M416028 五、新型說明： 【新型所屬之技術領域】 本創作係有關-種發光二極體⑽)燈具，特別是一種 以平板式熱管均熱之LED燈具。 【先前技術】 • 由於高功率發光二極體(LED)發光時容易產生大量的 廢熱’尤其當採用集中式芯片時，數量眾多的⑽晶片密 集酉己置在基板上’集中的廢熱格夕卜難以排出。若led燈 具無良好的餘卿’會使LED晶丨溫度過高，大幅降低 LED的性能與壽命。如採収扇做絲式賴，雖然散熱能 力較強’但牽涉到噪音與風扇壽命，尤其當風扇故障時， LED即會過熱而迅速燒壞;如採用被動式自然對流的散熱機 參 制，雖可安靜且無壽命限制，但自然對流的散熱效能甚低， 需搭配大面積的散熱轉片方足以應付大量的廢熱。又由於 集中的大量廢熱不易均勻分散至大面積的散熱韓片上，為 避免均熱的困難，-般多採用分散式設計，將眾多的晶片 散佈在大面積上’避免熱量過於集中，得以在自然對流狀 況下控制LED⑼溫度。然而，分散式設計在電路配置、 防水處理及光型掌控等方面均較集中式設計複雜許多。 3 M416028 創作人先前已提出中華民國創作專利申請第98128179 號’針對集中式高功率LED揭露一項技藝，如圖1所示， 採用均熱性極佳之平板式熱管112’並將其設置於一密封容 器壁110構成的氣密空間中。此外’LED模組130(包括LED 芯片、LED基板及透光鏡等）的基板131與密封容器壁11〇 之底板的接合面四周設置有密封物質134，以對LED基板 131做密封性保護。此技藝除使廢熱能均勻散開至較大面 積’進而能使大面積的散熱鰭片126充分發揮被動散熱的 功能外，並使平板式熱管112與LED模組的基板131受到 密封容器壁110與密封物質134的充分保護，與環境中的 水或污染物隔絕，具有免於鏽蝕的優點。然而，在此先前 技藝中，LED基板131與平板式熱管112間被密封容器壁 110隔開’使兩者間的導熱路徑包含一層容器壁11〇與兩層 導熱介面物質138 ’造成熱阻增加，對led的溫控產生負面 影響。 【新型内容】 為了解決上述問題，本創作提出一種發光二極體燈 具’其中平板式熱管與⑽芯片係設置於—防水、防汽的 氣密空間中’在此氣密郎巾，平板式熱管的紐區藉-層導熱介面物f ’直接與LED芯片之基板相接，而平板式 4 熱管的冷麵藉另-層導熱介面物s，直接與散熱韓片結 構底板相接，使得.力率之⑽芯片所釋放出的熱量可藉 由高均熱性辭板式熱管擴散至較A面積的散_片^ 構，再散至外界的大氣巾，具有散熱效率高之優點，得以 使LED晶#的溫度鱗在較低的溫度。此外，平板式熱管 與LED芯片均受到氣密空間的充分保護，與外界環境中的 水或污染物隔絕，具有免於鏽钮或性能衰退的問題。 為了達到上述目的，本創作一實施例之發光二極體燈 具包含：一氣密空間，由一框架、散熱鰭片結構底板之— 部份、一透光鏡共同組成，其中在各元件接合面處安置配 緊元件，如〇型環或墊片環，以防滲漏，並利用鎖固元件 完成組裝與固定。氣密空間中至少包括一發光二極體芯片 與一平板式熱管，平板式熱管下表面藉一層導熱介面物質 貼抵於發光·一極體这片之基板，其上表面則藉另一層導熱 介面物質貼抵於散熱鰭片結構底板。 【實施方式】 圖2所示為本創作一實施例LED燈具之結構示意圖， 如圖所示，一 LED燈具5由至少一 LED芯片15、一平板式 熱管12、一散熱鰭片結構24、一框架16及一透光鏡14所 M416028 鏡14外環中設置開孔，並將鎖固元件18通過開孔而直接 完成鎖固目的，則可免除固定框17之必要性。前述之平板 式熱管12係為一内含少量工作流體（圖中未示）的密封腔 體，腔體内壁通常貼附一層毛細結構物（圖中未示），且定 義有一蒸發區，此處蒸發區係指平板式熱管12與led芯片 15的基板相貼合的區域；LED芯片15發光所產生的廢熱經 第一導熱介面物質36傳至平板式熱管12的蒸發區，使該 處的工作流體吸收熱源之熱量而成為蒸汽，蒸汽在管體内 部均勻擴散並進而在大面積的冷凝區凝結，冷凝區此處係 才曰平板式熱管12與散熱鰭片結構底板25相貼合的區域； 凝結所釋放出的經第二導熱介面物⑽傳至散熱韓片 結構底板25，並進而分散至大面積的散熱則％，再藉由 自然對流_散至外界大氣巾。散賊片結構24可做適當 表面處理，如陽極處理、塗佈漆料或其他物質，以增加熱 輻射散熱。散熱鰭片26亦可具凹凸不平表面，如波浪型等， 以加強自然對流之散熱效果。上述⑽燈具5可涵蓋一個 以上的獨立氣密空間1〇’個別包括—平板式熱管ι2、一⑽ 芯片15與-透光鏡14等树；亦可涵蓋—個以上較大的 獨立氣密朗1G，侧包括複數個⑽別15或複數個平 板式熱管12。由於LED芯片需連接電源供應線路，上述氣 密空間10需狀-電源線，只要在電源線通孔（未顯示） 7 M416028 做好防滲漏措施，如使用螺絲、〇環或密封物質作密封，將 可輕易維持氣密空間10的氣密性。上述揭露之結構除具有 水密及汽密性，亦有易於安裝、拆卸的方便性。 圖2亦揭露在散熱鰭片結構底板25中可設置複數個 通氣貫穿孔27，以利於LED燈具5下方的冷空氣經貫穿孔 27向上流入散熱鰭片26之間隙中，以加強散熱能力。 φ 圖3所示為本創作另一實施例發光二極體燈具之結 構示意圖，其中包括一電源控制器7〇，以供應led芯片15 所品電此（電源線路未顯示）；一燈罩6〇，其上設置複數個 燈罩通氣開口 61，便於上浮之對流氣體之流通。 以上所述之實關健為說明本創作之技術以 點’其目的在使熟習此項技藝之人士能夠瞭解本創狀内 • 細細實施，當不能以之限定本創作之專利翻即大 ♦ 驗本創作所揭示之精神所作之鱗變化或修飾，仍應涵 蓋在本創作之專利範圍内。 8 M416028 27 貫穿孔 36 第一導熱介面物質 38 第二導熱介面物質 60 燈罩 61 燈罩通氣開口 70 電源控制器M416028 V. New description: [New technical field] This creation is related to a kind of light-emitting diode (10)) lamps, especially an LED lamp with flat-plate heat pipe soaking. [Prior Art] • High-power light-emitting diodes (LEDs) are prone to generate a large amount of waste heat when they emit light. Especially when a centralized chip is used, a large number of (10) wafers are densely placed on the substrate. Difficult to discharge. If the LED lamp has no good Yuqing, the LED crystal temperature will be too high, which will greatly reduce the performance and life of the LED. For example, the harvesting fan is made of wire, although the heat dissipation capability is strong, but it involves noise and fan life, especially when the fan fails, the LED will overheat and burn out quickly; if passive heat convection is used, It can be quiet and has no life limit, but the natural convection heat dissipation performance is very low, and it needs to be matched with a large area of heat transfer fins to cope with a large amount of waste heat. Moreover, since a large amount of waste heat is concentrated and is not easily dispersed uniformly on a large-area heat-dissipating Korean film, in order to avoid the difficulty of soaking heat, a distributed design is widely used, and a large number of wafers are spread over a large area to avoid excessive concentration of heat, which is natural. Control the LED (9) temperature under convection conditions. However, the decentralized design is much more complicated than the centralized design in terms of circuit configuration, waterproof processing, and light control. 