M415254 五、新型說明： 【新型所屬之技術領域】 本創作係關於一種散熱模組，尤指一種提高散熱效果的 散熱模組。 【先前技術】 由於LED燈低耗電量及高光功率的特性，其已經取代 •傳統燈泡及省電燈泡，成為現今照明器材做為發光源的首 選。 而基於LED燈易受高溫產生光衰的現象，現今設置有 L E D燈的照明器材皆會配設有一散熱模組，早期的散熱模 組主要係將複數散熱片排列成環狀，並焊接在一金屬套筒 的筒壁上，焊接的步驟不僅麻煩，且容易因空焊影響散熱 效率，且焊接的製程會產生大量污染，因此，現有一種免 焊式的散熱模組，係如圖6所示，該免焊式散熱模組係包 • 含有： 一散熱鰭片組50，係包含有複數排列成環狀的散熱鰭 片51,且各散熱鰭片51於頂部垂直壁面向外延伸形成有一 一導熱片52及一組合片53,此二者係一體成型；其中，該 導熱片52上形成有複數穿孔521，該組合片53則具有兩 相對側邊，其中一側邊形成有一勾孔54，另一相對側邊則 朝向相鄰散熱鰭片51導熱組合片53的勾孔54形成一勾條 55 ’且該勾條55插入相鄰散熱鰭片51的勾孔54内，以將 該複數散熱鰭片51勾扣組合，組合後該複數導熱片52及 3 Μ4ί-5254 組合片53構成一環面59 ; 一散熱底盤60’係於下表面對應散熱鰭片組5〇環面 59的穿孔53形成有複數突柱61,且該複數突柱61穿過各 穿孔53,使該散熱底盤60固定於該該散熱模組5〇各散熱 綠片51的導熱組合片52上。 上述散熱模組主要係以該散熱底盤供設置LED燈板， LED燈板產生廢熱之後，即可藉由該散熱底盤將熱能導向 該散熱鰭片組，供該散熱鰭片組與空氣進行熱交換，將熱 月t·散逸，而因上述散熱模組係藉由勾扣組合並與該散熱底 盤突柱的組合固定，故可令該散熱模組不需焊接組裝；然 而，請進一步參閱圖7,上述散熱模組的散熱底盤6〇與該 複數散熱錯片51接觸處主要係該導熱組合片52的導熱片 52及組合片53的頂面，使得散熱底盤6〇與該散熱鰭片組 50之間的熱傳導效率差，影響整個散熱模組的散熱效率， 故此種散熱模組仍需要改良，以提供更佳的散熱效率。 【新型内容】 有鑑於上述現有散熱模組之技術缺陷，本創作的主要 目的係提出一種提高散熱效果的散熱模組。 欲達上述目的所使用的主要技術手段係令該提高散熱 效果的散熱模組包含有： 一散熱鰭片組，係包含有複數排列成環狀的散熱鰭 片，且各散熱鰭片於頂部向上延伸形成一導熱插片及垂直 壁面向外延伸形成有一組合片，該組合片連接於散埶鰭片 壁面之側邊形成有一勾孔，相對該勾孔之另一側邊則朝向 M415254 相鄰散熱鰭片的勾孔形成一勾條，且該勾條插入相鄰散熱 齊片的勾孔内，以將該複數散熱鰭片勾扣組合，組合後該 複數散熱韓片的導熱插片呈放射栅狀排列，而該複數組合 片則構成一環面； 一散熱底盤，係於表面對應散熱鰭片組複數放射柵狀 排列的導熱插片而形成複數放射狀排列的條孔且該複數 條孔供該複數導熱插片穿設固定，且該散熱底盤的下表面 抵靠在該散熱鰭片組的環面上。 本創作的散熱底盤係固定於散熱鰭片組的環面上時， 除與該複數組合片的頂面接觸外，更因為複數導熱插片可 分別穿設於散熱底盤的對應條孔内，使得該散熱鰭片組的 各導熱插片4以其大面積的兩相對外壁面直接與散熱底盤 接觸，相較既有僅以單一頂面與散熱底盤接觸，確實提高 一者之間的接觸面積，提高散熱底盤與該散熱鰭片組之間 的熱傳導效率，有助於散熱模組的散熱效率提升。 【實施方式】 凊參閱圖1及圖3,本創作提高散熱效果的散熱模組係 包含有： 一散熱鰭片組1 〇，係包含有複數排列成環狀的散熱鰭 片11，且各散熱鰭片11於頂部向上延伸形成一導熱插片 12及垂直壁面向外延伸形成有一組合片13，該組合片 連接於散熱鳍片11壁面之側邊形成有一勾孔14，相對該勾 孔14之側邊則朝向相鄰散熱鰭片扪的勾孔形成一勾條 5且該勾條15插入相鄰散熱齊片u的勾孔14内，以將 5 賴 5254 該複數散熱縛片11勾扣組合’組合後該複數散熱韓片^ 的導熱插片12呈放射柵狀排列，而該複數組合片13則構 成一環面16,於本實施例中，各散熱鰭片底部垂直壁面 向外延伸形成一底組合片17,該底組合片連接散熱韓片 11壁面之側邊形成有一勾孔18，且相對該勾孔18之另— 側邊則形成朝向相鄰散熱鰭片彳彳之勾孔18形成有一勾條 19,且該勾條19插入相鄰的散熱鰭片扪之勾孔18中將 複數散熱鰭片11勾扣組合，以增加該散熱鰭片組1〇的穩 固性，該導熱插片12進一步向下彎折而形成一摺疊片 121，以增加導熱插片12之厚度，且一穿孔122係共同穿 經該導熱插片1 2及該摺疊片1 2 ’ ； 一散熱底盤20,係於表面對應散熱韓片組1〇複數放射 柵狀排列的導轨插片 12 & 守…棚月U而形成複數放射狀排列的條孔 21 ’且該複數條孔21供該複數導熱插片穿設固定且 該散熱底盤20的下表面抵靠在該散熱韓片組則環面祕 上； 上迷各散熱鰭片11可如圖 圏4及圖5所示，於頂部對應M415254 V. New Description: [New Technology Field] This creation is about a heat dissipation module, especially a heat dissipation module that improves heat dissipation. [Prior Art] Due to the low power consumption and high optical power of LED lamps, it has replaced traditional light bulbs and power-saving bulbs, making it the preferred choice for today's lighting equipment. However, based on the phenomenon that LED lamps are susceptible to high temperature light decay, lighting fixtures equipped with LED lamps are equipped with a heat dissipation module. The early heat dissipation modules mainly arranged a plurality of heat dissipation fins in a ring shape and were welded in one. On the cylinder wall of the metal sleeve, the welding step is not only troublesome, and it is easy to affect the heat dissipation efficiency due to the air welding, and the welding process generates a large amount of pollution. Therefore, a conventional solderless heat dissipation module is shown in FIG. The solderless heat dissipation