M396366 五、新型說明： 【新型所屬之技術領域】 本創作係屬錄諸狀躺，林故—觀齡觀仙該散熱 結構之照明裝置。 【先前技術】 目則’照明裝置中之LED，特別是使用大功率晶片之LED，在工作過程 中’其將產生大量之熱量，產品對散熱器有著較高要求，但是現有技術中 =散熱器大纽計為-㈣，其通f藉由擠出成型或採關加工方式進行 製造’其生產效率低，加玉時縣導致生產成本高，現有技術中也有採用 鳍片式之散熱H，但是這種則式的散熱器上的散刻為間距設置，其熱 阻高，導熱、散熱性能差。 【新型内容】 本創作之主要目的在魏服上魏有技狀从，提供了—種散熱結 構及使職賴結構之卿裝置，其散紐能好，散熱結構之熱阻小，且 散熱結構加工、生產成本低。 本創作設狀雜結構所_之雜方案為： —種散熱結構’包括至少―散熱座，該散熱座包括至少二散熱片該 散熱片上下堆疊貼合且相鄰散熱片之間固定連接。 ' 具體地，該散熱片開設有至少—通孔。 優選地，該通孔呈圓形或方形或多邊形。 具體地，該散熱片呈片狀，該散熱片之一端面凸設有柳接凸起部’該 散熱片之另-端面於該_凸起部對應處設有與相鄰散熱片之鲫接凸麵 3 M396366 相匹配之鉚接凸穴。該鉚接凸起部亦可為鉚接穿孔。 優選地，該散熱片呈圓形或方形或多邊形。 具體地，該散熱座之側面開設有至少一對流孔。 進—步地，相鄰該散熱片之間塗設有導熱膠。 具體地’該散熱座設置為兩個或多個，且該兩個或多個散熱座之間首 尾相接相鄰散熱座之間相鉚接，該散熱片包括第—散熱片和第二散教片， 該第一散熱片和第二散_隔設置，該第一散熱片上開設有触孔該 鉚接孔上穿設有銷軸。 進-步地’該散熱座之側面或端面上固設有散熱風扇。 本創作之照明裝置所採帛之技術方案為： 一種照明裝置’包括發光構件，還包括上述之散熱結構，該發光構件 固設於該散熱結構上。 本創作提供-錄減構錢職餘轉之㈣裝置，1藉 熱片上下堆疊貼合而得到散熱座，減小散熱座之熱阻，產品散紐能好， 且散熱片可通過衝财式成型，具有生產速度快生產效料、生產成本 低之優點’使卿裝置王作時所產生之熱量可及時通過餘結構轄射至外 部％境中，縣照職置可在合理的溫度下可靠地工作。 為使本辦之目的、技術方案及優點更加錢明自以下結合附圖及 實施例’對本創作進行進-步詳細說明。應當理解，此處所描述的具體實 施例僅翻崎釋本創作，並*麟限定本創作。 【實施方式】 如第一圖〜第四圖所示 本創作實施例提供之一種散熱結構，可用於 M396366 對照明裝置、CPU或其他發熱量較大之電器元件進行散熱，該散熱結構包括 至少一散熱座100 ’該散熱座100包括至少二散熱片U0，散熱片11〇之數 量可為兩片或多片，該散熱片110上下堆疊貼合且相鄰散熱片11〇之間固 定連接，藉由將多片散熱片110上下堆疊貼合，以降低相鄰散熱片11〇之 間之熱阻，提高產品之散熱性能，散熱片110可採用板狀金屬材料藉由衝 壓之生產方式成型，具有生產效率高、生產速度快、生產成本低等諸多優 點。而且，只要開設一套散熱片110之模具’便可根據不同的應用場合設 镰 置散熱片110堆疊之數量，使產品可適應不同的使用要求，結構通用性佳。 具體地’如第一圖〜第四圖所示’該散熱片110開設有至少一通孔lu， 趨時’各散熱片no上之通孔lu相重合’以絲熱座⑽上形成貫通 於散熱座100之貫孔，以增加散熱座_之散熱表面積，使空氣可穿過散 熱座100，增強了散熱座100之對流散熱效果。通孔U1可與散熱片11〇 一 起衝壓成型’也可以在散刻11G完成堆疊組裝後彻機加工方式加工出 鲁 孔ui優選地，本實施例中，通孔ui與散熱片11〇—起通過衝壓模具M396366 V. New description: [New technical field] This creation is recorded in the form of a lie, and it is the lighting device of the heat dissipation structure. [Prior Art] The LEDs in the lighting device, especially the LEDs using high-power chips, will generate a large amount of heat during the work process, and the products have high requirements for the heat sink, but in the prior art, the radiator The big New Zealand is - (4), and its pass f is manufactured by extrusion molding or cutting processing method. Its production efficiency is low, and Jiayu County leads to high production cost. In the prior art, fin-type heat dissipation H is also used, but The scatter on the heat sink of this type is a pitch setting, and the thermal resistance is high, and the heat conduction and heat dissipation performance are poor. [New Content] The main purpose of this creation is to have a technical structure in Wei Wei, and to provide a kind of heat dissipation structure and a device for making the structure of the job. The diffusion can be good, the thermal resistance of the heat dissipation structure is small, and the heat dissipation structure Processing and production costs are low. The hybrid structure of the present invention is: - a heat dissipating structure 'includes at least a heat sink, the heat sink includes at least two heat sinks, the heat sinks are stacked one on top of the other and the adjacent heat sinks are fixedly connected. Specifically, the heat sink is provided with at least a through hole. Preferably, the through hole is circular or square or polygonal. Specifically, the heat sink has a sheet shape, and one end surface of the heat sink is convexly provided with a protruding portion of the heat sink. The other end surface of the heat sink is provided at the corresponding portion of the convex portion to be connected with the adjacent heat sink. Convex 3 