TWM413816U - Heat-dissipation structure of high-brightness LED lamp - Google Patents

Heat-dissipation structure of high-brightness LED lamp Download PDF

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Publication number
TWM413816U
TWM413816U TW100208445U TW100208445U TWM413816U TW M413816 U TWM413816 U TW M413816U TW 100208445 U TW100208445 U TW 100208445U TW 100208445 U TW100208445 U TW 100208445U TW M413816 U TWM413816 U TW M413816U
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Taiwan
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heat
led lamp
conducting
substrate
cover
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TW100208445U
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Chinese (zh)
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Guang-Ming Xiao
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Glacialtech Inc
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M413816 五、新型說明: I新型所屬之技術領域】 本創作係有關LED燈具之散熱技術,特別是指—種可以 有效釋放LED廢熱,長效維持LED應有的發光效率,並提昇 LED燈具使用壽命之LED燈具散熱構造。 I先前技術】 按’發光一極體(Light Emitting Diode,LED)因具有節能 省電的好處與優勢近年來已廣泛地應用於日常生活當中,舉凡 』不斋、豕電裝置、相電子組件、照明燈具.等皆是發光二 極體的應帛料。赌祕光二爾以下输咖)作為發光 源之豕用照明燈具為例,因其具有暖燈時間快、反應速度快、 f積小、壽命長、省電、耐震、污練度低、高可靠度與適合 :產的優點’使得傳統白熾燈泡與日光燈已有漸漸被取代的趨 〇β 作為發光源的咖照明裝置,都僅具有 =光源的輸出方向,亦即LED照明裳置中之所有⑽皆朝 ,耻_咖__必須有相當M413816 V. New Description: I belong to the new technical field of technology. This creation is about the heat dissipation technology of LED lamps, especially the kind of LED waste heat can be effectively released, and the luminous efficiency of LEDs should be maintained for a long time, and the service life of LED lamps can be improved. The LED lamp heat dissipation structure. I. Prior Art] According to the 'Light Emitting Diode (LED), it has been widely used in daily life because of its energy saving and power saving advantages. In recent years, it has not been fasted, electrical devices, electronic components, Lighting fixtures, etc. are all the materials for the LEDs. For example, the illuminating light is used as a light source. For example, it has a warm lighting time, a fast response speed, a small accumulation of F, a long life, power saving, shock resistance, low pollution, and high reliability. Degree and fit: the advantages of production 'making the traditional incandescent bulbs and fluorescent lamps have gradually replaced the trend of the 〇β as the source of illumination, all have only = the output direction of the light source, that is, all of the LED lighting (10) All are, shame _ _ _ _ must have quite

同時運作,方得以達到傳統白熾麵或日光燈管 之焭度表現效果。 B 其次,咖在工作期間所消耗的電能,除了實際工作外, 3 M413816 =轉化成熱量散發;例如,目前高功率咖的輸入功率 僅:〜麗會轉換成光,— 咖工作綱所產生賴量導致咖㈣裝肋部溫度迅速 上升’如果不及時將該熱量排出至外界散發,使咖晶粒界 面溫度過高,而降低發光效率及壽命。At the same time, it can achieve the performance of traditional incandescent or fluorescent tubes. B Secondly, in addition to the actual work, the energy consumed by the coffee during the work, 3 M413816 = converted into heat dissipation; for example, the current input power of high-power coffee is only: ~ Li will be converted into light, - the work of the coffee work The amount causes the coffee (4) rib temperature to rise rapidly. 'If the heat is not discharged to the outside in time, the temperature of the coffee grain interface is too high, and the luminous efficiency and life are reduced.

