100年.12月29日修正雜頁 五、新型說明： •【新型所屬之技術領域】 [0001] 本創作係有關磨粒的構造’尤其是有關應用於晶圓薄基 板、TFT-LCD玻璃、陶瓷、模具或金屬等加工作業、或對 陶瓷晶圓、矽晶圓、玻璃晶1、石英晶圓及金屬晶圓等 進行拋光作業、或用以填補於電子元件表面與散熱裝置 之間的空隙的材料等產品的磨粒。 [先前技術] [0002] 研磨顆粒（磨粒）可以被固定在芯線上做成線鋸，以進行 精密切割或切斷作業。線鋸已廣泛應用於晶圓薄基板、 TFT-LCD玻璃、陶究、模具或金屬等加工作業。 [0003] 台灣專利M412050揭示一種固定磨粒線鋸結構，係將超磨 粒固定於具有高強度之金屬線或耐熱與拉伸強度優良之 樹脂線所構成之芯線之表面，以電附著或黏著剤所構成 之電鍍接著層來填埋超磨粒，並將被覆蓋之超磨粒從部 分電鍍接著層露出，使超磨粒固定分散於芯線之表面。 [0004] 台灣公開專利201 1 19772揭示一種具有研磨粒的鋸線， 研磨粒部分嵌在金屬核心中且部分在有機黏合劑層中。 [0005] 台灣公告專利455521揭示一種線鋸的研磨線及該研磨線 的製造方法’研磨顆粒利用於數秒内即可完成固化之光 固化樹脂或電子束固化樹脂黏著在芯線上。 [0006] 化學機械拋光的拋光墊用以對陶瓷晶圓、矽晶圓、玻璃 晶圓、石英晶圓及金屬晶圓等進行抛光作業。研磨顆粒 也可以被固定在金屬盤上做成修整器，用以對化學機械 表單編號A0101 第3買/共17頁 M426481 ___ —ϊ&Ο''年.1-2背..'29.甘_ 按IE替換黃 拋光的抛光墊進行修整（Dressing)或者調整 (Conditioning)，以恢復拋光塾的拋光性能。 [0007] 台灣專利1 264345揭示一種CMP修整器及其製造方法。該 CMP拋光墊包括一樹脂層、被固定在該樹脂層中以便每一 超級磨粒的一外露部分從該樹脂層突出的超級磨粒，及 一設置在每一超級磨粒與該樹脂層之間的金屬鍍層，其 中該外露的部分實質上在該金屬鍍層之外。 [0008] 台灣專利1314497揭示一種電鑄薄砂輪片，係具備於金屬 鍍覆相分散磨粒而構成之薄砂輪片磨粒層，此薄砂輪片 β 磨粒層係具有依序積層於該薄砂輪片磨粒層的層厚方向 之第1至第5磨粒層，其中第1、第3、第5磨粒層之上述磨 粒的含有量係設為比第2、第4磨粒層之上述磨粒的含有 量多。 [0009] 研磨顆粒（磨粒）可以被摻雜於該高分子載體中作成散熱 膏之填補材料，用以填補於電子元件表面與散熱裝置之 間的空隙，避免散熱裝置無法完全緊密的貼合電子元件 | ，以提升散熱效果。 [0010] 台灣公開專利201 102420揭示一種具有改質鑽石顆粒之 散熱膏，包含複數個鑽石顆粒，摻雜於該高分子載體中 ，該等鑽石顆粒之表面具有一含氧基團；以及一添加劑 ，摻雜於該高分子載體中，以進一步使各該鑽石顆粒均 勻分佈於該高分子載體中。 [0011] 一般研磨、切割的工具或填補材料中的磨粒，不容易與 結合劑或高分子載體直接牢固結合，因此常需要在磨粒 表單编號Α0101 第4頁/共17頁 M426481 100年.12月29日修正替換頁 的表面做改質。使磨粒的表面改質的方法，包括在磨粒 的表面塗佈金屬層，例如鑛上銅、錄、欽、銀、鉻等金 屬；或是將磨粒陶瓷化，如將鑽石磨粒的表面鍍鈦（Ti) 、矽（Si)、鉻（Cr)、鎢（W)等金屬，然後在高溫的環境 下形成TiC、SiC、CrC、WC等碳化物形式，以增加磨粒 的親水性及與結合劑的結合性；但是金屬與高分子結合 劑的結合強度仍然不佳，例如於鋸切加工時，被固定於 線芯上鑽石磨粒容易脫落，而減低產品的壽命。 【新型内容】 [0012] 為了進一步改良習磨粒的構造，以增加磨粒與高分子聚 合物的結合強度，提升產品的效率，而提出本創作。 [0013] 本創作的主要目的，在提供一種磨粒的構造，使磨粒的 表面結合一層奈米金屬氧化物層，可進一步使磨粒的表 面與奈米金屬氧化物層之間具有一層由金屬或金屬碳化 物中之一者構成的中間層；藉由奈米金屬氧化物層增加 磨粒與高分子聚合物的結合強度，以提升產品的效率。 [0014] 本創作的其；他目的、功效，請參閱圖式及實施例，詳細 說明如下。 【實施方式】 [0015] 如第1圖所示，本創作第一實施例磨粒的構造A，包括一 磨粒10的整個表面結—層奈米金屬氧化物層101，藉由 奈米金屬氧化物層101增加磨粒10與高分子聚合物的結合 強度，以提升產品的效率。 [0016] 磨粒10可為天然鑽石、人造鑽石、立方氮化硼、碳化矽 表單編號A0101 第5頁/共17頁 M426481 、三氧化二铭或氧化鈽等超硬磨粒或該等^ 合物。奈米金屬氧化物層ιοί可為由奈米氧化鈦（Ti〇 ) 奈米氧化铭Ui2〇3)、奈米氧化石夕（Si〇2)或奈米氧化2辞 (ZnO)等奈米氧化金屬或其混合物構成的奈米金屬氧化物 層11。奈米金屬氧化物層1〇1的厚度為30nm(奈米）至 500nm，其中以50nm至200nm最佳。 [0017] 奈米金屬氧化物層101係塗佈在磨粒丨〇的整個表面。可利 用化學氣相沉積法（CVD)將奈米金屬氧化物101彼附於磨 粒10的表面；上述化學氣相沉積法（CVD)法是由原子層龙 積法（ALD : Atomic Layer Deposition) 氧化金屬或其混合物彼附於磨粒1〇的表面β100 years. December 29th revised miscellaneous page 5. New description: • [New technical field] [0001] This creation is about the construction of abrasive particles, especially related to wafer thin substrates, TFT-LCD glass, Processing operations such as ceramics, molds, or metals, or polishing of ceramic wafers, tantalum wafers, glass crystals, quartz wafers, and metal wafers, or gaps between the surface of electronic components and heat sinks Abrasives of materials such as materials. [Prior Art] [0002] Abrasive particles (abrasive grains) can be fixed to a core wire to form a wire saw for precision cutting or cutting work. Wire saws have been widely used in wafer thin substrates, TFT-LCD glass, ceramics, molds or metals. [0003] Taiwan Patent No. M412050 