1153連結於把 手1151之相反側並連結於可動平台12〇。藉由樞轉件 1153，把手1151得以樞轉於一固定位置& (第2圖）或一 釋放位置& (第4圖）。 導杯117貫穿可動平台12〇，使可動平台12〇在導桿 m上沿-直線運動。透過支撐_ 113的把+ 115的調整 可動平台120在導桿117上相對於基座U1沿一直線（z 方向）來回移動於一第二位置？1 (第2圖）或一第—位置 P2 (第4圖）之間。 屏蔽裝置130包括：一第一殼體131以及一第二殼邀 133。第一殼體131與第二殼體133彼此面對，且分別嗖漫 於基座m與可動平台120之上。當可動平台12〇位於澤 -位置P1 (第2圖）時’第二殼體133與第一殼體131處 1闔狀態，當可動平台120位於第一位置p2 (第4圖） 時’第二殼體133肖第一殼體131 4於一開狀態。在一且 體實施例中，第一殼體131與第二殼體133皆為金屬製成， 以產生遮蔽效應。 台座單元140承接於該屏蔽裝置13〇之中，且包括·· 7 M428363 第H)〇223159號專利說明書修正. 修正日期：101年3月13日 一第一承載座141、一第二承載座143及一測試台座145。 第一承載座141設置於第一殼體131當中，並連結於影像 輸送線171以及電源線175。第二承載座143設置於第一 冗又體131中，其中第二承載座丨43面向第一承載座141並 藉由複數個彈性元件丨42彼此連結。因此，在無外力施加 於第二承載座丨43時，第二承載座143位於一初始位置Di (第3圖），當一外力施加於第二承載座丨43時，彈性元 件142遭壓縮，第二承载座143朝第一承載座141接近， 並到達一測試位置D,(第5圖）。此外，在本實施例中第 二承載座143包括一凹槽ι46，用於放置一晶片¥於其中。 值得注意的是，為了使第二承載座143來回於初始位 置h (第3圖）與測試位置D2 (第5圖）時不致偏移，可 透過導柱144貫穿於第一承載座141以及第二承載座143, 用以維持第二承載座143與第一承載座141的相對位置。 測試台座145面向第二承載座143並設置於第二殼體 133當中，其中訊號線173穿過第二殼體133電性連结於 測試台座145。測試台座145包括複數個定位銷147, ^功 能將於後方說明。 訊號收發模組150連結於影像輸送線171及一訊號線 Π3,且在此實施例中，連結於第一承載座141的電源線 175同樣地連結於訊號收發模組15〇,但並不應限定於此。 電源線175亦可獨立連結於一電力源。在一具體實施例 中，電源線175供應一 5V/2A的電源輸入。顯示器16〇可 M428363 *第賺細號專利說明書修正 修正日期：10】年3月13日 •選擇性地連結於訊號收發模組15G，用以觀測晶片w的測 試結果。衰減斋177可選擇性的連結於影像輸送線ΐ7ι或 訊號線173以針對傳輸於其_的訊號進行調節。另一方 面’訊號收發模‘組150以及顯示_ 16〇可適應性地放置在 支撐架113上，以減少測試機台1〇〇的體積。 本創作之測試機台⑽的使用方式朗如下··欲對一 .晶片⑺進行訊號測試時，首先將把手115移動至固定位置 _ S】（第2圖），使可動平台12〇位於第一位置ρι(第， 此時第-殼體m與第二殼體133處於開狀態，且第二承 載平台143位於初始位置Dl (第3圖）；放置晶0於第 二承載平台143上預先設定之凹槽146 ;將把手ιΐ5移動 至釋放位置S2 (第4圖），使可動平台12〇在導桿117上 沿一直線（z方向）到達第二位置？2(第4圖）。此時， 此時第-殼體131與第二殼體133處於閨狀態，且測試a 座145的定位銷147 |穿第二承載座143，使彈性元件^ #因測試台座145接近而被壓縮，故第二承載座143沿導柱 141接近第—承載平台141並到達測試位置D2(第5圖）。 值=主意的是’當第一殼體131與第二殼體133處於閨狀 態日寸，該測試機台100提供晶片w 一測試環境，供晶片W 射頻頻率作訊號測試。 /請參照第4、5圖。第二承載座143到達測試位置D2 i , α座單元1 40開始針對晶片W進行測試，其中第—承 載平台141以及測試台座145電性連接於晶片w。詳而t 之，測試台座145藉由晶片W電性連接於第一承载平: 9 M428363 第100223159號翻說明書修正 修正日期：ΗΠ年3月13日 141 ’其中訊號線Π3所傳輸之輪人訊號藉由影像輸送線 171傳遞至訊號收發模組150,或者影像輸送線m所傳輸 之輸入訊號藉由訊號線173傳遞至訊號收發模組15〇，此 時顯示器160將顯示晶片W測試結果。相反的，若晶片益 法正常運作，顯示器16〇將無法顯示晶片㈣試結果。‘，，' 待測試完成後，使用者將把手113移動至固定位置& (第2圖）’使可動平台12〇回到第一位置h (第2圖） 且第二承載平纟⑷回到初始位置匕（第3圖），此時台 座單元140即停止測試晶片w。 綜上所述，透過本創作的測試機台，晶片測 可獲得簡化，且晶片測試的效率也可獲得提升。壬 ㈣已以較佳實施例揭露於上，然其並非用以 二=::f此項技藝者，在不脫㈣^^ w可作些許之更動與潤飾，因此本創作之伴 5隻祀圍當視後附之巾料·圍所界定者為準。 M428363 修正日期：1〇1年3月13曰 第100223159號專利說明書修正. 【圖式簡單說明】 ^圖顯示習知技術中，晶片測試治具的示意圖； :2圖顯不本創作之較佳實施例的測 圖’其中可動平台位於第_位置； L思 第2 _示本創作之較佳實施例的部 -圖:其中第二承載座位於初始位置； M面不 :4圖顯示本創作之較施例的 圖：中可動平台位於第二位置;以及 ^的-意 音圖，1Γ顯示本創作之較佳實施例的部分元件的叫面--圖，其中可動平台位於測試位置。 件的相不M428363 Patent Specification No. 100223159 Amendment 5, New Description: Date of revision: March 13, 101 [Technical field of new type] This creation is about the type of machine, especially for testing a wafer RF frequency. Test machine. [Prior Art] ^ After the wafer fabrication is completed, a signal test is required. Referring to the first technique, the test fixture 1G pass-up cover u-down 盍 13, a link 15 and a handle 17 are provided. - the sides are pivotally connected to each other 'the connecting rod 15 is connected to the upper part':: the cover 13 is hung by the middle link 15 including a decompression element to support the cover U, and between H13 'when in use' the user uses the handle The test fixture (7) is closed. Then, the user tests the wafer with the hand chip 2 11 and the lower cover 13 'and the input signal. ^The cover is closed. It is not easy to do. When a large number of wafers are to be tested, economic considerations. The resulting discrepancies and heavy weight will take a long time. [New content] With this in mind, the purpose of this creation is to provide a ~-testing machine. The easy-to-operate machine provides a test piece for testing the above purpose. The test machine includes: ° 'for the - crystal, the support frame, a M428363' patent specification No. 100223159. Amendment date: 101 years On March 13th, the moving platform, a shielding device and a pedestal unit are arranged on the base. The movable platform is displaced through the support frame. A shielding device comprises: a first housing and a second housing. One shell The first housing is disposed on the movable platform, and the second housing is disposed on the movable platform. The pedestal unit is received in the shielding device for carrying the