M396366 Matching riveting burrs. The rivet boss may also be a riveted perforation. Preferably, the heat sink is circular or square or polygonal. Specifically, at least one pair of flow holes are formed in a side of the heat sink. Further, a thermal conductive paste is applied between the adjacent fins. Specifically, the heat sink is disposed in two or more, and the two or more heat sinks are riveted between the first and second heat sinks, and the heat sink includes a first heat sink and a second heat sink. The first heat sink and the second diffuser are disposed, and the first heat sink is provided with a contact hole, and the rivet hole is provided with a pin. A cooling fan is fixed to the side or end surface of the heat sink. The technical solution adopted by the lighting device of the present invention is as follows: A lighting device' includes a light-emitting member, and further includes the above-mentioned heat-dissipating structure, and the light-emitting member is fixed on the heat-dissipating structure. This creation provides - (4) devices for recording and subtracting the money to transfer the money, and 1 to obtain the heat sink by stacking the heat sheets up and down, reducing the thermal resistance of the heat sink, the product balance can be good, and the heat sink can pass the punching type Forming, with the advantages of fast production speed and low production cost. The heat generated by the King of the Kings can be sent to the external environment through the residual structure. The county can work reliably at a reasonable temperature. . In order to make the purpose, technical solutions and advantages of the present invention more detailed, the present invention will be described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for the sake of the original creation, and that *lin defines the creation. [Embodiment] As shown in the first to fourth embodiments, a heat dissipation structure provided by the present embodiment can be used for heat dissipation of a lighting device, a CPU, or other electrical components having a large amount of heat, and the heat dissipation structure includes at least one The heat sink 100' includes at least two heat sinks U0, and the number of the heat sinks 11 can be two or more. The heat sinks 110 are stacked one on top of the other and the adjacent heat sinks 11 are fixedly connected. The plurality of fins 110 are stacked one on top of the other to reduce the thermal resistance between the adjacent fins 11 and improve the heat dissipation performance of the product. The fins 110 can be formed by stamping production using a sheet metal material. Many advantages such as high production efficiency, fast production speed and low production cost. Moreover, as long as the mold of the heat sink 110 is opened, the number of the heat sinks 110 can be stacked according to different applications, so that the product can adapt to different use requirements, and the structure has good versatility. Specifically, as shown in the first to fourth figures, the heat sink 110 is provided with at least one through hole lu, and the through holes lu on each of the heat sinks are coincident with each other to form a heat through the heat sink (10). The through hole of the seat 100 is used to increase the heat dissipation surface area of the heat sink, so that the air can pass through the heat sink 100, and the convection heat dissipation effect of the heat sink 100 is enhanced. The through hole U1 can be stamped and formed together with the heat sink 11〇. It can also be processed in a machined manner after the stacking assembly is completed in the 11G. Preferably, in the embodiment, the through hole ui and the heat sink 11 are combined. By stamping die
