M397029 五、新型說明： 【新型所屬之技術領域】 本創作是有關於一種發光元件，且特別是有關於一種 具有側視式(side view)發光二極體封裝體的發光元件。 【先前技術】 近年來節省能源及開發新能源是很重要的議題，光源 對於人類現今是不可或缺的，而其中發光二極體(light emitting diode，LED)是最受矚目的節能光源。發光二極體 除了是主要的照明光源外，也因其省電、壽命長與低污染 的特性’成為節能與環保的重要光源。 一般而言，在使用發光二極體作為光源的發光元件 中，發光二極體封裝體可分為直視式(t〇pview)發光二極體 封裝體與侧視式發光二極體封裝體。直視式發光二極體封 裝體由頂部向上發光，而侧視式發光二極體封裝體則在侧 向上發光。目前，側視式發光二極體封裝體已廣泛地使用 於顯不器的背光照明設備或諸如行動電話等的小型電子設 倚中。 【新型内容】 本創作提供一種發光元件，其易於進行檢測與重功 (rework)’且具有較佳的散熱效果。 3作提出—㈣光元件，其包括發光三極體封裝 土 乂及銲料(solder)。發光二極體封裝體包括至少一 個承載器(carrier)、發光二極體晶片、殼體(housing)以及封 膠(encapsulant)。承載器具有第一部分與第二部分，其中第 一部分具有第一端與第二端，而第二部分具有與第一端對 應的第三端。發光二極體晶片配置於第一部分上，且與第 一部分電性連接。殼體包覆部分承載器並暴露出第一端、 第二端與第三端。殼體具有正面與背面，且正面具有第一 開口。第一開口暴露出發光二極體晶片。第二端以及至少 部分的第一端與第三端沿殼體的側面延伸至殼體的背面。 第一封膠配置於第一開口中並覆蓋發光二極體晶片。發光 二極體封裝體配置於基板上，其中具有第一端與第三端的 殼體的側面朝向基板。銲料配置於基板與發光二極體封裝 體之間，且將第一端與第三端電性連接至基板。 依照本創作實施例所述之發光元件，上述之承载器例 如為導線架(lead frame)。 依照本創作實施例所述之發光元件，上述之第一部分 例如為晶片座(die pad)，而第二部分例如為導腳(iea(j)。 依照本創作實施例所述之發光元件，上述之第一部分 例如與第二部分電性分離。 依照本創作實施例所述之發光元件，上述之第一封膠 的材料例如為矽樹脂、環氧樹脂或丙烯酸樹脂。 依照本創作實施例所述之發光元件，上述之第一封膠 中例如含有螢光材料。 依照本創作實施例所述之發光元件，上述之殼體的材 料例如為封裝膠體(molding compound)、陶瓷或具有絕緣表 «97029 面的金屬。 依照本創作實施例所述之發光元件，上述之基板例如 為電路板〇 依照本創作實施例所述之發光元件，上述之第一端、 與第三端例如沿殼體的側面延伸至背面。 = 依照本創作實施例所述之發光元件，上述之第一端與 =第一端以父替的方式分別沿殼體的侧面延伸至背面以及 朝向正面延伸。 依照本創作實施例所述之發光元件，上述之第一端與 第三端例如作為接腳(pin)之用。 依照本創作實施例所述之發光元件，上述之第二端例 如作為散熱片（heat sink)之用。 依照本創作實施例所述之發光元件，上述之背面例如 具有第二開口，且第二開口暴露出部分承載器。 _ 依照本創作實施例所述之發光元件，還可以包括電子 =與第二封膠。電子元件配置於第二開σ所暴露出的承 器上。第二封膠配置於第二開口中並覆蓋電子元件。 依照本創作實施例所述之發光元件，上述之背面例如 "有凹槽’且填充材料配置於凹槽中。 ’上述之殼體例如 ’上述之發光二極 依照本創作實施例所述之發光元件 為多層結構。 依照本創作實施例所述之發光元件 體封裴體包括多個承載器》 依照本創作實施例所述之發光元件，上述之承載器例 M397029 如為共平_或非共平面的。 依照本創作實施例所述之發光元件，上述之第一部分 部分例如為共平面的或非共平面的。 依照本創作實施例所述之發光元件，上述之殼體的長 又例如；丨於3 mm至40 mm之間。 依照本創作實施例所述之發光元件，上述之殼體 度例如介於3 mm至40 mm之間。 、 依照本創作實施例所述之發光元件，上述之殼體的 又列如介於1 mm至30 mm之間。 基於上述，本創作將承載器的第—部分的第一端和/ 皆弟—部分的第三端由殼體的侧面穿出並沿著側面延伸至 電性連接至基板的接腳，因此可以透過直接觀 =风體的老面來檢測銲料是否正確地銲接於接腳上，碰 短路或斷路的發生。此外’欲對接腳或銲料進行 於接，配置於殼體的背面，因此可以容祕進行重功， 第：=省1生產時間與成本。另外，本創作將承载器的 面，；第二St側面穿出並沿著側面延伸至背 效果广第-端可以作為散熱片之用，且具有較佳的散熱 為讓本創作之上述特徵和優點能更明_懂 牛實化例’並配合所附圖式作詳細說明如下。 文特 實施方式】 之側視 圖1為依照賴作-實_讀_發光元件 7 M397029 示意圖。圖2為圖1中的發光元件之後視示意圖。圖3為 圖1中的發光元件之前視示意圖。請同時參照圖i、圖2 與圖3,發光元件10包括發光二極體封裝體1〇〇、基板1〇2 以及銲料104。發光二極體封裝體100包括承載器1〇6、發 光一極體晶片108、殼體11〇以及封膠112。在本實施例中， 發光二極體封裝體100包括三個承載器1〇6。在其他實施 例中’也可以視實際需求而配置不同數量的承載器。 承載益106具有彼此電性分離的第一部分i〇6a與第 一部分l〇6b。在本實施例中，一個第一部分i〇6a對應一 個第二部分106b。在其他實施例中，一個第一部分i〇6a 也可以對應多個第二部分106b。此外，在本實施例中，第 一部分106a與第二部分l〇6b為共平面的。在其他實施例 中，第一部分106a與第二部分l〇6b也可以是非共平面的。 另外，在本實施例中，三個承载器106為共平面的。在其 他實施例中’各個承載器也可以是非共平面的。承載器1〇6 例如為導線架’而第一部分106a可視為晶片座，第二部分 則可視為導腳、此外，第一部分i〇6a具有第一端S1 與第二端S2，而第二部分106b具有第三端S3，且第三端 S3與第一端S1相對應》 發光二極體晶片108配置於第一部分1〇6a(晶片座） 上，且與第二部分106b(導腳)電性連接。在本實施例中， 發光二極體晶片108例如是透過打線接合(wire bonding)的 方式，藉由接合線108a而電性連接至第二部分i〇6b。 毅體110包覆部分承載器106並暴露出第一端S1、第 M397029 二端S2與第三端S3 »殼體110的材料例如為封裝膠體(聚 碳酸酯（polycarbonate，PC)、聚鄰笨二甲醢胺 (polyphthalamide，PPA)等）、陶瓷或具有絕緣表面的金屬。 此外，殼體110亦可是由進行多次射出成型步驟所形成的 多層殼體》 詳細地說，殼體110包覆了部分承載器106，而第一 端S1與第三端S3由殼體110的側面110a穿出，並沿著 側面110a延伸至殼體110的背面110c。此外，第二端S2 沿殼體110的侧面110b延伸至殼體110的背面i10c。在 本實施例中，第一端S1、第二端S2與側面ll〇a以及背面 110c接觸，而第三端S3與側面110b以及背面li〇c接觸。 在其他實施例中，第一端S1、第二端S2也可以與側面ii〇a 以及背面ll〇c不接觸，而第三端S3也可以與側面ii〇b 以及背面110c不接觸。另外，殼體110的正面n〇d具有 開口 114。開口 114暴露出配置於第一部分l〇6a上的發光 二極體晶片108。在本實施例中，開口 114具有傾斜的側 壁’以利於反射並集中發光二極體晶片108所發出的光。 封膠112配置於開口 114中並覆蓋發光二極體晶片 108。封膠112的材料例如為矽樹脂、環氧樹脂或丙烯酸樹 脂。此外’封膠112中可以含有螢光材料。發光二極體晶 片108所發出的光可以激發螢光材料而產生螢光，並藉由 混合發光二極體晶片108所發出的光與螢光來產生不同顏 色的光’或者藉由螢光材料將發光二極體晶片108所發出 的光轉換為不同顏色的光。 