M415264 五、新型說明： 【新型所屬之技術領域】 本創作是關於用於傳真機、影印機、影像掃描器 '條 碼讀取機等所使用的影像讀取裝置的照明光源的線狀光源 裝置。 【先前技術】 近年來’於個人傳真機等的影像讀取裝置，由於發光 —極體（以下稱爲led )的輸出功率提高，且感光元件， 也就是C C D型感測器的精密化，變得必須使用小型且低 耗電的LED來作爲讀取光源裝置的光源。舉例來說，已 知I有在由透光性的樹脂所構成的線狀導光體的端部配置 LED ’使LED的發光入射至導光體而在內部反射，使其從 所需要的方向出射至外部，藉此成爲線狀的光源的線狀光 源裝置。 第7圖是顯示習知例，也就是專利文獻1所示的線狀 光源裝置的結構的長邊方向剖面圖。 線狀光源裝置8具有：長型由透光性樹脂所構成的導 光體81，和被安裝在基板82上的白色LED 83。在基板 82的安裝有LED 83的面的相反側面上，經由傳熱構件84 接合有鋁製的散熱板85。另外，在此散熱板85上形成有 :朝LED 83的相反側的方向突出的散熱片86。 藉由這樣的線狀光源裝置8，可經由被配置於後方的 散熱板85及散熱片86，將產生於LED 83的熱散熱。 M415264 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2009-25679號公報 【新型內容】 [新型欲解決的課題] 可是，對於搭載這些線狀光源裝置的原稿讀取裝置等 ，已著手進行進一步的小型化。 但是，被讀取的原稿的尺寸爲既有的固定尺寸，所以 爲了使裝置小型化，必須縮小光源部分以外。 爲了 LED的散熱，雖以設置如上述所謂的散熱器爲 佳，但由於它們在長邊方向上佔有寬度，而無法小型化。 而爲了維持同等的散熱性能，無法縮小散熱器的體積。 也就是說，有必須維持和習知同等的散熱性能，同時 將線狀光源裝置本身小型化這樣的課題。 根據上述，本創作的目的是提供小型且散熱良好的構 造的線狀光源裝置。 [用以解決課題的手段] 爲了解決上述課題，本創作的申請專利範圍第1項所 記載的創作爲線狀光源裝置，其具備：發光元件；安裝有 該發光元件的基板；具有與該發光元件相對向的光取入面 ，且具有在與該光取入面不同的面上朝長邊方向以直線狀 -4 - M415264 延伸的光出射面的導光體；以及具有涵蓋長邊方向全體而 將該導光體的與光出射面不同的部分予以支承的凹部的支 承體，該線狀光源裝置的特徵爲：上述支承體是由金屬所 構成，上述基板和上述支承體是由貫穿至它們中的同一金 . 屬構件所連結。 另外，本創作的申請專利範圍第2項所記載的創作， 是如申請專利範圍第1項的創作，其特徵爲：上述基板和 φ 上述支承體是藉由複數個金屬構件所連結。 另外，本創作的申請專利範圍第3項所記載的創作， 是如申請專利範圍第1或2項的創作，其特徵爲：上述金 屬構件爲螺釘，且是對著上述支承體螺合。 另外，本創作的申請專利範圍第4項所記載的創作， 是如申請專利範圍第1或2項的創作，其特徵爲：上述金 屬構件爲定位銷，是對於上述支承體壓入。 另外，本創作的申請專利範圍第5項所記載的創作， ^ -是如申請專利範圍第2項的創作，其特徵爲：上述複數個 .金屬構件包含有：對於上述支承體螺合的螺釘、以及對於 上述支承體壓入的定位銷。 另外，本創作的申請專利範圍第6項所記載的創作， 是如申請專利範圍第1或2項的創作，其特徵爲：在上述 支承體，貫穿有上述金屬構件，並且形成有：以沿著長邊 方向延伸的方式開口的溝槽。 [新型效果] -5- M415264 根據本創作，以金屬構成導光體支承體來代替散熱器 ，並藉由同一金屬構件來將安裝有發光元件的基板和導光 體予以連結，藉此可得到同等的散熱效果。 因此，不需要基板後方的散熱片等，而可將線狀光源 裝置小型化。 【實施方式】 就本創作的實施形態加以說明。第1圖是顯示本創作 的線狀光源裝置的圖面，（a )是觀看基板側端面的側視 圖，（b)是將長邊方向朝左右配置的正視圖，（c)是沿 著A-A’線切斷的剖面圖。 另外，第2圖是將第1圖朝周方向旋轉90°的圖面， 同樣地，（a )是側視圖，（b )是正視圖，（c )是 B - B ’ 線的剖面圖。 另外，這些第1圖、第2圖的位置關係，也是藉由在 第1圖（a)、第2圖（a)、及第3圖（a)以箭頭所示 的光的出射方向差異來加以表示。 於第1圖（b )，在由透光性的樹脂材料所構成的導 光體30的長邊方向的一端部，也就是左端部，配置有金 屬製的連接部20與金屬製的基板11。於此圖，導光體30 是藉由金屬製的支承體40來支承位於紙面背側的背面， 另外，紙面前側的一部分是藉由彈簧材5 3來加以輔助性 地固定。 在基板11的導光體30側的表面設有用於供電的連接 -6 - M415264 器12 〇 另外，此基板11雖爲例如銅等的金屬，但在基板11 上形成有未圖示的絕緣層，且在此絕緣層內埋設有從發光 元件至連接器的佈線圖案等，所以和連接部20並不會短 . 路。 如第1圖（a)所示，大致爲長方形的基板11，是由 金屬製的構件也就是定位銷52及螺釘51所貫穿，並連同 φ 位於其內側的連接部20被固定於支承體40。 如第1圖（c )所示，導光體3 〇的剖面形狀的一部分 大致爲半圓狀，此部分朝長邊方向延伸，且是具有透鏡功 能的光出射面32。與此光出射面32不同的相反側，是由 支承體30的凹部41所支承，且爲了將入射至導光體30 的光導向箭頭的光出射方向，而形成有大致爲鋸齒狀的反 射部（未圖示）。 另外’在凹部4 1的表面設有擴散反射構件，使從大 ·'致爲鋸齒狀的反射部離開的光反射，再入射至導光體3 0。 . 在導光體30的周方向的一部分形成有凸部34，且此 凸部34是藉由彈簧材53來加以輔助性地固定於支承體4〇 〇 在支承體40的外面，形成有：其周方向的一部分開 口的剖面爲圓形的溝槽43a、43b，且溝槽43a' 43b沿著 長邊方向延伸。 這些溝槽具有分別讓定位銷52及螺釘5 1貫穿的螺孔 等的功’在將螺釘5 1螺合的情況’形成成爲母螺紋的 M415264 螺孔。 另外，由於一部分開放，而在支承體40的外面形成 有複數個凸部44，且此凸部44增加支承體40的表面積， 而具有散熱片的功能。 於第2圖（b)，在基板11的其中一面，安裝有發光 元件1〇也就是LED。在基板11和導光體30之間，配置 有：在內部形成反射面部21的金屬製的塊體也就是連接 部20。 以此安裝面側面對於導光體3 0的左側的端面也就是 光取入面的方式來加以配置。 連接部20是用於發光元件10和導光體30之間的定 位，並將從發光元件1〇所放射的光有效率地導向導光體 30 ° 作爲材料，舉例來說’雖然是鋁等的金屬，但也可以 由樹脂等所構成。 基板11和連接部20是由螺釘所貫穿，而被固定於支 承體40 »在支承體40形成有：如上述具有螺孔功能的溝 槽，從此溝槽的端部至中途將螺釘51螺合。 在本創作的線狀光源裝置1 ’從發光元件1〇所出射的 光是藉由連接部20的反射面部21而改變方向，並從光取 入面入射至導光體30內部。 入射的光朝長邊方向行經內部，同時其一部分由反射 部反射至預定的方向’並從光出射面32出射至外部。 藉此’從光出射面32出射在長邊方向上連續的線狀 -8 - M415264 的光。 第3圖是用來說明本創作的作用效果的模式圖，其顯 示安裝有發光元件的基板、和導光體支承體的機械性連接 關係。 . 在將導光體30支承的支承體40的長邊方向左側端部 ，配置有：連接部20和安裝有發光元件10的基板η。如 上述’將基板11和連接部20貫穿的螺釘51及定位銷52 φ ’是貫穿至支承體4〇內部。具體來說，螺釘51是螺合於 螺孔，而將定位銷5 2壓入。 在使用發光元件10時所產生的熱，首先會傳向位於 後方（左側）的基板1 1。雖然假設在對於此基板1〗進一 步於後方設有散熱器來作爲散熱構件的情況適當地加以散 熱，但如本創作的課題所揭示的散熱器並不適合小型化。 所以’以金屬材料構成將導光體30支承的支承體40 ’用來代替散熱器。然後，藉由金屬構件也就是螺釘5 1 #-及定位銷52來做基板1丨和支承體40的熱傳遞手段。 . 因此’可順利地從基板1 1傳熱至支承體4〇，藉由此 支承體40可進行與散熱器同等的散熱，所以不需要配置 於基板1 1的後方的散熱器。也就是說，可使線狀光源裝 置1的長邊方向的空間縮小。 爲了確認以上的冷卻效果，使用本創作的線狀光源裝 置來進行亮燈時的溫度測定實驗。對於溫度測定，針對第 1圖及第2圖所示的線狀光源裝置，使用改變散熱器的有 無、定位銷及螺釘等的金屬構件的有無、連接部的材料、 -9 - M415264 支承體的材料等的各種線狀光源裝置。 