五、新型說明： 【新型所屬之技術領域】 [0001] 本新型為有關一種量測設備，尤指一種積體電路晶片的 檢測裝置。 【先前技術】 [0002] 隨著科技的發展’許多的資訊電子產品愈來愈輕薄短小 ，但所備具的功能卻只增不減，在如此的狀況下，使得 電子電路走向積體化，製作成可執行多種功能的晶片， 由於該晶片内的結構繁複’線寬窄小，製作上具有一定 的困難度，且所需的製作成本高，相對的，品質及良率 的管控也愈加重要》 [0003] 於是，該晶片在出廠前’必須經過測試機台的檢測，而 該測試機台主要包含有一測試座以及一測試電路板，利 用該測試座供該晶片放置定位後，該晶片再透過該測試 座與該測試電路板電性連接，而進行檢測。 [0004] 在中華民國新型專利第M400590號中，即揭露一種晶片測 試座定位結構，其設有一底座以及一與底座樞接之蓋體 ，底座上設有一凹槽，並於凹槽内設有一組導接裝置， 而蓋體底面設有一抵壓單元，其中，導接裝置設有一配 合待測晶片固定的定位部，並於定位部中設有複數個對 應待測晶片底部錫球位置的透孔，透孔用以套接固定待 測晶片之錫球，將待測晶片定位於定位部上，定位部下 方設有一導通待測晶片與測試電路板的導電部，該待測 晶片藉由該抵壓單元的抵壓，與該導電部導接，藉由該 導電部中的該導通件與該測試電路板導接，而進行量測 表單褊號A0101 第3頁/共22頁 M423838 ο [0005] 從上述可知，該待測晶片必需透過該導通件與該測試電 路板導接，然而，習知的該導通件為由兩接觸端子夹置 一彈簧而形成的探針結構，此種探針結構由於經由彈簧 的導通’具有阻抗值1¾、对電流低、電感而的缺失》容 易造成測試結果的不準確，另外，此種探針結構為直立 狀，該兩接觸端子位於同一軸線上，使得該測試電路板 上的接點排列位置，必需與該待測晶片上的接點排列位 置一致，才能順利與該待測晶片導通量測，造成該測試 電路板上的接點排列位置需和該待測晶片一樣緊密，徒 增該測試電路板上電路佈線的難度，故有改善之必要。 【新型内容】 [0006] 本新型的主要目的，在於解決習知用於晶片測試座中的 彈簧探針，因阻抗值高、耐電流低、電感高造成測試結 果不準確的問題，本新型的次要目的在於解決習知測試 電路板的接點排列位置需與待測晶片一致，徒增該測試 電路板上電路佈線難度的問題。 [0007] 為達上述目的，本新型提供一種積體電路晶片的檢測裝 置，包含有一檢測基座、複數個彎曲探針以及一底板。 該檢測基座包含一測試面以及一遠離該測試面的容置面 ，該測試面開設複數個第一端子孔，該容置面開設複數 個探針容置槽，且該第一端子孔與該探針容置槽連通； 該彎曲探針對應設置於該探針容置槽，並包含一第一端 子部、一相對該第一端子部的第二端子部以及一彎折彈 性部，該彎折彈性部設於該第一端子部與該第二端子部 表單编號A0101 第4頁/共22頁 之間並與該第一端子部及該第二端子部連接，該第一端 子部穿出該第一端子孔，且該第一端子部與該第二端子 部之間於平行該測試面的方向上具有一位移量；該底板 抵頂該彎曲探針，並覆蓋該探針容置槽，該底板具有一 遠離該容置面的底面，該底面開設有複數個第二端子孔 ，該第二端子孔連通該探針容置槽，令該第二端子部經 由該第二端子孔突出該底面。 [0008] 由上述說明可知，本新型藉由該彎曲探針的設置，利用 該彎折彈性部使該第一端子部及該第二端子部之間得以 形成往復的上下移動進行量測，並改善使用彈簧帶來的 阻抗值高、耐電流低、電感高造成測試結果不準確的問 題，且由於該第一端子部與該第二端子部之間於平行該 測試面的方向上具有該位移量，使得與該第二端子部電 性導接的一測試電路板，其電路佈線的接點排列位置不 需與所欲測試的一晶片之接點排列位置一致，可依該位 '移量進行調整，降低電路佈線的難度。 【實施方式】 [0009] 有關本新型的詳細說明及技術内容，現就配合圖式說明 如下： [0010] 請搭配參閱『圖1』、『圖2』及『圖3』所示，『圖1』 及『圖2』分別為本新型一實施例的外觀立體及結構分解 示意圖，『圖3』為本新型一實施例的檢測基座背視示意 圖，如圖所示：本新型為一種積體電路晶片的檢測裝置 ，包含有一檢測基座10、複數個彎曲探針20、複數個直 立探針40、一底板30及一晶片置放座50。該檢測基座10 表單編號A0101 第5頁/共22頁 M423838 包含一測試面11以及一遠離該測試面n的容置面12，該 測試面11開設複數個第一端子孔ιη及複數個第一直孔 112，該第一直孔112貫穿該檢測基座1〇，該容置面〗2開 設複數個探針容置槽121，且該第一端子孔丨丨丨與該探針 谷置槽121連通。 [0011] [0012] «月搭配參閱『圖4A』及『圖4B』所示，分別為本新型一 實施例的彎曲探針及直立探針剖面示意圖，該彎曲探針 20對應設置於該探針容置槽12ι，並包含一第一端子部21 、一相對該第一端子部21的第二端子部22以及一彎折彈 性部23，該彎折彈性部23設於該第一端子部21與該第二 端子部22之間並與該第一端子部21及該第二端子部22連 接，該第一端子部21穿出該第一端子孔ln，在本實施例 中，s亥彎折彈性部23包含一第一轉折段231及一第二轉折 段232，該第一轉折段231與該第一端子部21連接，而該 第二轉折段232的一端與該第一轉折段231連接，並與該 第一轉折段231之間形成一轉角，而另一端則與該第二端 子部22連接，在此，該第一端子部21、該第一轉折段231 、該第二轉折段232及該第二端子部22為一體成型，且該 第一轉折段231的長度大於該第二轉折段232的長度，使 該第一端子部21與該第二端子部22之間於平行該測試面 11的方向上具有一位移量S 〇 該直立探針40設於該第一直孔112，並包含一套筒44、一 彈性伸縮件43、一第一接觸端41及一相對該第一接觸端 41的第二接觸端42，該彈性伸縮件43設置於該套筒44内 ，在此實施例中，該彈性伸縮件43為一彈簧，該第一接 表單編號A0101 觸端41及該第二接觸端4 2分別連接於該彈'性伸縮件4 3的 兩端’並突出該套筒44，且該第一接觸端41還穿出該第 一直孔112 ’要補充說明的是，該彎曲探針2〇及該直立探 針40在圖示上分別僅以四個及兩個示意，實際上可依使 用需求而增減，另外，該第一端子部21及該第二端子部 22之間也可僅設一轉折段（圖未示），以該轉折段的兩端 分別連接該第一端子部21及該第二端子部22，而同樣使 該第一端子部21與該第二端子部22之間於平行該測試面 11的方向上具有該位移量S。 [0013] 請搭配參閱『圖5』所示，『圖5』為本新型一實施例的 底板背視示意圖，該底板30抵頂該彎曲探針20及該直立 探針40 ’並覆蓋該探針容置槽121，該底板30具有一相鄰 該容置面12的頂面31及一遠離該容置面12的底面32，‘該 頂面31開設複數個對應該探針容置槽121的輔助容置槽 311，該輔助容置槽311供容置該彎折彈性部23，並與該 探針容置槽121連通形成供該彎折彈性部23因彎折而上下 擺動的一活動空間，而該底面32開設有複數個第二端子 孔321及複數個第二直孔322，該第二端子孔321與該輔 助容置槽311連通，使該第二端子部22經由該第二端子孔 321突出該底面32，該第二直孔322則與該第一直孔112 連通，令該第二接觸端42由該第二直孔322突出該底面32 〇 [0014] 再請搭配參閱『圖1』及『圖2』所示，該檢測基座1〇於 該測試面11還凹設有一卡合槽113，令該第一端子孔^ 及該第一直孔112形成於該卡合槽113的一底部，並與該 表單編號A0101 第7頁/共22頁 M423838 卡合槽113連通，該晶片置放座50卡合於該卡合槽113， 且該晶片置放座50上凹設有一晶片槽51，該晶片槽51為 供放置所欲測試的一晶片（圖未示），並具有複數個穿孔 511，該穿孔511不僅對應該第一端子孔丨丨丨及該第一直 孔112連通，還對應該晶片上所設置的複數個第一電性接 點，另外，該檢測基座10更於該測試面n上連接兩擋止 片13，使該兩擋止片13部分覆蓋於該卡合槽113上，抵止 該晶片置放座50於該卡合槽113内。 [0015] 請搭配參閱『圖6A』及『圖6B』所示，分別為本新型一 實施例的晶片置放座於待測位置及測試位置的示意圖， 該晶片置放座50與該卡合槽Π3之間，設置有四個彈性件 52分布於該卡合槽113的周圍，在此實施例中，該彈性件 52為彈簧，並供抵頂該晶片置放座5〇於該卡合槽113内上 下往復移動，使該晶片置放座5 〇具有一待測位置及一測 試位置，該待測位置為該晶片置放座5〇受該四個彈性件 52抵頂，並與該兩擋止片13接觸，使該第一端子部21及 該第一接觸端41位於該穿孔511内，該測試位置為該晶片 置放座50受一外力下壓，壓縮該四個彈性件52，使該第 一端子部21及該第一接觸端41穿出該穿孔511。 [0016] 於使用時，該第二端子部22及該第二接觸端42分別由該 第二端子孔321及該第二直孔322突出該底面32與一測試 電路板（圖未示）的第二電性接點電性連接，將該晶片置 於該晶片置放座50的該晶片槽51中，該晶片置放座5〇為 事先選擇具有符合容置該晶片尺寸的晶片槽51，且該晶 片置放座50位於該待測位置，而後再利用一抵壓單元（圖 表單编號A0101 第8頁/共22頁 未不）向下推抵該晶片置放座5〇，並使該晶片置放座5〇位 於該測試位置，此時該第_端子部21及該第_接觸端Ο 將會穿出該穿孔5U，並與該晶片的該第一電性接點電性 連接，且該第-端子部21及該第—接觸端41於接觸該第 一電性接點後具-緩衝的彈性，令該第—端子部21及該 第一接觸端41不致於過度抵頂該晶片而使該晶片毀損， 並使得該晶#透㈣彎崎針2Q及該直立探雜與該測 試電路板錄連接而進行測試作業，需特職明的是， 由於S玄第一端子部21與該第二端子部22之間於平行該測 試面11的方向上具有該位移量3，因此該第二電性接點的 位置，不需與該第一電性接點的位置一致，增加該測試 電路板上電路佈線的靈活度及間距。 [0017] 另外，在上述所提的實施例中，還可直接將該晶片置放 座50固定於該卡合槽113 ,而不設置該彈性件52，使該晶 片置放座50與該檢測基座1〇為一體，令該第一端子部η 及β亥第一接觸端41直接穿出該穿孔511 ,該晶片則放置於 該晶片槽51中與該第一端子部21及該第一接觸端41接觸 ，利用該彎折彈性部2 3及該彈性伸縮件4 3分別提供於該 第一端子部21及該第一接觸端41的彈性，以抵壓該晶片 與該第一端子部21及該第一接觸端41電性連接的方式進 行量測。 [0018] 综上所述，由於本新型藉由該彎曲探針的設置，利用該 第一轉折段具有大於該第二轉折段的長度，使該第一端 子部及該第二端子部之間不僅可於垂直方向往復的位移 而進行量測’且該第一端子部與該第二端子部之間於平 表單編號Α0101 第9頁/共22頁 M423838 [0019] [0020] [0021] [0022] [0023] [0024] [0025] [0026] [0027] 表單编號A0101 行該測試面的方向上還具有該位移量，具有增加該測試 電路板上電路佈線的靈活度及間距的效果，再者，該第 一端子部、該第一轉折段、該第二轉折段及該第二端子 部在結構上形成簡易的彎折且為一體成型，進一步改善 習知技術由彈簧帶來的阻抗值高、耐電流低、電感高造 成測試結果不準確的問題，因此本新型極具進步性及符 合申請新型專利的要件，爰依法提出申請，祈鈞局早曰 賜准專利，實感德便。 以上已將本新型做一詳細說明，惟以上所述者，僅爲本 新型的一較佳實施例而已，當不能限定本新型實施的範 圍。即凡依本新型申請範圍所作的均等變化與修飾等， 皆應仍屬本新型的專利涵蓋範圍内。 【圖式簡單說明】 圖1，為本新型一實施例的外觀立體示意圖。 圖2，為本新型一實施例的結構分解示意圖。 圖3，為本新型一實施例的檢測基座背視示意圖。 圖4A，為本新型一實施例的彎曲探針示意圖。 圖4B，為本新型一實施例的直立探針剖面示意圖。 圖5，為本新型一實施例的底板背視示意圖。 圖6A，為本新型一實施例的晶片置放座於待測位置的示 意圖。 圖6B，為本新型一實施例的晶片置放座於測試位置的示 意圖。 第10頁/共22頁 [0028]M423838 【主要元件符號說明】 ίο :檢測基座V. New description: [New technical field] [0001] The present invention relates to a measuring device, and more particularly to a detecting device for an integrated circuit chip. [Prior Art] [0002] With the development of technology, many information electronic products are becoming lighter and thinner, but the functions they provide are only increasing. Under such circumstances, the electronic circuits are integrated. It is made into a wafer that can perform a variety of functions. Because of the complicated structure in the wafer, the line width is narrow, the manufacturing has certain difficulty, and the required manufacturing cost is high, and the control of quality and yield is more important. [0003] Therefore, the wafer must pass the test of the test machine before leaving the factory, and the test machine mainly includes a test socket and a test circuit board. After the test socket is used for positioning the wafer, the wafer is re-transmitted. The test socket is electrically connected to the test circuit board for detection. [0004] In the Republic of China, the new patent No. M400590 discloses a wafer test seat positioning structure, which is provided with a base and a cover pivotally connected to the base, the base is provided with a recess, and a recess is provided in the recess. a guiding device, wherein the bottom surface of the cover body is provided with a pressing unit, wherein the guiding device is provided with a positioning portion fixed to the wafer to be tested, and a plurality of positions corresponding to the bottom of the wafer to be tested are provided in the positioning portion. a hole, a through hole for tying the solder ball of the wafer to be tested, positioning the wafer to be tested on the positioning portion, and a conductive portion for conducting the wafer to be tested and the test circuit board under the positioning portion, wherein the wafer to be