TWM426755U - Heat pipe - Google Patents

Description

M426755 101.02.10.10.Replacement page 5. New description: [New technical field] [〇〇〇1] This is a heat pipe for reducing the temperature of electronic components, especially for flats with grooves. Heat pipe" [prior art]

[0002] With the miniaturization of electronic components, higher temperatures are generated, and in order to solve the high temperature generated by the local components, there is a development of using a heat pipe to cool down. The outer layer of the heat pipe is a sealed copper pipe with a capillary structure inside the pipe wall and a working fluid inside the copper pipe. When one end of the heat pipe absorbs the heat energy generated by the heat generating component, the heat is transferred to the working fluid in the pipe wall of the heat pipe. Because the heat pipe is in a vacuum state, the working fluid absorbs heat and generates a phase change to evaporate into a gas phase fluid, and the gas phase fluid flows to the heat pipe. The other end of the heat dissipates into a liquid phase at a low temperature, and the capillary structure returns the liquid phase fluid after the temperature drop to the evaporation end by the capillary phenomenon, so that the cycle is repeated, and the heat is continuously dispersed.

[0003] At present, the development of a flat heat pipe, that is, the use of a heat pipe after flattening, can reduce the volume of the heat pipe, but the capillary structure of the relatively flat heat pipe is more difficult to design, and it is necessary to maintain a certain vapor passage to make the steam It can circulate smoothly with liquid (two-phase flow). [0004] Taiwan Patent No. M406173 discloses a heat pipe with radial drainage, which is provided with a hollow body, and is provided with a first capillary structure on the inner wall surface of the body, and an evaporation section and a condensation section are respectively disposed on two sides of the body, and The body is filled with a working fluid; the first capillary structure is disposed on the surface of the body with a plurality of ribs extending through the evaporation section and the condensing section, and a groove is formed between the two adjacent ribs, and the first capillary structure is evaporated. The section is provided with a screw 1002U2# single number A0101 page 3 / a total of 14 pages 1013049020-0 M426755 10 years: February 10, the core is replacing the page-shaped guide groove, the guide groove is radially cut by the surface of the rib Having two adjacent grooves at the evaporation section communicate with each other by a guide groove; a surface of the first capillary structure at the evaporation section is locally sintered with a second capillary structure, and the second capillary structure is filled in the groove and the guide groove, and covered On the surface of the rib; the second capillary structure is formed by a high water content of a mesh fiber type, a powder sintered type, a polymer material, a composite material or any composite type thereof. [0005] Taiwan Patent No. 1,259,264 discloses a composite capillary structure of a heat pipe, comprising: a tube of a heat pipe having a plurality of grooves in the tube body, the groove extending in the axial direction of the tube body, and being formed in the inner circumference of the tube body a layer of composite capillary structure, disposed on the groove on the circumferential surface of the tube body; the position of the composite capillary structure is limited to the heat receiving end of the tube of the heat pipe, and surrounds the groove on the circumferential surface of the tube body.

[0006] The grooved heat pipe disclosed in the above two Taiwan patents has the disadvantage that the capillary structure (tissue) is disposed in the groove to cause the capillary action direction to be restricted by the direction of the groove, and the gas phase channel and the liquid phase channel interfere with each other. The heat dissipation effect is limited, and the structure is complicated and the manufacturing cost is high. [0007] [New content] In order to further improve the structure of the conventional grooved heat pipe, and to improve the heat dissipation effect of the heat pipe and reduce the manufacturing cost, the present invention is proposed.

[0008] The present invention extends the "flat heat pipe and its supporting structure" disclosed in the new patent No. M397508 approved by the applicant, and is provided with a plurality of first capillary grooves directly in the long groove of the working fluid; The pedestal and the cover plate do not need to be sintered by high temperature to form a capillary structure, which can greatly simplify the structure of the flat heat pipe, reduce the number of combined components, save assembly time, and have a low manufacturing cost creation concept. The creator has repeatedly researched and tested the heat pipe applied to the creation and applied for the applicant 10021423 (^^^ A0101 Page 4/14 pages 1013049020-0 M426755 101. February 10th revised replacement page [0009] The main object is to provide a heat pipe which is formed on the inner wall of the pipe body to form a capillary microstructure and at least one axially extending and concave groove structure; there is no capillary microstructure in the groove structure; the capillary microstructure acts as a liquid passage, the groove structure As a vapor channel, it can be directly packaged into a heat pipe, which has a simple structure and a better heat dissipation effect.