第4圖（a)〜（c)及第5圖（3)〜（d)是顯示實驗 條件1〜7的線狀光源裝置，顯示與第3圖相同的基板和 導光體支承體的機械性連接關係的模式圖。這些圖面的各 種條件的細節將在之後加以敘述。 在此’被標有和第3圖相同的圖號的結構是具有相同 功能，因此省略說明。 第6圖是顯示其各種線狀光源裝置的實驗條件1〜7 及其溫度測定結果。 用於實驗的發光元件’是在藍色發光元件上塗佈有黃 色螢光體的擬似白色LED，LED輸入電流値爲200 ( mA ) 〇 溫度測定是針對L E D接合溫度（元件溫度）、l E D 基板溫度、導光體支承體（距離光取入面15 mm的位置） 溫度，測定各處的溫度飽和時的溫度。另外，接合溫度是 根據以安裝於與基板接觸的LED封裝部分的熱電偶所測 定的溫度來加以算出。 在此，用於連接部及支承體的金屬爲鋁，定位銷爲 SUS製，螺釘爲鐵製^ 第4圖（a)是就條件（1)所示的線狀光源裝置。此 條件是作爲習知例的線狀光源裝置，其在基板11的後方 設有散熱器54。無定位銷52’基板11僅藉由螺釘51而 固定於樹脂製的支承體30。 此條件的亮燈時的溫度是如第6圖所示，LED接合溫 -10- M415264 度爲41.9°C ’ LED基板溫度爲33°C，支承體溫度爲21.1°C ，故知道產生於發光元件的熱並未傳向支承體，而是由散 熱器所散熱。 對於本創作的線狀光源裝置是以此條件1爲基準，而 . 要求同程度的散熱性能。對於各種條件的散熱效果的評估 ，是和此條件1同樣地，將元件溫度，也就是LED接合 溫度變成45度以下的打◎，將變成50度以下的視爲具有 φ 充分的效果而打〇，而對超過50度的打X。 第4圖（b )是就條件（2 )所示的線狀光源裝置，是 從第4圖（a )移除散熱器的結構。 此條件的亮燈時的溫度是如第6圖所示，LED接合溫 度變成74.7 °C，LED基板溫度變成68 °C，支承體溫度變成 2 1 .2 °C，散熱並不充分。依此條件，得知由於熱無處逸出 ，LED接合溫度變爲高溫。 第4圖（C )是就條件（3 )所示的線狀光源裝置，是 以金屬構成連接部20及支承體30，並將各個構件從兩端 _ 推擠而加以密合的結構。 此條件的亮燈時的溫度是如第6圖所示，LED接合溫 度變成62.3 °C，LED基板溫度變成54.7 °C，支承體溫度變 成24.82t，散熱並不充分。 這顯示了，即使僅以金屬來構成各結構，仍無法良好 地傳遞自LED所產生的熱。雖然從LED也就是發光元件 1 0所產生的熱會暫時傳遞至位於後方的基板1 1，但在之 後會經由其他構件也就是連接部20，而被傳遞至支承體 -11 - M415264 4 0。因此，認爲是位於構件間的微小間隙阻止熱量的傳遞 〇 第5圖（a)是就條件（4)所示的線狀光源裝置，其 是與本創作，也就是第3圖相同的結構。 此條件的亮燈時的溫度是如第6圖所示，LED接合溫 度變成42.6 °C，LED基板溫度變成35.5。(：，支承體溫度變 成2 9 °C，故得到了良好的散熱效果。 此條件顯示’從LED也就是發光元件i 〇所產生的熱 ’是經由螺釘51及定位銷52’而良好地傳遞至金屬製的 支承體30。 因此，支承體溫度比條件1 ~ 3更商，而L E D接合溫 度下降’可以說與設有散熱片的情況具有同等的散熱性能 〇 這是由於在將螺釘螺合、壓入插銷的情況，受壓力所 貫穿的構件彼此連結，在構件間沒有產生間隙的空間，另 外’由於金屬構件因延展性而稍微變形，因間隙也被塡滿 故構件彼此密合而變得幾乎沒有間隙，所以可視爲熱傳遞 變好。 第5圖（b)是就條件（5)所示的線狀光源裝置，是 從第5圖（a )移除定位銷5 2的結構。 此條件的亮燈時的溫度是如第6圖所示，L E D接合溫 度變成43.3 °C，LED基板溫度變成36_5乞，支承體溫度變 成2 8.9 °C，故得到了良好的散熱效果。 第5圖（c)是就條件（6)所示的線狀光源裝置，是 -12- M415264 從第5圖（a)移除螺釘51的結構。 此條件的亮燈時的溫度是如第6圖所示，L E D接合溫 度變成48_5°C，LED基板溫度變成35.5 °C，支承體溫度變 成25.7°C，故得到了充分的散熱效果。 - 依這些條件，顯示了在藉由任一金屬構件來連接基板 .^和支承體30的情況，具有充分的散熱效果。對於比起 插銷，螺釘的溫度更低這件事，將其視爲藉由螺紋來增加 φ 構件間的接觸面積的緣故。 第5圖（d)是就條件（7)所示的線狀光源裝置，是 於第5圖（a )的結構以樹脂作爲連接部。 此條件的亮燈時的溫度是如第6圖所示，LED接合溫 度變成49.4 °C，LED基板溫度變成41.91，支承體溫度變 成2 6.2 °C，故得到了充分的散熱效果。 此條件顯示，連接部20即使不是金屬而是樹脂，也 會有散熱效果。也就是說，傳自基板11的熱並不是經由 # '連接部所傳遞’而可視爲經由螺釘51及定位銷5 2所傳遞 〇 根據上述，以金屬構成導光體支承體來代替散熱器， 並藉由同一金屬構件來將安裝有發光元件的基板、與導光 體連結，藉此可得到同等的散熱效果。因此，不需要基板 後方的散熱器等，而可將線狀光源裝置小型化。 【圖式簡單說明】 第1圖是顯示本創作的線狀光源裝置的圖面，（a ) -13- M415264 是觀看基板側端面的側視圖’ （b )是將長邊方向朝左右 配置的正視圖，（c )是A-A’線剖面圖。 第2圖是將本創作的線狀光源裝置，也就是第1圖朝 周方向旋轉90°的圖面，（a )是觀看基板側端面的側視圖 ，（b)是將長邊方向朝左右配置的正視圖，（c)是B-B， 線剖面圖。 第3圖是用來說明本創作的作用效果的模式圖。 第4圖是顯示習知例及比較例，也就是線狀光源裝置 的各種實驗條件的圖面。 第5圖是顯示本創作的線狀光源裝置的各種實驗條件 的圖面。 第6圖是顯示本創作的線狀光源裝置的實驗結果的圖 面。 第7圖是顯示習知例的線狀光源裝置的長邊方向剖面 圖。 【主要元件符號說明】 1 :線狀光源裝置 10 :發光元件 1 1 :基板 12 :連接器 20 :連接部 21 :反射面部 30 :導光體 14- M415264 3 2 :光出射面 3 3 :反射部 34 :凸部 40 :支承體 41 :凹部 42 =擴散反射構件 43a :溝槽M415264 V. New description: [New technical field] This is a linear light source device for illumination light sources used in image reading devices used in facsimile machines, photocopiers, image scanners, and bar code readers. [Prior Art] In recent years, in an image reading apparatus such as a personal facsimile machine, the output power of the light-emitting body (hereinafter referred to as led) is improved, and the photosensitive element, that is, the CCD type sensor is refined and changed. It is necessary to use a small and low-power LED as a light source for reading the light source device. For example, it is known that I arranges an LED at the end of a linear light guide made of a translucent resin so that the light emitted from the LED enters the light guide and is internally reflected to be in a desired direction. A linear light source device that emits light to the outside and thereby becomes a linear light source. Fig. 7 is a longitudinal cross-sectional