TWM426970U - High temperature circuit substrate and its associated LED parts - Google Patents

Description

M4-26970 V. New description: [New technical field] This is a circuit board for an electronic component that can be used for high-temperature exothermic heat. In particular, a circuit component for a high-temperature component has an LED component with the substrate. [Prior Art] At present, light-emitting diodes (LEDs) are quite popular, not only small in size, fast in response time, long in service life, low in brightness, and resistant to vibrations. Therefore, LED components are gradually replacing the backlights of the display, the camera flash, Traffic numbers, heads and taillights have even entered the general lighting market. However, with the development of the application of high-power LED lighting equipment, the high thermal current accompanying the high-heat problem is not the current general printed circuit board material or semiconductor substrate, so it has become a topic of great concern. In order to withstand the large amount of thermal energy emitted by high-brightness LEDs, the industry has chosen a ceramic substrate with high temperature resistance or a substrate with high thermal conductivity as a carrier for LED dies.

',,, and k types of shouting substrates are mostly made of, for example, inorganic oxidized powder and about 30% to 50% of the glass material plus organic binder, which is uniformly mixed into a muddy aggregate, ##Using a scraper to destroy the material into a sheet, and then forming a piece of raw material through a drying process, the thief drills a through hole in the raw embryo, and then fills the hole in the metal hole of the through hole. And • printing the metal circuit on the surface of the raw embryo, and finally placed in the sintering furnace for sintering, but for the large amount of hot material separation efficiency of the LED, the thermal conductivity of the substrate is still lower than that of the metal material. The thermal conductivity of the substrate causes the heat dissipation of the LED to be affected.

However, when the wire plate is used as the carrier, since the junction substrate has conductive properties, the required circuit cannot be directly disposed on the surface of the substrate. As shown in FIG. t, the surface of the substrate must be laid first. After the insulating layer 12, the two pairs of enabling pads W 3 M4-26970 are then placed on the insulating layer 12 and the conductive ends of the LED dies 13 are wired to enable The pad 15 is soldered, but this causes the efficiency of heat conduction to be affected by the insulation of the insulating layer 12 between the LED die 13 and the aluminum substrate 11. However, in order to allow the thermal energy generated by the LED dies to be efficiently conducted to the aluminum substrate, a heat conducting column 2 〇 is formed on the surface of the aluminum substrate 21 as shown in FIG. 2, and then In addition, a cup-shaped casing 24 made of a pre-formed non-conductive material is adhered to the aluminum substrate 21, and an opening is formed in the bottom surface of the cup-shaped casing 24 to allow the heat-conducting column 2 to pass through so that the cup-shaped casing body 24 The heat-conducting column 20 can be surrounded, and the inner bottom surface of the cup-shaped casing 24 is further formed with two conductive pads 25 for guiding, and then the LED die 23 is directly disposed on the guide 2(), and The conductive ends of the LED die 2; 3 are respectively connected to the two turns 塾 2S, and finally the light-permeable colloid is injected into the casing 24 (10), 0, 胄LED $ grain 23 ” The heat generated by the heat can be directly guided to the substrate 21 by the heat conducting column 2, and then the heat energy is guided away from the substrate by the substrate, thereby increasing the heat dissipation efficiency. However, the heat conducting column is formed on the substrate. The way, it must be formed on a piece of substrate by using the method of cutting The method is formed in a mold having a predetermined shape or extruded in a squeeze-type manner, so that the heat-conducting column and the substrate can be integrally formed, but when it is manufactured by using a laser cutting method, it is necessary to be - When the substrate is cut, the cut portion is thus wasted, and the size of the substrate for the LED die is about several hundred micrometers. (4) The above-mentioned residual method is difficult to make such a delicate structure. 'And in the production process towel will be pro-cold due to high temperature (four) ringing, but also make the production of the thermal column will produce angle errors.

And the cup-shaped fruit is called twilight and guide _ material, so you can't make LED 4 M4-26970

And the generated field when the light is irradiated to the cup-shaped casing cannot be guided to the substrate through the cup-shaped casing, and further, since the cup-shaped casing is disposed on the substrate in an adhesive manner, the adhesion is performed. The effect is likely to decrease due to the influence of county time or high temperature. Therefore, the quality of the products manufactured through such a process is not excellent, and the product positioning is therefore low. Important direction. [New content] Therefore, 'how to lack supply—the kind of substrate with high thermal conductivity and can be fabricated to form a thermally conductive column' can also accurately and accurately produce the overall structure, especially during the formation of the heat-conducting column. It will cause an angle error due to the temperature difference, and the light emitted by the coffee grains can be more concentrated and fine-direction, and the heat generated when the light emitted by the coffee grains is irradiated can be corrected to the substrate. The surrounding structure on the substrate and surrounding the guide can have a long-term effect. *It will be the creation of the product market competitiveness - the purpose is to provide an electronic element for high temperature heat release. High dispersion