9 M397029 發光二極體封裝體100以側面ii〇a朝向基板1〇2的 方式配置於基板102上。基板1〇2例如為電路板銲料1〇4 配置於基板102與發光二極體封裝體1〇〇之間，且將.位於 背面110c上的第一端S1與第三端S3電性連接至基板。 換句話說’由殼體110的側面110a穿出並沿著側面11〇a 延伸至背面110c的第一端S1與第三端S3作為接腳之用。 此外，沿殼體110的侧面1 l〇b延伸至背面1 i〇c的第二端 做為散熱片之用。在本實施例中，多個第二端S2彼 此分離，而在其他實施例中，也可以視實際需求而將多個 第二端S2連接在一起》 此外，殼體110的長度L例如介於3 mm至40 mm之 間，寬度W例如介於3 mm至40 mm之間，深度〇例如 介於1 mm至30 mm之間。 特別一提的是，上述的發光元件1〇除了可以應用於 一般的照明之外，還可以應用於顯示器中，作為背光模組 中的光條(light bar)之用。 在上述實施例中，第一端S1與第三端S3皆由殼體11〇 的側面110a穿出，並沿著側面1 i〇a延伸至殼體11〇的背 面UOc。然而，在其他實施利中，視實際設計需求，也可 以疋將第一端S1與第三端S3以交替的方式分別沿殼體 的側面110a延伸至背面ll〇c以及朝向正面u〇d延伸。 圖4為依照本創作另一實施例所繪示的發光元件之側 視示意圖。圖5為圖4中的發光元件之後視示意圖。在圖 4與圖5中，與圖1至圖3相同的元件將以相同的標號表 M397029 示。請同時參照圖4與圖5，在發光元件20中，第一端 S1沿殼體110的側面i10a延伸至背面i10c，而第三端S3 沿殼體110的側面ll〇a朝向正面ll〇d延伸。然而，在另 一實施例中，也可以是第三端S3沿殼體110的側面ii〇a 延伸至背面110c，而第一端S1沿殼體110的侧面11〇a朝 向正面110d延伸。或者，在一個第一部分106&對應多個 第二部分106b的實施例中，也可以將第一端S1與多個第 三端S3以交替的方式分別沿殼體no的侧面110a延伸至 背面110c以及朝向正面u〇d延伸。 此外’在上述各實施例中，殼體11〇的背面ll〇c還 可以具有凹槽或暴露出部分承載器106的開口。以下將對 此作進一步地說明。 圖6為依照本創作再一實施例所繪示的發光元件之側 視示意圖。在圖6中，與圖1至圖3相同的元件將以相同 的標號表示。請參照圖6，在發光元件60中，殼體110的 背面110c具有暴露出部分承載器106的開口 600。此外， 電子元件602配置開口 600所暴露出的承載器106上。電 子元件602可以是發光二極體、靜電放電（electrostatic discharge，ESD)保護元件(例如基納(Zener)二極體）等。與 開口 114相同，開口 600也可以具有傾斜的侧壁。封膠604 配置於開口 600中並覆蓋電子元件602。封膠604的材料 .例如為矽樹脂、環氧樹脂或丙烯酸樹脂。與封膠112相同， 封膠604也可以含有螢光材料。 圖7為依照本創作又一實施例所繪示的發光元件之側 11 M397029 視示意圖。在圖7中，與圖！至圖3相同的元 的標號表示。請參照圖7，在發光元件7〇中，殼體 背面110c具有凹槽700 ’且填充材料7〇2配置於凹样· 中。填充材料702可以是與殼體11〇不同的材料，^ 實際需求而為具有各種特性的材料^舉例來說，為 成本，填充材料702可以是價格低於殼體11〇的材料。或 者，在另-實施例中，也可以省略填充材料7〇2。或者: 例中，也可以用多層結構(或組合和__ ❹卜提的是’本創倾不限於是上述各實施例可 視實際需求而將上述實施例搭配使用。 综上所述，在本創作的發光元件中，由於承載器 第一端和/或第二部分的第三端由殼體的側面穿 侧面延伸至背面來作為接腳，因此在藉由鲜料將 體的背面來_銲料是否正確地銲接於接腳上 路或斷路的發生。 乂避克短 銲料並未正钱銲接於接腳上時，由於接腳 ==背面’因此可以容易地進行重功，以節省生 、沾f外’在本鋪的發光元件巾於承健的第一部 刀的第二端由殼體的側面穿出並沿著側面延伸至背面，因 此可以作為散熱片之用’且具有較佳的散熱效果。 雖然本創作已以實施例揭露如上，然其並非用以限定 12 L1l^y /\J29 太名丨^，任何所屬技術領域中具有通常知識者’在不脫離 ^作之精神和範圍内，當可作些許之更動與潤飾，故本 J作之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為依照本創作一實施例所誇示的發光元件之側視 示意圖。 圖2為圖1中的發光元件之後視示意圖。 圖3為圖1中的發光元件之前視示意圖。 圖4為依照本創作另一實施例所繪示的發光元件之側 視示意圖。 圖5為圖4中的發光元件之後視示意圖。 圖6為依照本創作再一實施例所繪示的發光元件之側 視示意圖。 圖7為依照本創作又一實施例所繪示的發光元件之側 視示意圖。 【主要元件符號說明】 10、20、60、70 :發光元件 100 :發光二極體封裝體 102 :基板 104 :銲料 106 :承載器 106a :第一部分 13 M397029 106b :第二部分 108 :發光二極體晶片 108a :接合線 110 :殼體 110a、110b :側面 110c :背面 110d :正面 112、604 :封膠 114、600 :開口 602 :電子元件 700 :凹槽 702 :填充材料 D :深度 L :長度 51 :第一端 52 :第二端 53 :第三端 W :寬度M397029 V. New description: [Technical field to which the novel technology belongs] The present invention relates to a light-emitting element, and more particularly to a light-emitting element having a side view light-emitting diode package. [Prior Art] In recent years, energy conservation and the development of new energy sources are very important issues. Light sources are indispensable for humans today, and light emitting diodes (LEDs) are the most attractive energy-saving light sources. In addition to being the main source of illumination, the LEDs are also an important source of energy and environmental protection due to their power saving, long life and low pollution characteristics. In general, in a light-emitting element using a light-emitting diode as a light source, the light-emitting diode package can be classified into a direct-view type light-emitting diode package and a side-view light-emitting diode package. The direct-view LED package emits light from the top, while the side-view LED package emits light in the lateral direction. Currently, side-view LED packages have been widely used in backlighting devices for displays or in small electronic devices such as mobile phones. [New content] The present invention provides a light-emitting element which is easy to perform detection and rework' and has a better heat dissipation effect. 