view showing the structure of a linear light source device shown in Patent Document 1, which is a conventional example. The linear light source device 8 has a long light guide 81 made of a translucent resin, and a white LED 83 mounted on the substrate 82. On the opposite side surface of the surface of the substrate 82 on which the LEDs 83 are mounted, a heat dissipation plate 85 made of aluminum is joined via the heat transfer member 84. Further, on the heat radiating plate 85, a heat sink 86 projecting in a direction opposite to the LED 83 is formed. With such a linear light source device 8, heat generated in the LEDs 83 can be dissipated via the heat sink 85 and the heat sink 86 disposed at the rear. [Mast Document] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2009-25679 [New Content] [New problem to be solved] For a document reading device or the like in which these linear light source devices are mounted, Further miniaturization has been initiated. However, since the size of the document to be read is an existing fixed size, in order to downsize the device, it is necessary to reduce the size of the light source. In order to dissipate heat of the LEDs, it is preferable to provide a heat sink as described above, but since they occupy a width in the longitudinal direction, they cannot be miniaturized. In order to maintain the same heat dissipation performance, the size of the heat sink cannot be reduced. In other words, there is a problem in that it is necessary to maintain the same heat dissipation performance as the conventional one and to reduce the size of the linear light source device itself. According to the above, the object of the present invention is to provide a linear light source device which is small in size and heat-dissipating. [Means for Solving the Problem] In order to solve the above problem, the creation of the first aspect of the present application is a linear light source device comprising: a light-emitting element; a substrate on which the light-emitting element is mounted; and the light-emitting device a light guiding surface that faces the light-receiving surface of the element and has a light-emitting surface that extends linearly in the longitudinal direction -4 to M415264 on a surface different from the light-intake surface; and has a longitudinal direction A support for a concave portion that supports a portion of the light guide that is different from a light exit surface, wherein the support is made of metal, and the substrate and the support are penetrated to The same gold in them is connected to the member. Further, the creation described in the second paragraph of the patent application of the present application is the creation of the first item of the patent application, characterized in that the substrate and the φ support are connected by a plurality of metal members. Further, the creation described in the third paragraph of the patent application of the present application is the creation of the first or second aspect of the patent application, characterized in that the metal member is a screw and is screwed to the support. Further, the creation described in the fourth aspect of the patent application of the present application is the creation of the first or second aspect of the patent application, characterized in that the metal member is a positioning pin and is press-fitted into the support. In addition, the creation described in item 5 of the scope of the patent application of the present application is the creation of the second item of the patent application, characterized in that the plurality of metal members