因此’為了能有效散逸LED使用時產生的熱能,進而長 效維持LED應有光效顿提昇咖_裝置之使用壽 命’如何設計可以有效釋放LED照明震置(LED燈具)廢熱^ 散熱構造即為一重要關鍵,亦為業界亟欲解決之課題。… :【新型内容3 本創作之主要目的,係在提供一種可以有效釋放1^£1)廢 熱,使LED長效維持應有的發光效率,並增加LED.燈具使用 哥命之向亮度LED燈具散熱構造。 為達上述目的,本創作之高亮度LED燈具散熱構造基本 上包括有:一導熱基板、一導熱柱、複數個散熱鰭片,以及複 數個LED ;其中,各LED係設於該導熱基板底面;該導熱柱 係設於該導熱基板頂面中心處;至於,各散熱鰭片係圍繞配設 於該導熱柱四周並與該導熱柱接觸;以及,各散熱鰭片底端形 成有一折邊供貼附於該導熱基板頂面。 利用上述結構特徵,本創作之高亮度LED燈具散熱構造 即可透過導熱基板及導熱柱將LED所產生之廢熱傳遞至散熱 =升^4錄_片之折邊料絲板之貼_用下,大 賴則之鮮。俾韻-料財效釋放 u使LED長效維持猶的發級率,並相對增加咖 燈具使用壽命之高亮度LED燈錄熱構造。 以下進-步_摘作各_之具體實施方式: 依據上述主要結構魏,本創作之高亮度咖燈且 放熱構造於實施時’所述導熱柱外圍設有複數道供散熱籍片嵌 片之加導絲與散_狀接合效果,提升散熱籍 依據上述主要結鄕徵,本_之高亮度LED燈具散熱 構造於實料’所述各散絲狀錢設註少-穿孔,以增 加各散熱鰭片之間的空氣對流效果。 依據上边主要結觀徵’摘作之高絲咖燈具散熱 構造於實職導絲減部設有—组驗罩,該組燈殼 罩係具有-相對包覆於各LED外部之外遮罩,以及一相對設 於咖ίϋ光口處之透光罩,利用外遮罩及透光罩對咖構成 屏蔽’並對來自LED之絲產生預定反射、聚光效果。 上述外遮罩之頂部設有一供LED光線通過之穿孔,於穿 =内緣設有-内凸緣,該透光罩係具有一凸部供套入外遮罩之 穿孔,另於㈣外·有-外凸緣供與外遮罩之内凸緣搭接; 以及,透縣之外凸緣及外縣之内凸緣上分別設有相對合之 螺絲穿孔’該導熱基板另設有與各螺絲穿孔相對應之螺孔,使 得以利用螺絲將該組燈殼罩之外遮罩及透光罩鎖固於該導熱 基板底部。 依據上述主要結構特徵,本創作之高亮度LED燈具散熱 構造於實施時,所述導熱柱頂部設有一組燈殼座,該組燈殼座 係具有一與該導熱柱連接之底板,以及一罩設於底板上方之殼 ^ 由叙盍及底板構成一供枚容LED驅動模級之容置空間。 上述燈殼座係可進一步設有一組橫跨於該殼蓋上方之提 把,該提把上設有至少一裝配孔供LED燈具安裝於牆面或天 花板使用。 上述燈殼座之底板設有複數個螺絲穿孔,該導熱柱頂端 &有與底板螺絲穿孔相對應之螺孔,使得以利用螺絲將該組燈 殼座之底板鎖固於該導熱柱頂部。 依據上述主要結構特徵,本創作之高亮度LED燈具散熱 構造於貫施時’所述導熱柱係為中空之柱狀結構體,使達到輕 1化之效果,同時可加快熱能朝向外圍散熱鰭片傳遞之速度。 依據上述主要結構特徵·,本創作之高亮度LED燈具散熱 構造於實施時’所述導熱柱底端設有複數個螺孔,該導熱基板 設有與導熱桎底端螺孔相對應之螺絲穿孔,使得以利用螺絲將 導熱柱鎖固於該導熱基板頂部。 依據上迷主要結構特徵,本創作之高亮度LED燈具散熱 構13_於貝% k,所述各散熱,鳍片底端之折邊係可以利用焊接方 式貼附於該導熱基板上。 Μ4ϋ81ό 依據上述主要結構特徵,本創作之高亮度LED燈具散熱 構迨於κ轭時’所述各散熱鰭片底端之折邊係可以利用鉚接方 式貼附於該導熱基板上。 依據上述主要結構特徵,本創作之高亮度LED燈具散熱 構k於貫施時’舰各散觸#底端之折絲可以湘導熱膠 黏著方式貼附於該導熱基板上。 依據上述主要結構特徵’本創作之高亮度LED燈具散熱 構造於實稱,所述各LED係直接__導減板底部。 依據上逃主要結構特徵,本創作之高亮度LED燈具散熱 構造於實麟’所述LED係以駭數量為-組財式建構於 -基材上,ϋ職紐將各组LED^_雜絲底部。 相較於先前技術,本創作之高亮度LED燈具散熱構造可 大中田提升LED之熱能傳遞至各散熱鰭片之速度,加速整體 LED燈具之廢熱排放效率;尤其,所應用之led燈具係可 驅動模組及LED與分職設於整喊_造之上、下端,並 將LED與LED驅動模組加赌隔,可有效防止LED受LED 驅動模組舰生之熱能影? ’可長輯持哪應有的發光效 率,並增加LED燈具之使轉命;故,摘合顧於禮堂、 展覽館、賣場等挑高建築物之室内照明使用,減少因為led 燈具維修、更換所附出之時間及成本。 7 M413816 .【實施方式.】 以下依據賴作之技術手段哪適於本解之實施方式 並配合圖式說明如後: 請參閱第-圖至第三圖所示,本創作之高亮度咖燈且 散熱構造基本上包財:—導絲板1〇、細社卿、一 導熱柱30 ,以及複數個散熱鰭片4〇,其中. 該導熱基板K)係可以為利用銅、銘等金屬材料所製成之 具有較佳熱傳導效率之板狀結構體。 各㈣0係設於該導熱基板10底面;於實施時,各LED 係可以直贼構於鱗錄板麵。或如赋崎,像以預定 數量之LED20為-組的方式建構於一基材21上,透過該基材 21將各組LED20設於該導熱基板1〇底部。 該導熱柱㈣設於料錄㈣杨巾心處,該導熱柱 30係可私、轉金屬材料所^成之具有較佳熱傳導 效率之柱狀結構體,且為巾空之錄結構體紐,錢到輕量 化之效果,時可加快熱絲向關散細# 4q傳遞之速度。 至於’各散熱韓片40係呈放射狀圍繞配設於該導熱柱3〇 四周並與該導熱柱30接觸;各散熱籍片4〇底端形成有一折邊 4i供貼附於該導熱基板10 了頁面;於實施時,各散熱鐘片4〇 底端之折邊41可鑛以焊接、鉚誠姻導歸黏著之方式 貼附於該導熱基板10頂面。另外,可進一步於各散熱趙片4〇 之板面設有至少-穿孔42 ’以增加各散熱韓片4〇之間的空氣 8 對流效果。 再者’上述導熱柱30 T論為中空之柱狀結構體或實心之 柱狀結構H ’解錄30係可於其外圍設錢數道供散熱縛 片40敢入之溝槽31,使增加導熱柱3〇與散熱鰭片恥之接合、 接觸效果’並提升散熱別4〇 (组裝可靠度。以及,該導熱 柱30底端係可設有複數個螺孔32,該導熱基板1〇則配合設 有與導熱柱30底端螺孔32相對應之螺絲穿孔n,使得以利 用螺絲81將導熱柱30鎖固於該導熱基板1〇頂部。 原則上,本創作之高亮度LED ;Jt具散熱構造主要利用上 述、’、。構#徵’讓LED2G所產生之廢熱透過導熱基板1Q及導熱 柱30將LED快速的傳遞至散熱籍片4〇,以達到廢熱排放之 效果,尤其,在各散熱鰭片40之折邊41與導熱基板1〇之貼 附作用下,大幅提升熱能傳遞至散熱鰭片4〇之速率。俾可以 有效釋放LED20廢熱’使LEmo長效維持應有的發光效率, 並相對增加LED燈具之使用壽命。 請同時配合參照第四圖、第五圖所示.,本創作之高亮度 LED燈具散熱構造於貫際應用時’該導熱基板底部係可設 有一組燈殼罩50,該組燈殼罩50係具有一相對包覆於各 LED20外部之外遮罩51 ’以及一招對設於LEm〇出光口處之 透光罩52 ;該外遮罩51之頂部設有一供LED2〇光線通過之 穿孔511,於穿孔511内緣設有一内凸緣512,該透光罩52係 具有一凸部521供套入外遮罩51之穿孔η〗,另於凸部521 M413816 外圍設有一外凸緣522供與外遮罩51之内凸緣5i2搭接。 上述透光罩52之外凸緣522及外遮罩51之内凸緣512上 分別設有相對合之螺絲穿孔523、犯,該導熱基板1〇另設有 ’、各螺”糸牙孑匕523、513才目對應之螺孔L2,使得以利用螺絲82 將該組燈料5G之外鮮51及透鮮& _於該導熱基板 10底邛,利用外遮罩51及透光罩.52對LED20構成屏蔽,並 對來自LED20之光源產生預定反射、聚光效果。 又本創作之兩党度led燈具散熱構造於實際應用時, 該導熱柱30頂部係可設有一組燈殼座60 ,該組燈殼座6〇係 具有一與該導熱柱30連接之底板61,.以及一罩設於該底板61 上方之殼盍62’該燈殼座之底板61設有複數個螺絲穿孔611, 該導熱柱30頂端設有與底板61螺絲穿孔611相對應之螺孔 33 ·’使得以利用螺絲83將該組燈殼座6〇之底板61鎖固於該 導熱柱30頂部’並由殼蓋62及底板61構成一供收容LED驅 動模組70之谷置空間。.以及,該燈殼座6〇係可進一步設有一 組橫跨於該殼蓋62上方之提把63,該提把63上設有至少一 裝配孔631供LED燈具安裝於牆面或天花板使用。 具體而§ ’本創作之高亮度LED燈具散熱構造不但可大 幅提升LED之熱能傳遞至各散熱鰭片之速度,加速整體LED 燈具之廢熱排放效率;尤其,所應用之LED燈具係可LED驅 動模組及LED與分別配設於整組散熱構造之上、下端,並將 LED與LED驅動模組加以區隔,可有效防止LED受led驅 10 動极、輯絲之魏影響,可長效轉應有的發光效 率^增加LED燈具之使用壽命;故,尤適合顧於禮堂、 展見館賣場等挑向建築物之室内照明使用,減少因為LED 燈具維修、更換卿出之_及成本。 