discloses a fixed abrasive wire saw structure in which a superabrasive grain is fixed to a surface of a core wire composed of a high-strength metal wire or a resin wire excellent in heat resistance and tensile strength to be electrically adhered or adhered. The electroplated adhesive layer formed by the crucible is used to fill the superabrasive grains, and the covered superabrasive grains are exposed from the partial electroplating and subsequent layers, so that the superabrasive grains are fixedly dispersed on the surface of the core wire. [0004] Taiwan Patent Publication No. 201 1 19772 discloses a saw wire having abrasive grains partially embedded in a metal core and partially in an organic binder layer. [0005] Taiwan Publication No. 455521 discloses a polishing line for a wire saw and a method of manufacturing the same. The abrasive particles are adhered to the core wire by using a light curing resin or an electron beam curing resin which can be cured in a few seconds. [0006] Chemical mechanical polishing polishing pads are used to polish ceramic wafers, tantalum wafers, glass wafers, quartz wafers, and metal wafers. The abrasive particles can also be fixed on a metal plate to make a dresser for the chemical mechanical form number A0101. Buy 3/17 pages M426481 ___ —ϊ&Ο''year.1-2 back..'29. Gan _ Replace the yellow polished polishing pad with IE for Dressing or Conditioning to restore the polishing performance of the polished enamel. [0007] Taiwan Patent No. 1,264,345 discloses a CMP conditioner and a method of manufacturing the same. The CMP polishing pad includes a resin layer, superabrasive grains fixed in the resin layer so that an exposed portion of each superabrasive grain protrudes from the resin layer, and a superabrasive grain and the resin layer are disposed An intermetallic coating wherein the exposed portion is substantially outside the metal coating. [0008] Taiwan Patent No. 1314497 discloses an electroformed thin grinding wheel piece which is provided with a thin grinding wheel piece abrasive layer formed by dispersing abrasive grains in a metal plating phase, and the thin grinding wheel piece β abrasive grain layer has a sequential layering on the thin layer. The first to fifth abrasive layer in the layer thickness direction of the abrasive grain layer, wherein the content of the abrasive grains in the first, third, and fifth abrasive layers is set to be smaller than that of the second and fourth abrasive layers The content of the above abrasive grains is large. [0009] The abrasive particles (abrasive particles) may be doped into the polymer carrier to form a filling material for the thermal grease to fill the gap between the surface of the electronic component and the heat sink, so as to prevent the heat sink from being completely tightly attached. Electronic components | to improve heat dissipation. [0010] Taiwan Patent Publication No. 201 102420 discloses a heat-dissipating paste having modified diamond particles, comprising a plurality