M421663 五、新型說明： 【新型所屬之技術領域】 本創作係提供一種具有音箱之電子裝置，尤指一種不需 使用螺絲，且可有效隔絕音箱振動之電子裝置。 【先前技術】 傳統的音箱組裝技術中，通常係利用螺絲以將音箱鎖固 於殼體上。但是使用螺絲作為固定元件的成本昂貴，且螺絲 係為剛性材質，無法有效吸收音箱於操作時所產生的震動。 另種傳統式的音箱組裝技術係利用螺絲搭配防震墊片，然 而此種方式無法確保螺絲於穿透防震墊片後可正確地鎖固 於曰相上，若螺絲歪斜地插入音箱上之螺孔，防震墊片會被 螺絲擠壓喊生變形，而音箱所產生之震動即會從防震塾片 之變形處傳遞出來，因此如何設計出—成本低廉、組裳簡易 且具有較佳吸震功能之固定機構，以確保音箱可穩固地安裝 於设體上，即為現今電子產業重點發展目標之一。 【新型内容】 本創作係提供-種不需使用螺絲，且可有效隔絕音箱振 動之電子裝置，以解決上述之問題。 本創作之申請專利範圍係揭露一種具有音箱之電子装 置’其包含有-殼體’―音箱，其包含有__揚聲器，該音箱 係用來提供該揚聲H-共振空間，以及—固錢構，其係用 來將該音箱m定於該㈣^卿定機構包含有—定位結 M421663 構，設置於該殼體上，一夾鉗結構，設置於該音箱之一旁側， 以及一套環結構。該套環結構之側表面形成有一凹陷部，該 夾鉗結構係用來夾持於該套環結構之該凹陷部，且該套環結 構係設置於該定位結構上。 本創作之申請專利範圍另揭露該套環結構之中間區域 係形成有一開孔，該定位結構係為一柱體，且該柱體係穿設 該開孔，以使該套環結構套接於該定位結構。 本創作之申請專利範圍另揭露該套環結構係以摩擦接 合方式設置於該定位結構。 本創作之申請專利範圍另揭露該開孔之内側壁係形成 有一凹槽。 本創作之申請專利範圍另揭露該套環結構之該凹陷部 之一内側壁係形成有一凸塊，該凸塊用來於該夾钳結構夾持 該套環結構時抵接於該夾鉗結構。 本創作之申請專利範圍另揭露該殼體係包含有一肋結 構，該套環結構之一下端面係於套接該定位結構時接觸該肋 結構。 本創作之申請專利範圍另揭露該固定機構另包含有一 卡勾件，設置於該定位結構上，該卡勾件係用來於該套環結 構套接於該定位結構時，抵接該套環結構之一上端面。 本創作之申請專利範圍另揭露該卡勾件與該肋結構分 別用來限制該套環結構相對該定位結構之滑移。 本創作之申請專利範圍另揭露該固定機構另包含有一 5 M421663 蓋狀結構，連接該套環結構，該蓋狀結構之内部形成有一容 置二間，且該疋位結構係部分容置於該容置空間内。 本創作之申請專利範圍另揭露該蓋狀結構係以 型方式連接於該套環結構。 _本創作之申請專利範圍另揭露該電子裝置另包含有一 外蓋，連接該殼體，該外蓋係用來抵接該蓋狀結構辞 制該套環結構相對該定位結構滑動。 9 " 〜本創作之申料利範圍另揭露該固定機構另包含有一 緩衝結構’設置於該蓋狀結構鄰近該外蓋之一端。 本創作之_請專利範圍另揭露該蓋狀結構之 成有一破孔。 糸形 本創作之申料·圍另揭露該定位結難為一卜 =内且該岐機構另包含有—突出部，其係設置於該中工空 本創作之申請專利範圍另揭露該固定 卡合結構，設置於該套環結構之—端，該套環^^有' 卡合結構以設置於該定位結構上。 ’、错°玄 扣社本創作之申請專利範圍另揭露該定位結構係為—c型 本創作之申請專利範圍另揭露該固定機構另包含 握持部m該套環結構相對該卡合結構之另—端。 本創作之申請專利範圍另揭露該套 及該握持部係.體成财式相接合/、、。構料合結構 M421663 本創作之結構簡單、組裝容易，不需額外使用鎖附工 具，例如螺釘、螺栓、螺絲起子，即可將音箱快速且穩固地 安裝於殼體内，以確保電子裝置受外力撞擊時音箱不會自殼 體脫落。此外，本創作之固定機構之阻尼器可選擇性地視設 計需求由套環結構、蓋狀結構、缓衝結構或卡合結構所結合 而成，且阻尼器可由具彈性變形特性之材料組成，藉以有效 隔絕音箱所產生之振動，避免音箱所產生之振動經由殼體傳 遞至其他電子元件。 【實施方式】 請參閱第1圖，第1圖為本創作第一實施例之一電子裝 置10之元件爆炸示意圖。電子裝置10包含有一殼體12、一 音箱14以及一固定機構16。音箱14包含有一揚聲器141， 揚聲器141係藉由音箱14所提供之共振空間以有效提昇音 質。固定機構16包含有二定位結構18，設置於殼體12上， 二夹鉗結構20，分別設置於音箱14之兩旁側，以及二套環 結構22，用來連接相對應定位結構18與夾鉗結構20。請參 閱第2圖與第3圖，第2圖為本創作第一實施例之套環結構 22之外觀示意圖，第3圖為本創作第一實施例之套環結構 22之剖視圖。套環結構22之側表面形成有一凹陷部221， 夾鉗結構20係用來夾持於套環結構22之凹陷部221，且套 環結構22係設置於定位結構18上，因此套環結構22可作 為一媒介以將音箱14固定於殼體12上。於第一實施例中， 凹陷部221可為一環狀凹陷部，夾鉗結構20可為一 C型扣 M421663 結構，且該c型扣結構係以緊配合方式卡合於該環狀凹陷 部。此外，套環結構22之中間區域可形成有一開孔222，定 位結構18可為一柱體，且該柱體係用來穿設該開孔222，以 使套環結構22可以摩擦接合方式套接於該柱體上。一般來 說，套環結構22可以具有彈性變形特性之材料所組成，套 環結構22可視為一阻尼器，且音箱14所產生之振動可藉由 該阻尼器吸收，以避免振動經由殼體12傳遞至其他電子元 件，例如一硬碟機或一光碟機，而影響運轉效能。 如第2圖與第3圖所示，為了提高吸振效率，套環結構 22之開孔222的内側壁面可形成一環狀凹槽223。套環結構 22之一第一區塊22A可藉由環狀凹槽223之設計而形成一 懸臂結構，當音箱14於揚聲器141運作而產生振動時，該 懸臂結構可用來提高套環結構22(第一區塊22A)之彈性變形 裕度，以有效吸收音箱14所產生之振動；且該懸臂結構另 可利用其中空區域來避免該振動透過定位結構18直接傳遞 至殼體12。此外，套環結構22之凹陷部221的内侧壁面可 選擇性地形成複數個凸塊224，舉例來說，凸塊224可為一 圓弧凸點，其係可分別形成於套環結構22之一第二區塊22B 或一第三區塊22C之表面上。第二區塊22B及第三區塊22C 分別自上、下兩端夾持夾钳結構20，因此當爽钳結構20與 套環結構22接合時，凸塊224可用來抵接於夾鉗結構20之 表面，藉由減少接觸面積而降低兩者間的摩擦。如第1圖所 示，殼體12可包含有複數個肋結構121，其係設置於鄰近各 M421663 定位結構18之位置。固定機構16另可包含有複數個卡勾件 24，分別設置於相對應定位結構18上。當套環結構22套接 於定位結構18時，套環結構22之一下端面可與肋結構121 接觸，且卡勾件24可抵接於套環結構22之一上端面，藉以 限制套環結構22相對定位結構18之上下滑移。 請參閱第4圖與第5圖，第4圖與第5圖分別為本創作 第一實施例之電子裝置10於不同結合狀態之示意圖。如第4 圖所示，夾鉗結構20可為C型扣結構，套環結構22可為一 環型結構，故使用者首先將該C型扣結構自側向套入該環型 結構以與其接合，接著如第5圖所示，將連接於音箱14之 兩套環結構22軸向套上定位結構18。由於卡勾件24係以可 彈性彎曲方式連接於定位結構18，當兩個套環結構22套入 定位結構18時，套環結構22可推壓卡勾件24縮入定位結 構18之内部空隙，以使套環結構22可通過卡勾件24之限 位。當套環結構22通過卡勾件24後，套環結構22之上、 下端面分別被卡勾件24及肋結構121抵接，以固定套環結 構22相對定位結構18的位置，因此音箱14即可利用固定 機構16穩固地安裝於殼體12内。 請參閱第6圖，第6圖為本創作第二實施例之電子裝置 10之元件爆炸示意圖。相較於第一實施例，第二實施例係藉 由不同的固定機制來限制套環結構22之位移，以防止套環 結構22脫離定位結構18。第二實施例中，與前述實施例相 同編號之元件具有相同結構與功能，故於此不再詳述。第二 M421663 實施例之固定機構16另可包含有一蓋狀結構26，連接於套 環結構22，例如蓋狀結構26可選擇性地以一體成型方式連 接於套環結構22。蓋狀結構26可與套環結構22結合而形成 一阻尼器。請參閱第7圖至第8圖，第7圖為本創作第二實 施例之套環結構22與蓋狀結構26(意即該阻尼器）之外觀示 意圖，第8圖為本創作第二實施例之套環結構22與蓋狀結 構26(意即該阻尼器）之剖視圖。