准以上之貫施說明及圖式所#,係舉例說明本創作之較佳 貝知例者’並非以此揭限本創作。舉凡與本創作之構造、裝置、 4寸徵等近喊相f同者,均蘭本創狀倾目的及中請專利 範圍之内。 M413816 .【圖式簡單說明】 第一圖:本創作所應用之LED燈具外觀結構圖。 第二圖:本創作之高亮度LED燈具散熱構造外觀結構圖。 第三圖:本創作之高亮度LED燈具散熱構造結構分解圖。 第四圖:本創作之高亮度LED燈具散熱構造結構剖視圖。 第五圖:本創作之高亮度LED燈具散熱構造立體分解剖視圖。 φ I主要元件符號說明】 10導熱基板 11螺絲穿孔 12螺孔 20 LED 21基材 30導熱柱 • 31溝槽 32螺孔 33螺孔 40散熱鰭片 41折邊 42穿孔 50燈殼罩 51外遮罩 12 M413816 511穿孔 512内凸緣 513螺絲穿孔 52透光罩 521凸部 522外凸緣 523螺絲穿孔 φ 60燈殼座 61底板 611螺絲穿孔 62殼蓋 63提把 631裝配孔 70 LED驅動模組 • 81螺絲 82螺絲 83螺絲 13Therefore, in order to effectively dissipate the heat energy generated when the LED is used, the LED should have a long-lasting effect. The light effect should be improved. _ The service life of the device can be effectively designed to effectively release the LED lighting (LED lamp) waste heat. An important key is also the topic that the industry wants to solve. ... : [New Content 3 The main purpose of this creation is to provide a kind of waste heat that can effectively release 1^£1), to make the LED long-lasting to maintain the proper luminous efficiency, and to increase the LED. Heat dissipation structure. In order to achieve the above objective, the high-brightness LED lamp heat dissipation structure of the present invention basically comprises: a heat-conducting substrate, a heat-conducting column, a plurality of heat-dissipating fins, and a plurality of LEDs; wherein each LED is disposed on a bottom surface of the heat-conducting substrate; The heat-conducting column is disposed at a center of a top surface of the heat-conducting substrate; wherein, each of the heat-dissipating fins is disposed around the heat-conducting column and is in contact with the heat-conducting column; and a bottom edge of each of the heat-dissipating fins is formed with a flange Attached to the top surface of the thermally conductive substrate. By using the above structural features, the heat-dissipating structure of the high-brightness LED lamp of the present invention can transmit the waste heat generated by the LED through the heat-conducting substrate and the heat-conducting column to the heat-dissipating _ 4 Da Lai is fresh.俾韵-materials release u make the LED long-lasting to maintain the rate of the hair, and relatively increase the life of the lamp, the brightness of the LED lamp recording structure. The following is a detailed implementation of the following steps: According to the above-mentioned main structure Wei, the high-intensity coffee lamp of the present invention and the heat-dissipating structure are implemented at the periphery of the heat-conducting column with a plurality of heat-dissipating panels. Adding the effect of the guide wire and the scattered _-like joint, and improving the heat dissipation according to the above-mentioned main knots, the heat-dissipating structure of the high-brightness LED lamp of the present invention is less than the perforation to increase the heat dissipation. Air convection between fins. According to the above-mentioned main knot sign, the high-wire coffee lamp heat-dissipating structure is provided in the actual guide wire reduction section, and the set of cover shells has a cover that is oppositely coated on the outside of each LED, and a cover. Compared with the translucent cover provided at the mouth of the coffee, the outer mask and the translucent cover are used to shield the coffee from the 'shade' and produce a predetermined reflection and concentrating effect on the wire from the LED. The top of the outer mask is provided with a perforation for the passage of the LED light, and the inner flange is provided with an inner flange. The transparent cover has a convex portion for inserting the perforation of the outer cover, and (4) The outer flange is provided to overlap the inner flange of the outer cover; and the flanges outside the county