3 M416028 The creator has previously proposed the Republic of China Patent Application No. 98128179, which discloses a technique for centralized high-power LEDs. As shown in Figure 1, a flat heat pipe 112' with uniform heat is used and placed in one. The sealed container wall 110 is formed in an airtight space. Further, a sealing substance 134 is provided around the joint surface of the substrate 131 of the LED module 130 (including the LED chip, the LED substrate, the light-transmitting mirror, and the like) and the bottom plate of the sealed container wall 11 to seal the LED substrate 131. In addition to the function of uniformly dispersing the waste heat energy to a large area, the large-sized heat dissipation fins 126 can fully exert the function of passive heat dissipation, and the flat heat pipe 112 and the substrate 131 of the LED module are subjected to the sealed container wall 110. The sealing material 134 is sufficiently protected from water or contaminants in the environment and has the advantage of being free of rust. However, in this prior art, the LED substrate 131 and the flat heat pipe 112 are separated by the sealed container wall 110 'so that the heat conduction path between the two includes a layer of the container wall 11 〇 and the two layers of the thermal interface material 138 ', resulting in an increase in thermal resistance. , has a negative impact on the temperature control of led. [New content] In order to solve the above problems, the present invention proposes a light-emitting diode lamp in which a flat-plate heat pipe and a (10) chip system are disposed in an air-tight space of waterproof and anti-steam. The new zone borrows the layer thermal interface f' directly to the substrate of the LED chip, and the cold surface of the flat 4 heat pipe is directly connected to the heat sink Korean substrate by the other layer of the thermal interface. The heat released by the (10) chip can be diffused to the A-area by means of a high-heat-heated plate heat pipe, and then dispersed to the outside air towel, which has the advantage of high heat dissipation efficiency, so that the LED crystal# The temperature scale is at a lower temperature. In addition, the flat heat pipe and the LED chip are fully protected by the airtight space, and are isolated from water or contaminants in the external environment, and have the problem of being free of rust buttons or performance degradation. In order to achieve the above object, a light-emitting diode lamp according to an embodiment of the present invention comprises: an air-tight space, which is composed of a frame, a part of a heat-dissipating fin structure bottom plate, and a light-transmitting mirror, wherein at the joint surface of each component Place the clamping elements, such as the 〇-ring or gasket ring, to prevent leakage and complete the assembly and fixing with the locking elements. The airtight space includes at least one light emitting diode chip and a flat heat pipe. The lower surface of the flat heat pipe is adhered to the substrate of the light emitting body by a layer of thermal conductive interface material, and the upper surface thereof is borrowed by another thermal interface. The substance adheres to the bottom plate of the heat dissipation fin structure. [Embodiment] FIG. 2 is a schematic structural view of an LED lamp according to an embodiment of the present invention. As shown in the figure, an LED lamp 5 is composed of at least one LED chip 