include: screws for screwing the support body And a positioning pin that is pressed into the support body. In addition, the creation described in the sixth paragraph of the patent application of the present application is the creation of the first or second aspect of the patent application, characterized in that the support member has the metal member inserted therein and is formed with A groove that opens in a manner that extends in the longitudinal direction. [New effect] -5- M415264 According to the present invention, a light guide body is made of a metal instead of a heat sink, and the substrate on which the light emitting element is mounted and the light guide are connected by the same metal member. The same cooling effect. Therefore, the heat sink or the like behind the substrate is not required, and the linear light source device can be downsized. [Embodiment] An embodiment of the present creation will be described. Fig. 1 is a plan view showing the linear light source device of the present invention, wherein (a) is a side view of the end surface on the side of the viewing substrate, (b) is a front view in which the longitudinal direction is arranged to the left and right, and (c) is along A. -A' line cut section view. In addition, Fig. 2 is a view in which the first figure is rotated by 90° in the circumferential direction, and (a) is a side view, (b) is a front view, and (c) is a cross-sectional view taken along line B - B '. In addition, the positional relationship between the first figure and the second figure is also caused by the difference in the direction of emission of light indicated by the arrows in the first (a), second (a), and third (a) arrows. Express it. In Fig. 1(b), a metal connecting portion 20 and a metal substrate 11 are disposed at one end portion of the light guiding body 30 made of a translucent resin material in the longitudinal direction, that is, at the left end portion. . In the figure, the light guide body 30 supports the back surface on the back side of the paper surface by a metal support body 40, and a part of the front side of the paper is additionally fixed by the spring material 53. A connection -6 - M415264 12 for supplying power is provided on the surface of the substrate 11 on the side of the light guide 30. Further, although the substrate 11 is made of a metal such as copper, an insulating layer (not shown) is formed on the substrate 11. Further, a wiring pattern or the like from the light-emitting element to the connector is buried in the insulating layer, so that the connection portion 20 is not short. As shown in Fig. 1(a), the substantially rectangular substrate 11 is penetrated by a member made of metal, that is, the positioning pin 52 and the screw 51, and is fixed to the support 40 together with the connecting portion 20 on the inner side of the φ. . As shown in Fig. 1(c), a part of the cross-sectional shape of the light guide body 3 is substantially semicircular, and this portion extends in the longitudinal direction and is a light exit surface 32 having a lens function. The opposite side to the light exit surface 32 is supported by the concave portion 41 of the support body 30, and a substantially zigzag-shaped reflecting portion is formed in order to guide the light incident on the light guide body 30 to the light emission direction of the arrow. (not shown). Further, a diffuse reflection member is provided on the surface of the concave portion 41, and light that has been separated from the large-sized "tooth-shaped reflection portion" is reflected and incident on the light guide body 30. A convex portion 34 is