and the inner flange of the outer county are respectively provided with opposite screw perforations. The screw holes are corresponding to the screw holes, so that the outer cover of the lamp cover and the transparent cover are locked to the bottom of the heat-conducting substrate by using screws. According to the above main structural features, the heat-dissipating structure of the high-brightness LED lamp of the present invention is implemented, the top of the heat-conducting column is provided with a set of lamp housings, the lamp housing base has a bottom plate connected to the heat-conducting column, and a cover The shell disposed above the bottom plate comprises a housing space for the LED to drive the mold level. The lamp housing can further be provided with a set of handles extending over the cover, and the handle is provided with at least one mounting hole for the LED lamp to be mounted on the wall or the ceiling. The bottom plate of the lamp housing is provided with a plurality of screw holes, and the top end of the heat conducting column has a screw hole corresponding to the hole of the bottom plate screw, so that the bottom plate of the lamp housing is locked to the top of the heat conducting column by using a screw. According to the above main structural features, the heat-dissipating structure of the high-brightness LED lamp of the present invention is a hollow column-like structure when the heat-conducting column is applied in a continuous manner, so that the effect of lightening is achieved, and the heat-dissipating fins are accelerated toward the periphery. The speed of delivery. According to the above main structural features, the high-brightness LED lamp heat dissipation structure of the present invention is provided with a plurality of screw holes at the bottom end of the heat conducting column, and the heat conducting substrate is provided with a screw perforation corresponding to the screw hole at the bottom end of the heat conductive crucible. In order to lock the heat-conducting column to the top of the heat-conducting substrate by using a screw. According to the main structural features of the above, the high-brightness LED lamp of the present invention has a heat dissipation structure 13_j, and the heat dissipation and the bottom edge of the fin can be attached to the heat-conducting substrate by soldering. Μ4ϋ81ό According to the above main structural features, when the high-intensity LED lamp of the present invention is heat-dissipated to the κ yoke, the hem of the bottom end of each of the heat-dissipating fins can be attached to the heat-conducting substrate by riveting. According to the above main structural features, the high-brightness LED lamp of the present invention has a heat-dissipating structure, and the folding wire at the bottom end of the ship can be attached to the heat-conducting substrate by a thermal conductive adhesive. According to the above main structural features, the heat-dissipating structure of the high-brightness LED lamp of the present invention is embodied in the real name, and each of the LEDs is directly __the bottom of the lowering plate. According to the main structural features of the escape, the high-brightness LED lamp heat dissipation structure of the present creation is based on the number of LED 所述 所述 所述 所述 所述 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组 组bottom. Compared with the prior art, the high-brightness LED lamp heat dissipation structure of the present invention can increase the heat transfer energy of the LED to the heat dissipation fins, and accelerate the waste heat emission efficiency of the overall LED lamp; in particular, the applied LED lamp can be driven. The module and the LED and the sub-division are set on the top and bottom of the shouting, and the LED and the LED driving module are gambling separated, which can effectively prevent the LED from being affected by the thermal driving effect of the LED driving module. 