Structure of the circuit board. Another creation of this creation

And accurate structure of the LED components. According to this creation -

An exothermic circuit component, the electric side surface, and the middle pole, the circuit substrate comprising: and wherein at least

The substrate comprises: a substrate body; a layer of at least one through hole bonded to the substrate body to expose the substrate body to at least a portion of the M4-26970 insulating layer; at least one exposed portion of the substrate body through the at least one through hole, away from the a metal thermally conductive column extending thermally in the direction of the substrate body and in close contact with the insulating layer; and a conductive loop formed on the insulating layer of the substrate for guiding the temperature-exothermic circuit component. • An LED assembly according to the present disclosure, comprising: at least one LED die having a di-energy end, • a luminescent light; and a circuit substrate comprising: a substrate body; a layer bonding to the substrate a body-woven surface having at least one perforation for exposing the plate body to at least a portion of the insulating layer; at least one of the exposed portions of the substrate body passing through the at least one through hole and conducting heat away from the substrate body a metal heat conducting column extending and in close contact with the insulating layer for insulating and thermally conducting the LED die; and a conductive loop formed on the insulating layer for contacting the LED die enabling end; at least A pair of enabling pads formed on the insulating layer for guiding the enabling ends of the LED dies; the conductive circuit further comprising a transparent insulating package disposed on the LED dies. Since the circuit substrate for a high-temperature component of the fourth aspect of the present invention and the LED component having the substrate are first attached with a photoresist film on the substrate body, and covered with a photomask having a predetermined pattern on the photoresist film, and then light is performed. The exposure and development of the resist film causes the photoresist film to change its phase structure to form an insulating layer having perforations, and then electroplating the portion of the substrate body exposed from the perforations, so that the gold-based thermally conductive column can be formed in the perforations. It can be in close contact with the insulating layer, and the circuit of the present invention is used. The substrate is fabricated by a lithography process of exposure and development, and the circuit substrate formed with the metal heat-conducting column can be easily fabricated and the metal heat-conducting column formed is not The angle error caused by the temperature difference makes the whole structure can be precisely and accurately produced, and the wire made by the LED die can be more than the same. The thermal energy generated by the surrounding wall can also be guided to the substrate body, and the M4-26970 method formed by the surrounding wall of the present case is also thickened by electroplating from the substrate body. The grounding is therefore higher in adhesion than the casing having a surrounding structure to adhere to the substrate, so that it is not easily released, and all of the above objects are achieved. [Embodiment] (d) The foregoing description of the preferred embodiments of the preferred embodiments of the present invention will be apparent from the detailed description of the preferred embodiments. The first embodiment of the circuit substrate for a high temperature component and the LED component having the substrate is a circuit board which can be provided for a high temperature heat release circuit component such as an LED die or a transistor, wherein the circuit substrate manufacturing process is as shown in FIG. As shown in the first step, a substrate body 41 having a metal material such as copper and a substrate as shown in FIG. 4 and having a plurality of fibers connected to each other as shown in FIG. 4 is formed, so that a v-shaped recess is formed between each of the substrate bodies 41. The fragile portion 415 of the trench is used for separating the main body of the substrate in the future. Of course, as is well understood by those skilled in the art, it is easy to understand that all the components on the substrate are separated 'not necessarily limited to forming a fragile portion in this step. After the rough manufacturing is completed, it is not necessary to separate by simply cutting by, for example, laser cutting. • In step 302, a photoresist film 451 is embossed on the surface of each substrate body 41, and as shown in FIG. 6 and covered with a mask 6 having a ring-hole shape, the photoresist is covered. Next, as in step 3〇4, for example, ultraviolet light is irradiated, so that the light/restriction film 451 not covered by the mask 6 is exposed to change its phase structure, and then the image is washed and developed so that the phase structure is not changed. The portion removed while the phase structure is changed remains on the substrate body 41 to form an insulating layer 45' which is bonded to the surface of the substrate body 41 as shown in Figs. 6 and 7 and which spans the fragile portion 415. The removed portion forms a plurality of perforations corresponding to the mask 6, so that a portion of the substrate body is exposed through the through holes 450. 7 M426970 is then further as step 305, and as shown in FIG. 8, on the substrate body 41 via the through holes 45 〇 • partially away from the substrate body, and in the portion of the substrate body W corresponding to the exposed holes 45 进行 plating - growth - a thermally conductive extended metal heat conducting column 47, wherein the metal heat conducting column 47 is made of a material selected from the group consisting of copper, silver, gold, titanium, titanium alloy, nickel alloy, nickel alloy, chromium alloy, and the like. The metal heat conducting column 47 is in close contact with the insulating layer 45 in the through hole 450. However, the metal heat conducting column 47 may be higher than the surface of the insulating layer 45 after the weft, so that the metal heat transfer column 4 can be reused by the grinder. The exposed portion and the surface of the insulating layer 45 are subjected to precision grinding to make the metal heat conducting column 47 and the insulating layer 45 have a smooth surface structure. Next, as shown in FIG. 9 and FIG. 1( ), two through-insulation layers β and a substrate are drilled by a drill on the surface of the insulating layer 45 and at both sides of the respective metal heat-conducting columns 47. The through hole 485 of the body 41, and in step 3〇7, respectively, an insulated coated enameled wire 486 is disposed in the through hole 485 β, and the two ends of the conductive wire of the enamel wire are respectively attached to a layer for guiding. The solder bumps 481 @ solders, and together constitute a set of conductive loops 48 formed on the insulating layer 45 and penetrating the insulating layer 45 and the substrate body q, and thus, in this step, the sheet has a plurality of sets that have not yet been cut. The substrate of the circuit board 4 is assembled. A circuit board for a high temperature component of the present invention and a second embodiment having the base_LED assembly, the flow of which is shown in FIG. 11, is a circuit substrate formed by continuing the previous embodiment, and is illustrated as an LED 'die. The high temperature exothermic circuit component, so after forming the circuit substrate, as shown in step 3G8, and as shown in FIG. 12, the LED die 8 is soldered to the metal heat conducting column π in an electrically insulating and thermally conductive manner, and then the LED die 8 is The two enabling ends are respectively connected to the enabling soldering, and then, as shown in step 309, a plurality of circuit substrates 4 that have not been separated are co-located into a mold, and a plurality of circuit boards are respectively formed in the mold. The predetermined shape of the cavity is 4, and a transparent material 8 M4-26970 resin is injected into the cavity. After the stencil is removed, a predetermined $-shaped transparent insulating package is formed on each circuit substrate 4. 9 'and completely cover the led die s, and finally, as in step (10), the circuit substrate 4 is separated, that is, the Dutu I3 hemp LED component. The third embodiment of the circuit substrate for a high temperature component and the coffee component having the substrate is as shown in FIG. 15, and the flow of the substrate body 41_ is as shown in FIG. 14, first as in step 4〇1.