[0010] Another object of the present invention is to provide a heat pipe which, in addition to forming a capillary microstructure on the inner surface of the pipe body, does not require an additional capillary structure, and can make a flatter heat pipe to save space occupied by the heat pipe. [0011] Still another object of the present invention is to provide a heat pipe which can be manufactured by a pipe manufacturing method while forming at least one axially extending and concave groove structure on the inner wall of the pipe body; by chemical etching or The mechanical processing method directly forms a capillary microstructure on the inner surface of the pipe body, and does not need to use other materials to form a capillary structure by high-temperature sintering, except for the material of the pipe body itself, and the manufacturing cost is low.

[0012] For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below. [Embodiment] As shown in Figs. 1 and 2, the heat pipe 1 of the present invention comprises a pipe body 10 and a working fluid 20. The inside of the tubular body 10 is in a closed space 11, and the working fluid 20 is placed in the sealed space 11. The inner wall 12 of the tubular body 10 forms a capillary microstructure 13 and at least one axially extending and concave groove structure 14; the groove structure 14 has no capillary microstructures 13; the capillary microstructures 13 serve as liquid passages, and the groove structure 14 serves as a vapor aisle. 1〇〇21423(^单号A_第5页/14 pages 1013049020-0 M426755 ίσα: Year: 〇February ίο日梭正换页[0014] When the evaporation section 15 of the heat pipe 1 absorbs the heat energy generated by the heating element After that, the heat is transferred to the working fluid 20 inside the pipe body 10. Since the heat pipe 1 is in a near vacuum state, the working fluid 20 absorbs heat and evaporates into a gas phase fluid, and the gas phase fluid flows to the condensation section 16 of the heat pipe 1 via the groove structure 14; The gas phase fluid is condensed into a liquid phase fluid after being dissipated at a low temperature, and the liquid phase fluid is returned to the evaporation section 15 of the heat pipe 1 by the capillary phenomenon of the capillary microstructure 13, so that the cycle of the heating element is continuously generated by the cycle of the heating element. Scattered.

[0015] The material of the pipe body 10 may be copper, aluminum, stainless steel or alloys thereof; the pipe body 10 may be flat. The capillary structure 13 may include a multi-striped path connecting the evaporation section 15 and the condensation section 16, which may be parallel or cross each other, for example, intersecting vertically, irregularly intersecting, or intersecting in an orderly manner. The multi-striped road is disposed separately from the groove structure 14, and the multi-striped path is not present in the groove structure 14, so that the liquid passage and the vapor passage do not interfere with each other. The texture of the capillary microstructure 13 may have a depth of 1 μm (micrometer) - 200 / / m, preferably 50 / / m - 150 / / m. The capillary microstructure 13 can be formed on the inner wall 12 of the tubular body 10 by a method of one of chemical or mechanical processing. [0016] As shown in FIG. 3, the heat pipe 1 of the present invention can be pressed flatter so that the distance between the capillary microstructures 13 above and below the tube body 10 is between 0 mm (contact each other) to 1 mm. It can increase the capillary force and reduce the space occupied by the heat pipe 1, which helps to make the electronic products light and thin. [0017] As shown in FIGS. 1 and 4, a method of manufacturing the present heat pipe includes the following steps: [0018] (1) A pipe body 10 is manufactured by a pipe manufacturing method while at least one axis is formed on the inner wall 12 of the pipe body 10. Groove structure 1()() 21423 extending and recessed as a vapor channel (^单单 A0101 Page 6 / 14 pages 1013049020-0 M426755 __