- 衝壓成型，其生產成本低。 A 少一 另外’組裝時，也可簡各散熱片11G堆疊組裝後在其—端設置至 沒有開設通孔m之散熱;^ 11G，以在散熱座⑽上形成盲孔。 優選地，如第-圖和第二圖所示，該通孔U1呈圓形或方形或多邊形， 外，也可以呈三角形、擴圓形、圖案形或其他合適之形狀，還可以在散 熱座100上設置上述不同形狀之通孔m之組合。該通孔⑴之形狀數 量可根據實際情況隨意調整’均屬於本創作之保護範圍。 具體地，如第-圖〜第六圖⑷⑻所示該散熱片⑽呈片狀該散 5 M396366 … 之端面凸°又有鉚接凸起部113或是設有鉚接穿孔113卜該散熱 片110之另-端祕該鉚接凸起部113或鉚接穿孔1311對應處設有與相鄰 散熱片110之鉚接凸起部113相匹配之柳接凸穴112，藉由這樣設計，娜接 凸起部113或鉚接穿孔1131可卡緊於相鄰散熱片110上之鉚接凸穴112 内，在組裝生產時，將散熱片110上下堆疊並在散熱片110上施加壓力， 鉚接凸起部113或鉚接穿孔咖將卡緊於鉚接凸穴112，麟接凸穴112 與鉚接凸起部113或職f孔1311這間設χ為碰配合，使柳之散熱片 110之間可以可罪地固定，且貼合緊密，減小產品熱阻，提高產品之散熱性 能，產品之可靠性佳’且結構合理，生產工藝易於實現有利於降低產品 之成本。且相鄰散熱片11()之間可以塗設砍膠導熱夥等導熱性能佳之 熱材料，⑽—錢小產品之熱阻，提高產品之散雛能。另外地，也可 以用螺栓穿設於各散熱片11Q並料散制UQ堆疊固定還可以採用其 他合適方式，如卡箍壓緊、膠水枯緊等合適之固定方式將散熱片11〇上下 貼合壓緊固定，均屬於本創作的保護範圍。 優選地’如第-圖〜第七圖所示，該散熱月11〇呈圓形或方形或多邊 形’具體可根據實際安裝位置及空間而設定。另夕卜，也可以將組裝好之散 熱座⑽通過機加卫之方式將散熱座⑽加卫至合適形狀以適應不同之 文裝空間，提高產品之相容性。 具體地，如第-圖和第二圖所示，該散熱座1〇〇之側面開設有至少一 對流孔101，對流孔101與通孔lu垂直交叉且相互導通，以進一步增加散 熱座100之散熱表自積’且可使產品輕量化，散熱座100之上下左右都可 形成通風流道，產品的散熱性能佳。 M396366 優選地’該散熱片110採用鋁合金或銅合金材料製造，其導熱性能佳β 另外，也可以採用矽鋼片或其他散熱性能好之材料製造，均屬於本創作的 保護範圍。- Stamping, its production cost is low. A is less than one. In addition, when assembled, the heat sink 11G can be stacked and assembled at its end to the heat dissipation of the through hole m; ^11G to form a blind hole in the heat sink (10). Preferably, as shown in the first and second figures, the through hole U1 is circular or square or polygonal, and may also have a triangular shape, an expanded circular shape, a pattern shape or other suitable shape, and may also be in the heat sink. A combination of the above-described different shapes of through holes m is provided on the 100. The number of shapes of the through hole (1) can be adjusted as needed according to the actual situation, and both belong to the protection scope of the present creation. Specifically, as shown in the first to sixth figures (4) and (8), the heat sink (10) has a sheet shape, and the end face of the 5 M396366 has a riveted protrusion 113 or a riveted through hole 113. Further, the rivet protrusion 113 or the rivet hole 1311 is provided with a splicing protrusion 112 matching the rivet protrusion 113 of the adjacent fin 110. Or the riveted perforations 1131 can be clamped into the riveting cavities 112 on the adjacent fins 110. During assembly and assembly, the fins 110 are stacked up and down and pressure is applied to the fins 110, and the riveted protrusions 113 or riveted perforations are applied. The clips are clamped to the riveting cavities 112, and the collars 112 and the riveting projections 113 or the holes 1311 are configured to be in abutting manner, so that the fins 110 can be restrained and fixed. Close, reduce the thermal resistance of the product, improve the heat dissipation performance of the product, the reliability of the product is good, and the structure is reasonable, and the production process is easy to realize, which is beneficial to reducing the cost of the product. And adjacent heat sinks 11 () can be coated with hot materials such as rubber-coated heat-conducting heat-conducting materials, (10) - the thermal resistance of small