'It can be used for long-term lighting efficiency and increase the LED lighting. Therefore, it is suitable for indoor lighting use in high-rise buildings such as auditoriums, exhibition halls and stores, reducing the maintenance and replacement of LED lamps. The time and cost attached. 7 M413816 . [Embodiment.] The following is based on the technical means of the solution. It is suitable for the implementation of this solution and with the following description: Please refer to the figure - to the third figure, the high-brightness coffee lamp of this creation The heat dissipation structure is basically rich: - a guide wire plate, a thin wire, a heat-conducting column 30, and a plurality of heat-dissipating fins 4, wherein the heat-conducting substrate K) can be made of a metal material such as copper or metal. A plate-like structure having a preferred heat transfer efficiency. Each of the (4) 0 sets is disposed on the bottom surface of the heat-conductive substrate 10; in practice, each of the LEDs can be formed on the scale board surface. Or, as for the case, it is constructed on a substrate 21 in such a manner that a predetermined number of LEDs 20 are grouped, and each group of LEDs 20 is disposed on the bottom of the heat-conductive substrate 1 through the substrate 21. The heat conducting column (4) is disposed at the center of the material (4) Yang towel, and the heat conducting column 30 is a columnar structure having a heat transfer efficiency which can be made by a private or a rotating metal material, and is a structure of the hollow space. When the money is lighter, the speed of the hot wire can be increased. As for the 'heat-dissipating Korean film 40 series, it is arranged around the heat-conducting column 3〇 and is in contact with the heat-conducting column 30; the bottom end of each heat-dissipating film 4 is formed with a flange 4i for attaching to the heat-conducting substrate. 10 pages; in the implementation, the bottom edge 41 of each of the heat-dissipating bells 4 can be attached to the top surface of the heat-conducting substrate 10 by welding, riveting and bonding. In addition, at least a through hole 42 ′ may be further provided on the surface of each of the heat dissipating films 4 to increase the air convection effect between the heat dissipating pieces 4〇. Furthermore, the above-mentioned heat-conducting column 30 T is a hollow column-like structure or a solid column-like structure H'. The 30-series can be provided with a plurality of grooves 31 for the heat-dissipating piece 40 to be inserted into the groove 31, so as to increase The heat-conducting column 3 〇 is bonded to the heat-dissipating fins, and the contact effect is 'and the heat-dissipating heat is further improved. (Assembly reliability is also provided. Moreover, the bottom end of the heat-conducting column 30 may be provided with a plurality of screw holes 32, the heat-conductive substrate 1〇 The screw hole perforation n corresponding to the screw hole 32 at the bottom end of the heat conducting column 30 is matched, so that the heat conducting column 30 is locked on the top of the heat conducting substrate 1 by using the screw 81. In principle, the high brightness LED of the present invention; Jt The heat dissipating structure mainly utilizes the above-mentioned, ', _ _ _ _ ' let the waste heat generated by the LED 2G through the heat-conducting substrate 1Q and the heat-conducting column 30 to quickly transfer the LED to the heat-dissipating film 4 〇 to achieve the effect of waste heat discharge, especially in The adhesion