M395785 五、新型說明： [新型所屬之技術領域】 本創作侧於-種「LED散熱結構」，尤指一種可供燈基 板進行散熱之熱導結構。 【先前技術】M395785 V. New description: [New technical field] This creation side is a kind of "LED heat dissipation structure", especially a heat conduction structure for heat dissipation of the lamp substrate. [Prior Art]
按’習用之LED燈基板結構’大部分皆係將LED燈直接組裝於 基板頂面的鋪上，使各燈分別與各_形成電連結，然而哪 、且在使用日〗會產生兩熱’習知之基板結構並不具有較佳之散熱效 果’故易㈣熱’驗LED_制壽命A斷低，甚至讓整體LED 燈之良率降低，甚不具經濟實祕；是故，囉前述制之缺失， 實有將之作進一步改良之必要。 本創作人有鑑於目前制結構仍有改進的地方，所以就從事 相關產品的多年·經驗，且針對目前存在_關題，深思改 口的方法在經過多次改良測試後，終於創造出一種⑽散熱結構。 【新型内容】 緣此’本創作之主要目的係在於提供一種可增加熱傳導速度 及面積使^熱知以快速散出，具有較佳之散熱效果之⑽散孰 結構。 … 本創作之另-目的係在於提供—種使得L騰之壽命延長，整 體之光衰小，具有触亮紅LED散熱結構。 一為了達到上述目的，本創作提出了一種散熱結構，其具有 一基板’該基板之頂底面設3定位置設有若干制狀之銅箱， M395785 •且縣板之底__另設有-_，而各銅_面分職設一 .，使各LED燈分別與各賴形成電熱連結，而各LED燈之底面 分別具有—如與各_鋪之_層，且雌板與各LED燈接觸 之銅箱位置處分別設有—以上之散熱導孔，該散熱導孔之内緣面 亦设有賴，使頂面及底面之賴得以碱電熱連結。 . 其中’該基板鄰近各銅箔之設定位置設有一以上之散熱導孔。 - 其可進一步包括二對合設置之透明燈罩，該二燈罩得以裝設 • 邊基板’使該基板上之各LED燈得以被該二燈罩包覆。 其中’ s玄燈罩係為長條管狀。 其中，該基板係為圓板狀。 其可進一步包括一燈泡狀之燈罩，該圓形基板係裝設於該燈 泡狀之燈罩内。 其可進一步包括一以上之透明小圓罩，各小圓罩係分別罩設 定位於各LE：D燈之外周緣。 # 以下茲配合本創作較佳實施例之圖式進一步說明如下 ’以期能使熟悉本創作相關技術之人士，得依本說明書之陳述據 以實施。 【實施方式】 首先，請配合參閱第一圖至第十三圖所示，本創作為一種led 散熱結構，其具有一基板10，該基板10之頂面及底面設定位 置設有若干排列狀之銅箔1 1，且該基板10之底面的銅猪1 1 另設有一得以防止氧化之錫層13，而各銅箔11之頂面分別裝 4 M395785 設一 燈20 ’使各LED燈20分顺各銅落i工形成電熱連 、结，而各燈2 〇之底面分別具有-得以與各鋪！ ！接觸之絕 緣層2 1，且該基板1 Q與各1^燈2 Q接觸之_ i i位置處分 別設有-以上之散鱗孔1 2，該散解孔i 2之内緣面亦設有 銅箱11’使頂面及底面之銅箱i工得以形成電熱連結。 • 其巾’絲板1 〇鄰近各域11之設定位置設有-以上之 • 散熱導孔12 (如第六圖及第七圖所示）。 • 其可進一步包括二對合設置之透明燈罩3 0，該二燈罩3 〇 得以裝設該基板1 〇，使該基板丄〇上之各哪燈2 〇得以被該二 燈罩30包覆（如第十圖所示）。 其中，5亥燈罩3 〇係為長條管狀。 其中，該基板10係為圓板狀（如第十—圖所示）。 其可進-步包括-燈泡狀之燈罩4Q，該圓形基板i 〇係裝 設於該燈泡狀之燈罩40内（如第十二圖所示）。 • 其可進一步包括一以上之透明小圓罩5 0，各小圓罩5 0係 '分別罩設定位於各LED燈2 0之外周緣（如第十三圖所示）。 而藉由以上之組合構成，請續配合參閱第一圖至第十三圖所 不，由於本創作之基板i 〇與各le_2 〇接觸之銅箱工工位置處 分別設有-以上之散熱導孔12(如第一圖至第五圖所示），散 ,、’、導孔1 2之内緣面亦没有銅n 1 1，使頂面及底面之銅羯1 1 付以形成電熱連結’或者，另外加上基板i⑽近各網丄工之 又疋位置亦认有一以上之散熱導孔12 (如第六、七圖及第九圖 5 M395785 . 所示）’且散熱導孔12之内緣面亦設有銅箔11，使頂面及底 _ 面之銅箔11得以形成電熱連結，故可增加基板1〇高溫時之熱 傳導速度及面積，使得高熱得以自各個散熱導孔i 2快速散出， 其係先由基板1〇頂面先吸熱，再利用散熱導孔12之熱傳導將According to the 'used LED lamp substrate structure', most of the LED lamps are directly assembled on the top surface of the substrate, so that the lamps are electrically connected to the respective _, however, the heat will be generated on the use day. The substrate structure of the conventional structure does not have a better heat dissipation effect. Therefore, it is easy to (4) heat's inspection. LED_system life A is low, and even the overall LED lamp yield is reduced, and it is not economically secret. Therefore, the lack of the above system is , there is a need to further improve it. In view of the fact that the current structure still has improvement, the creator has been engaged in many years of experience in related products, and has developed a kind of (10) heat dissipation after many improvements and tests in response to the existing problems. structure. [New content] The main purpose of this creation is to provide a (10) dilated structure that can increase the heat transfer rate and area so that the heat is quickly dissipated and has a better heat dissipation effect. ... The other purpose of this creation is to provide a kind of extension of the life of the L-Teng, the overall light decay is small, and the red LED heat dissipation structure is illuminated. In order to achieve the above object, the present invention proposes a heat dissipating structure having a substrate 'the top surface of the substrate is provided with three predetermined positions of copper boxes, M395785 • and the bottom of the county board __ another - _, and each copper _ surface is divided into two. Each LED light is electrically connected to each other, and the bottom surface of each LED light has - for example, each layer, and the female board and each LED light