3 proposed - (4) optical components, including light-emitting diode package earth and solder. The light emitting diode package includes at least one carrier, a light emitting diode wafer, a housing, and an encapsulant. The carrier has a first portion and a second portion, wherein the first portion has a first end and a second end, and the second portion has a third end corresponding to the first end. The light emitting diode chip is disposed on the first portion and electrically connected to the first portion. The housing encloses a portion of the carrier and exposes the first end, the second end, and the third end. The housing has a front side and a back side, and the front side has a first opening. The first opening exposes the light emitting diode wafer. The second end and at least a portion of the first and third ends extend along the side of the housing to the back of the housing. The first adhesive is disposed in the first opening and covers the light emitting diode chip. The light emitting diode package is disposed on the substrate, wherein a side of the housing having the first end and the third end faces the substrate. The solder is disposed between the substrate and the LED package, and electrically connects the first end and the third end to the substrate. According to the light-emitting element of the present embodiment, the above-mentioned carrier is, for example, a lead frame. According to the light-emitting element of the present embodiment, the first portion is, for example, a die pad, and the second portion is, for example, a lead pin (iea(j). According to the light-emitting element of the present creative embodiment, the above The first part is electrically separated from the second part, for example. According to the light-emitting element of the present invention, the material of the first sealant is, for example, a resin, an epoxy resin or an acrylic resin. In the light-emitting element, the first sealant contains, for example, a fluorescent material. According to the light-emitting element of the present embodiment, the material of the above-mentioned housing is, for example, a molding compound, a ceramic or an insulating table «97029 The light-emitting element according to the embodiment of the present invention, wherein the substrate is, for example, a circuit board, the light-emitting element according to the embodiment of the present invention, the first end and the third end are, for example, along the side of the housing. Extending to the back side. According to the light-emitting element of the present embodiment, the first end and the first end are respectively extended along the side of the housing to the back side by the parent. And extending toward the front surface. According to the light-emitting element of the embodiment of the present invention, the first end and the third end are used as a pin, for example, the light-emitting element according to the embodiment of the present invention, the second For example, the light-emitting