[ιοί年.02月ϊ〇日 Revision Replacement Page I 14 ; 1 [0019] (2) The inner wall 12 of the pipe body 10 is machined to form a capillary as a liquid passage by one of a chemical etching method or a mechanical processing method. Microstructure a; [0020] (3) Using a sealing process of a general heat pipe, the inside of the pipe body 1 is a sealed space U in which the working fluid 20 is accommodated, and the air in the sealed space is extracted to form the heat pipe 1. Generally, the heat pipe sealing process includes: placing the working fluid 2 inside the body 10, and after withdrawing the air inside the pipe body 10, closing the pipe body 10 to make the inside of the pipe body 10 a closed space 丨i, and forming a heat pipe! Or, after the air inside the pipe Φ 胄 10 is pulled out and then the inside of the pipe body 10 is placed inside the pipe body, the pipe body 10 is closed to make the inside of the pipe body 10 a closed space n, and the heat pipe 1 is formed. [0021] wherein in the step (2), the chemical etching method etches the inner wall 12 outside the groove structure 14 inside the tube body with a chemical solution, and forms the capillary microstructure 13 on the surface of the inner wall 12; the machining method is The inner wall 12 of the inner surface of the groove structure 14 is formed by the tool, and since the tube body 1 is made of softer metal, after the tool is processed, a mark is formed on the surface of the inner wall 12, and The surface of the inner wall 12 forms a capillary microstructure 13 having a multi-striped path; the multi-striped road is disposed separately from the groove structure 14, and the groove structure 14 does not have the multi-striped path, so that the liquid passage and the vapor passage do not interfere with each other. It is a grinding wheel or a metal brush or a broach or a pond knife. [_ Which step can be called in step (3) - step includes making the heat pipe! The flat shape is formed such that the distance between the capillary microstructures i 3 above and below the inside of the tubular body 10 is between 〇m (contacting each other) to 1 mm. The original creation and its production method are based on the pipe body (four) Qingcheng as the liquid pass 10021423 (^^^ A0101 page 7 / 14 pages 1013049020-0 M426755 1 year February 10 & The structure and the at least one axially extending and concave groove structure serve as a vapor passage; the groove structure has no capillary microstructure; the capillary microstructure is disposed separately from the groove structure, so that the direction of the capillary action is not caused by the direction of the groove structure Limiting the disadvantage that the liquid passage and the vapor passage interfere with each other, so that the heat dissipation effect can be improved, and the structure is simple, and the heat pipe can be directly packaged, so that the manufacturing cost can be reduced. [0025] The heat pipe of the present invention, except for the pipe body In addition to the formation of the capillary microstructure on the inner surface, a flatter heat pipe can be produced without adding extra capillary structure to save space occupied by the heat pipe. The method for manufacturing the heat pipe is to manufacture a pipe body by using a pipe manufacturing method. The inner wall of the tubular body forms at least one axially extending and concave groove structure; using chemical etching or machining to the inner surface of the tubular body The capillary microstructure is directly formed, and the capillary structure is not required to be sintered by high-temperature sintering other than the material of the tube itself, and the production cost is low.

[0030] [0030] [0030] [0030] As described above, only the embodiment using the content of the present technical technology, any person skilled in the art using this creation is modified and changed, which belongs to the creative claim. The patent scope is not limited to those disclosed in the examples. [Simple description of the drawing] Fig. 1 is a schematic perspective view of a portion of the heat pipe which is not flattened. Figure 2 is a schematic cross-sectional view of the heat pipe when it is crushed. Fig. 3 is a schematic cross-sectional view showing the heat pipe in which the heat pipe is pressed. FIG. 4 is a flow chart of the method for manufacturing the heat pipe.

1_23(Ρ号 Α0101 Page 8 of 14 1013049020-0 M426755

101 years. February 10th revision replacement hundred [main component symbol description] [0031] 1 heat pipe 10 pipe body [0032] 11 confined space 12 inner wall [0033] 13 capillary microstructure 14 groove structure [0034] 15 evaporation section 16 Condensation section [0035] 20 Working fluid [0036] (1), (2), (3) respectively, the manufacturing method of the heat pipe is step number 10021423, the production order number A〇101, page 9 / total 14 pages 1013049020-0

Claims (1)

M426755 The following year, the application scope of the patent: Extracted; the inner wall of the tubular body forms a capillary microstructure and at least one axially extending and concave groove structure; wherein the capillary microstructure acts as a liquid passage, the groove structure acts as a vapor passage, and the material of the tubular body itself is removed It is not necessary to make the capillary structure with other materials. The heat pipe according to claim 1, wherein the capillary structure comprises a multi-strip road connecting an evaporation section and a condensation section of the heat pipe; the multi-strip road is not included in the groove structure; the multi-strip road Separately disposed from the groove structure, the liquid passage and the vapor passage do not interfere with each other. The heat pipe of claim 2, wherein the multi-striped roads are parallel or cross-connected to each other. The heat pipe of claim 3, wherein the multi-striped road has a depth of from 1 micrometer to 200 micrometers. The heat pipe of claim 4, wherein the multi-striped road has a depth of from 50 micrometers to 150 micrometers. The heat pipe according to claim 5, wherein the multi-striped road has a shape that is vertically crossed, irregularly intersected, or intersected by an ordered rule. 7. As described in claim 3 A heat pipe, wherein the capillary microstructure is formed by a tool to machine the inner wall. 8. The heat pipe of claim 7, wherein the tool is one of a grinding wheel or a metal brush or a broach or a file. Pulse 142#单单Α〇101 Page 10/14 pages 1013049020-0 f 101 years. After February 10th, the replacement of the heat pipe, as described in claim 1, wherein the capillary structure is The chemical solution etches the inner wall former. The heat pipe according to any one of the preceding claims, wherein the pipe body is in a flat shape, wherein the heat pipe according to the first aspect of claim 4, wherein the pipe body is above and below The distance between the capillary structures is between 0 mm and 丨 mm. The heat pipe according to Item 11 of the Japanese Patent Application No. 11, wherein the pipe body is made of steel, aluminum, stainless steel and alloys thereof. The heat pipe according to claim 12, wherein the pipe system is manufactured by a pipe-making method. 10〇2U23(f single dock dare λ〇1〇1 1013049020-0