On the surface of the side, the ink-on-layer photoresist film 451 is further covered with a mask 6 having a predetermined shape on the photoresist film 451 as in step 4〇2, and then, as in the step, is irradiated with ultraviolet rays, for example, so as not to be irradiated. The photoresist film 451 masked by the mask 6 is exposed to change its phase structure, and then the image is washed and developed, so that the unaltered portion of the phase structure is removed, and the phase change material_ remains on the substrate body , to form a FIG. 16 shows an insulating layer shirt bonded to the surface of the substrate body 41. The removed portion forms a plurality of through holes 45 corresponding to the mask 6, and then, as in the step side, please refer to the figure. The wire body 41 of the wire plate is oriented away from the substrate body 41 via the perforated portion, and is electrically connected to a portion of the substrate body 41 corresponding to the hole 45 (), so that the metal heat conduction column 47 for heat conduction is extended. A surrounding bottom layer 490 surrounds the metal thermally conductive column 47. Next, in step 405, a layer of photoresist film 453 ' is further coated on the insulating layer 45 and the metal heat-conducting column 47, and a light having a predetermined pattern is exposed again, and the light-resist film is used for development to make light. The resist film 453 is only exposed around the bottom layer 490, and then as (4) 4〇6, as shown in FIG. 18, 'electrical ore is again performed, so that the surrounding bottom layer is thickened, and as the step is torn, the photoresist film 453 is removed, so that the thickening is thickened. Surrounding the bottom layer 49〇, forming a surrounding wall as shown in FIG. 19 and FIG. 2B, and the ring 49 of the present example is a ring hole and is partially extended in the direction of the Saki-Metal heat conduction check 47. The surrounding walls 49 respectively comprise two semi-surrounding members 9 M426970 491 ' corresponding to each other and each of the semi-circular members has a two-end edge side, and each of the two corresponding half-surrounding members 491 has a gap between the corresponding edges. 4910. Next, as shown in step 408, the photoresist body is adhered to the substrate body 41, and the photoresist film is covered by a photomask having a predetermined circuit pattern, and then the photoresist film is exposed and developed. The operation 'forms the attached photoresist film to form a predetermined circuit pattern corresponding to the reticle, and performs the ship and plating operation on the substrate body again, that is, forms a conductive loop, wherein the conductive loop 2 includes an enablement toward the metal heat conductive column 47. The pad is similar, and the conductive pad is guided to pass through the energizing electrode segment 483 on the gap side, and as shown in the figure, and as shown in FIG. 22, a plurality of power receiving wires (four) die 8 are The thermally conductive side is cut into the gold hot column 47 and the two enabling ends of the LED die 8 are respectively guided to the enable solder. Finally, as a step, and - and referring to FIG. 23 and FIG. 24, the light permeable dragon is injected into the surrounding wall 49, since the light can be permeable to __lang _ degrees, the light flowing to the side of the gap can be permeable. Because of the influence of stickiness, the surface tension of the light-permeable colloid on the _ side is increased enough to maintain the light-permeable colloid in the surrounding wall 49 and not flow out from the gap side, and is formed after the fine separation. The light-transmissive insulating package 9' of the pellet 8 is formed with a plurality of coffee maker components disposed on the same substrate. Since the high-temperature element _ circuit substrate and the (4) brain component of the case are lithography processes using exposure and development, the circuit substrate on which the metal heat-conducting column is formed can be efficiently and easily fabricated, and the metal heat conduction 职It will not be subject to the angle error caused by the temperature difference, so that the whole sound structure can be precisely and accurately produced, especially in the case of the circuit board with multiple metal heat-conducting columns, which can significantly improve the production efficiency. And the surrounding wall is formed by electroplating thickening from the substrate body, so that the surrounding wall of the present invention has a degree of adhesion M426970 can be attached to the substrate in a manner that adheres to the substrate in a manner that is generally attached to the substrate, so It won't be easy to loosen' because the surrounding wall is made of metal, so the light emitted by the LED die can be reflected, so that the emitted light can be concentratedly emitted in the same direction, and when the LED die emits light, The thermal energy generated by the surrounding wall can also be guided to the substrate body to increase the heat dissipation efficiency of the LED' and achieve all of the above objectives. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto, that is, the equivalent change of the simple call made according to the scope of the new patent application and the content of the new manual is Modifications shall remain within the scope of this new patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a conventionally disposed LED element on a surface of an aluminum substrate and then disposed on the insulating layer to form two pairs of enable pads; FIG. 2 is a conventional The formed cup-shaped casing is adhered to the side view of the LED element disposed on the reduction plate; FIG. 3 is a manufacturing flow chart of the high-temperature element circuit substrate of the first-aged version of the present invention; __ 4 is a high-temperature element in this case A top view of the green body of the Wei substrate; FIG. 5 is a side view of the substrate body imprint-layer photoresist film; FIG. 6 is a thin film of the film of FIG. 5, _ irradiated by the material line Figure 7 is a side view of the substrate body formed on the surface of the substrate body, the insulating layer is formed by a fragile portion, and the insulating layer is further formed with a perforation; and the substrate body of FIG. 7 is exposed to the perforation. Side view of the surface of the electric ore metal heat conduction crucible; M426970 Figure 9 is the surface of the insulating layer of Figure 8 drilled through the hole at the sides of each metal heat-conducting column, respectively, the strip is insulated and covered by the enameled wire (10) Side view of the group-conducting circuit; Figure 1 0 is a plan view of the surface of the insulating layer of FIG. 9; FIG. 11 is a manufacturing flowchart of the circuit substrate for a high temperature component of the second preferred embodiment of the present invention and an LED module having the substrate; FIG. 12 is a second preferred embodiment of the present invention. The LED assembly of the circuit board for the high-temperature heat-dissipating circuit component of the embodiment is a side view of the LED die and is wired (four) scaled pads and packaged; FIG. 13 is a circuit board of FIG. 2 separated by one by one (4) FIG. 14 is a flow chart showing the manufacturing process of the circuit substrate for a high temperature component and the LED module having the substrate according to the third preferred embodiment of the present invention; FIG. 15 is a third embodiment of the present invention having the high temperature heat release. The substrate body of the circuit board for circuit components is stamped with a photoresist film, and then the photoresist film is covered with a pre-filament-shaped photomask, and irradiated with ultraviolet rays, for example, to form a perforated insulating layer. The side view of the substrate body of FIG. 15 corresponds to the exposed surface of the perforation for electrowinning, and extends to a side view of a metal heat conducting column; FIG. 17 is a plating of the portion of the substrate body of the ® 16 corresponding to the perforation. Stretching up - a metal heat-conducting column, and forming a surrounding view of the surrounding layer around the metal; the insulating layer and the metal heat-conducting column of Figure I7 are covered with a photoresist film and covered with a pre-patterned mask After exposure, the photonic acid is developed to expose the bottom layer, and then the bottom view of the bottom layer of the electric age is thickened. 12 After the remaining photoresist film of Fig. 18 is removed, the thickening surrounds the bottom layer to form a surrounding wall. FIG. 2 is a top view of the substrate body of FIG. 19 with a surrounding wall formed thereon, and FIG. 19 is a side view of a film disposed in the wall about a heat conductive contact to a metal heat conducting column; FIG. % of the surrounding wall is not placed in a thermal conductive contact to the gold layer of the thermal conductive column of the top view; 环绕 Figure 21 in the surrounding wall of the injected light permeable colloid solidified to form a closed [EE grain transparent insulating package side view; Figure 24 is a plan view of a light-transmissive insulating package in which a light-transparent gel is cured to form a closed LED die in a surrounding wall of p| 〇〇>; main component 11 '21 description] 铭 substrate 12, 45 insulating layer 15, 25, 481 enabling pads 13, 23, 8 LED die 20 Thermal column 24 Cup case 4 Circuit board 41 Substrate body 415 Fragile part 451 ' 453 Photoresist film 13 M426970