wafer. The displacement of the movable platform may cause the first housing and the second housing to be opened. a state or a state, and wherein the test machine provides a wafer-test environment according to the open state or the 阖 state. In the above preferred embodiment, the pedestal unit is disposed in the first housing, and the climb includes a first load And a second carrier that faces the first carrier, wherein the first carrier and the second carrier are both disposed in the first housing, and the second carrier is configured to carry the wafer thereon and move to a test position And between the initial positions, when the movable platform is in a second position, the first housing and the second housing are in a state of squat, the second carrier is in a test position, and the first carrier is electrically connected to the wafer, and When the movable platform is in a first position, the first housing and the second housing are in an open state, the second carrier is in an initial position, and the second carrier is electrically separated from the wafer. In the above preferred embodiment The pedestal unit further includes at least one elastic component, a test pedestal and a guide post. The elastic component is disposed between the first carrier and the second carrier. The guide pillar leads through the first carrier and the second carrier. The utility model includes a test pedestal disposed in the second housing and including at least one positioning pin. When the first housing and the second housing are in a squat state, the positioning pin of the test pedestal penetrates through the second carrier, and the test pedestal The wafer is electrically connected to test the wafer. When the first casing and the second casing are in an open state, the test pedestal electrically separates the wafer to stop testing the wafer. M428363 Revision date··(9) Year 3 suppression day ★ In the above comparison In the preferred embodiment, the test machine further includes a signal line, a signal transmission module and a display. The signal line is connected to the pedestal. The attenuation is set on the signal (4). The signal transceiver module connects to the signal line. The display (four) button is connected to the signal transceiver module, wherein the signal transceiver module is electrically connected to the first carrier. In the above preferred embodiment, the support frame further includes at least one guide rod, and the guide shaft is over-movable, so that the movable flat "guide rod slides, and its straight line. The housing is in the above preferred embodiment, the first housing and The second casing is made of metal by the present invention, the wafer, the three-dimensional measuring machine, the user uses a simple step, the process of the wafer testing is another aspect, the efficiency of the wafer testing test of the creation.曰曰 测试 测试 提升 提升 提升 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升A cross-sectional schematic view of a sub-element of a preferred embodiment shows a test machine A of the preferred embodiment of the present invention. 113, - movable platform 12 〇 °_ ^: a pedestal 11 a truss a signal Transceiver module 15G, 4 screen 敝 f set i3G, pedestal unit 140, - page non-state 160, an image transport line 〗 71, M428363 The 1002 fine number is difficult to correct the correct date: March 13th, a signal Line 173, an attenuator 175 and a power line 175. Support frame 113 s Placed on the base hi, comprising a handle and I "and the two guide rods 117. Two guiding rods 117 are vertically disposed on the base lu. The handle 115 includes a body 1151, a pivoting member 1153, and an extension rod i] 55. The bucking member 1153 is coupled to the support frame 113 ±. The handle 1151 is also attached to one side of the towing member 1153, and the extension rod 1155 is coupled to the pivoting member 1153 to be coupled to the opposite side of the handle 1151 and coupled to the movable platform 12A. By the pivoting member 1153, the handle 1151 is pivoted to a fixed position & (Fig. 2) or a release position & (Fig. 4). The guide cup 117 extends through the movable platform 12A, causing the movable platform 12 to move linearly on the guide bar m. Adjustment of the +115 through the support _ 113 The movable platform 120 moves back and forth in a straight line (z direction) relative to the base U1 on the guide 117 to a second position. 