蓋狀結構26之内部可形成 有一容置空間261，當套環結構22套接於定位結構18時， 定位結構18可部分容置於容置空間261内，此時套環結構 22之該下端面不與殼體12之肋結構121接觸。肋結構121 與套環結構22間之空隙可用來提高套環結構22的變形裕 度，以防止套環結構22受擠壓而過度變形。第二實施例之 套環結構22具有如第一實施例所述之凹陷部221、開孔 222、凹槽223與凸塊224，其結構及功能如前所述（未示於 圖中），於此不再詳述。 此外，第二實施例之電子裝置10另可包含有一外蓋 28。外蓋28用來連接殼體12，藉以包覆音箱14及固定機構 16。固定機構16另可包含有一緩衝結構30，設置於蓋狀結 構26鄰近外蓋28之一端。當外蓋28與殼體12接合時，外 蓋28可抵接於緩衝結構30,藉以防止套環結構22相對定位 結構18滑動而脫離。由於蓋狀結構26遮蔽了套環結構22 之開孔222，蓋狀結構26之頂端另可形成有一破孔263，， 且破孔263係容置空間261及開孔222連通。當由蓋狀結構 M421663 26及套環結構22所組成之該阻尼器套接於定位結構18時， 使用者可透過破孔263來觀察到套環結構22相對定位結構 18之位置。於第二實施例中，定位結構18可為一中空挺體， 且固定機構16另可包含有一突出部32，設置於該中空枝體 内。當蓋狀結構26及套環結構22套接至定位結構18上時， 突出部32可些微露出破孔263’以便於使用者可藉由觀察突 出部32相較破孔263之相對位置，來判斷套環結構22是否 φ 已正確地組裝於定位結構18上。第二實施例之安裝步驟依 序為，使用者先將連接音箱丨4之夾鉗結構20夾持於套環鈐 構22之凹陷部221内，接著將套環結構22及蓋狀結構26 一起套入定位結構18，最後再蓋上外蓋28(意即將外蓋28 與殼體12接合）’此時外蓋28係緊密抵接於緩衝結構3〇， 以完成第二實拖例之音箱1.4的組裝。 請參閱第9圖’第9圖為本創作第三實施例之電子裝置 I 10之元件爆炸示意圖。相較於前述實施例，第三實施例係藉 由不同的固定機制來限制套環結構22之位移，以防止套環 結構22脫離定位結構18。第三實施例中，與前述實施例相 同編號之凡件具有相同結構與功能，故於此不再詳述。第三 實施例之電子裝置10的固定機構16另可包含有兩卡合結構 34，分別設置於相對應套環結構22之一端，以及兩握持部 36 ’分別設置於相對應套環結構22相對卡合結構34之另一 端。一般來说，套環結構22、卡合結構34及握持部36係可 以一體成型方式相結合而形成一阻尼器。請參閱第1〇圖， M421663 第ι〇圖為本創作第三實施例之套環結構22 及握持部卿尼器)之外觀示意圖。第：。構34 =可為一 c型扣結構，因此套環結構22可利用 34與該C型扣結構之接合，而固定於殼體12上。㈣f 於握持部36可由具彈性變形特性之材料所 由 36係用來提供使用者—施力點 持部 持部以彈性變形方式穿設爽握之 凹陷部221與夾廳構20卡合， 了構22之 μ的組裝。第三實施例之套環結構音箱 :=21、，22、_3 與二::實其:： 功此如則所述(未示於圖中)，於此不再詳述。 霉及 之套本創:之固定機構係使用由彈性材料所組成 為接“位結構與夾崎構之媒介，以使1 :穩固地設置於殼體内。為了簡化組裝流_提高安^相 定位：：機構可依據不同的機構空間搭配相對應的 ::::::環•以使套環結構可限位於 = t #蓋狀結構套接於定位結構時，麵_ 八&可不接觸殼體之肋結構，以延長套環結構的使用善 :構且Si接合殼體時可用來抵住與套環結構連接之:衝 r射t套環結構及錄結構脫較錢構；於第：實 把例中，套援έ士 μ 币一貫 、構於上、下兩端分別連接卡合結構及握持 12 M421663 部，卡合結構用來與定位結構相嵌合，握持部則用來施加外 力以帶動套環结構卡合至連接於音箱之夾鉗結構。因此本創 作之固定機構可利用阻尼器以穩定地將音箱安裝於殼體 内，阻尼器可包含套環結構、蓋狀結構、卡合結構或握持部， 並藉由阻尼器之彈性變形特性有效地吸收音箱所產生之振 動，以避免振動傳遞至殼體而影響其他電子元件之運作。 相較於先前技術，本創作之結構簡單、組裝容易，不需 額外使用鎖附工具，例如螺釘、螺栓、螺絲起子，即可將音 箱快速且穩固地安裝於殼體内，以確保電子裝置受外力撞擊 時音箱不會自殼體脫落。此外，本創作之固定機構之阻尼器 可選擇性地視設計需求由套環結構、蓋狀結構、緩衝結構或 卡合結構所結合而成，且阻尼器可由具彈性變形特性之材料 組成，藉以有效隔絕音箱所產生之振動，避免音箱所產生之 振動經由殼體傳遞至其他電子元件。 以上所述僅為本創作之較佳實施例，凡依本創作申請專 利範圍所做之均等變化與修飾，皆應屬本創作之涵蓋範圍。 【圖式簡單說明】 第1圖為本創作第一實施例之電子裝置之元件爆炸示意圖。 第2圖為本創作第一實施例之套環結構之外觀示意圖。 第3圖為本創作第一實施例之套環結構之剖視圖。 第4圖與第5圖分別為本創作第一實施例之電子裝置於不同 結合狀態之示意圖。 第6圖為本創作第二實施例之電子裝置之元件爆炸示意圖。 13 M421663 第7圖為本創作第二實施例之套環結構與蓋狀結構之外觀示 意圖。 第8圖為本創作第二實施例之套環結構與蓋狀結構之剖視 圖。 第9圖為本創作第三實施例之電子裝置之元件爆炸示意圖。 第10圖為本創作第三實施例之套環結構、卡合結構及握持 部之外觀示意圖。 【主要元件符號說明】 10 電子裝置 12 殼體 121 肋結構 14 音箱 141 揚聲器 16 固定機構 18 定位結構 20 爽甜結構 22 套環結構 22A 第一區塊 22B 第二區塊 22C 第三區塊 221 凹陷部 222 開孔 223 凹槽 224 凸塊 24 卡勾件 26 蓋狀結構 261 容置空間 263 破孔 28 外蓋 30 緩衝結構 32 突出部 34 卡合結構 36 握持部 14M421663 V. New Description: [New Technology Field] This creation provides an electronic device with a speaker, especially an electronic device that does not require the use of screws and can effectively isolate the vibration of the speaker. [Prior Art] In the conventional speaker assembly technique, a screw is usually used to lock the speaker to the housing. However, the use of screws as fixing components is expensive, and the screws are rigid materials, which cannot effectively absorb the vibration generated by the speaker during operation. Another traditional speaker assembly technology uses screws with shock-proof gaskets. However, this method does not ensure that the screws can be correctly locked to the 曰 phase after penetrating the shock-proof gasket. If the screws are inserted obliquely into the screw holes on the speaker The shock-proof gasket will be deformed by the screw, and the vibration generated by the speaker will be transmitted from the deformation of the shock-proof cymbal. Therefore, how to design - the