of the folded edge 41 of each of the heat dissipating fins 40 and the heat-conducting substrate 1 大幅 greatly increases the rate at which thermal energy is transferred to the heat-dissipating fins 4 俾. The heat of the LED 20 can be effectively released to keep the LEmo long-lasting to maintain the desired luminous efficiency. And relatively increase the service life of LED lamps. At the same time, referring to the fourth and fifth figures, the high-brightness LED lamp heat dissipation structure of the present invention can be provided with a set of lamp housings 50 at the bottom of the heat-conducting substrate. The utility model has a transparent cover 52 ′ which is opposite to the outer surface of each of the LEDs 20 and a light-transmissive cover 52 disposed at the LEm exiting light outlet; the top of the outer cover 51 is provided with a through hole 511 for the LED 2 to pass light. An inner flange 512 is disposed on the inner edge of the through hole 511. The transparent cover 52 has a convex portion 521 for receiving the through hole η of the outer cover 51, and an outer flange 522 is provided at the periphery of the convex portion 521 M413816. The inner flange 5i2 of the outer cover 51 is overlapped. The outer flange 522 of the transparent cover 52 and the inner flange 512 of the outer cover 51 are respectively provided with opposite screw holes 523, and the heat conductive substrate 1〇 There is also a screw hole L2 corresponding to the ', each screw' 糸 孑匕 523, 513, so that the set of light materials 5G and the fresh light & In other words, the outer cover 51 and the light transmissive cover 52 are used to shield the LED 20 and generate a predetermined reflection and condensing effect on the light source from the LED 20. In the actual application, the top of the heat-conducting column 30 can be provided with a set of lamp housings 60. The set of lamp housings 6 has a bottom plate 61 connected to the heat-conducting column 30. And a cover 62' disposed on the bottom plate 61. The bottom plate 61 of the lamp housing is provided with a plurality of screw holes 611, and the top end of the heat transfer column 30 is provided with a screw hole 33 corresponding to the screw hole 611 of the bottom plate 61. 'Theft, the bottom plate 61 of the set of lamp housings 6 is locked to the top of the heat-conducting column 30 by the screws 83', and the cover 62 and the bottom plate 61 form a valley space for housing the LED driving module 70. And the lamp housing 6 can further be provided with a set of handles 63 extending over the cover 62, and the handle 63 is provided with at least one mounting hole 631 for mounting the LED lamp on the wall or the ceiling. . Specifically, § 'The high-brightness LED lamp heat dissipation structure of this creation can not only greatly increase the speed of heat transfer of LEDs to the fins, but also accelerate the waste heat emission efficiency of the overall LED lamps; in particular, the LED lamps used can be LED driver modules. The group and the LED are respectively arranged on the upper and lower ends of the entire heat dissipation structure, and the LED and the LED driving module are separated, which can effectively prevent the LED from being affected by the moving pole of the led drive 10 and the wire of the wire, and can be long-lasting The luminous efficiency should be increased to increase the service life of LED lamps; therefore, it is especially suitable for indoor lighting used in buildings such as auditoriums, exhibition halls, etc., to reduce the cost and maintenance of LED lamps. The above descriptions and the schemas are examples of the best examples of this creation. Anyone who is similar to the structure, installation, and 4-inch sign of this creation is within the scope of