1 (Fig. 2) or a - position P2 (Fig. 4). The shielding device 130 includes a first housing 131 and a second housing 133. The first housing 131 and the second housing 133 face each other and are respectively disposed over the base m and the movable platform 120. When the movable platform 12 is located at the position P1 (Fig. 2), the second housing 133 and the first housing 131 are in a state of 1 ,, when the movable platform 120 is at the first position p2 (Fig. 4) The second housing 133 is in the open state of the first housing 131 4 . In one embodiment, the first housing 131 and the second housing 133 are both made of metal to create a shadowing effect. The pedestal unit 140 is received by the shielding device 13 , and includes the modification of the patent specification of the Japanese Patent No. 223159. The date of revision: a first carrier 141 and a second carrier on March 13, 101 143 and a test pedestal 145. The first carrier 141 is disposed in the first housing 131 and is coupled to the image transmission line 171 and the power line 175. The second carrier 143 is disposed in the first redundancy body 131, wherein the second carrier seat 43 faces the first carrier 141 and is coupled to each other by a plurality of elastic members 42. Therefore, when no external force is applied to the second carrier holder 43, the second carrier 143 is located at an initial position Di (Fig. 3), and when an external force is applied to the second carrier holder 43, the elastic member 142 is compressed. The second carrier 143 approaches the first carrier 141 and reaches a test position D (Fig. 5). Further, in the present embodiment, the second carrier 143 includes a recess ι 46 for placing a wafer therein. It should be noted that, in order to prevent the second carrier 143 from moving back and forth between the initial position h (Fig. 3) and the test position D2 (Fig. 5), the guide post 144 can be penetrated through the first carrier 141 and the first The second carrier 143 is configured to maintain the relative position of the second carrier 143 and the first carrier 141. The test pedestal 145 faces the second carrier 143 and is disposed in the second housing 133. The signal line 173 is electrically connected to the test pedestal 145 through the second housing 133. The test pedestal 145 includes a plurality of locating pins 147, the function of which will be described later. The signal transceiver module 150 is coupled to the image transmission line 171 and a signal line Π3. In this embodiment, the power line 175 connected to the first carrier 141 is similarly connected to the signal transceiver module 15 〇, but should not Limited to this. The power line 175 can also be independently connected to a power source. In one embodiment, power line 175 supplies a 5V/2A power input. Display 16 〇 M428363 * The first earned patent specification amendment Date of revision: 10] March 13 • Selectively connected to the signal transceiver module 15G to observe the test results of the wafer w. The attenuation 177 is selectively coupled to the image transport line ΐ7ι or the signal line 173 for adjustment of the signal transmitted thereto. The other side 'signal transceiver module' group 150 and display _ 16 〇 are adaptively placed on the support frame 113 to reduce the volume of the test machine 1 。. The use of the test machine (10) of this creation is as follows: · When performing signal test on a wafer (7), first move the handle 115 to a fixed position _S] (Fig. 2), so that the movable platform 12 is at the first position. Position ρι (first, at this time, the first housing m and the second housing 133 are in an open state, and the second bearing platform 143 is located at the initial position D1 (FIG. 3); the placement of the crystal 0 is preset on the second carrier platform 143. The groove 146; moving the handle ΐ5 to the release position S2 (Fig. 4), causing the movable platform 12 to lie on the guide 117 in a straight line (z direction) to reach the second position ? 