of diamond particles doped in the polymer carrier, the surface of the diamond particles having an oxygen-containing group; and an additive And doping in the polymer carrier to further uniformly distribute each of the diamond particles in the polymer carrier. [0011] Generally, the abrasive or cutting tool or the abrasive particles in the filling material are not easily and directly bonded to the bonding agent or the polymer carrier, so it is often required to be in the abrasive grain form number Α0101, page 4/17, M426481, 100 years. On December 29th, the surface of the replacement page was revised to be modified. A method for modifying the surface of an abrasive grain, comprising coating a metal layer on a surface of the abrasive grain, such as a metal such as copper, nickel, silver, or chromium on the ore; or ceramizing the abrasive grain, such as a diamond abrasive grain. The surface is coated with metals such as titanium (Ti), bismuth (Si), chromium (Cr), tungsten (W), and then forms carbides such as TiC, SiC, CrC, and WC in a high temperature environment to increase the hydrophilicity of the abrasive grains. And the binding property with the binder; but the bonding strength of the metal and the polymer binder is still not good, for example, when sawing, the diamond abrasive grains fixed on the core are easy to fall off, and the life of the product is reduced. [New Content] [0012] In order to further improve the structure of the abrasive particles, the bonding strength between the abrasive particles and the polymer polymer is increased, and the efficiency of the product is improved, and the present invention is proposed. [0013] The main object of the present invention is to provide a structure of abrasive grains such that the surface of the abrasive particles is bonded to a layer of nano metal oxide, which further provides a layer between the surface of the abrasive particles and the nano metal oxide layer. An intermediate layer composed of one of a metal or a metal carbide; the bonding strength of the abrasive particles to the high molecular polymer is increased by the nano metal oxide layer to improve the efficiency of the product. [0014] The purpose of this creation; his purpose, efficacy, please refer to the drawings and embodiments, the details are as follows. [Embodiment] As shown in Fig. 1, the structure A of the abrasive grain of the first embodiment of the present invention includes an entire surface layer-layer nano-metal oxide layer 101 of an abrasive grain 10, which is oxidized by a nano metal. The layer 101 increases the bonding strength of the abrasive particles 10 to the high molecular polymer to enhance the efficiency of the product. [0016] The abrasive particles 10 may be natural diamonds, synthetic diamonds, cubic boron nitride, strontium carbide form number A0101, page 5 of 17 M426481, super-hard abrasive grains such as bismuth oxide or cerium oxide or the like Things. The nano-metal oxide layer ιοί can be a nano-oxidized metal such as