module package includes: a heat dissipation fin set 50 comprising a plurality of heat dissipation fins 51 arranged in a ring shape, and each of the heat dissipation fins 51 extends outwardly from the top vertical wall surface. A heat conductive sheet 52 and a composite sheet 53 are integrally formed; wherein the heat conductive sheet 52 is formed with a plurality of through holes 521, and the combined sheet 53 has two opposite sides, wherein one side of the side is formed with a hook hole 54. The other opposite side defines a hook strip 55 ′ toward the hook hole 54 of the heat-dissipating fin 53 of the adjacent heat-dissipating fin 51 , and the hook 55 is inserted into the hook hole 54 of the adjacent heat-dissipating fin 51 to Cooling fins 51 hook combination, combination The plurality of thermal conductive sheets 52 and 3 Μ 4 ί - 5254 combined sheets 53 form a toroidal surface 59; a heat-dissipating chassis 60 ′ is formed on the lower surface of the perforation 53 corresponding to the heat-dissipating fin group 5 〇 annular surface 59, and a plurality of studs 61 are formed, and the plurality The protruding post 61 passes through each of the through holes 53 to fix the heat dissipating chassis 60 to the heat conducting composite sheet 52 of the heat dissipating green sheets 51 of the heat dissipating module 5 . The heat dissipation module mainly uses the heat dissipation chassis to provide an LED light board. After the LED light board generates waste heat, the heat dissipation chassis can guide the heat energy to the heat dissipation fin group, and the heat dissipation fin group exchanges heat with the air. The heat dissipation module is dissipated, and since the heat dissipation module is fixed by the hook combination and the combination of the heat dissipation chassis protrusion, the heat dissipation module can be assembled without welding; however, please refer to FIG. 7 The heat dissipating chassis 6 上述 of the heat dissipation module and the plurality of heat dissipating strips 51 are mainly at the top surface of the heat conducting sheet 52 and the combining sheet 53 of the heat conducting composite sheet 52 , so that the heat dissipating chassis 6 〇 and the heat dissipating fin set 50 The heat transfer efficiency between the two is poor, which affects the heat dissipation efficiency of the entire heat dissipation module. Therefore, the heat dissipation module still needs to be improved to provide better heat dissipation efficiency. [New content] In view of the technical defects of the above existing heat dissipation modules, the main purpose of the present invention is to propose a heat dissipation module that improves the heat dissipation effect. The main technical means for achieving the above purpose is that the heat dissipation module for improving the heat dissipation effect comprises: a heat dissipation fin group comprising a plurality of heat dissipation fins arranged in a ring shape, and each heat dissipation fin is at the top upward Extending to form a thermal conductive insert and extending perpendicularly outwardly to form a composite