the patent and the scope of the patent. M413816 . [Simple description of the diagram] The first picture: the appearance of the LED lamps used in this creation. The second picture: the appearance structure diagram of the heat-dissipating structure of the high-brightness LED lamp of this creation. The third picture: the exploded view of the heat dissipation structure of the high-brightness LED lamp of this creation. The fourth picture: a cross-sectional view of the heat dissipation structure of the high-brightness LED lamp of the present creation. The fifth picture: The three-dimensional anatomical view of the heat-dissipating structure of the high-brightness LED lamp of this creation. Φ I main component symbol description] 10 thermal substrate 11 screw perforation 12 screw hole 20 LED 21 substrate 30 thermal column • 31 groove 32 screw hole 33 screw hole 40 heat sink fin 41 flange 42 perforation 50 lamp cover 51 cover Cover 12 M413816 511 perforation 512 inner flange 513 screw perforation 52 transmissive cover 521 convex 522 outer flange 523 screw perforation φ 60 lamp housing 61 bottom plate 611 screw perforation 62 cover 63 handle 631 assembly hole 70 LED drive module • 81 screws 82 screws 83 screws 13

Claims (1)

M413816 六、申請專利範圍: h一種高亮度LED燈具散熱構造,係包括有: 一導熱基板; 複數個LED ’安裝於該導熱基板底面; 一導熱柱,設於該導熱基板頂面中心處; 複數個散熱鰭片’呈放射狀隱_㈣導敝四周並與該 導熱柱接觸;以及 各散熱鰭>5底端形成有一折邊供貼附於該導熱基板頂面。 2. 如申請專利翻第〗項所述之高亮度led燈具散熱構造,其 中,該導熱柱外圍設有複數道供散熱鰭片嵌入之溝槽。 3. 如申請翻顏第!摘狀高亮度led燈具散熱構造,其 中’各散熱鱗片之板面設有至少—穿孔。 《如申請專利範圍第】項所述之高亮度LED燈錄熱構造,其 中,該導熱基板底部設有一組燈殼罩,該組燈殼罩係具有一相 對包覆於各LED外部之外遮罩,以及一相對設於咖出光口 處之透光罩。 5.如申請專利範圍第4項所述之高亮度LED燈具散熱構造,其 中’該外料設有-供LED光線通過之穿孔,於穿孔内 緣設有一内凸緣,該透光罩係具有一凸部供套入外遮罩之穿 孔’另於凸部外圍設有-外凸緣供與外遮罩之内凸緣搭接;以 及,該透光罩之外凸緣及該外遮罩之内凸緣上分別設有相對合 之螺絲穿孔’該導熱基板另設有與各螺絲穿孔相對應之螺孔, 14 M413816 利用螺絲將該組燈殼罩之外遮罩及透光罩鎖固於該導熱基板 底部。 6·如申請專利範圍第1項所述之高亮度LED燈具散熱構造,其 中,該導熱柱頂部設有一組燈殼座,該組燈殼座係具有一與該 導熱柱連接之底板,以及一罩設於底板上方之殼蓋,由殼蓋及 底板構成一供收容LED驅動模组之容置空間。 7. 如申請專利範圍第6項所述之高亮度LED燈具散熱構造,其 中,該燈殼座設有一組橫跨於該殼蓋上方之提把,該提把上設 有至少一裝配孔。 8. 如申請專利範圍第6項所述之高亮度LED燈具散熱構造,其 中,該燈殼座之底板設有複數個螺絲穿孔,該導熱柱頂端設有 與底板螺絲穿孔相對應之螺孔,利用螺絲將該組燈殼座之底板 鎖固於該導熱柱頂部。 9. 如申請專概㈣1項所述之高亮度LED祕散熱構造,其 中’該導熱柱係為中空之柱狀結構體。 1〇.如申請專利範圍第1項所述之高亮度LED燈具散熱構造,其 中,該導熱柱底端設有複數個螺孔,該導熱基板設有與導熱柱 底端螺孔㈣應之獅穿孔,利_絲將導熱柱個於該導熱 基板頂部。 Π.如申請專利範圍帛i項所述之高亮度哪燈具散熱構造,其 中,該各散熱鰭片底端之折邊係利用焊接方式貼附於該導熱 基板上。 15 12·如申請翻細第1項所述之高 中,該各散熱鰭片底端之折邊係 基板上。 =申清專利範圍第1項所述之高亮度LED燈具散熱構造,其 該各散熱籍片底端之折邊係利用導熱膠黏著方式貼附於 該導熱基板上。 、M413816 VI. Patent application scope: h A high-brightness LED lamp heat dissipation structure includes: a heat-conducting substrate; a plurality of LEDs mounted on the bottom surface of the heat-conducting substrate; a heat-conducting column disposed at the center of the top surface of the heat-conducting substrate; The heat dissipating fins 'radiately _ (four) around the guide and are in contact with the heat conducting column; and the bottom end of each heat sink fin 5 is formed with a flange for attaching to the top surface of the heat conducting substrate. 2. The heat-dissipating structure of the high-brightness LED lamp as described in the patent application, wherein a plurality of grooves for the heat-dissipating fins are embedded in the periphery of the heat-conducting column. 3. If you apply for a face! A high-brightness LED lamp heat-dissipating structure is selected, wherein at least the perforation plate has at least a perforation. The high-intensity LED lamp recording structure according to the invention, wherein the bottom of the heat-conducting substrate is provided with a set of lamp housings, and the group of lamp housings has a relatively covering outer cover of each LED. a cover, and a light-transmissive cover opposite to the light outlet of the coffee. 