products, improve the product's ability to disperse. Alternatively, the heat sink 11 〇 can be attached to the heat sink 11Q by bolts to the heat sinks 11Q and the bulk of the UQ stack can be fixed by other suitable means, such as clamp pressing, glue tightness and the like. Pressing and fixing are all within the scope of this creation. Preferably, as shown in the first to seventh figures, the heat dissipation month 11 is circular or square or polygonal. Specifically, it can be set according to the actual installation position and space. In addition, the assembled heat sink (10) can also be used to defend the heat sink (10) to a suitable shape to fit different text spaces and improve product compatibility. Specifically, as shown in the first and second figures, at least one pair of flow holes 101 are defined in the side surface of the heat sink 1 , and the convection holes 101 and the through holes lu are perpendicularly intersected and electrically connected to each other to further increase the heat sink 100 The heat sink is self-contained and can make the product lighter, and the ventilation channel can be formed on the upper and lower sides of the heat sink 100, and the heat dissipation performance of the product is good. M396366 Preferably, the heat sink 110 is made of aluminum alloy or copper alloy material, and has good thermal conductivity. In addition, it can also be made of silicon steel sheet or other materials with good heat dissipation properties, which are all protected by the present invention.
具體地，如第一圖〜第五圖和第七圖〜第十一圖所示，該散熱座100 «X置為兩個或多個，且該兩個或多個散熱座之間首尾相接相鄰散熱座 1〇〇之間相鉚接，該散熱片110包括第一散熱片114和第二散熱片，該 第-散熱片114和第二散熱片115間隔設置，該第一散熱片114上開設有 鉚接孔116，該鉚接孔116上穿設有銷軸12〇。藉由這樣設計，可使產品可 f折成不同形狀’使產品可適應於多種安裝空間，可根據實際情況對產品 相鄰散熱座1GG間之相對角度進行調整，產品相容性佳。 進一步地’該散熱座1〇〇之侧面或端面上固設有散熱風扇（圖中未示 出）’利用強制對流之方式使空氣快速流過散熱座⑽，並從通孔ui和對 流孔101中流過，大大增加產品之散熱性能。Specifically, as shown in FIG. 1 to FIG. 5 and FIG. 11 to FIG. 11 , the heat sink 100 «X is set to two or more, and the first and last phases between the two or more heat sinks are The heat sink 110 includes a first heat sink 114 and a second heat sink. The first heat sink 114 and the second heat sink 115 are spaced apart from each other. The first heat sink 114 is spaced apart from each other. The upper opening is provided with a rivet hole 116, and the rivet hole 116 is provided with a pin 12 穿. With this design, the product can be folded into different shapes. The product can be adapted to a variety of installation spaces, and the relative angle between the adjacent heat sinks 1GG can be adjusted according to actual conditions, and the product compatibility is good. Further, a heat dissipating fan (not shown) is fixed on the side or end surface of the heat sink 1' to rapidly flow air through the heat sink (10) by means of forced convection, and from the through hole ui and the convection hole 101 Flowing through, greatly increasing the heat dissipation performance of the product.