2 (Fig. 4). At this time, the first housing 131 and the second housing 133 are in a state of squatting, and the positioning pin 147 of the test a seat 145 passes through the second carrier 143, so that the elastic member ^ is compressed by the proximity of the test pedestal 145, so The second carrier 143 approaches the first carrier platform 141 along the guide post 141 and reaches the test position D2 (Fig. 5). Value = the intention is that when the first housing 131 and the second housing 133 are in a state of paralysis, the The test machine 100 provides a test environment for the wafer w for the signal frequency measurement of the wafer W. / Please refer to 4, 5, the second carrier 143 reaches the test position D2 i , and the α-seat unit 140 starts testing for the wafer W, wherein the first carrier platform 141 and the test pedestal 145 are electrically connected to the wafer w. The test pedestal 145 is electrically connected to the first load bearing plane by the wafer W: 9 M428363 No. 100223159. The revised date of the amendment is: March 13 of the following year 141 'where the signal of the wheel transmitted by the signal line Π3 is transmitted by the image transmission line 171 is transmitted to the signal transceiver module 150, or the input signal transmitted by the image transmission line m is transmitted to the signal transceiver module 15 by the signal line 173. At this time, the display 160 will display the test result of the wafer W. Conversely, if the chip benefits The method works normally, the display 16〇 will not be able to display the wafer (4) test results. ',, ' After the test is completed, the user moves the handle 113 to the fixed position & (Fig. 2) 'to bring the movable platform 12 back to the first Position h (Fig. 2) and the second bearing plate (4) returns to the initial position 第 (Fig. 3), at which time the pedestal unit 140 stops testing the wafer w. In summary, through the creation of the test machine, the wafer Measured And the efficiency of wafer testing can also be improved. (4) has been exposed in the preferred embodiment, but it is not used by the two =::f this artist, can not make off (four) ^ ^ w can make some For the change and retouching, the 5 companions of this creation are subject to the definition of the towel and the enclosure. The date of revision is: Amendment date: March 1, 2011, No. 100223159. Brief Description] The figure shows a schematic diagram of a wafer test fixture in the prior art; 2 shows a map of the preferred embodiment of the present invention, wherein the movable platform is located at the _ position; L思第2 _ shows the creation Part of the preferred embodiment: wherein the second carrier is in the initial position; the M surface is not: Figure 4 shows a diagram of the embodiment of the present invention: the middle movable platform is in the second position; 1 is a diagram showing a part of the components of the preferred embodiment of the present invention, wherein the movable platform is at the test position. The phase of the piece
【主要元件符號說明】 〇〜剛試治具； 1〜上蓋； 13 下蓋； 15 17 連桿； 把手； 100 111 113 115 117 12〇 13〇 測試機台； 基座； 支撐架； 才巴手； 導桿； 可動平台； 屏蔽裝置； M428363 第100223159號專利說明書修正： 修正日期：101年3月I3曰 131 〜第一殼體； 133 〜第二殼體； 140 〜台座單元； 141 〜第一承載座； 143 〜第二承載座； 144 〜導柱； 145 〜測試台座； 146 〜凹槽； 147 〜定位銷； 150 〜訊號收發模組； 160 〜顯示器； 171 〜影像傳輸線； 173 〜訊號線； 175 〜電源線； 177 〜衰減器； Di ’ -初始位置； D2 ’ -測試位置； S.， 固定位置， S2 ’ -釋放位置； P.- -第一位置； p2 - -第二位置。[Main component symbol description] 〇~just test fixture; 1~top cover; 13 lower cover; 15 17 link; handle; 100 111 113 115 117 12〇13〇 test machine; base; support frame; Guide rod; movable platform; shielding device; M428363 Patent Specification No. 100223159: Revision date: March 101 I3曰131 ~ first housing; 133 ~ second housing; 140 ~ pedestal unit; 141 ~ first 143 ~ second carrier; 144 ~ guide column; 145 ~ test pedestal; 146 ~ groove; 147 ~ locating pin; 150 ~ signal transceiver module; 160 ~ display; 171 ~ image transmission line; 173 ~ signal line ; 175 ~ power line; 177 ~ attenuator; Di ' - initial position; D2 ' - test position; S., fixed position, S2 ' - release position; P. - - first position; p2 - - second position.