The heat-dissipating guide holes are respectively disposed at the positions of the copper boxes that are in contact with each other, and the inner peripheral surface of the heat-dissipating guide holes is also provided with a base, so that the top surface and the bottom surface are connected by alkali electric heat. Wherein the substrate is provided with more than one heat dissipation via hole adjacent to the set position of each copper foil. - It may further comprise a two-piece transparent cover, the two shades being mounted. The side substrate ' enables each LED light on the substrate to be covered by the two lamp covers. Among them, the 's Xuan lampshade is a long tube. Among them, the substrate is in the shape of a disk. It may further comprise a bulb-shaped lampshade, the circular substrate being mounted in the bulb-like lampshade. It may further comprise more than one transparent small dome, each of which is disposed adjacent to the periphery of each LE:D lamp. The following is a further description of the preferred embodiment of the present invention, which is intended to enable those skilled in the art to practice the present invention to be implemented in accordance with the present specification. [Embodiment] First, as shown in the first to thirteenth drawings, the present invention is a LED heat dissipation structure having a substrate 10, and the top surface and the bottom surface of the substrate 10 are arranged in a plurality of arrays. The copper foil 1 1 and the copper pig 1 1 on the bottom surface of the substrate 10 are additionally provided with a tin layer 13 for preventing oxidation, and the top surfaces of the copper foils 11 are respectively provided with 4 M395785, and a lamp 20' is provided to make each LED lamp 20 points. With the help of each copper, the electric heat is connected and the knot is formed, and the bottom surface of each of the lamps 2 has - and can be paved separately! ! Contacting the insulating layer 2 1, and the substrate 1 Q is provided with a scalar hole 1 2 above the _ ii position of each of the lamps 2 Q, and the inner edge surface of the dispersing hole i 2 is also provided The copper box 11' enables the copper box of the top surface and the bottom surface to form an electrothermal connection. • The towel's wire 1 is adjacent to each of the fields 11 and has the above-mentioned heat dissipation holes 12 (as shown in the sixth and seventh figures). • It may further comprise a pair of transparent lampshades 30 disposed, the two lampshades 3 being capable of mounting the substrate 1 〇 such that each of the lamps 2 on the substrate is covered by the two lamps 30 (eg Figure 10). Among them, the 5 hai lampshade 3 is a long tubular shape. The substrate 10 is in the shape of a disk (as shown in the tenth-figure). It can further include a bulb-shaped lampshade 4Q which is mounted in the bulb-like lampshade 40 (as shown in Fig. 12). • It may further include more than one transparent small dome 50, and each of the small domes 50 is set to be located outside the periphery of each LED lamp 20 (as shown in FIG. 13). With the above combination, please continue to refer to the first to the thirteenth drawings. Since the substrate i 本 of this creation is in contact with each of the le_2 〇, the thermal conduction guide is provided. The hole 12 (as shown in the first to fifth figures), the inner edge of the hole, the ', and the guide hole 1 2 is also free of copper n 1 1, so that the top and bottom copper 羯 1 1 are added to form an electric heat connection. 