low-cost, simple group and simple shock-absorbing function The mechanism to ensure that the speaker can be stably installed on the device is one of the key development goals of the electronics industry today. [New Content] This creation provides an electronic device that does not require the use of screws and can effectively isolate the vibration of the speaker to solve the above problems. The patent application scope of the present invention discloses an electronic device having a speaker, which includes a housing, a speaker, which includes a speaker, which is used to provide the speaker H-resonance space, and Structure, which is used to set the speaker m to the (four) ^ ding mechanism includes a positioning knot M421663 structure, is disposed on the housing, a clamp structure, is disposed beside one of the speakers, and a set of rings structure. The side surface of the collar structure is formed with a recessed portion for holding the recessed portion of the collar structure, and the collar structure is disposed on the positioning structure. The patent application scope of the present invention further discloses that the intermediate portion of the collar structure is formed with an opening, the positioning structure is a cylinder, and the column system is disposed through the opening, so that the collar structure is sleeved on the Positioning structure. The scope of the patent application of the present invention further discloses that the collar structure is disposed in the positioning structure in a frictional engagement manner. The scope of the patent application of the present invention further discloses that the inner side wall of the opening is formed with a groove. The patent application scope of the present invention further discloses that a sidewall of the recessed portion of the collar structure is formed with a bump for abutting the clamp structure when the clamp structure clamps the collar structure. . The scope of the patent application of the present invention further discloses that the housing comprises a rib structure, and a lower end surface of the collar structure is in contact with the rib structure when the positioning structure is sleeved. The scope of the patent application of the present invention further discloses that the fixing mechanism further comprises a hook member disposed on the positioning structure, the hook member is configured to abut the collar when the collar structure is sleeved on the positioning structure. One of the upper end faces of the structure. The scope of the patent application of the present invention further discloses that the hook member and the rib structure are used to limit the slip of the collar structure relative to the positioning structure, respectively. The scope of the patent application of the present invention further discloses that the fixing mechanism further comprises a cover structure of 5 M421663, and the collar structure is connected, and the inside of the cover structure is formed with two compartments, and the clamping structure is partially accommodated therein. Included in the space. The scope of the patent application of the present invention further discloses that the cover structure is connected to the collar structure in a manner. Further, the electronic device further includes an outer cover for connecting the housing, the outer cover for abutting the cover structure to slid the sleeve structure relative to the positioning structure. 