15, a flat heat pipe 12, a heat sink fin structure 24, and a heat sink fin structure. The frame 16 and a transparent mirror 14 are provided with openings in the outer ring of the mirror 14 and the locking element 18 is directly inserted through the opening to eliminate the necessity of the fixing frame 17. The flat heat pipe 12 is a sealed cavity containing a small amount of working fluid (not shown). The inner wall of the cavity is usually attached with a capillary structure (not shown) and defines an evaporation zone. The evaporation zone refers to a region where the flat heat pipe 12 and the substrate of the LED chip 15 are adhered; the waste heat generated by the LED chip 15 is transmitted to the evaporation zone of the flat heat pipe 12 via the first heat conduction interface material 36, so that the work there is performed. The fluid absorbs the heat of the heat source to become steam, and the steam is uniformly diffused inside the pipe body and further condensed in a large area of the condensation zone, where the condensation zone is the area where the flat heat pipe 12 and the heat dissipation fin structure bottom plate 25 are adhered; The second heat-conducting interface (10) released by the condensation is transmitted to the heat-dissipating Korean structure bottom plate 25, and then dispersed to a large area for heat dissipation, and then convected by natural convection to the outside air towel. The thief sheet structure 24 can be suitably surface treated, such as anodized, coated, or otherwise, to increase heat radiation. The heat dissipation fins 26 may also have uneven surfaces, such as waves, to enhance the heat dissipation effect of natural convection. The above (10) luminaire 5 can cover more than one independent airtight space 1 〇 'individually include - flat type heat pipe ι2, one (10) chip 15 and - light transmissive mirror 14 and the like; can also cover more than one large independent airtight 1G, the side includes a plurality of (10) other 15 or a plurality of flat heat pipes 12. Since the LED chip needs to be connected to the power supply line, the above-mentioned airtight space 10 needs a power supply line, as long as the power supply line through hole (not shown) 7 M416028 is well protected against leakage, such as using a screw, an annulus or a sealing substance. The airtightness of the airtight space 10 can be easily maintained. In addition to being watertight and airtight, the above disclosed structure also has the convenience of being easy to install and disassemble. FIG. 2 also discloses that a plurality of ventilation through holes 27 may be disposed in the heat dissipation fin structure bottom plate 25 to facilitate the cold air flowing under the LED lamps 5 to flow upward through the through holes 27 into the gap of the heat dissipation fins 26 to enhance the heat dissipation capability. FIG. 3 is a schematic structural view of a light-emitting diode lamp according to another embodiment of the present invention, which includes a power controller 7〇 for supplying the LED chip 15 (the power line is not shown); a lamp cover 6〇 A plurality of shade ventilation openings 61 are provided thereon for facilitating the circulation of the convective gas floating upward. The above-mentioned Shi Guanjian is a description of the technology of this creation. The purpose of the technique is to enable those who are familiar with the art to understand the implementation of the creation and to implement the patent. Changes or modifications to the scales made by the spirit of this work should still be covered by the scope of this creation. 8 M416028 27 Through Hole 36 First Thermal Interface Material 38 Second Thermal Interface Material 60 Lampshade 61 Shade Vent Opening 70 Power Controller