'Or, in addition to the substrate i (10) near the network to complete the location of the heat is also recognized more than one of the thermal conduction holes 12 (such as the sixth, seventh and ninth Figure 5 M395785.) and the thermal conduction hole 12 The inner edge surface is also provided with a copper foil 11 so that the copper foil 11 of the top surface and the bottom surface can be electrically and thermally connected, so that the heat conduction speed and the area of the substrate 1 at a high temperature can be increased, so that high heat can be obtained from the respective heat dissipation vias i 2 Quickly dissipating, which first absorbs heat from the top surface of the substrate 1 and then uses the heat conduction of the heat dissipation via 12
熱能傳導到底面，而具有較佳之散熱效果，相對地，得以使得LED •燈2 〇之壽命延長，且整體之光衰小，而具有較佳之亮度，深具 . 實用性。 鲁除此之外，請配合參閱第十圖所示，使用者更可以利用二對 合設置之長條形透明燈罩3 0裝設基板1〇，使基板丄0上之各 1^1)燈2 0得以被二燈罩3 〇包覆（如第十圖所示），另外，亦可 將本創作設置為圓板狀之基板10(如第十一圖所示），其可裝 。又於燈/包狀之燈罩4q内（如第十二圖所示），或者，可利用一 以上之透明小圓罩5 〇分別罩設定位於各LED燈2 0之外周緣（如 第十二圖所不），如此便得以使之形成一LED燈之面板結構，整體 # 之組裝方式簡單方便，深具實用性。 、、’不上所述，本創作LED散熱結構，有效地改善習用結構所存在 的種種缺點’且本創作之主要技術手段並未見於任何相關之刊物 中’誠符合新型專利之申請要件，爰依法提出申請，懇請釣局 賜准本創作專利權。 【圖式簡單說明】 第一圖係本創作之第—實施例立體分解示意圖。 第二圖係本創作H施例立體組合示意圖。 6 Γ圖係第二圖之3-3組合剖面示意圖。 =五圖係本創作之第二實施例組合剖賴圖。 第六圖係本創作之第三實施取體分解示意圖。 七圖係本創作之第三實施顺合剖面示意圖。 八圖係本創作之第四實施例立體分解示意圖。 第九圖係本_之第五實闕立體分解示意圖。 第十圖係摘作之触實補謂外觀示意圖。 第十®係本創作之第六實施例立體分解示意圖。 第忙圖係本創作之另—較佳實施例立體外觀示意圖 第十二圖縣_之又—較佳實侧立體外觀示意圖 【主要元件符號說明】 基板1 0 散熱導孔12 絕緣層2 1 銅箔1 1 _ 錫層1 3 " LE：D燈 2 〇 燈罩3 0 燈罩4 0 小圓罩5 0The heat energy is transmitted to the bottom surface, and has better heat dissipation effect. In contrast, the life of the LED lamp 2 is prolonged, and the overall light decay is small, and the brightness is better, and the utility is practical. In addition to the above, please refer to the tenth figure, the user can also use the two pairs of long strip-shaped transparent lampshade 30 to install the substrate 1〇, so that each 1^1) lamp on the substrate 丄0 20 can be covered by the two lampshades 3 (as shown in the tenth figure), and the present invention can also be set as a disk-shaped substrate 10 (as shown in FIG. 11), which can be mounted. Also in the lamp/package lampshade 4q (as shown in the twelfth figure), or more than one transparent small dome 5 〇 can be used to set the outer periphery of each LED lamp 20 (such as the twelfth In the figure, it is possible to form a panel structure of an LED lamp, and the assembly method of the whole # is simple and convenient, and is practical. , 'Not as mentioned, the LED heat dissipation structure of this creation effectively improves the various shortcomings of the conventional structure' and the main technical means of this creation have not been found in any related publications. Apply in accordance with the law, and ask the fishing bureau to grant the patent right. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a perspective exploded view of the first embodiment of the present invention. The second figure is a three-dimensional combination diagram of the present embodiment. 6 Γ Picture is a schematic diagram of the combined 3-3 section of the second figure. = Five figures are a combination of the second embodiment of the present creation. The sixth figure is a schematic diagram of the third embodiment of the creation. The seven figures are schematic diagrams of the third implementation of this creation. Eight Diagrams is a perspective exploded view of a fourth embodiment of the present invention. The ninth figure is a three-dimensional exploded schematic view of the fifth embodiment. The tenth picture is a schematic diagram of the appearance of the touch-filled complement. A tenth exploded view of a sixth embodiment of the present invention. The first embodiment of the present invention is a second embodiment of the present invention. Foil 1 1 _ Tin layer 1 3 " LE: D lamp 2 〇 lamp cover 3 0 lampshade 4 0 small dome 5 0