tested is The pressing of the pressing unit is conducted in contact with the conductive portion, and the conducting member in the conductive portion is connected to the test circuit board to perform measurement measurement No. A0101 Page 3 of 22 M423838 ο [ 0005] It can be seen from the above that the wafer to be tested must be connected to the test circuit board through the conductive member. However, the conventional conductive member is a probe structure formed by sandwiching a spring between two contact terminals. Needle structure due to The conduction of the spring 'having an impedance value of 13⁄4, low current, and lack of inductance" is likely to cause inaccuracies in the test results. In addition, the probe structure is upright, and the two contact terminals are located on the same axis, so that the test circuit The arrangement position of the contacts on the board must be consistent with the position of the contacts on the wafer to be tested, so as to smoothly conduct the measurement with the wafer to be tested, and the position of the contacts on the test circuit board needs to be aligned with the wafer to be tested. It is as close as possible, and it is necessary to increase the difficulty of circuit wiring on the test circuit board. [New content] [0006] The main purpose of the present invention is to solve the problem that the spring probe used in the wafer test socket has high impedance value, low current resistance and high inductance, resulting in inaccurate test results. The secondary purpose is to solve the problem that the position of the contacts of the conventional test circuit board needs to be consistent with the wafer to be tested, and the difficulty of circuit wiring on the test circuit board is increased. In order to achieve the above object, the present invention provides a detecting device for an integrated circuit wafer, comprising a detecting base, a plurality of curved probes, and a bottom plate. The test pedestal includes a test surface and a accommodating surface away from the test surface. The test surface defines a plurality of first terminal holes, the accommodating surface defines a plurality of probe accommodating grooves, and the first terminal hole and the first terminal hole The probe receiving groove is connected to the probe receiving groove; the bending probe is disposed correspondingly to the probe receiving groove, and includes a first terminal portion, a second terminal portion opposite to the first terminal portion, and a bending elastic portion. The bent elastic portion is disposed between the first terminal portion and the second terminal portion form number A0101, page 4 of 22 pages, and is connected to the first terminal portion and the second terminal portion, the first terminal portion The first terminal hole is pierced, and the first terminal portion and the second terminal portion have a displacement amount in a direction parallel to the test surface; the bottom plate abuts the curved probe and covers the probe The bottom plate has a bottom surface away from the accommodating surface, the bottom surface is provided with a plurality of second terminal holes, and the second terminal hole communicates with the probe accommodating groove, so that the second terminal portion passes the second terminal The hole protrudes from the bottom surface. [0008] As can be seen from the above description, the present invention uses the bending elastic portion to measure the reciprocating up and down movement between the first terminal portion and the second