9 " ~ The scope of the application of the present invention further discloses that the fixing mechanism further comprises a buffer structure disposed adjacent to one end of the cover. The scope of the present invention also discloses that the cover structure has a broken hole. The claim of the creation of the 糸 ················································································ The structure is disposed at an end of the collar structure, and the collar has a 'snap structure to be disposed on the positioning structure. The patent application scope of the present invention is also disclosed in the patent application scope. The fixing mechanism is further disclosed in the patent application. The fixing mechanism further includes a grip portion m. The collar structure is opposite to the engaging structure. Another end. The scope of the patent application of the present invention further discloses that the sleeve and the grip portion are combined with each other. The structure of the structure M421663 is simple in structure and easy to assemble. It can be quickly and firmly installed in the housing without additional locking tools such as screws, bolts and screwdrivers to ensure the external force of the electronic device. The speaker does not fall off the housing when it hits. In addition, the damper of the fixing mechanism of the present invention can be selectively combined by a collar structure, a cover structure, a buffer structure or a snap structure according to design requirements, and the damper can be composed of a material having elastic deformation characteristics. In order to effectively isolate the vibration generated by the speaker, the vibration generated by the speaker is prevented from being transmitted to other electronic components via the housing. [Embodiment] Please refer to Fig. 1. Fig. 1 is a schematic view showing the explosion of components of the electronic device 10 of the first embodiment of the present invention. The electronic device 10 includes a housing 12, a speaker 14 and a securing mechanism 16. The speaker 14 includes a speaker 141 that is responsive to the resonant space provided by the speaker 14 to effectively enhance the sound quality. The fixing mechanism 16 includes two positioning structures 18 disposed on the housing 12, and two clamping structures 20 respectively disposed on the two sides of the speaker 14, and two sets of ring structures 22 for connecting the corresponding positioning structures 18 and the clamps. Structure 20. Referring to Figures 2 and 3, Figure 2 is a schematic view showing the appearance of the collar structure 22 of the first embodiment of the present invention, and Figure 3 is a cross-sectional view of the collar structure 22 of the first embodiment of the present invention. The side surface of the collar structure 22 is formed with a recessed portion 221, and the clamp structure 20 is used for clamping the recessed portion 221 of the collar structure 22, and the collar structure 22 is disposed on the positioning structure 18, so the collar structure 22 It can be used as a medium to fix the speaker 14 to the housing 12. In the first embodiment, the recessed portion 221 can be an annular recessed portion, and the clamp structure 20 can be a C-shaped buckle M421663 structure, and the c-shaped buckle structure is engaged with the annular recessed portion in a tight fit manner. . In addition, the intermediate portion of the collar structure 22 can be formed with an opening 222. The positioning structure 18 can be a cylinder, and the column system is used