formed in a part of the circumferential direction of the light guide body 30, and the convex portion 34 is additionally fixed to the support body 4 by the spring member 53 on the outer surface of the support body 40, and is formed with: A part of the opening in the circumferential direction has a circular cross section 43a, 43b, and the groove 43a' 43b extends in the longitudinal direction. These grooves have M415264 screw holes which are formed as female threads when the screw holes of the locating pins 52 and the screws 51 are respectively inserted in the case where the screws 5 1 are screwed together. Further, since a part of the opening is formed, a plurality of convex portions 44 are formed on the outer surface of the support body 40, and the convex portion 44 has a surface area of the support body 40 and has a function as a heat sink. In Fig. 2(b), a light-emitting element 1 is also mounted on one side of the substrate 11, that is, an LED. Between the substrate 11 and the light guide 30, a metal block, that is, a connecting portion 20, in which the reflecting surface portion 21 is formed is disposed. The side of the mounting surface is arranged such that the end face on the left side of the light guide body 30, that is, the light take-in surface. The connecting portion 20 is used for positioning between the light-emitting element 10 and the light guide 30, and efficiently guides the light emitted from the light-emitting element 1 to the light guide 30° as a material, for example, although it is aluminum or the like. The metal may be made of a resin or the like. The substrate 11 and the connecting portion 20 are penetrated by screws and are fixed to the support body 40. The support body 40 is formed with a groove having a function of a screw hole as described above, and the screw 51 is screwed from the end portion of the groove to the middle. . The light emitted from the light-emitting element 1' in the linear light source device 1' of the present invention is redirected by the reflecting surface portion 21 of the connecting portion 20, and is incident on the inside of the light guiding body 30 from the light-receiving surface. The incident light passes through the inside in the longitudinal direction while a part thereof is reflected by the reflecting portion to a predetermined direction' and is emitted from the light exiting surface 32 to the outside. Thereby, the light of the linear -8 - M415264 continuous in the longitudinal direction is emitted from the light exit surface 32. Fig. 3 is a schematic view for explaining the effect of the present creation, showing the mechanical connection relationship between the substrate on which the light-emitting element is mounted and the light guide support. In the left end portion of the support body 40 that supports the light guide body 30 in the longitudinal direction, a connection portion 20 and a substrate η on which the light-emitting element 10 is mounted are disposed. The screw 51 and the positioning pin 52 φ ' through which the substrate 11 and the connecting portion 20 are inserted are penetrated into the inside of the support body 4''. Specifically, the screw 51 is screwed to the screw hole, and the positioning pin 52 is pressed. The heat generated when the light-emitting element 10 is used is first transmitted to the substrate 11 located at the rear (left side). Although it is assumed that heat is appropriately dissipated as a heat dissipating member in the case where the substrate 1 is further provided with a heat sink, the heat sink disclosed in the present problem is not suitable for miniaturization. Therefore, the