terminal portion by the bending elastic portion, and The invention improves the problem that the impedance value of the spring is high, the current resistance is low, and the inductance is high, resulting in inaccurate test results, and the displacement between the first terminal portion and the second terminal portion in the direction parallel to the test surface The amount of contact between the circuit board and the test circuit board electrically connected to the second terminal portion does not need to be aligned with the position of the contact point of the chip to be tested, and can be shifted according to the position Make adjustments to reduce the difficulty of circuit wiring. [Embodiment] [0009] The detailed description and technical contents of the present invention will now be described as follows: [0010] Please refer to "Figure 1", "Figure 2" and "Figure 3", "Figure 1′′ and “Fig. 2” are respectively a perspective view of the appearance and structure of the present invention, and Fig. 3 is a schematic rear view of the detecting base according to an embodiment of the present invention, as shown in the figure: The detecting device of the bulk circuit chip comprises a detecting base 10, a plurality of bending probes 20, a plurality of upright probes 40, a bottom plate 30 and a wafer placing base 50. The test base 10 has a test surface 11 and a receiving surface 12 away from the test surface n. The test surface 11 defines a plurality of first terminal holes ι and a plurality of The first through hole 112 extends through the detecting base 1 , and the receiving surface 2 defines a plurality of probe receiving grooves 121 , and the first terminal hole and the probe are placed The slots 121 are in communication. [0012] [Monthly matching, as shown in FIG. 4A and FIG. 4B, respectively, is a schematic cross-sectional view of a bending probe and an upright probe according to an embodiment of the present invention, and the bending probe 20 is correspondingly disposed on the probe. The pin receiving groove 1212 includes a first terminal portion 21, a second terminal portion 22 opposite to the first terminal portion 21, and a bent elastic portion 23, and the bending elastic portion 23 is disposed at the first terminal portion. 21 and the second terminal portion 22 are connected to the first terminal portion 21 and the second terminal portion 22, and the first terminal portion 21 passes through the first terminal hole ln. In this embodiment, The bending elastic portion 23 includes a first turning portion 231 and a second turning portion 232. The first turning portion 231 is connected to the first terminal portion 21, and one end of the second turning portion 232 and the first turning portion The second terminal portion 21 is connected to the second terminal portion 22, and the first terminal portion 21, the first turning portion 231, the second portion The turning section 232 and the second terminal portion 22 are integrally formed, and the length of the first inflection section 231 is greater than the length of the second inflection section 232 The first terminal portion 21 and the second terminal portion 22 have a displacement amount S in a direction parallel to the test surface 11 . The upright probe 40 is disposed in the first straight hole 112 and includes a a sleeve 44, an elastic expansion member 43, a first contact end 41 and a second contact end 42 opposite the first contact end 41. The elastic expansion member 43 is disposed in the sleeve 44, in this embodiment. The elastic expansion