to penetrate the opening 222, so that the collar structure 22 can be frictionally engaged. On the cylinder. In general, the collar structure 22 can be composed of a material having elastic deformation characteristics, and the collar structure 22 can be regarded as a damper, and the vibration generated by the speaker 14 can be absorbed by the damper to avoid vibration via the housing 12. It is transmitted to other electronic components, such as a hard disk drive or a CD player, which affects the performance. As shown in Figs. 2 and 3, in order to improve the vibration absorption efficiency, the inner side wall surface of the opening 222 of the collar structure 22 may form an annular groove 223. The first block 22A of one of the collar structures 22 can be formed into a cantilever structure by the design of the annular groove 223. When the speaker 14 is operated to vibrate by the speaker 141, the cantilever structure can be used to improve the collar structure 22 ( The elastic deformation margin of the first block 22A) effectively absorbs the vibration generated by the speaker 14; and the cantilever structure can utilize the hollow region to prevent the vibration from being transmitted directly to the housing 12 through the positioning structure 18. In addition, the inner side wall surface of the recessed portion 221 of the collar structure 22 can selectively form a plurality of bumps 224. For example, the bumps 224 can be a circular arc bump, which can be respectively formed on the collar structure 22 On the surface of a second block 22B or a third block 22C. The second block 22B and the third block 22C respectively clamp the clamp structure 20 from the upper and lower ends, so that when the stiffener structure 20 is engaged with the collar structure 22, the bump 224 can be used to abut the clamp structure. The surface of 20 reduces the friction between the two by reducing the contact area. As shown in Fig. 1, the housing 12 can include a plurality of rib structures 121 disposed adjacent to the respective M421663 positioning structures 18. The fixing mechanism 16 may further include a plurality of hook members 24 respectively disposed on the corresponding positioning structures 18. When the collar structure 22 is sleeved on the positioning structure 18, a lower end surface of the collar structure 22 can be in contact with the rib structure 121, and the hook member 24 can abut against an upper end surface of the collar structure 22, thereby limiting the collar structure. 22 slides over the relative positioning structure 18. Referring to FIG. 4 and FIG. 5, FIG. 4 and FIG. 5 are respectively schematic diagrams showing the electronic device 10 of the first embodiment in different combinations. As shown in FIG. 4, the clamp structure 20 can be a C-shaped buckle structure, and the collar structure 22 can be a ring-shaped structure, so the user firstly inserts the C-shaped buckle structure into the ring-shaped structure from the side to engage with the ring-shaped structure. Next, as shown in FIG. 5, the two loop structures 22 connected to the speaker 14 are axially fitted to the positioning structure 18. Since the hook member 24 is elastically bent to the positioning structure 18, when the two collar structures 22 are nested into the positioning structure 18, the collar structure 22 can press the hook member 24 to retract into the internal space of the positioning structure 18. So that the collar structure 22 can pass the limit of the hook member 24. After the collar structure 