support 40' supporting the light guide body 30 is made of a metal material instead of the heat sink. Then, the heat transfer means of the substrate 1 and the support 40 are made by the metal members, that is, the screws 5 1 #- and the positioning pins 52. Therefore, the heat can be smoothly transferred from the substrate 11 to the support 4, whereby the support 40 can dissipate heat equivalent to the heat sink. Therefore, the heat sink disposed behind the substrate 1 1 is not required. In other words, the space in the longitudinal direction of the linear light source device 1 can be reduced. In order to confirm the above cooling effect, the linear light source device of the present invention was used to perform a temperature measurement experiment at the time of lighting. For the measurement of the temperature, the presence or absence of the metal member such as the presence or absence of the heat sink, the positioning pin, and the screw, the material of the connection portion, and the -9 - M415264 support are used for the linear light source device shown in Figs. 1 and 2 . Various linear light source devices such as materials. 4(a) to (c) and Fig. 5 (3) to (d) are the linear light source devices showing the experimental conditions 1 to 7, and the same substrate and the light guide support body as those of Fig. 3 are displayed. Schematic diagram of the sexual connection relationship. Details of the various conditions of these drawings will be described later. Here, the structure marked with the same reference numerals as in Fig. 3 has the same function, and therefore the description thereof will be omitted. Fig. 6 is a graph showing experimental conditions 1 to 7 of various linear light source devices and their temperature measurement results. The light-emitting element used in the experiment is a pseudo-white LED coated with a yellow phosphor on the blue light-emitting element, and the LED input current 値 is 200 (mA). The temperature measurement is for the LED junction temperature (element temperature), l ED The substrate temperature and the temperature of the light guide support (a position 15 mm from the light intake surface) were measured, and the temperature at each temperature saturation was measured. Further, the bonding temperature was calculated from the temperature measured by a thermocouple attached to the LED package portion in contact with the substrate. Here, the metal used for the connection portion and the support is aluminum, the positioning pin is made of SUS, and the screw is made of iron. Fig. 4(a) is a linear light source device shown by the condition (1). This condition is a linear light source device as a conventional example in which a heat sink 54 is provided behind the substrate 11. The substrate 11 without the positioning pin 52' is fixed to the support body 30 made of resin only by the screw 51. The temperature at the time of lighting of this condition is as shown in Fig. 6, and the LED bonding temperature is -10 415 264 degrees, which is 41.9 ° C. The temperature of the LED substrate is 33 ° C, and the temperature of the support is 21.1 ° C. The heat of the component is not transmitted to the support but is dissipated by the heat sink. The linear light source device of the present invention is based on this condition 1, and requires the same degree of heat dissipation performance. In the evaluation of the heat dissipation effect of various conditions, in the same manner as in the case of the condition 1, the element temperature, that is, the LED junction temperature is changed to 45 degrees or less, and the temperature is 50 