member 43 is a spring, and the first connection form number A0101 the contact end 41 and the second contact end 42 are respectively connected to the two ends of the elastic 'sexual expansion member 43 and protrude from the sleeve 44. And the first contact end 41 also passes through the first straight hole 112 ′. It should be added that the curved probe 2 〇 and the upright probe 40 are respectively illustrated by only four and two in the figure, respectively. The upper terminal portion 21 and the second terminal portion 22 may be provided with only one turning segment (not shown), and the two ends of the turning segment are respectively connected to the first portion. a terminal portion 21 and the second terminal portion 22, and the first terminal portion 21 and the second terminal portion 22 are also paralleled in the test. The displacement amount having a direction S. 11 [0013] Please refer to FIG. 5, and FIG. 5 is a schematic rear view of the bottom plate of the present invention. The bottom plate 30 abuts the curved probe 20 and the upright probe 40' and covers the probe. The pin accommodating groove 121 has a top surface 31 adjacent to the accommodating surface 12 and a bottom surface 32 away from the accommodating surface 12, and the top surface 31 defines a plurality of corresponding probe accommodating grooves 121. The auxiliary accommodating groove 311 is configured to receive the bending elastic portion 23 and communicate with the probe accommodating groove 121 to form an activity for the bending elastic portion 23 to swing up and down due to bending. a plurality of second terminal holes 321 and a plurality of second straight holes 322 are formed in the bottom surface 32. The second terminal holes 321 are in communication with the auxiliary receiving groove 311, so that the second terminal portion 22 passes through the second The terminal hole 321 protrudes from the bottom surface 32, and the second straight hole 322 communicates with the first straight hole 112, so that the second contact end 42 protrudes from the bottom surface 32 by the second straight hole 322. [0014] As shown in FIG. 1 and FIG. 2, the detecting base 1 is further recessed with an engaging groove 113 on the test surface 11 to make the first terminal. And the first straight hole 112 is formed at a bottom of the engaging groove 113, and communicates with the M423838 engaging groove 113 of the form number A0101, which is engaged with the card. a groove 113 is formed, and a wafer groove 51 is recessed in the wafer holder 50. The wafer groove 51 is a wafer (not shown) for placing a test, and has a plurality of holes 511, which are not only The first terminal hole 丨丨丨 and the first straight hole 112 are connected to each other, and corresponding to the plurality of first electrical contacts disposed on the wafer, and the detecting pedestal 10 is further connected to the test surface n. The stopper piece 13 partially covers the engagement piece 13 in the engagement groove 113 to abut the wafer placement seat 50 in the engagement groove 113. [0015] Please refer to FIG. 6A and FIG. 6B for a schematic view of a wafer placement stand in a position to be tested and a test position according to an embodiment of the present invention. The wafer placement base 50 is engaged with the same. Between the slots 3, four elastic members 52 are disposed around the engaging slots 113. In this embodiment, the elastic members 52 are springs and are disposed to abut the wafer mounting seat 5 to the latch. The groove 113 is reciprocally moved