nano-titanium oxide (Ti〇) nano-oxidized Ui2〇3), nano-oxidized stone (Si〇2) or nano-oxidized (ZnO) Or a nano metal oxide layer 11 composed of a mixture thereof. The thickness of the nano metal oxide layer 1 〇 1 is from 30 nm (nm) to 500 nm, with 50 nm to 200 nm being optimal. [0017] The nano metal oxide layer 101 is coated on the entire surface of the abrasive crucible. The nano metal oxide 101 may be attached to the surface of the abrasive grain 10 by chemical vapor deposition (CVD); the above chemical vapor deposition (CVD) method is performed by the ALD (Atomic Layer Deposition) method. The oxidized metal or a mixture thereof is attached to the surface of the abrasive particle 1
將上述奈米 [0018] 也可利用溶膠凝膠法（Sol-Gel)將奈米金屬氧化物^叫坡 附於磨粒10的表面；上述溶膠凝膠法係可選擇以浸潰杈 提法及沉降法及旋轉塗佈法及喷霧法及塗刷法及沾濕法 其中任一方式。 [0019] 溶膠-凝膠法係選自由的奈米氧化鈦、奈米氧化鋁、奈米 氧化矽或奈米氧化鋅等奈米氧化金屬顆粒所組成之群組 ，並令溶液及前述任一材質顆粒一同注入一槽體内均勻 混合分散，其後將多個磨粒浸泡於s〇卜Gel溶液中，再將 多個磨粒從Sol-Gel溶液中取出或將s〇卜Gel溶液全數由 槽體中漏除，令前述奈米金屬氧化物顆粒附著於多個磨 粒的表面；然後將多個磨粒置放於烤箱中進行乾燥處理 ，並將烤箱之溫度設定介於50至200度，乾燥時間1〇至 6〇刀知，乾燥溫度越高即可縮短乾燥作業之時間。為了 令磨粒表面的奈米金屬氧化物層可均勻成膜狀及穩固附 表單编號細 第6頁/共17頁 M426481 100年12月29日按正替换頁 著於磨粒表面，可進行燒結作業，將磨粒置放於燒結爐 内，並將燒結溫度設定於200至800度，燒結時間5至60 分鐘，最後將磨粒由燒結爐内取出。 [0020] 如第2圖所示，本創作第二實施例磨粒的構造B，包括一 磨粒10的整個表面結合一層奈米金屬氧化物層101，且磨 粒10的整個表面與奈米金屬氧化物層101之間具有一層中 間層102，例如包括由鈦（Ti)、鑛（W)、鉻（Cr)、鉬 (Mo)、釩（V)或矽（Si)等金屬層構成的中間層102，其中 以鈦或矽材料為最佳。中間層102係利用熱蒸鍍的方式塗 佈於磨粒10的表面，然後將奈米金屬氧化物層101塗佈在 中間層102的整個表面。 [0021] 當磨粒10為天然鑽石或人造鑽石且提高熱蒸鍍的溫度時 ，可以使鈦、鎢、鉻、釩或矽等金屬層構成的中間層102 與鑽石的接觸面反應形成碳化鈦（TiC)、碳化鎢（WC)、 碳化鉻（CrC)、碳化釩（VC)或碳化矽（SiC)等金屬碳化物 層，使中間層102除了金屬層之外進一步具有一金屬碳化 物層；其中以包括有碳化鈦或碳化石夕等金屬碳化物層為 最佳。金屬碳化物層介於天然鑽石或人造鑽石與該金屬 層之間。 [0022] 奈米金屬氧化物層101可以與鑽石結合，但是如果有鈦、 鎢、鉻、鉬、釩或矽等金屬層或金屬碳化物層構成的中 間層102，將使磨粒10與奈米金屬氧化物層101的結合更 堅固。鑽石磨粒表面的鈦（Ti)層的厚度為0.1/iin(微米） 至2/zm ;碳化鈦（TiC)層的厚度為0. Olem(微米）至0.5 表單編號A0101 第7頁/共17頁 "ido年12方29日核正替換頁 [0023] 利用本創作第一、二實施例磨粒的構造A、B，可製作成 多種產品，如第3圖所示，製作成第一實施例具有磨粒的 產品1，包括多個磨粒10、一基體20及一高分子聚合物30 :磨粒10的表面結洽—層奈米金屬氧化物層101 ;多個結 合奈米金屬氧化物層101的磨粒10混合高分子聚合物30彼 附在基體20的至少一側表面201 ;多個磨粒10的一部分突 出高分子聚合物30。本實施例具有磨粒的產品1為砂紙或 修整器，基體20為砂紙或修整器的基體。 [0024] 高分子聚合物30可為熱塑性高分子材料、熱固性高分子 € 材料或彈性高分子材料。熱塑性高分子材料如壓克力樹 脂等，可以利用紫外線固化方式成型。熱固性高分子材 料包括環氧樹脂、紛酸樹脂、苯酌(Phenolic)、聚醜亞 胺（Polyimide)丙稀酸等或其混合物，經乾燥、加熱反 應熟化成形。彈性高分子材料如矽膠等，可以用加熱方 式熟化成型。基體20可為金屬材料、高分子材料或陶瓷 材料或其複合材料。 ’ [0025] 如第4圖所示，製作成第二實施例具有磨粒的產品2，包 _ 括多個磨粒10、一基體21及一高分子聚合物30 ;磨粒10 的表面結洽—層奈米金屬氧化物層101 ;多個結合奈米金 屬氧化物層101的磨粒10混合高分子聚合物30披附在基體 21的整個表面211 ;多個磨粒10的一部分突出高分子聚合 物30。本實施例具有磨粒的產品2為一線鋸，基體21為線 鋸的基體。線鋸可為切割單晶矽晶圓或太陽能多晶矽或 藍寶石用的線鋸。線鋸的製造方式，可利用熱固性或熱 塑型高分子材料、金屬粉末（如銅等）或陶瓷粉末與鑽石 表單编號Α0101 第8頁/共17頁 M426481 100年.12月29日修正替換頁 磨粒、添加劑（如分散劑）及可塑劑等配方設計選定後， 將其混合均勻，黏著於線材，經乾燥、加熱反應（或紫外 線固化）熟化成形。 [0026] 如第5圖所示，製作成第三實施例具有磨粒的產品3，包 括多個磨粒10、一基體22及一高分子聚合物30 ;磨粒10 的表面结令—層奈米金屬氧化物層101 ;多個結合奈米金 屬氧化物層101的磨粒10混合高分子聚合物30坡附在基體 22的表面221 ;多個磨粒10的一部分突出高分子聚合物 30。本實施例具有磨粒的產品3為一砂輪，基體22為砂輪 的基體。 [0027] 如第6圖所示，製作成第四實施例具有磨粒的產品4，包 括多個磨粒10及高分子聚合物30 ;磨粒10的表面結合一 層奈米金屬氧化物層101 ;多個磨粒10混合高分子聚合物 30形成散熱膏，用以作為填補於電子元件表面與散熱裝 置之間的空隙之填補材料，避免散熱裝置無法完全緊密 的貼合電子元件，以提升散熱效果。