5. The high-brightness LED lamp heat dissipation structure according to claim 4, wherein the outer material is provided with a perforation for the passage of the LED light, and an inner flange is provided at the inner edge of the perforation. a convex portion for inserting the through hole of the outer cover' is further provided on the periphery of the convex portion - the outer flange is for overlapping with the inner flange of the outer cover; and the outer cover of the transparent cover and the outer cover The inner flange is respectively provided with a corresponding screw perforation. The heat conducting substrate is further provided with a screw hole corresponding to each screw perforation, and the 14 M413816 uses a screw to lock the outer cover of the light cover and the transparent cover. At the bottom of the thermally conductive substrate. 6. The high-brightness LED lamp heat dissipation structure according to claim 1, wherein the top of the heat-conducting column is provided with a set of lamp housings, the lamp housing has a bottom plate connected to the heat-conducting column, and a The cover is disposed above the bottom plate, and the cover and the bottom plate form a receiving space for receiving the LED driving module. 7. The high-brightness LED lamp heat dissipation structure according to claim 6, wherein the lamp housing is provided with a set of handles extending over the cover, and the handle is provided with at least one mounting hole. 8. The high-brightness LED lamp heat dissipation structure according to claim 6, wherein the bottom plate of the lamp housing is provided with a plurality of screw perforations, and the top end of the heat-conducting column is provided with a screw hole corresponding to the screw hole of the bottom plate. The bottom plate of the set of lamp housings is locked to the top of the heat conducting column by screws. 9. For the high-brightness LED secret heat dissipation structure described in Item 1 (4), the heat-conducting column is a hollow columnar structure. 1. The high-brightness LED lamp heat dissipation structure according to claim 1, wherein the bottom end of the heat-conducting column is provided with a plurality of screw holes, and the heat-conducting substrate is provided with a screw hole at the bottom end of the heat-conducting column (4) The perforation, the wire is placed on the top of the thermally conductive substrate. For example, the high-brightness heat dissipation structure of the heat-dissipating fins is applied to the heat-conducting substrate by soldering. 15 12· If the application is to refine the high school described in item 1, the bottom edge of each of the heat dissipation fins is on the substrate. = The clear heat-dissipating structure of the high-brightness LED lamp according to claim 1, wherein the bottom edge of each of the heat-dissipating sheets is attached to the heat-conducting substrate by means of a thermally conductive adhesive. , 亮度LED燈具散熱構造,其 利用鉚接方式貼附於該導熱 申》月專利範圍弟1項所述之高亮度LED燈具散熱構造,其 中,各LED係直接建構於該導熱基板底部。 15.如申請專利範圍第1項所述之高亮度LED燈具散熱構造,其 中,該LED燈具散熱構造係將LED以預定數量為一级的方 式建構於一基材上,透過該基材將各組LED設於該導熱基板 底部。The heat-dissipating structure of the brightness LED lamp is attached to the heat-dissipating structure of the high-brightness LED lamp according to the heat-transfer method in the patent application scope, wherein each LED is directly constructed on the bottom of the heat-conducting substrate. 15. The high-brightness LED lamp heat dissipation structure according to claim 1, wherein the LED lamp heat dissipation structure is configured to construct the LED on a substrate in a predetermined number of stages, through which the substrate is The group of LEDs is disposed at the bottom of the thermally conductive substrate. 1616
TW100208445U 2011-05-11 2011-05-11 Heat-dissipation structure of high-brightness LED lamp TWM413816U (en)

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