up and down so that the wafer placement seat 5 has a position to be tested and a test position, and the position to be tested is that the wafer placement seat 5 is abutted by the four elastic members 52, and The two stoppers 13 are in contact with each other, and the first terminal portion 21 and the first contact end 41 are located in the through hole 511. The test position is that the wafer placement base 50 is pressed by an external force to compress the four elastic members 52. The first terminal portion 21 and the first contact end 41 are passed through the through hole 511. [0016] In use, the second terminal portion 22 and the second contact end 42 protrude from the bottom surface 32 and a test circuit board (not shown) by the second terminal hole 321 and the second straight hole 322, respectively. The second electrical contact is electrically connected, and the wafer is placed in the wafer slot 51 of the wafer placement base 50. The wafer placement base 5 is preselected to have a wafer slot 51 conforming to the size of the wafer. And the wafer placement base 50 is located at the position to be tested, and then pushes down the wafer placement seat 5〇 by using a pressing unit (Fig. No. A0101, page 8/22 pages). The first and second contact portions of the wafer are electrically connected to the first electrical contact of the wafer. And the first terminal portion 21 and the first contact end 41 have a buffer-like elasticity after contacting the first electrical contact, so that the first terminal portion 21 and the first contact end 41 are not excessively over-received. The wafer is damaged by the wafer, and the crystal #透(四)弯崎针 2Q and the vertical probe are connected to the test circuit board for measurement. In the operation, it is necessary for the second electrical terminal to have the displacement amount 3 in the direction parallel to the test surface 11 between the first terminal portion 21 and the second terminal portion 22, so that the second electrical contact The position does not need to be consistent with the position of the first electrical contact, thereby increasing the flexibility and spacing of the circuit wiring on the test circuit board. [0017] In addition, in the above-mentioned embodiment, the wafer placement base 50 can be directly fixed to the engagement groove 113 without the elastic member 52 being disposed, so that the wafer placement base 50 and the detection are performed. The pedestal 1 is integrated, so that the first terminal portion η and the 亥 first contact end 41 directly pass through the through hole 511, and the wafer is placed in the chip slot 51 and the first terminal portion 21 and the first The contact end 41 is in contact with the elastic portion of the first terminal portion 21 and the first contact end 41 by the bending elastic portion 23 and the elastic expansion member 43 to respectively press the wafer and the first terminal portion. 21 and measuring the manner in which the first contact end 41 is electrically connected. [0018] In summary, since the present invention is configured by the bending probe, the first inflection segment has a length greater than the length of the second inflection segment, so that the first terminal portion and the second terminal portion are between The measurement can be performed not only in the reciprocating displacement in the vertical direction, but also in the flat form number between the first terminal portion and the second terminal portion. 