22 passes through the hook member 24, the upper and lower end faces of the collar structure 22 are respectively abutted by the hook member 24 and the rib structure 121 to fix the position of the collar structure 22 relative to the positioning structure 18, and thus the speaker 14 The fixing mechanism 16 can be used to securely mount in the housing 12. Please refer to FIG. 6. FIG. 6 is a schematic diagram showing the explosion of components of the electronic device 10 according to the second embodiment of the present invention. In contrast to the first embodiment, the second embodiment limits the displacement of the collar structure 22 by a different securing mechanism to prevent the collar structure 22 from disengaging from the positioning structure 18. In the second embodiment, elements numbering the same as those of the foregoing embodiments have the same structure and function, and therefore will not be described in detail herein. The second M421663 embodiment of the securing mechanism 16 can further include a lid-like structure 26 coupled to the collar structure 22, for example, the lid-like structure 26 can be selectively coupled to the collar structure 22 in an integrally formed manner. The lid structure 26 can be combined with the collar structure 22 to form a damper. Please refer to FIG. 7 to FIG. 8 . FIG. 7 is a schematic diagram showing the appearance of the collar structure 22 and the cover structure 26 (that is, the damper) according to the second embodiment of the present invention. FIG. 8 is a second embodiment of the creation. A cross-sectional view of the collar structure 22 and the lid structure 26 (i.e., the damper). The accommodating space 18 is formed in the accommodating space 18, and the locating structure 18 is partially accommodated in the accommodating space 261. The end faces are not in contact with the rib structure 121 of the housing 12. The gap between the rib structure 121 and the collar structure 22 can be used to increase the deformation margin of the collar structure 22 to prevent the collar structure 22 from being excessively deformed by being squeezed. The collar structure 22 of the second embodiment has a recessed portion 221, an opening 222, a recess 223 and a bump 224 as described in the first embodiment, the structure and function of which are as described above (not shown). It will not be detailed here. In addition, the electronic device 10 of the second embodiment may further include an outer cover 28. The cover 28 is used to connect the housing 12 to cover the speaker 14 and the fixing mechanism 16. The securing mechanism 16 can further include a cushioning structure 30 disposed adjacent the one end of the outer lid 28 of the lid-like structure 26. When the outer cover 28 is engaged with the housing 12, the outer cover 28 can abut against the cushioning structure 30 to prevent the collar structure 22 from sliding away from the positioning structure 18. Since the cover structure 26 shields the opening 222 of the collar structure 22, the top end of the cover structure 26 can be formed with a hole 263, and the hole 263 is connected to the receiving space 261 and the opening 222. When the damper composed of the cover structure M421663 26 and the collar structure 22 is sleeved on the positioning structure 18, the user can observe the position of the collar structure 22 relative to the positioning structure 18 through the hole 263. In the second embodiment, the positioning structure 18 can be a hollow body, and the fixing mechanism 16 