sheet, the composite sheet is connected to a side of the wall surface of the heat sinking fin to form a hook hole, and the other side of the hook hole is adjacent to the M415254 A hook strip is formed in the hook hole of the fin, and the hook strip is inserted into the hook hole of the adjacent heat sinking piece to hook and combine the plurality of heat radiating fins, and the heat conducting insert of the plurality of heat radiating pieces is combined as a radiation grid Arranging in a shape, and the plurality of composite sheets form a toroidal surface; a heat dissipating chassis is formed on the surface of the heat dissipating fin group and the plurality of heat conducting fins arranged in a plurality of radial grids to form a plurality of radially arranged strip holes and the plurality of holes are provided for The plurality of thermal conductive inserts are fixedly disposed, and the lower surface of the heat dissipation chassis abuts against the annular surface of the heat dissipation fin set. When the heat dissipation chassis of the present invention is fixed on the annular surface of the heat dissipation fin group, in addition to the top surface contact of the plurality of combination sheets, the plurality of heat conduction insertion sheets can be respectively disposed in the corresponding strip holes of the heat dissipation chassis, so that Each of the heat-conducting fins 4 of the heat-dissipating fin group directly contacts the heat-dissipating chassis with two large outer wall surfaces of the large-area fin group, and the contact area between the one of the heat-dissipating fins 4 is improved by a single top surface and the heat-dissipating chassis. The heat conduction efficiency between the heat dissipation chassis and the heat dissipation fin group is improved, and the heat dissipation efficiency of the heat dissipation module is improved. [Embodiment] Referring to FIG. 1 and FIG. 3, the heat dissipation module for improving the heat dissipation effect includes: a heat dissipation fin group 1 〇, which includes a plurality of heat dissipation fins 11 arranged in a ring shape, and each heat dissipation The fins 11 extend upwardly from the top to form a thermal conductive insert 12 and the vertical wall faces outwardly to form a composite sheet 13 . The composite sheet is connected to the side of the wall surface of the heat dissipating fin 11 to form a hook hole 14 opposite to the hook hole 14 . A hook strip 5 is formed on the side of the hook hole of the adjacent heat sink fin 且, and the strip 15 is inserted into the hook hole 14 of the adjacent heat sinking piece u to hook and bond the 5 heat absorbing ring 11 The heat-conducting inserts 12 of the plurality of heat-dissipating fins are arranged in a radial grid shape, and the plurality of composite sheets 13 form a toroidal surface 16. In this embodiment, the vertical wall of each of the heat-dissipating fins extends outwardly to form a ring-shaped surface. The bottom combination piece 17 is formed with a hook hole 18 formed on the side of the wall surface of the heat dissipating