1010101, page 9 / total 22 pages M423838 [0019] [0020] [0021] [0027] [0027] [0027] Form No. A0101 also has the displacement amount in the direction of the test surface, which has the effect of increasing the flexibility and spacing of the circuit wiring on the test circuit board. Furthermore, the first terminal portion, the first inflection segment, the second inflection segment and the second terminal portion are structurally formed into a simple bending and are integrally formed, thereby further improving the conventional technology by a spring. The problem of high impedance, low current resistance and high inductance results in inaccurate test results. Therefore, the new model is highly progressive and meets the requirements for applying for a new type of patent, and the application is made according to law. The praying bureau has given the patent as early as possible. . The present invention has been described in detail above, but the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited. That is, the equal changes and modifications made in accordance with the scope of this new application shall remain within the scope of the patent of this new type. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing the appearance of an embodiment of the present invention. 2 is a schematic exploded view showing the structure of an embodiment of the present invention. FIG. 3 is a schematic rear view of the detecting base according to an embodiment of the present invention. 4A is a schematic view of a curved probe according to an embodiment of the present invention. 4B is a schematic cross-sectional view of an upright probe according to an embodiment of the present invention. FIG. 5 is a schematic rear view of a bottom plate according to an embodiment of the present invention. Fig. 6A is a view showing the wafer placement stand in a position to be tested according to an embodiment of the present invention. Figure 6B is a schematic illustration of a wafer placement station in a test position in accordance with an embodiment of the present invention. Page 10 of 22 [0028] M423838 [Key component symbol description] ίο : Detection base
[0029] 11 :測試面 [0030] 111 :第一端子孔 [0031] 112 :第一直孔 [0032] 113 :卡合槽 [0033] 12 :容置面 [0034] 121 :探針容置槽 [0035] 13 :擋止片 [0036] 20 :彎曲探針 [0037] 21 :第一端子部 [0038] 22 :第二端子部. [0039] 23 :彎折彈性部 [0040] 231 :第一轉折段 [0041] 232 :第二轉折段 [0042] 30 :底板 [0043] 31 :頂面 [0044] 311 :輔助容置槽 [0045] 32 :底面 [0046] 321 :第二端子孔 表單编號A0101 第11頁/共22頁 M423838 [0047] 322 :第二直孔 [0048] 4 0 :直立探針 [0049] 41 :第一接觸端 [0050] 42 :第二接觸端 [0051] 43 :彈性伸縮件 [0052] 44 :套筒 [0053] 50 :晶片置放座 [0054] 51 :晶片槽 [0055] 511 :穿孔 [0056] 52 :彈性件 [0057] S :位移量 表單编號A0101 第12頁/共22頁[0029] 11 : Test surface [0030] 111 : First terminal hole [0031] 112 : First straight hole [0032] 113 : Engagement groove [0033] 12 : accommodating surface [0034] 121 : Probe accommodation Slot [0035] 13 : stopper piece [0036] 20 : bending probe [0037] 21 : first terminal portion [0038] 22 : second terminal portion. [0039] 23 : bending elastic portion [0040] 231 : First turning section [0041] 232: second turning section [0042] 30: bottom plate [0043] 31: top surface [0044] 311: auxiliary receiving groove [0045] 32: bottom surface [0046] 321 : second terminal hole Form No. A0101 Page 11 of 22 M423838 [0047] 322: Second straight hole [0048] 4 0: Upright probe [0049] 41: First contact end [0050] 42: Second contact end [0051 43: elastic expansion member [0052] 44: sleeve [0053] 50: wafer placement seat [0054] 51: wafer groove [0055] 511: perforation [0056] 52: elastic member [0057] S: displacement amount form No. A0101 Page 12 of 22