本實施例還提供-種照明裝置，如第十二圖〜第十四圖所示包括發 光構件200 ’還包括上述之散熱結構，該發光構件固設於該散熱結構上。 優選地’發光構件為LED，具體之結構設計中，將發光構件⑽貼合於 散熱座⑽之上端，贿發光構件辦時所產生的熱量可及時傳導至 散熱座⑽中’散熱請再將熱量輻射至外部衡，藉此提高罐 置撤·，使職置W跑度下轉，㈣臟置之使 用壽命，提高產品之可靠性。 以上所述僅為本創作的較佳實施例而已，並不用以限制本創作凡在 本創作的精神和顧之崎作—_換和改料’均應包含 7 M396366 在本創作的保護範圍之内。 【圖式簡單說明】 第一圖是摘作實施破供-_設有方形觀之散熱結敎體示意圖； 第二圖是本創作實施例提供-種開設有多邊形通孔之賴結構立體示意 B3 · 園， 第三圖是本創作實劇提供-麵_設有對流孔之散熱結構立體示意 因 · _， 第四圖是本創作實施例提供-種散熱#呈圓形之散熱結構立體示意圖； 第五圖是本創作實施例提供-種散熱片呈圓形且經加工之散熱結構立體示 意圖； 第六圖（A)是本創作實施例提供-種散熱結構之鉚接凸起部和鉚接凸穴處 剖面示意圖； 第六圖（B)是本創作實施例提供一種散熱結構之鉚接穿孔和鉚接凸穴處剖 面示意圖； 第七圖是本創作實施例提供一種包括兩個相互鉚接之散熱座之散熱結構立 體示意圖； 第八圖是本創作實施例提供一種包括三個鉚接之散熱座之散熱結構立體示 意圖； 第九圖是第七圖其中一散熱座之立體示意圖； 第十圖是第七圖其中一散熱座之另一立體示意圖； 第十一圖是第七圖其中另一散熱座之立體示意圖； 第十二圖是本創作實施例提供一種照明裝置之立體示意圖； M396366 第十三圖是本創作實施例提供一種散熱結構之側面開設有對流孔之照明裝 置立體示意圖； 第十四圖是本創作實施例提供一種散片呈圓形之照明裝置之立體示意圖。 【主要元件符號說明】 散熱座100 對流孔101 散熱片110 通孔111 鉚接凸穴112 鉚接凸起部113 鉚接穿孔1131 第一散熱片114 第二散熱片115 鉚接孔116 銷軸120 發光構件200The embodiment further provides an illumination device, as shown in the twelfth to the fourteenth aspects, including the light-emitting member 200' further comprising the above-mentioned heat dissipation structure, the light-emitting member being fixed on the heat dissipation structure. Preferably, the 'light-emitting member is an LED. In the specific structural design, the light-emitting member (10) is attached to the upper end of the heat-dissipating block (10), and the heat generated by the light-emitting member can be timely transmitted to the heat sink (10). Radiation to the external balance, thereby improving the tank release, so that the position of the W run down, (4) the service life of the dirty, improve the reliability of the product. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of this creation. The spirit of the creation and the Gusaki's work--changing and reforming should include 7 M396366 in the protection scope of the present creation. Inside. [Simple description of the drawing] The first figure is a schematic diagram of the implementation of the broken supply--the heat-dissipating body with a square view; the second figure is a three-dimensional schematic diagram of the structure provided by the present embodiment. · The garden, the third picture is the three-dimensional schematic diagram of the heat-dissipation structure provided by the actor with the convection hole. The fourth picture is a three-dimensional schematic diagram of the heat dissipation structure provided by the present embodiment. The fifth figure is a perspective view of a heat dissipation structure in which the heat sink is circular and processed according to the present embodiment; the sixth figure (A) is a riveted boss and a riveting cavity provided by the present invention. FIG. 6 is a cross-sectional view showing a riveted perforation and riveting cavities of a heat dissipating structure according to an embodiment of the present invention; and a seventh embodiment of the present invention provides a heat dissipating block including two mutually riveted heat sinks. The eighth embodiment is a three-dimensional schematic diagram of a heat dissipation structure including three riveted heat sinks; the ninth figure is a perspective view of one of the heat sinks of the seventh figure; FIG. 11 is a perspective view of the heat sink of the seventh embodiment; FIG. 11 is a perspective view of the heat sink of the seventh embodiment; The third embodiment of the present invention provides a three-dimensional schematic diagram of an illumination device with a convection hole on the side of the heat dissipation structure. The fourteenth embodiment is a perspective view of a lighting device in which the fragment is circular. [Description of main component symbols] Heat sink 100 Convection hole 101 Heat sink 110 Through hole 111 Riveting cavity 112 Riveting boss 113 Riveting through hole 1131 First heat sink 114 Second heat sink 115 Riveting hole 116 Pin 120 Light emitting member 200