degrees or less, which is considered to have a sufficient effect of φ. And hit X for more than 50 degrees. Fig. 4(b) shows the structure of the linear light source device shown in the condition (2), which is a heat sink removed from Fig. 4(a). The temperature at the time of lighting of this condition is as shown in Fig. 6, the LED junction temperature becomes 74.7 °C, the LED substrate temperature becomes 68 °C, and the support temperature becomes 21.2 °C, and the heat dissipation is not sufficient. According to this condition, it is known that the LED bonding temperature becomes high because the heat has nowhere to escape. Fig. 4(C) shows a linear light source device shown in the condition (3), in which the connecting portion 20 and the support body 30 are made of metal, and the respective members are pushed from both ends to be in close contact with each other. The temperature at the time of lighting of this condition is as shown in Fig. 6, the LED junction temperature becomes 62.3 °C, the LED substrate temperature becomes 54.7 °C, and the support body temperature becomes 24.82 t, and the heat dissipation is not sufficient. This shows that even if the structures are formed only of metal, the heat generated from the LEDs cannot be well transmitted. Although the heat generated from the LED, that is, the light-emitting element 10, is temporarily transmitted to the substrate 1 1 located at the rear, it is transferred to the support -11 - M415264 40 via the other member, that is, the connecting portion 20 thereafter. Therefore, it is considered that the minute gap between the members prevents the transfer of heat. Fig. 5(a) shows the linear light source device shown in the condition (4), which is the same structure as the present creation, that is, the third figure. . The temperature at the time of lighting of this condition is as shown in Fig. 6, the LED bonding temperature becomes 42.6 °C, and the LED substrate temperature becomes 35.5. (: The temperature of the support becomes 2 9 °C, so a good heat dissipation effect is obtained. This condition shows that 'the heat generated from the LED, that is, the light-emitting element i '' is well transmitted via the screw 51 and the positioning pin 52'. Therefore, the metal support body 30. Therefore, the support body temperature is more favorable than the conditions 1 to 3, and the LED junction temperature is lowered, which can be said to have the same heat dissipation performance as the case where the heat sink is provided. This is because the screw is screwed. When the pin is pressed in, the members that are penetrated by the pressure are connected to each other, and there is no space for creating a gap between the members. In addition, since the metal member is slightly deformed due to the ductility, the members are close to each other due to the gap being filled. There is almost no gap, so it can be considered that the heat transfer is good. Fig. 5(b) shows the structure of the linear light source device shown in the condition (5), and the positioning pin 52 is removed from Fig. 5(a). The temperature at the time of lighting of this condition is as shown in Fig. 6, the LED junction temperature becomes 43.3 °C, the LED substrate temperature becomes 36_5 乞, and the support temperature becomes 2 8.9 °C, so that a good heat dissipation effect is obtained. Figure (c) is just The linear light source device shown in the item (6) is a structure in which the -12-M415264 removes the screw 51 from Fig. 5(a). The temperature at the time of lighting of this condition is as shown in Fig. 6, the LED bonding temperature When it becomes 48_5 ° C, the temperature of the LED substrate becomes 35.5 ° C, and the temperature of the support becomes 25.7 ° C, so that a sufficient heat dissipation effect is obtained. - According to these conditions, it is shown that the substrate is connected by any metal member. In the case of the body 30, it has a sufficient heat dissipation effect. For the case where the temperature of the screw is lower than the bolt, it is considered to increase the contact area between the φ members by the thread. Fig. 5(d) is In the linear light source device shown in the condition (7), the structure of Fig. 5(a) is made of a resin as a connecting portion. The temperature at the time of lighting under this condition is as shown in Fig. 6, and the LED bonding temperature becomes 49.4. °C, the temperature of the LED substrate becomes 41.91, and the temperature of the support becomes 2 6.2 °C, so that a sufficient heat dissipation effect is obtained. This condition shows that the connection portion 20 has a heat dissipation effect even if it is not a metal but a resin. The heat transmitted from the substrate 11 is not via the #' connection It can be regarded as being transmitted via the screw 51 and the positioning pin 52. According to the above, the light guide body is made of metal instead of the heat sink, and the substrate on which the light-emitting element is mounted and the light guide are provided by the same metal member. By connecting the body, the same heat dissipation effect can be obtained. Therefore, the linear light source device can be miniaturized without using a heat sink or the like behind the substrate. [Simplified description of the drawing] Fig. 1 is a view showing the linear light source of the present invention. (a) -13- M415264 is a side view of the end surface of the viewing substrate side. (b) is a front view in which the longitudinal direction is arranged to the left and right, and (c) is a cross-sectional view taken along line A-A'. Fig. 2 is a plan view showing the linear light source device of the present invention, that is, the first embodiment rotated 90° in the circumferential direction, (a) is a side view of the end surface on the side of the viewing substrate, and (b) is a side view of the long side. The front view of the configuration, (c) is the BB, line profile. Fig. 3 is a schematic diagram for explaining the effect of the present creation. Fig. 4 is a view showing various experimental conditions of a conventional example and a comparative example, that is, a linear light source device. Fig. 5 is a view showing various experimental conditions of the linear light source device of the present invention. Fig. 6 is a view showing the experimental results of the linear light source device of the present invention. Fig. 7 is a longitudinal sectional view showing a linear light source device of a conventional example. [Description of main component symbols] 1 : Linear light source device 10 : Light-emitting element 1 1 : Substrate 12 : Connector 20 : Connection portion 21 : Reflecting surface portion 30 : Light guide body 14 - M415264 3 2 : Light exit surface 3 3 : Reflection Portion 34: convex portion 40: support body 41: concave portion 42 = diffused reflection member 43a: groove
4 3 b :溝槽 44 :凸部 48 :板 5 1 :螺釘 5 2 :定位銷 5 3 :彈簧材 54 :散熱片 5 5 :螺釘4 3 b : Groove 44 : Projection 48 : Plate 5 1 : Screw 5 2 : Locating pin 5 3 : Spring material 54 : Heat sink 5 5 : Screw
8 :線狀光源裝置 81 :導光體 8 2 :基板8 : Linear light source device 81 : Light guide body 8 2 : Substrate
83 : LED 8 4 :傳熱構件 8 5 :散熱板 8 6 :散熱片83 : LED 8 4 : Heat transfer member 8 5 : Heat sink 8 6 : Heat sink