can further include a protrusion 32 disposed in the hollow branch. When the cover structure 26 and the collar structure 22 are sleeved onto the positioning structure 18, the protrusion 32 can slightly expose the hole 263' so that the user can observe the relative position of the protrusion 32 relative to the hole 263. It is judged whether or not the collar structure 22 has been correctly assembled on the positioning structure 18. The mounting step of the second embodiment is in that the user first clamps the clamp structure 20 connected to the speaker 丨 4 into the recessed portion 221 of the collar structure 22, and then the collar structure 22 and the cover structure 26 together Nesting the positioning structure 18, and finally covering the outer cover 28 (meaning that the outer cover 28 is engaged with the housing 12) 'At this time, the outer cover 28 is closely abutted against the buffer structure 3〇, to complete the second real example of the speaker Assembly of 1.4. Referring to Fig. 9, Fig. 9 is a schematic view showing the explosion of the components of the electronic device I 10 of the third embodiment of the present invention. In contrast to the previous embodiments, the third embodiment limits the displacement of the collar structure 22 by a different securing mechanism to prevent the collar structure 22 from disengaging from the positioning structure 18. In the third embodiment, the same numbers and functions as those of the foregoing embodiments have the same structure and function, and therefore will not be described in detail herein. The fixing mechanism 16 of the electronic device 10 of the third embodiment may further include two engaging structures 34 respectively disposed at one end of the corresponding collar structure 22, and the two holding portions 36' are respectively disposed on the corresponding collar structure 22 The other end of the engaging structure 34 is opposite. In general, the collar structure 22, the snap-fit structure 34, and the grip portion 36 can be combined to form a damper in an integrally formed manner. Please refer to FIG. 1 , and the M421663 is a schematic view showing the appearance of the collar structure 22 and the grip portion of the third embodiment. No.: The frame 34 = can be a c-shaped buckle structure, so that the collar structure 22 can be secured to the housing 12 by the engagement of the 34 and the C-shaped buckle structure. (4) f The grip portion 36 may be used by the 36-series material having elastic deformation characteristics to provide a user-applying point portion, and the recessed portion 221 of the grip portion is elastically deformed to engage with the clip structure 20, The assembly of 22 μ is constructed. The collar structure speaker of the third embodiment: =21, 22, _3 and 2:: Actually:: This is as described above (not shown in the figure), and will not be described in detail herein. Mold and the set of the original: the fixed mechanism is made of elastic material to connect the "bit structure and the medium of the clips, so that 1: firmly set in the housing. In order to simplify the assembly flow _ improve the safety phase Positioning: The mechanism can be matched according to different institutional spaces: ::::: ring • so that the collar structure can be limited to = t #盖盖结构 接接在定位结构,面面_八& The rib structure of the casing is used to extend the use of the collar structure: the structure can be used to resist the connection with the collar structure when the Si is joined to the casing: the structure of the