The above nano-[0018] may also be attached to the surface of the abrasive grain 10 by a sol-gel method (Sol-Gel); the above sol-gel method may be selected by dipping and extracting And any of the methods of sedimentation and spin coating, spray, brushing and wetting. [0019] The sol-gel method is selected from the group consisting of nanometer oxidized metal particles such as nano titanium oxide, nano alumina, nano cerium oxide or nano zinc oxide, and the solution and any of the foregoing The material particles are uniformly injected into a tank to be uniformly mixed and dispersed, and then a plurality of abrasive grains are immersed in the s G G Gel solution, and then the plurality of abrasive grains are taken out from the Sol-Gel solution or the s G G Gel solution is completely Leaking in the tank, the aforementioned nano metal oxide particles are attached to the surface of the plurality of abrasive grains; then, the plurality of abrasive grains are placed in an oven for drying, and the temperature of the oven is set to 50 to 200 degrees. The drying time is from 1 to 6 knives. The higher the drying temperature, the shorter the drying time. In order to make the surface of the nano-metal oxide layer on the surface of the abrasive grain uniform and stable, the form number is fine. Page 6 of 17 M426481 On December 29, 100, the positive replacement page is placed on the surface of the abrasive grain. In the sintering operation, the abrasive grains are placed in a sintering furnace, and the sintering temperature is set at 200 to 800 degrees, the sintering time is 5 to 60 minutes, and finally the abrasive grains are taken out from the sintering furnace. [0020] As shown in FIG. 2, the structure B of the abrasive grain of the second embodiment of the present invention includes a whole surface of the abrasive grain 10 bonded with a layer of the nano metal oxide layer 101, and the entire surface of the abrasive grain 10 and the nanoparticle The metal oxide layer 101 has an intermediate layer 102 between, for example, a metal layer composed of titanium (Ti), ore (W), chromium (Cr), molybdenum (Mo), vanadium (V) or bismuth (Si). The intermediate layer 102, wherein titanium or tantalum material is preferred. The intermediate layer 102 is applied to the surface of the abrasive grain 10 by thermal evaporation, and then the nano metal oxide layer 101 is coated on the entire surface of the intermediate layer 102. [0021] When the abrasive grain 10 is a natural diamond or an artificial diamond and the temperature of the thermal evaporation is increased, the intermediate layer 102 composed of a metal layer such as titanium, tungsten, chromium, vanadium or niobium may be reacted with the contact surface of the diamond to form titanium carbide. a metal carbide layer such as (TiC), tungsten carbide (WC), chromium carbide (CrC), vanadium carbide (VC) or tantalum carbide (SiC), such that the intermediate layer 102 further has a metal carbide layer in addition to the metal layer; Among them, a metal carbide layer including titanium carbide or carbon carbide is preferred. The