450 Perforated 47 Metal Thermally Conductive Column 480 Ring Hole 485 Through Hole 486 Enameled Wire 48 Conductive Loop 483 Enable Electrode Section 490 Surround Layer 49 Surrounding Wall 491 Half Surrounding Parts 4911 End Edge 4910 Clearance 6 Photomask 9 Light Transmissive Insulation Package

14

Claims (1)

M426970 * \ Sixth, the scope of application for patents: 1·- kinds of temperature and 7-piece circuit board 'is for at least one high-temperature exothermic circuit component, the circuit The substrate comprises: a substrate body; a layer bonded to the substrate body-side surface, and wherein at least one perforation is formed to expose the substrate body to at least a portion of the insulating layer; and a) is recorded from the exposed portion of the substrate body a perforated, thermally conductive post that extends thermally in a direction toward the substrate body and in close contact with the insulating layer; and a conductive loop formed on the insulating layer for conducting the high temperature exothermic circuit component. 2. The circuit substrate of claim 2, wherein the insulating layer is a layer of a silk film layer. The circuit substrate of claim 1, wherein the insulating layer further comprises at least one annular hole surrounding the at least one perforation; and the circuit substrate further comprises at least a group of the substrate body The surrounding wall extending through the ring hole ' toward the direction of the metal guiding age. 4. The circuit substrate of claim 3, wherein each of the sets of surrounding walls respectively comprises two semi-surrounding members corresponding to each other, and each of the two sets of surrounding members of each of the surrounding walls has two end edges respectively A gap is sandwiched between the corresponding end edges of the two corresponding half-surround members, and the conductive loop includes the energizing electrode segments respectively passing through the gap. 5. The circuit substrate according to claim 2, 3 or 4, wherein the metal heat conducting column is selected from the group consisting of copper, silver, gold, titanium, titanium alloy, recording and recording alloy, and recording chromium alloy. . 6. An LED component comprising: to > a lED die having a di-energy end, receiving light; - a circuit board comprising: 15 M426970 1{〇Γ〇4 I month a substrate body; Perforating, bonding the base layer to the substrate body-side surface' and having an insulating layer formed therein at least at least a portion of the substrate body exposed; at least one exposed portion of the substrate body passing through the at least one solid perforation away from the substrate body a direction thermally conductively extending and closely contacting the insulating layer with a metal heat conducting column that is insulated from the led die and thermally conductive; a conductive loop formed on the layer for the LED die enabling end; the conductive loop further comprising at least a pair formed on the insulating layer for guiding the end of the LED die a set of enabling contacts; and a layer of δ is placed on the above-mentioned LED die in a light-transmissive insulating package ^ 7. The LED assembly of claim 6, wherein the insulating layer is further formed with at least one set of ring holes surrounding the at least one perforation; and the circuit substrate further comprises at least one set of the substrate body The surrounding wall extending in the direction of the metal guiding button; and the transparent insulating package is filled in the at least one surrounding wall. 8. The LED assembly of claim 7, wherein each of the sets of surrounding walls respectively comprises two semi-surrounding members corresponding to each other; the two semi-surround members of each of the surrounding walls respectively have two end edges; Each of the two corresponding half-surrounding members has a gap therebetween; and the conductive circuit includes an enabling electrode segment that passes through the gap and is connected to the enabling junction.