ring and the structure of the casing are removed; In the case of the actual case, the support of the gentleman's coin is consistent, and the upper and lower ends are respectively connected with the engaging structure and the grip 12 M421663, the engaging structure is used for fitting with the positioning structure, and the gripping portion is used. The external force is applied to drive the collar structure to engage with the clamp structure connected to the speaker. Therefore, the fixing mechanism of the present invention can utilize the damper to stably install the speaker in the casing, and the damper can include a collar structure and a cover shape. Structure, snap-fit structure or grip, and by elastic deformation of the damper Effectively absorbs the vibration generated by the speaker to prevent the vibration from being transmitted to the housing and affects the operation of other electronic components. Compared with the prior art, the present invention is simple in structure and easy to assemble, and does not require additional use of a locking tool such as a screw. , bolts, screwdrivers, the speaker can be quickly and steadily installed in the housing to ensure that the speaker will not fall off the housing when the electronic device is impacted by external force. In addition, the damper of the fixed mechanism of the present invention can be selectively Depending on the design requirements, it is composed of a collar structure, a cap structure, a buffer structure or a snap structure, and the damper can be composed of a material having elastic deformation characteristics, thereby effectively isolating the vibration generated by the speaker and avoiding the vibration generated by the speaker. It is transmitted to other electronic components via the housing. The above description is only a preferred embodiment of the present invention, and all the equivalent changes and modifications made by the scope of the patent application of the present invention should be covered by the present invention. 1 is a schematic diagram showing the explosion of components of the electronic device according to the first embodiment of the present invention. FIG. 2 is a first embodiment of the present invention. 3 is a cross-sectional view of the collar structure of the first embodiment of the present invention. FIGS. 4 and 5 are schematic views respectively showing the electronic device of the first embodiment in different combinations. Fig. 6 is a schematic view showing the explosion of the components of the electronic device according to the second embodiment of the present invention. 13 M421663 Fig. 7 is a schematic view showing the appearance of the collar structure and the lid structure of the second embodiment of the present invention. FIG. 9 is a schematic view showing the explosion of the components of the electronic device according to the third embodiment of the present invention. FIG. 10 is a view showing the collar structure and the engaging structure of the third embodiment of the present invention. Schematic diagram of the grip. [Main component symbol description] 10 Electronic device 12 Housing 121 Rib structure 14 Speaker 141 Speaker 16 Fixing mechanism 18 Positioning structure 20 Sweet structure 22 Collar structure 22A First block 22B Second block 22C third block 221 recessed portion 222 opening 223 recess 224 bump 24 snap hook 26 cover structure 261 accommodation space 263 hole 28 outer cover 30 buffer structure 32 protruding The grip portion 36 engaging structure 1434