metal carbide layer is between the natural diamond or the synthetic diamond and the metal layer. [0022] The nano metal oxide layer 101 may be combined with a diamond, but if there is a metal layer such as titanium, tungsten, chromium, molybdenum, vanadium or niobium or an intermediate layer 102 composed of a metal carbide layer, the abrasive grains 10 and Nai The combination of the rice metal oxide layer 101 is stronger. The thickness of the titanium (Ti) layer on the surface of the diamond abrasive is 0.1/iin (micrometer) to 2/zm; the thickness of the titanium carbide (TiC) layer is 0. Olem (micrometer) to 0.5 Form No. A0101 Page 7 of 17 Page "ido year 12 party 29th nuclear replacement page [0023] Using the structures A and B of the first and second embodiments of the present invention, a variety of products can be produced, as shown in Fig. 3, made into the first The product 1 having abrasive grains comprises a plurality of abrasive grains 10, a substrate 20 and a high molecular polymer 30: the surface of the abrasive particles 10 is bonded to the layer of nano-metal oxide layer 101; and the plurality of bonded nano-metals The abrasive particles 10 of the oxide layer 101 are mixed with the polymer 30 and attached to at least one side surface 201 of the substrate 20; a part of the plurality of abrasive grains 10 protrudes from the polymer 30. The product 1 having abrasive grains in this embodiment is a sandpaper or a dresser, and the base 20 is a base of a sandpaper or a dresser. [0024] The high molecular polymer 30 may be a thermoplastic polymer material, a thermosetting polymer, or an elastic polymer material. Thermoplastic polymer materials such as acrylic resins can be molded by ultraviolet curing. The thermosetting polymer material includes an epoxy resin, an acid resin, a Phenolic, a polyimide acrylic acid, or the like, or a mixture thereof, which is dried and heated to form a ripening. An elastic polymer material such as silicone rubber can be molded by heating. The substrate 20 may be a metal material, a polymer material or a ceramic material or a composite material thereof. [0025] As shown in FIG. 4, a product 2 having abrasive grains according to a second embodiment is produced, comprising a plurality of abrasive grains 10, a substrate 21 and a high molecular polymer 30; surface knots of the abrasive grains 10 a layer-layer nano-metal oxide layer 101; a plurality of abrasive particles 10 mixed with the nano-metal oxide layer 101 are mixed with the high-molecular polymer 30 on the entire surface 211 of the substrate 21; a part of the plurality of abrasive grains 10 protrudes high Molecular polymer 30. The product 2 having abrasive grains in this embodiment is a wire saw, and the base 21 is a base of a wire saw. The wire saw can be a wire saw for cutting single crystal germanium wafers or solar polysilicon or sapphire. The wire saw can be manufactured by using thermosetting or thermoplastic polymer materials, metal powder (such as copper) or ceramic