element according to the embodiment of the present invention has a second opening, for example, and the second opening exposes a portion of the carrier. The light-emitting element may further include an electron=and a second sealant. The electronic component is disposed on the receiver exposed by the second opening σ. The second sealant is disposed in the second opening and covers the electronic component. In the light-emitting element of the example, the back surface is, for example, "grooveed" and the filling material is disposed in the recess. The above-mentioned housing, for example, the above-mentioned light-emitting diode is a plurality of layers according to the present embodiment. The light-emitting element body sealing body according to the embodiment of the present invention includes a plurality of carriers. According to the light-emitting element of the present embodiment, the above-mentioned carrier example M397029 is as In the light-emitting element according to the embodiment of the present invention, the first partial portion is, for example, coplanar or non-coplanar. According to the light-emitting element of the present creative embodiment, the shell is The length of the body is, for example, between 3 mm and 40 mm. According to the light-emitting element of the present embodiment, the housing degree is, for example, between 3 mm and 40 mm. The light-emitting element described above, wherein the above-mentioned housing is further between 1 mm and 30 mm. Based on the above, the present invention has the first end of the first portion of the carrier and the third end of the portion The side of the casing penetrates and extends along the side to the pins electrically connected to the substrate, so that the solder can be correctly soldered to the pins through the direct view of the old surface of the wind body, and the occurrence of a short circuit or an open circuit occurs. . In addition, the pin or solder is to be connected to the back of the casing, so that it can be used for heavy work, and the production time and cost are saved. In addition, the creation of the surface of the carrier; the second St side is extended and extends along the side to the wide end of the back effect can be used as a heat sink, and has better heat dissipation for the above features of the creation and The advantages can be more clearly _ understand the cow example 'and with the drawings as detailed below. Figure 1 is a schematic view of a light-real-reading light-emitting element 7 M397029. FIG. 2 is a rear view of the light emitting element of FIG. 1. FIG. Fig. 3 is a front elevational view of the light-emitting element of Fig. 1. Referring to FIG. 2, FIG. 2 and FIG. 3 simultaneously, the light-emitting element 10 includes a light-emitting diode package 1A, a substrate 1〇2, and a solder 104. The LED package 100 includes a carrier 1〇6, a light-emitting diode wafer 108, a housing 11〇, and a sealant 112. In the present embodiment, the LED package 100 includes three carriers 1〇6. In other embodiments, different numbers of carriers may be configured depending on actual needs. The load factor 106 has a first portion i 〇 6a and a first portion 〇 6b that are electrically separated from each other. In the present embodiment, a first portion i 〇 6a corresponds to a second portion 106b. In other embodiments, a first