heat-dissipating film 11, and the other side of the hook hole 18 is formed to face the hook hole 18 of the adjacent heat-dissipating fin. There is a hook 19, and the hook 19 is inserted into the adjacent heat sink fin The plurality of heat-dissipating fins 11 are hooked and combined in the hook hole 18 to increase the stability of the heat-dissipating fin set 1 , and the heat-conductive insert 12 is further bent downward to form a folded piece 121 to increase the heat-conductive insert a thickness of 12, and a perforation 122 is commonly passed through the thermal conductive insert 1 2 and the folded piece 1 2 '; a heat-dissipating chassis 20 is attached to the surface of the heat-dissipating Korean group 1 The sheet 12 & the shackle U forms a plurality of radially arranged strip holes 21 ' and the plurality of holes 21 are provided for the plurality of heat conducting inserts to be fixed and the lower surface of the heat dissipating chassis 20 abuts against the heat sinking film The group is on the ring; the fan fins 11 can be shown in Figure 4 and Figure 5, corresponding to the top.
先垂直壁面向外延伸形忐—& A Γ延伸办成與該組合片13同向的接合底板 ，該接合底板111相對遠垃 丁連接於散熱鰭片11之另一側邊 則供向上延伸形成該導熱插^ 乃K，且該接合底板111寬度 不大於該組合片13之甯许 ^ 見度又’該接合底板20係供該散 :底盤20組合於散熱缚片組1〇上時抵靠可進一步增加 與該散熱底盤2Q的接觸面積；錢導熱插 片12可朝向散熱鰭片u .白下變折形成該一摺疊片121， 亦可背向散熱鰭片向下彎折 苓坼形成該一摺疊片121。 M415254 本創作組裝時，係先將該散熱底盤20的各條孔21對 準該散熱鰭片組10的各導熱插片12,令該散熱鰭片組1〇 的各導熱插片12分別插入該散熱底盤20的各條孔21中， 並使該散熱底盤20抵靠在該複數組合片構成的環面16 上’再對該散熱底盤20各條孔21兩旁冲壓，使該散熱底The first vertical wall-facing outwardly extending shape &-&A Γ extends to form a joint bottom plate in the same direction as the composite sheet 13, and the joint bottom plate 111 is connected to the other side of the heat dissipation fin 11 to extend upward. The heat conducting insert K is formed, and the width of the joint bottom plate 111 is not greater than the width of the composite sheet 13 and the joint bottom plate 20 is for the dispersion: when the chassis 20 is combined with the heat dissipation tab group 1 The contact area with the heat dissipation chassis 2Q can be further increased; the heat conduction tab 12 can be folded toward the heat dissipation fins u to form the folded sheet 121, or can be bent downwardly toward the heat dissipation fins. The folded piece 121. In the assembly of the M415254, the holes 21 of the heat dissipation chassis 20 are aligned with the heat conduction tabs 12 of the heat dissipation fin assembly 10, and the heat conduction tabs 12 of the heat dissipation fin group 1 are respectively inserted into the thermal conductive fins 12 In the holes 21 of the heat dissipation chassis 20, the heat dissipation chassis 20 is abutted against the toroid 16 formed by the plurality of composite sheets, and then the holes 21 of the heat dissipation chassis 20 are punched on both sides to make the heat dissipation bottom