powder and diamond form number Α0101 Page 8 of 17 M426481 100. December 29 revision replacement After the formulation of the page abrasive particles, additives (such as dispersant) and plasticizer is selected, it is uniformly mixed, adhered to the wire, and dried and heated (or UV-cured) to form. [0026] As shown in FIG. 5, a product 3 having abrasive grains according to a third embodiment, comprising a plurality of abrasive grains 10, a substrate 22, and a high molecular polymer 30; a surface layer of the abrasive grains 10 The nano metal oxide layer 101; the plurality of abrasive particles 10 bonded to the nano metal oxide layer 101 are mixed with the polymer polymer 30 on the surface 221 of the substrate 22; a part of the plurality of abrasive grains 10 protrudes from the polymer 30 . The product 3 having abrasive grains in this embodiment is a grinding wheel, and the base 22 is a base of the grinding wheel. [0027] As shown in FIG. 6, the product 4 having the abrasive grains of the fourth embodiment is formed, including a plurality of abrasive grains 10 and a polymer 30; the surface of the abrasive grains 10 is bonded to a layer of nano metal oxide layer 101. The plurality of abrasive particles 10 are mixed with the high molecular polymer 30 to form a thermal grease for filling the gap between the surface of the electronic component and the heat dissipating device, so as to prevent the heat dissipating device from completely fitting the electronic component to improve heat dissipation. effect.
[0028] 如第7圖所示，利用本創作第一、二實施例磨粒的構造A 、B，製作成具有磨粒的產品的製法，包括如下步驟： [0029] (1)使磨粒的表面披附一層奈米金屬氧化物層； [0030] (2)使多個彼附奈米金屬氧化物層的磨粒與高分子聚合物 混合； [0031] (3)使混合多個彼附奈米金屬氧化物層的磨粒後的高分子 聚合物坡附在一基體的至少一側表面；該多個結合奈米 金屬氧化物層的磨粒的一部分突出該高分子聚合物。 表單編號A0101 第9頁/共17頁 M426481[0028] As shown in FIG. 7, a method for producing a product having abrasive grains by using the structures A and B of the abrasive grains of the first and second embodiments of the present invention includes the following steps: [0029] (1) Making abrasive grains a surface coated with a layer of nano metal oxide; [0030] (2) mixing a plurality of abrasive grains of the nano-metal oxide layer with the high-molecular polymer; [0031] (3) mixing a plurality of The abrasive polymer core of the nano metal oxide layer is attached to at least one surface of the substrate; a part of the plurality of abrasive grains bonded to the nano metal oxide layer protrudes the polymer. Form No. A0101 Page 9 of 17 M426481
=±00^.12^ Z9 Q=±00^.12^ Z9 Q
[0032] 上述步驟（1)之前可進一步包括如下步驟： [0033] 以熱蒸鍍的方式使金屬塗佈於磨粒的表面形成一中間層 〇 [0034] 上述步驟（3)可被省略，而步驟（2)中是使多個披附奈米 金屬氧化物層磨粒混合高分子聚合物形成散熱膏。 [0035] 利用本創作第一、二實施例磨粒的構造A、B，製作成具 有磨粒的產品的製法，包括上述具有磨粒的產品記載的 技術内容，不再重覆敘述。 [0036] 本創作磨粒的構造，使磨粒的整個表面披附一層奈米金 屬氧化物層，以增加磨粒與高分子結合劑的結合強度， 可改良習知具有磨粒的產品，提升產品的效率。 [0037] 以上所記載，僅為利用本創作技術内容之實施例，任何 熟悉本項技藝者運用本創作所為之修飾、變化，皆屬本 創作主張之專利範圍，而不限於實施例所揭示者。 【厨式簡單說明】 $ [0038] 圖1為本創作第一實施例磨粒的構造的示意圖。 [0039] 圖2為本創作第二實施例磨粒的構造的示意圖。 [0040] 圖3為利用本創作的第一實施例具有磨粒的產品的示意圖 〇 [0041] 圖4為利用本創作的第二實施例具有磨粒的產品的示意圖 〇 [0042] 圖5為利用本創作的第三實施例具有磨粒的產品的示意圖 表單编號A0101 第10頁/共17頁 M426481 100年12月29日核正替换頁 [0043] 圖6為利用本創作的第四實施例具有磨粒的產品的示意圖 [0044] 圖7為利用本創作的具有磨粒的產品的製法的流程圖。 【主要元件符號說明】 [0045] A、B磨粒的構造 [0046] 1、2、3、4具有磨粒的產品[0032] The above step (1) may further include the following steps: [0033] coating the metal on the surface of the abrasive particles by thermal evaporation to form an intermediate layer [0034] The above step (3) may be omitted, In the step (2), the plurality of coated nano metal oxide layer abrasive particles are mixed with the high molecular polymer to form a thermal grease. [0035] The method for producing a product having abrasive grains by using the structures A and B of the abrasive grains of the first and second embodiments of the present invention, including the technical contents described in the above-mentioned product having abrasive grains, will not be repeated. [0036] The structure of the created abrasive grain is such that the entire surface of the abrasive grain is coated with a layer of nano metal oxide to increase the bonding strength between the abrasive grain and the polymer binder, and the product having the abrasive grain can be improved and improved. Product efficiency. The above descriptions are merely examples of the use of the present technical content, and any modifications and variations made by those skilled in the art using the present invention are the scope of patents claimed herein, and are not limited to those disclosed in the embodiments. . [Brief Description] [0038] FIG. 1 is a schematic view showing the configuration of the abrasive grain of the first embodiment of the present invention. 2 is a schematic view showing the configuration of the abrasive grain of the second embodiment of the present invention. 3 is a schematic view of a product having abrasive grains according to a first embodiment of the present invention. [0041] FIG. 4 is a schematic view of a product having abrasive grains according to a second embodiment of the present invention. [0042] FIG. A schematic view of a product having abrasive grains using the third embodiment of the present invention. Form No. A0101 Page 10 of 17 M426481 December 29, 100 Nuclear Replacement Page [0043] FIG. 6 is a fourth implementation using the present creation Schematic diagram of a product having abrasive grains [0044] Fig. 7 is a flow chart showing a process for producing a product having abrasive grains using the present invention. [Explanation of main component symbols] [0045] Structure of A, B abrasive grains [0046] 1, 2, 3, 4 products having abrasive grains
[0047] 10磨粒 [0048] 101奈米金屬氧化物層 [0049] 102中間層 [0050] 20、21、22基體 [0051] 201、211、221 表面 [0052] 30高分子聚合物 [0053] 51 ' 52磨粒的構造 [0054] (1)、（2)、（3)分別為步驟編號 表單編號A0101 第11頁/共17頁10 abrasive grains [0048] 101 nm metal oxide layer [0049] 102 intermediate layer [0050] 20, 21, 22 substrate [0051] 201, 211, 221 surface [0052] 30 high molecular polymer [0053 ] 51 '52 abrasive grain structure [0054] (1), (2), (3) are the step number form number A0101 page 11 / a total of 17 pages