portion i 〇 6a may also correspond to a plurality of second portions 106b. Further, in the present embodiment, the first portion 106a and the second portion 106b are coplanar. In other embodiments, the first portion 106a and the second portion 106b may also be non-coplanar. Additionally, in the present embodiment, the three carriers 106 are coplanar. In other embodiments, the individual carriers may also be non-coplanar. The carrier 1〇6 is, for example, a lead frame' and the first portion 106a can be regarded as a wafer holder, the second portion can be regarded as a lead leg, and further, the first portion i〇6a has a first end S1 and a second end S2, and the second portion 106b has a third end S3, and the third end S3 corresponds to the first end S1" The LED array 108 is disposed on the first portion 1a6a (wafer holder) and electrically connected to the second portion 106b (lead) Sexual connection. In the present embodiment, the LED wafer 108 is electrically connected to the second portion i〇6b by a bonding wire 108a, for example, by wire bonding. The body 110 covers a portion of the carrier 106 and exposes the first end S1, the M397029 two-end S2 and the third end S3. The material of the housing 110 is, for example, an encapsulant (polycarbonate, PC). Polyphthalamide (PPA), ceramics or metals with an insulating surface. In addition, the housing 110 may also be a multi-layer housing formed by performing multiple injection molding steps. In detail, the housing 110 covers a portion of the carrier 106, and the first end S1 and the third end S3 are comprised by the housing 110. The side surface 110a passes through and extends along the side surface 110a to the back surface 110c of the housing 110. Further, the second end S2 extends along the side 110b of the housing 110 to the rear surface i10c of the housing 110. In the present embodiment, the first end S1 and the second end S2 are in contact with the side surface 11a and the back surface 110c, and the third end S3 is in contact with the side surface 110b and the back surface li〇c. In other embodiments, the first end S1 and the second end S2 may also not be in contact with the side ii 〇 a and the back 〇 〇 c, and the third end S 3 may also not be in contact with the side ii 〇 b and the back surface 110 c. In addition, the front surface n〇d of the housing 110 has an opening 114. The opening 114 exposes the light emitting diode chip 108 disposed on the first portion 106a. In the present embodiment, the opening 114 has a sloped side wall' to facilitate reflection and concentration of light emitted by the LED wafer 108. The encapsulant 112 is disposed in the opening 114 and covers the LED wafer 108. The material of the sealant 112 is, for example, a resin, an epoxy resin or an acrylic resin. Further, the sealant 112 may contain a fluorescent material. The light emitted by the LED chip 108 can excite the phosphor material to generate fluorescence, and generate light of different colors by mixing light and fluorescence emitted from the LED chip 108' or by using a fluorescent material. The light emitted by the LED wafer 108 is converted into light of a different color. 