盤20條孔21因受沖壓變形而夹住各導熱插片】2，即組裝 完成；此時，該散熱底盤20除與各散熱鰭片彳彳的組合片 13頂面接觸外，亦會與該導熱插片12的兩相對外壁面接 觸，使得各散熱錯片11以其導熱插片12大面積的兩相對 外壁面直接與散熱底盤接觸，可有效提高散熱底盤2〇盘各 散熱歸片11之間的導熱效率，又，形成有該穿孔122的導 熱插片…其穿孔122則可供沖壓變形的散熱底盤肋突 入該穿孔122中，使該散熱底盤2〇進_步與該穿孔122内 孔壁接觸，更增加接觸面積，提高導熱效果。 紅上所述，本創作係以散熱籍片的導熱插片兩相對外 頂面皆與散熱底盤接觸，加大散熱鰭片與 ::之接觸面積，且進-步增設該接合底板及該穿孔 又更進一步增加與該散熱底盤的接觸面 作散敎轉]故可提尚本創 作與該散熱底㈣的熱傳導效率 散熱模組的散熱效率。 進而k问整個 【圖式簡單說明】 圖彳：為本創作之立體分解圆。 圖2 :為本創作散熱鰭片之立體圖。 圖3 :為本創作組合後之剖面圖。 Μ4ί-5^54 圖4 :為本創作另一較佳實施例組合後剖面圖。 圖5 :為本創作又一較佳實施例組合後剖面圖。 圖6:為習用散熱模組之立體分解圖。 圖7 :為習用散熱模組組合後之剖面圖。 【主要元件符號說明】 1 0散熱鰭片組 1 1 1接合底板 11散熱鰭片 12導熱插片 121摺疊片 122穿孔 13組合片 14勾孔 15勾條 16環面 1 7底組合片 18勾孔 19勾條 20散熱底盤 21條孔 50散熱鰭片組 51散熱鰭片 52導熱片 53組合片 521穿孔 54勾孔 55勾條 60散熱底盤 61突柱 8The 20 holes 21 of the disk are clamped by the stamping deformation to clamp the thermal conductive inserts 2, that is, the assembly is completed; at this time, the heat dissipation chassis 20 is in contact with the top surface of the combined heat sink fins 13 and also The two opposite outer wall surfaces of the heat conducting insert 12 are in contact with each other, so that the heat dissipating strips 11 are directly in contact with the heat dissipating chassis with the opposite outer wall surfaces of the large area of the heat conducting insert 12, thereby effectively improving the heat dissipating chassis of the heat dissipating chassis 2 The heat transfer efficiency between the heat-insulating inserts of the perforations 122 is formed by the heat-dissipating fins of the perforations 122, and the heat-dissipating ribs of the heat-dissipating chassis 2 are inserted into the through-holes 122, so that the heat-dissipating chassis 2 is inserted into the through-holes 122. The hole wall contact increases the contact area and improves the heat conduction effect. In the above description, the heat-insulating inserts of the heat-dissipating sheets are in contact with the heat-dissipating chassis, and the contact area of the heat-dissipating fins and the heat-insulating fins is increased, and the joint bottom plate and the perforations are further added. Furthermore, the contact surface of the heat dissipation chassis is further increased, so that the heat dissipation efficiency of the heat conduction efficiency heat dissipation module of the present invention and the heat dissipation bottom (4) can be improved. Then ask the whole [Simplified illustration of the diagram] Figure: The three-dimensional decomposition circle of the creation. Figure 2: A perspective view of the heat sink fins. Figure 3: A cross-sectional view of the combination of the creations. Μ4ί-5^54 Fig. 4 is a rear sectional view showing another preferred embodiment of the present invention. Figure 5 is a rear cross-sectional view showing another preferred embodiment of the present invention. Figure 6: An exploded perspective view of a conventional heat dissipation module. Figure 7: A cross-sectional view of a conventional heat dissipating module. [Main component symbol description] 1 0 heat sink fin set 1 1 1 joint bottom plate 11 heat sink fin 12 heat transfer insert 121 fold piece 122 perforation 13 combination piece 14 hook hole 15 hook strip 16 torus 1 7 bottom combination piece 18 hook hole 19 hooks 20 cooling chassis 21 holes 50 heat sink fins 51 heat sink fins 52 heat transfer sheet 53 combination sheet 521 perforation 54 hook hole 55 hook strip 60 heat sink chassis 61 studs 8