9 M397029 The LED package 100 is disposed on the substrate 102 such that the side surface ii〇a faces the substrate 1〇2. The substrate 1〇2 is, for example, a circuit board solder 1〇4 disposed between the substrate 102 and the LED package 1〇〇, and electrically connects the first end S1 and the third end S3 on the back surface 110c to Substrate. In other words, the first end S1 and the third end S3 which are formed by the side surface 110a of the housing 110 and extend along the side surface 11A to the rear surface 110c serve as pins. Further, the second end extending along the side surface 110b of the housing 110 to the back surface 1 i〇c serves as a heat sink. In this embodiment, the plurality of second ends S2 are separated from each other, and in other embodiments, the plurality of second ends S2 may be connected together according to actual needs. Further, the length L of the housing 110 is, for example, Between 3 mm and 40 mm, the width W is, for example, between 3 mm and 40 mm, and the depth 〇 is, for example, between 1 mm and 30 mm. In particular, the above-described light-emitting element 1 can be applied to a display as a light bar in a backlight module, in addition to general illumination. In the above embodiment, the first end S1 and the third end S3 are both passed out from the side surface 110a of the casing 11〇 and extend along the side surface 1 i〇a to the back surface UOc of the casing 11〇. However, in other implementations, depending on the actual design requirements, the first end S1 and the third end S3 may be extended in an alternating manner along the side surface 110a of the housing to the rear surface 11c and toward the front surface u〇d. . 4 is a schematic side view of a light emitting device according to another embodiment of the present invention. Fig. 5 is a rear view showing the light emitting element of Fig. 4. In Figs. 4 and 5, the same elements as those of Figs. 1 to 3 will be denoted by the same reference numeral M397029. Referring to FIG. 4 and FIG. 5 simultaneously, in the light-emitting element 20, the first end S1 extends along the side surface i10a of the housing 110 to the rear surface i10c, and the third end S3 faces the front surface 〇 〇 along the side surface 〇a of the housing 110. extend. However, in another embodiment, the third end S3 may extend along the side ii 〇 a of the housing 110 to the back surface 110c, and the first end S1 extends along the side 11 〇 a of the housing 110 toward the front surface 110d. Alternatively, in an embodiment in which the first portion 106& corresponds to the plurality of second portions 106b, the first end S1 and the plurality of third ends S3 may be extended in an alternating manner along the side surface 110a of the housing no to the rear surface 110c, respectively. And extending towards the front u〇d. Further, in the above embodiments, the back surface 11c of the casing 11's may also have a recess or an opening exposing a portion of the carrier 106. This will be further explained below. FIG. 6 is a schematic side view of a light emitting device according to still another embodiment of the present invention. In Fig. 6, the same elements as those of Figs. 1 to 3 will be denoted by the same reference numerals. Referring to Figure 6, in the light-emitting element 60, the back surface 110c of the housing 110 has an opening 600 that exposes a portion of the carrier 106. In addition, electronic component 602 is disposed on carrier 106 that is exposed by opening 600. The electronic component 602 may be a light emitting diode, an electrostatic discharge (ESD) protection element (e.g., a Zener diode), or the like. Like the opening 114, the opening 600 can also have sloping side walls. The sealant 604 is disposed in the opening 600 and covers the electronic component 602. The material of the sealant 604 is, for example, a resin, an epoxy resin or an acrylic resin. As with the sealant 112, the sealant 604 can also contain a fluorescent material. FIG. 7 is a schematic view of the side of the light-emitting element 11 M397029 according to another embodiment of the present invention. In Figure 7, with the figure! The same reference numerals as in Fig. 3 are indicated. Referring to Fig. 7, in the light-emitting element 7A, the casing rear surface 110c has a groove 700' and the filling material 7〇2 is disposed in the concave shape. The filler material 702 may be a different material than the housing 11 , and is actually a material having various characteristics. For example, at a cost, the filler material 702 may be a material having a lower price than the housing 11 . Alternatively, in another embodiment, the filling material 7〇2 may be omitted. Or: In the example, the multi-layer structure (or combination and __ ❹ 提 ' ' ' 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本In the created light-emitting element, since the first end of the carrier and/or the third end of the second portion extends from the side through side of the casing to the back side as a pin, the back of the body is soldered by fresh material. Whether it is soldered correctly on the lead or open circuit. When the short solder is not soldered to the pin, the pin can be easily reworked due to the pin == back side, so as to save the raw material. Externally, the light-emitting component of the present shop is pierced from the side of the casing and extends along the side to the back side at the second end of the first blade of the bearing, so that it can be used as a heat sink and has better heat dissipation. Although the present invention has been disclosed above by way of example, it is not intended to limit 12 L1l^y /\J29 too 丨^, and any person having ordinary knowledge in the technical field is not in the spirit and scope of the work. When you can make some changes and retouch, Therefore, the scope of protection of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side elevational view of a light-emitting element exaggerated in accordance with an embodiment of the present invention. Figure 3 is a front elevational view of the illuminating element of Figure 1. Figure 4 is a side elevational view of the illuminating element in accordance with another embodiment of the present invention. Figure 6 is a side elevational view of a light-emitting element according to another embodiment of the present invention. Figure 7 is a side elevational view of a light-emitting element according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS] 10, 20, 60, 70: Light-emitting element 100: Light-emitting diode package 102: Substrate 104: Solder 106: Carrier 106a: First part 13 M397029 106b: Second part 108: Light-emitting diode chip 108a: bonding wire 110: housing 110a, 110b: side surface 110c: back surface 110d: front surface 112, 604: sealant 114, 600: opening 602: electronic component 700: recess 702: filling material D: depth L: length 51: First end 52: first Terminal 53: third terminal W: Width